MOLEX 87587-0059

R
Low Profile (25°) DIMM Socket
October/2000
(1.27mm Pitch, Multi-Key)
Introduction
Dual In-line Memory Modules (DIMMs) are widely adopted
by cumputer industries as DIMMs offer the ability to easily
upgrade memory using industry standard modules.
The continuous increase in systems complexities have
resulted in chasis height and PCI Card spacing constraints. Molex
now offers Through-Hole DIMM in 25 degree angle to allow
customers to better utilize their available space. The Angled
DIMM socket is an extension of the very popular Molex
vertical DIMM socket.
Molex Angled DIMM sockets accept modules conforming
to specification established by JEDEC. For more information,
please contact your nearest Molex sales office or visit our
worldwide website.
Features & Benefits
Ejector latch
Dual module support towers
align modules for insertion
Pre-loaded contacts enhanced reliability
Function key option
PC Board
Voltage key option
Accepts standards
JEDEC MO-161 modules
Module to be seated
and locked in place
Ordering Information and Dimensions
Circuits
168
Order No.
15µ" Select Gold
87587-0048
87587-0049
87587-0050
87587-0057
87587-0058
87587-0059
30µ" Select Gold
87587-0148
87587-0149
87587-0150
87587-0157
87587-0158
87587-0159
Function Key
Voltage Key
Solder Tail Length
Left
Center
Right
Left
Center
Right
Center (3.3V)
Center (3.3V)
Center (3.3V)
Center (3.3V)
Center (3.3V)
Center (3.3V)
2.79 (.110)
2.79 (.110)
2.79 (.110)
3.18 (.125)
3.18 (.125)
3.18 (.125)
Recommended
PCB Thickness
2.19 (.086) max.
2.58 (.101) max.
R
Low Profile (25°) DIMM Socket
October/2000
(1.27mm Pitch, Multi-Key)
Typical Application
25 degree DIMM application for low profile 1U server
R
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