7WBD3125 2-Bit Translating Bus Switch The 7WBD3125 is an advanced high−speed low−power 2−bit translating bus switch in ultra−small footprints. Features • • • • • • • http://onsemi.com High Speed: tPD = 0.25 ns (Max) @ VCC = 4.5 V 3 W Switch Connection Between 2 Ports Power Down Protection Provided on Inputs Zero Bounce TTL−Compatible Control Inputs Ultra−Small Pb−Free Packages These are Pb−Free Devices MARKING DIAGRAMS 1 UDFN8 MU SUFFIX CASE 517AJ AFM G 1 ULLGA8 1.45 x 1.0 CASE 613AA 2M G 1 ULLGA8 1.6 x 1.0 CASE 613AB AHM G 1 ULLGA8 1.95 x 1.0 CASE 613AC AJM G 8 1 8 UQFN8 MU SUFFIX CASE 523AN 1 AE MG G 8 US8 US SUFFIX CASE 493 AA MG G 1 8 Micro8] DM SUFFIX CASE 846A D125 AYWG G 1 A Y W M G = Assembly Location = Year = Work Week = Date Code = Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. This document contains information on some products that are still under development. ON Semiconductor reserves the right to change or discontinue these products without notice. © Semiconductor Components Industries, LLC, 2010 February, 2010 − Rev. 0 1 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Publication Order Number: 7WBD3125/D 7WBD3125 OE1 A1 8 1 2 7 VCC GND 3 6 4 5 A1 B2 7 6 5 OE2 8 VCC B2 OE1 4 GND B1 A2 1 2 3 OE2 B1 A2 Figure 2. UQFN8 Figure 1. ULLGA8/UDFN8 (Top Thru−View) (Top Thru−View) OE1 1 8 VCC A1 2 7 OE2 B2 3 6 B1 GND 4 5 A2 Figure 3. US8/Micro8 (Top View) A1 B1 FUNCTION TABLE OE1 A2 B2 OE2 Figure 4. Logic Diagram http://onsemi.com 2 Input OEn Function L Bn = An H Disconnect 7WBD3125 MAXIMUM RATINGS Symbol Value Unit VCC DC Supply Voltage Parameter −0.5 to +7.0 V VIN Control Pin Input Voltage −0.5 to +7.0 V VI/O Switch Input / Output Voltage −0.5 to +7.0 V IIK Control Pin DC Input Diode Current VIN < GND −50 mA IOK Switch I/O Port DC Diode Current VI/O < GND −50 mA IO ON−State Switch Current $128 mA Continuous Current Through VCC or GND $150 mA ICC DC Supply Current Per Supply Pin $150 mA IGND DC Ground Current per Ground Pin $150 mA TSTG Storage Temperature Range −65 to +150 °C 260 °C TL Lead Temperature, 1 mm from Case for 10 Seconds TJ Junction Temperature Under Bias qJA Thermal Resistance PD Power Dissipation in Still Air at 85°C MSL FR VESD ILATCHUP 150 °C US8 (Note 1) UDFN8 UQFN8 ULLGA8 Micro8 251 111 208 455 392 °C/W US8 UDFN8 UQFN8 ULLGA8 Micro8 498 1127 601 274 319 mW Moisture Sensitivity Level 1 Flammability Rating Oxygen Index: 28 to 34 ESD Withstand Voltage UL 94 V−0 @ 0.125 in Human Body Mode (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) Latchup Performance Above VCC and Below GND at 125°C (Note 5) > 2000 > 200 N/A V $200 mA Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD22−A114−A. 3. Tested to EIA / JESD22−A115−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit 4.0 5.5 V Control Pin Input Voltage 0 5.5 V Switch Input / Output Voltage 0 5.5 V −55 +125 °C 0 0 5 DC nS/V VCC Positive DC Supply Voltage