UTC-IC 75N75

UNISONIC TECHNOLOGIES CO., LTD
75N75
Power MOSFET
75Amps, 75Volts
N-CHANNEL POWER MOSTFET
1
TO- 251
1
DESCRIPTION
The UTC 75N75 is n-channel enhancement mode power field
effect transistors with stable off-state characteristics, fast
switching speed, low thermal resistance, usually used at telecom
and computer application.
1
TO-252
TO-220
FEATURES
* RDS(ON) = 12.5mΩ @VGS = 10 V
* Ultra low gate charge ( typical 90 nC )
* Fast switching capability
* Avalanche energy Specified
* Improved dv/dt capability, high ruggedness
1
TO-220F
*Pb-free plating product number: 75N75L
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Order Number
Package
Normal
Lead Free Plating
75N75-TA3-T
75N75L-TA3-T
TO-220
75N75-TF3-T
75N75L-TF3-T
TO-220F
75N75-TM3-T
75N75L-TM3-T
TO-251
75N75-TN3-R
75N75L-TN3-R
TO-252
75N75-TN3-T
75N75L-TN3-T
TO-252
Note: Pin Assignment: G: Gate D: Drain S: Source
75N75L-TA3-T
(1)Packing Type
(2)Package Type
(3)Lead Plating
www.unisonic.com.tw
Copyright © 2005 Unisonic Technologies Co., Ltd.
Pin Assignment
1
2
3
G
D
S
G
D
S
G
D
S
G
D
S
G
D
S
Packing
Tube
Tube
Tube
Tape Reel
Tube
(1) T: Tube, R: Tape Reel
(2) TA3: TO-220, TF3: TO-220F, TM3: TO-251,
TN 3: TO-252
(3) L: Lead Free Plating, Blank: Pb/Sn
1 of 8
QW-R502-097,A
75N75
Power MOSFET
ABSOLUTE MAXIMUM RATINGS
PARAMETER
Drain to Source Voltage
SYMBOL
VDSS
RATINGS
UNIT
75
V
TC = 25℃
75
A
ID
Continuous Drain Current
TC = 100℃
56
A
Drain Current Pulsed (Note 1)
IDM
300
A
±20
Gate to Source Voltage
VGS
V
Single Pulsed (Note 2)
EAS
900
mJ
Avalanche Energy
300
mJ
Repetitive (Note 1)
EAR
Peak Diode Recovery dv/dt (Note 3)
dv/dt
15
V/ns
TC = 25℃
220
W
Total Power Dissipation
PD
Derating above 25℃
1.4
W/℃
Junction Temperature
TJ
+150
℃
Storage Temperature
TSTG
-55 ~ +150
℃
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
THERMAL DATA
PARAMETER
Thermal Resistance Junction-Ambient
Thermal Resistance Junction-Case
Thermal Resistance Case-Sink
SYMBOL
θJA
θJC
θCS
MIN
TYP
MAX
62.5
0.8
0.5
UNIT
℃/W
℃/W
℃/W
ELECTRICAL CHARACTERISTICS (TC = 25℃, unless otherwise specified)
PARAMETER
Off Characteristics
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Drain-Source Leakage Current
Gate-Source Leakage Current
Gate-Source Leakage Reverse
On Characteristics
Gate Threshold Voltage
Static Drain-Source On-State
Resistance
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge (Miller Charge)
SYMBOL
TEST CONDITIONS
BVDSS
VGS = 0 V, ID = 250 µA
ID = 1mA,
△BVDSS/△TJ
Referenced to 25℃
VDS = 75 V, VGS = 0 V
IDSS
VDS = 75 V, VGS = 0 V,
TJ = 150℃
VGS = 20V, VDS = 0 V
IGSS
VGS = -20V, VDS = 0 V
TYP
MAX
75
UNIT
V
0.08
20
µA
250
µA
100
-100
nA
nA
4.0
V
15
mΩ
VDS = VGS, ID = 250 µA
RDS(ON)
VGS = 10 V, ID = 48 A
12.5
CISS
COSS
CRSS
VGS = 0 V, VDS = 25 V
f = 1MHz
3300
530
80
pF
pF
pF
12
79
80
52
90
20
30
ns
ns
ns
ns
nC
nC
nC
tD(ON)
tR
tD(OFF)
tF
QG
QGS
QGD
VDD = 38V, ID =48A,
VGS=10V, (Note 4, 5)
VDS = 60V, VGS = 10 V
ID = 48A, (Note 4, 5)
2.0
V/℃
VGS(TH)
UNISONIC TECHNOLOGIES CO., LTD
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MIN
140
35
45
2 of 8
QW-R502-097,A
75N75
Power MOSFET
ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
Source-Drain Diode Ratings and Characteristics
Continuous Source Current
IS
Pulsed Source Current
ISM
Diode Forward Voltage
VSD
IS = 48A, VGS = 0 V
IS = 48A, VGS = 0 V
Reverse Recovery Time
trr
dIF / dt = 100 A/µs
Reverse Recovery Charge
Qrr
Note 1. Repeativity rating: pulse width limited by junction temperature
2. L=0.24mH, IAS=48A, RG=20Ω, Starting TJ=25℃
3. ISD≤48A, di/dt≤300A/µs, VDD≤BVDSS, Starting TJ=25℃
4. Pulse Test: Pulse Width≤300µs,Duty Cycle≤2%
5. Essentially independent of operating temperature.
UNISONIC TECHNOLOGIES CO., LTD
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MIN
TYP
MAX
75
300
1.4
90
300
UNIT
A
V
ns
µC
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QW-R502-097,A
75N75
Power MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
+
-
L
RG
Driver
* dv/dt controlled by RG
* I SD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
VGS
VDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS
(Driver)
P.W.
