P/N 97-68340 for Motorola 68340 144-Pin QFP-to-PGA Adapter FEATURES •Convert surface mount QFP packages to a 15x15 PGA footprint •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs •Pins are mechanically fastened and soldered to board using Aries’ patented process, creating a reliable electrical connection and rugged contact •Consult factory for panelized form or for mounting of consigned chips GENERAL SPECIFICATIONS •ADAPTER BODY: FR-4, 0.062 [1.58] thick, with 1-oz. min. Cu traces •PADS: bare Cu protected with ENIG or immersion white Sn to eliminate coplanarity concerns and solder bridges associated with hot air solder leveling •PINS: Brass 360 1/2-hard per UNS C36000 ASTM-B16-00 •PIN PLATING: 200μ [5.08μ] min. Sn per ASTM B 545 Type 1 or Sn/Pb 93/7 per ASTM B 545 over 100μ [2.54μ] Ni per SAE AMS-QQ-N-290 •OPERATING TEMPERATURE: 221°F [105°C] MOUNTING CONSIDERATIONS •SUGGESTED PCB HOLE SIZE: 0.062 ±0.003 [1.58 ±0.08] dia. •Will plug into standard PGA sockets ALL DIMENSIONS: INCHES [MILLIMETERS] CUSTOMIZATION: In addition to the standard products shown on this page, Aries specializes in custom design and production. Special materials, platings, sizes, and configurations can be furnished, depending on the quantity. NOTE: Aries reserves the right to change product general specifications without notice. ORDERING INFORMATION P/N 97-68340 P/N 97-68340-P for Panelized Form P/N 145-PGM15024-30 for Wire Wrap PGA Socket ALL TOLERANCES: ±0.005 [0.13] UNLESS OTHERWISE SPECIFIED ROW-TO-ROW ±0.003 [±0.08] PIN-TO-PIN ±0.003 [±0.08] NON-CUMULATIVE CONSULT FACTORY FOR OTHER SIZES AND CONFIGURATIONS Bristol, PA 19007-6810 USA TEL (215) 781-9956 • FAX (215) 781-9845 WWW.ARIESELEC.COM • [email protected] PRINTOUTS OF THIS DOCUMENT MAY BE OUT OF DATE AND SHOULD BE CONSIDERED UNCONTROLLED 18025 Rev. AA