VIN VI/O TA Operating Free−Air Temperature Dt / DV Input Transition Rise or Fall Rate Control Input Switch I/O http://onsemi.com 3 7WBD3125 DC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Conditions Min Typ 4.5 Max Min Unit −1.2 V Clamp Diode Voltage VIH High−Level Input Voltage (Control) 4.0 to 5.5 VIL Low−Level Input Voltage (Control) 4.0 to 5.5 0.8 0.8 V VOH Output Voltage High See Figure 5 Input Leakage Current 0 v VIN v 5.5 V 5.5 ±0.1 ±1.0 mA IOFF Power Off Leakage Current VI/O = 0 to 5.5 V 0 ±0.1 ±1.0 mA ICC Quiescent Supply Current IO = 0, VIN = VCC or 0 V OE1 = OE2 = GND OE1 = OE2 = VCC 5.5 ±1.0 ±0.1 ±1.0 ±1.0 mA mA 2.5 mA DICC Increase in Supply Current (Control Pin) One input at 3.4 V; Other inputs at VCC or GND 5.5 RON Switch ON Resistance VI/O = 0, II/O = 64 mA II/O = 30 mA 4.5 −1.2 Max VIK IIN II/O = −18 mA TA = −555C to +1255C TA = 255C 2.0 VI/O = 2.4, II/O = 15 mA VI/O = 2.4, II/O = 15 mA 4.0 2.0 V 3 3 7 7 7 7 15 50 50 50 70 70 W AC ELECTRICAL CHARACTERISTICS Symbol Parameter VCC (V) Test Condition TA = −555C to +1255C TA = 25 5C Min Typ Max Min Unit 0.25 ns ns tPD Propagation Delay, Bus to Bus See Figure 6 4.0 to 5.5 tEN Output Enable Time See Figure 6 4.5 to 5.5 0.8 2.5 4.2 0.8 4.2 4.0 0.8 3.0 4.6 0.8 4.6 4.5 to 5.5 0.8 3.0 4.8 0.8 4.8 4.0 0.8 2.9 4.4 0.8 4.4 tDIS CIN Output Disable Time 0.25 Max ns Control Input Capacitance VIN = 5 or 0 V 5.0 2.5 pF CIO(ON) Switch On Capacitance Switch ON 5.0 10 pF CIO(OFF) Switch Off Capacitance Switch OFF 5.0 5 pF http://onsemi.com 4 7WBD3125 TYPICAL DC CHARACTERISTICS VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 IOH = −0.1 mA 3.50 −6 mA −12 mA −24 mA 3.25 3.00 2.75 2.50 TA = +85°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 3.50 IOH = −0.1 mA 3.25 −6 mA −12 mA −24 mA 3.00 2.75 2.50 TA = +25°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) VOH, HIGH LEVEL OUTPUT VOLTAGE (V) 3.75 3.50 IOH = −0.1 mA 3.25 −6 mA −12 mA −24 mA 3.00 2.75 2.50 TA = −40°C VIN = VCC 2.25 2.00 4.50 4.75 5.00 5.25 5.50 5.75 VCC, SUPPLY VOLTAGE (V) Figure 5. Output Voltage High vs Supply Voltage http://onsemi.com 5 7WBD3125 AC LOADING AND WAVEFORMS Parameter Measurement Information From Output Under Test 500 W S1 7V Open Test S1 tPD Open tPLZ/tPZL 7V tPHZ/tPZH Open GND CL = 50 pF* 500 W *CL includes probes and jig capacitance. 3V 1.5 V 1.5 V Output Control Input tPHL VOH 1.5 V Output 1.5 V 1.5 V Output Waveform 2 S1 at Open (Note 6) VOL Voltage Waveforms Propagation Delay Times 1.5 V 3V 0V tPLZ tPZL Output Waveform 1 S1 at 7 V (Note 6) tPZH 0V tPLH 1.5 V 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ VOH VOH − 0.3 V 0V Voltage Waveforms Enable and Disable Times 6. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control 7. All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, ZO = 50 W, tr v 2.5 ns, tf v 2.5 ns. 8. The outputs are measured one at a time, with one transition per measurement. 