ADC12DC105 ADC12DC105 Dual 12-Bit, 105 MSPS A/D Converter with CMOS Outputs Literature Number: SNAS469A ADC12DC105 Dual 12-Bit, 105 MSPS A/D Converter with CMOS Outputs General Description Features The ADC12DC105 is a high-performance CMOS analog-todigital converter capable of converting two analog input signals into 12-bit digital words at rates up to 105 Mega Samples Per Second (MSPS). These converters use a differential, pipelined architecture with digital error correction and an onchip sample-and-hold circuit to minimize power consumption and the external component count, while providing excellent dynamic performance. A unique sample-and-hold stage yields a full-power bandwidth of 1 GHz. The ADC12DC080/105 may be operated from a single +3.0V or +3.3V power supply. A power-down feature reduces the power consumption to very low levels while still allowing fast wake-up time to full operation. The differential inputs provide a 2V full scale differential input swing. A stable 1.2V internal voltage reference is provided, or the ADC12DC105 can be operated with an external 1.2V reference. Output data format (offset binary versus 2's complement) and duty cycle stabilizer are pin-selectable. The duty cycle stabilizer maintains performance over a wide range of clock duty cycles. The ADC12DC105 is available in a 60-lead LLP package and operates over the industrial temperature range of −40°C to +85°C. ■ ■ ■ ■ ■ ■ ■ Internal sample-and-hold circuit and precision reference Low power consumption Clock Duty Cycle Stabilizer Single +3.0V or +3.3V supply operation Power-down mode Offset binary or 2's complement output data format 60-pin LLP package, (9x9x0.8mm, 0.5mm pin-pitch) Key Specifications ■ ■ ■ ■ ■ ■ ■ Resolution Conversion Rate SNR (fIN = 170 MHz) SFDR (fIN = 170 MHz) Full Power Bandwidth Power Consumption 12 Bits 105 MSPS 69 dBFS (typ) 83 dBFS (typ) 1 GHz (typ) 690 mW (typ), VA=3.0V 800 mW (typ), VA=3.3V Applications ■ ■ ■ ■ ■ High IF Sampling Receivers Wireless Base Station Receivers Test and Measurement Equipment Communications Instrumentation Portable Instrumentation Block Diagram 30073902 © 2008 National Semiconductor Corporation 300739 www.national.com ADC12DC105 Dual 12-Bit, 105 MSPS A/D Converter with CMOS Outputs October 23, 2008 ADC12DC105 Connection Diagram 30073901 Ordering Information Industrial (−40°C ≤ TA ≤ +85°C) www.national.com Package ADC12DC105CISQ 60 Pin LLP ADC12DC105CISQE 60 Pin LLP, 250 pc. Tape and Reel ADC12DC105LFEB Evaluation Board 2 ADC12DC105 Pin Descriptions and Equivalent Circuits Pin No. Symbol Equivalent Circuit Description ANALOG I/O 3 13 VINA+ VINB+ 2 14 VINAVINB- 5 11 VRPA VRPB 7 9 VCMOA VCMOB 6 10 VRNA VRNB Differential analog input pins. The differential full-scale input signal level is 2VP-P with each input pin signal centered on a common mode voltage, VCM. These pins should each be bypassed to AGND with a low ESL (equivalent series inductance) 0.1 µF capacitor placed very close to the pin to minimize stray inductance. An 0201 size 0.1 µF capacitor should be placed between VRP and VRN as close to the pins as possible, and a 1 µF capacitor should be placed in parallel. VRP and VRN should not be loaded. VCMO may be loaded to 1mA for use as a temperature stable 1.5V reference. It is recommended to use VCMO to provide the common mode voltage, VCM, for the differential analog inputs. VREF Reference Voltage. This device provides an internally developed 1.2V reference. When using the internal reference, VREF should be decoupled to AGND with a 0.1 µF and a 1µF, low equivalent series inductance (ESL) capacitor. This pin may be driven with an external 1.2V reference voltage. This pin should not be used to