Period
D=
P. W.
Period
VGS= 10V
I FM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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4 of 8
QW-R502-097,A
75N75
Power MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS
RG
VGS
D.U.T.
10V
10%
t D(ON )
Pulse Width ≤ 1μs
tD (OFF)
tF
tR
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit
Same Type
as D.U.T.
50kΩ
12V
0.2μF
Fig. 2B Switching Waveforms
QG
10V
0.3μF
VDS
QGS
QGD
VGS
DUT
VG
1mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L
VDS
BVDSS
RD
10V
VDD
D.U.T.
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
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IAS
tp
Time
Fig. 4B Unclamped Inductive Switching Waveforms
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QW-R502-097,A
75N75
Power MOSFET
TYPICAL CHARACTERISTICS
Transfer Characteristics
100
10-1
14
VGS=10V
13
12
11
0
10 20 30 40 50 60 70 80 90 100
Drain Current, I D (A)
6000
5000
4000
Capacitance Characteristics
(Non-Repetitive)
CISS=CGS+C GD (CDS=shorted)
COSS =CDS+C GD
CRSS=CGD
C ISS
3000
2000
1000
COSS
0
CRSS
*Note:
1. VGS=0V
2. f = 1MHz
100
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℃
1 50
2
4 5
6 7
8 9 10
3
Gate-Source Voltage, VGS (V)
Reverse Drain Current vs. Allowable Case
Temperature
102
150℃
10 1
25℃
*Note:
1. VGS=0V
2. 250µs Test
10 0
0.2 0.4 0.6 0.8 1.0 1.2 1.4
Source-Drain Voltage, VSD (V)
1.6
Gate Charge Characteristics
12
10
8
VDS=38V
6
VDS=60V
4
2
0
5
10 15 20 25 30 35
Drain-Source Voltage, VDC (V)
25
℃
Drain Current, ID (A)
Note:
1. VDS=25V
2. 20µs Pulse Test
On-Resistance Variation vs. Drain
Current and Gate Voltage
15
Capacitance (pF)
10 1
101
10 0
Drain-Source Voltage, VDS (V)
Reverse Drain Current, ISD (A)
Drain-Source On-Resistance, RDS(ON) (mΩ)
4.5V
101
102
Gate-to-Source Voltage, VGS (V)
Drain Current, ID (A)
On-State Characteristics
V GS
Top: 15V
10 V
8 V
7 V
102
6 V
5 .5V
5V
Bottorm : 4.5V
0
*Note: ID=48A
5 10 15 20 25 30 35 40 45
Total Gate Charge, Q G (nC)
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QW-R502-097,A
75N75
Power MOSFET
Breakdown Voltage Variation vs.
Junction Temperature
1.2
1.1
1.0
*Note:
1. VGS=0V
2. ID=250µA
0.9
0.8
-100
-50
0
50
100
150 200
Drain-Source On-Resistance, RDS(ON),
(Normalized)
Drain-Source Breakdown Voltage,
BVDSS(Normalized)
TYPICAL CHARACTERISTICS(Cont.)
Junction Temperature, T J (℃)
3.0
2.5
2.0
1.5
1.0
0.0
-100 -50
0
50
100 150 200
Junction Temperature, T J (℃)
Maximum Drain Current vs. Case
Temperature
60
100µs
10
10ms
1ms
DC
1
*Note:
1. T c=25℃
2. T J=150℃
3. Single Pulse
0.1
1
10
100
1000
Drain-Source Voltage, VD (V)
Drain Current, ID (A)
Drain Current , ID,(A)
70
Operation in This
Area by RDS(ON)
*Note:
1. VGS=10V
2. I D=3.5A
0.5
Maximum Safe Operating
100
On-Resistance Variation vs.
Junction Temperature
50
40
30
20
10
0
25
50
75
100
125
150
Case Temperature, T C (℃)
Thermal Response, ZθJC (t)
Transient Thermal Response Curve
1
D=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
Single pulse
*Note:
1. ZθJ C (t) = 0.88℃/W Max.
2. Duty Factor , D=t1/t2
3. TJ -TC =PDM×ZθJ C (t)
10
1
1E-5 1E-4 1E-3 0.01
0.1
Square Wave Pulse Duration, t 1 (sec)
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7 of 8
QW-R502-097,A
75N75
Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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QW-R502-097,A