9. tPLZ and tPHZ are the same as tDIS. 10. tPZL and tPZH are the same as tEN. 11. tPHL and tPLH are the same as tPD. Figure 6. tPD, tEN, tDIS Loading and Waveforms ORDERING INFORMATION Package Shipping† 7WBD3125USG US8 (Pb−Free) 3000 / Tape & Reel 7WBD3125MUTAG UDFN8 (Pb−Free) 3000 / Tape & Reel 7WBD3125AMUTCG UQFN8 (Pb−Free) 3000 / Tape & Reel (In Development) 7WBD3125AMX1TCG ULLGA8 – 0.5 mm Pitch (Pb−Free) 3000 / Tape & Reel (In Development) 7WBD3125BMX1TCG ULLGA8 – 0.4 mm Pitch (Pb−Free) 3000 / Tape & Reel (In Development) 7WBD3125CMX1TCG ULLGA8 – 0.35 mm Pitch (Pb−Free) 3000 / Tape & Reel (In Development) Micro8 (Pb−Free) 4000 / Tape & Reel (In Development) Device 7WBD3125DMR2G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 6 7WBD3125 PACKAGE DIMENSIONS UDFN8 1.8 x 1.2, 0.4P CASE 517AJ−01 ISSUE O PIN ONE REFERENCE ÉÉ ÉÉ 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH MAY NOT EXCEED 0.03 ONTO BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. A B D 0.10 C L1 E DETAIL A NOTE 5 TOP VIEW (A3) 0.05 C DIM A A1 A3 b b2 D E e L L1 L2 A 0.05 C SIDE VIEW e/2 A1 e (b2) 1 C SEATING PLANE DETAIL A 8X L 4 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 0.30 REF 1.80 BSC 1.20 BSC 0.40 BSC 0.45 0.55 0.00 0.03 0.40 REF MOUNTING FOOTPRINT* SOLDERMASK DEFINED (L2) 8 5 BOTTOM VIEW 8X 8X b 0.10 M C A B 0.05 M C 0.66 7X 0.22 NOTE 3 1.50 1 0.32 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 7WBD3125 PACKAGE DIMENSIONS ULLGA8 1.45x1.0, 0.35P CASE 613AA−01 ISSUE A ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.45 BSC 1.00 BSC 0.35 BSC 0.25 0.35 0.30 0.40 7X 0.48 8X 0.22 e/2 e 1 7X L NOTE 4 4 1.18 L1 0.53 8 5 8X b 0.05 C PKG OUTLINE 0.35 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 8 7WBD3125 PACKAGE DIMENSIONS ULLGA8 1.6x1.0, 0.4P CASE 613AB−01 ISSUE A ÉÉÉ ÉÉÉ PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C A 8X 0.05 C SEATING PLANE SIDE VIEW MOUNTING FOOTPRINT SOLDERMASK DEFINED* C A1 MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.60 BSC 1.00 BSC 0.40 BSC 0.25 0.35 0.30 0.40 7X 0.49 e/2 e 1 4 8 5 7X L NOTE 4 1.24 L1 0.53 8X b 0.05 C 1 PKG OUTLINE 0.40 PITCH DIMENSIONS: MILLIMETERS 0.10 C A B BOTTOM VIEW 8X 0.26 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 9 7WBD3125 PACKAGE DIMENSIONS ULLGA8 1.95x1.0, 0.5P CASE 613AC−01 ISSUE A PIN ONE REFERENCE 0.10 C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. 4. A MAXIMUM OF 0.05 PULL BACK OF THE PLATED TERMINAL FROM THE EDGE OF THE PACKAGE IS ALLOWED. A B D ÉÉÉÉ ÉÉÉÉ E DIM A A1 b D E e L L1 TOP VIEW 0.10 C 0.05 C MILLIMETERS MIN MAX −−− 0.40 0.00 0.05 0.15 0.25 1.95 BSC 1.00 BSC 0.50 BSC 0.25 0.35 0.30 0.40 A 8X 0.05 C MOUNTING FOOTPRINT SOLDERMASK DEFINED* SEATING PLANE SIDE VIEW 7X C A1 0.49 8X 0.30 e/2 e 7X L NOTE 4 4 1 1.24 L1 0.53 8 5 BOTTOM VIEW 8X b 0.10 C A B 0.05 C 1 PKG OUTLINE 0.50 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. NOTE 3 http://onsemi.com 10 7WBD3125 PACKAGE DIMENSIONS UQFN8, 1.6x1.6, 0.5P CASE 523AN−01 ISSUE O A B D ÉÉ ÉÉ ÉÉ PIN ONE REFERENCE 2X 0.10 C 2X EXPOSED Cu E A1 ÇÇ ÉÉ MOLD CMPD A3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 mm FROM THE TERMINAL TIP. DETAIL B DIM A A1 A3 b D E e L L1 L3 OPTIONAL CONSTRUCTION 0.10 C TOP VIEW L1 (A3) DETAIL B L3 A 0.05 C b 0.05 C SIDE VIEW (0.10) C A1 SEATING PLANE (0.15) DETAIL A SOLDERING FOOTPRINT* OPTIONAL CONSTRUCTION 1.70 8X 8X L3 L 0.50 PITCH 1 e 5 3 1 DETAIL A MILLIMETERS MIN MAX 0.45 0.60 0.00 0.05 0.13 REF 0.15 0.25 1.60 BSC 1.60 BSC 0.50 BSC 0.35 0.45 −−− 0.15 0.25 0.35 0.35 7 8 8X b 0.10 C A B BOTTOM VIEW 1.70 0.05 C 7X NOTE 3 0.25 8X 0.53 DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 11 7WBD3125 PACKAGE DIMENSIONS US8 CASE 493−02 ISSUE B NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. DIMENSION “A” DOES NOT INCLUDE MOLD FLASH, PROTRUSION OR GATE BURR. MOLD FLASH. PROTRUSION AND GATE BURR SHALL NOT EXCEED 0.140 MM (0.0055”) PER SIDE. 4. DIMENSION “B” DOES NOT INCLUDE INTER−LEAD FLASH OR PROTRUSION. INTER−LEAD FLASH AND PROTRUSION SHALL NOT E3XCEED 0.140 (0.0055”) PER SIDE. 5. LEAD FINISH IS SOLDER PLATING WITH THICKNESS OF 0.0076−0.0203 MM. (300−800 “). 6. ALL TOLERANCE UNLESS OTHERWISE SPECIFIED ±0.0508 (0.0002 “). −X− A 8 J −Y− 5 DETAIL E B L 1 4 R S G P U C −T− SEATING PLANE H 0.10 (0.004) T K D N 0.10 (0.004) M R 0.10 TYP T X Y V M SOLDERING FOOTPRINT* 3.8 0.15 0.50 0.0197 F DETAIL E 1.8 0.07 0.30 0.012 1.0 0.0394 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 12 DIM A B C D F G H J K L M N P R S U V MILLIMETERS MIN MAX 1.90 2.10 2.20 2.40 0.60 0.90 0.17 0.25 0.20 0.35 0.50 BSC 0.40 REF 0.10 0.18 0.00 0.10 3.00 3.20 0_ 6_ 5_ 10 _ 0.23 0.34 0.23 0.33 0.37 0.47 0.60 0.80 0.12 BSC INCHES MIN MAX 0.075 0.083 0.087 0.094 0.024 0.035 0.007 0.010 0.008 0.014 0.020 BSC 0.016 REF 0.004 0.007 0.000 0.004 0.118 0.126 0_ 6_ 5_ 10 _ 0.010 0.013 0.009 0.013 0.015 0.019 0.024 0.031 0.005 BSC 7WBD3125 PACKAGE DIMENSIONS Micro8t CASE 846A−02 ISSUE H D HE PIN 1 ID NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. 846A-01 OBSOLETE, NEW STANDARD 846A-02. E e b 8 PL 0.08 (0.003) M T B S A S SEATING −T− PLANE 0.038 (0.0015) A A1 MILLIMETERS NOM MAX −− 1.10 0.08 0.15 0.33 0.40 0.18 0.23 3.00 3.10 3.00 3.10 0.65 BSC 0.40 0.55 0.70 4.75 4.90 5.05 DIM A A1 b c D E e L HE MIN −− 0.05 0.25 0.13 2.90 2.90 INCHES NOM −− 0.003 0.013 0.007 0.118 0.118 0.026 BSC 0.016 0.021 0.187 0.193 MIN −− 0.002 0.010 0.005 0.114 0.114 MAX 0.043 0.006 0.016 0.009 0.122 0.122 0.028 0.199 L c SOLDERING FOOTPRINT* 8X 1.04 0.041 0.38 0.015 3.20 0.126 6X 8X 4.24 0.167 0.65 0.0256 5.28 0.208 SCALE 8:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Micro8 is a trademark of International Rectifier. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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