source or sink current when the internal reference is used. 19 OF/DCS This is a four-state pin controlling the input clock mode and output data format. OF/DCS = VA, output data format is 2's complement without duty cycle stabilization applied to the input clock. OF/DCS = AGND, output data format is offset binary, without duty cycle stabilization applied to the input clock. OF/DCS = (2/3)*VA, output data is 2's complement with duty cycle stabilization applied to the input clock. OF/DCS = (1/3)*VA, output data is offset binary with duty cycle stabilization applied to the input clock. 18 CLK The clock input pin. The analog inputs are sampled on the rising edge of the clock input. 57 20 PD_A PD_B This is a two-state input controlling Power Down. PD = VA, Power Down is enabled and power dissipation is reduced. PD = AGND, Normal operation. 59 DIGITAL I/O 3 www.national.com ADC12DC105 Pin No. Symbol Equivalent Circuit Description 42-49, 52-55 DA0-DA7, DA8-DA11 Digital data output pins that make up the 12-bit conversion result for Channel A. DA0 (pin 42) is the LSB, while DA11 (pin 55) is the MSB of the output word. Output levels are CMOS compatible. 23-24, 27-36 DB0-DB1, DB3-DB11 Digital data output pins that make up the 12-bit conversion result for Channel B. DB0 (pin 23) is the LSB, while DB11 (pin 36) is the MSB of the output word. Output levels are CMOS compatible. 39 DRDY Data Ready Strobe. The data output transition is synchronized with the falling edge of this signal. This signal switches at the same frequency as the CLK input. 8, 16, 17, 58, 60 VA Positive analog supply pins. These pins should be connected to a quiet source and be bypassed to AGND with 0.1 µF capacitors located close to the power pins. 1, 4, 12, 15, Exposed Pad AGND The ground return for the analog supply. The exposed pad on back of package must be soldered to ground plane to ensure rated performance. 26, 38,50 VDR Positive driver supply pin for the output drivers. This pin should be connected to a quiet voltage source and be bypassed to DRGND with a 0.1 µF capacitor located close to the power pin. 25, 37, 51 DRGND ANALOG POWER DIGITAL POWER www.national.com The ground return for the digital output driver supply. This pins should be connected to the system digital ground, but not be connected in close proximity to the ADC's AGND pins. 4 If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. Supply Voltage (VA, VDR) Voltage on Any Pin (Not to exceed 4.2V) Input Current at Any Pin other than Supply Pins (Note 4) Package Input Current (Note 4) Max Junction Temp (TJ) −40°C ≤ TA ≤ +85°C +2.7V to +3.6V +2.4V to VA Operating Temperature Supply Voltage (VA) Output Driver Supply (VDR) Clock Duty Cycle (DCS Enabled) (DCS Disabled) VCM |AGND-DRGND| −0.3V to 4.2V −0.3V to (VA +0.3V) ±5 mA ±50 mA +150°C 30°C/W (Notes 1, 3) 30/70 % 45/55 % 1.4V to 1.6V ≤100mV Thermal Resistance (θJA) ESD Rating Human Body Model (Note 6) 2500V Machine Model (Note 6) 250V Storage Temperature −65°C to +150°C Soldering process must comply with National Semiconductor's Reflow Temperature Profile specifications. Refer to www.national.com/packaging. (Note 7) Converter Electrical Characteristics Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.3V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 105 MHz, VCM = VCMO, CL = 5 pF/pin. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9) Symbol Parameter Conditions Typical Limits (Note 10) Units (Limits) STATIC CONVERTER CHARACTERISTICS Resolution with No Missing Codes 12 Bits (min) LSB (max) LSB (min) INL Integral Non Linearity (Note 11) ±0.5 1.1 -1.1 DNL Differential Non Linearity ±0.2 0.55 -0.55 LSB (max) LSB (min) PGE Positive Gain Error -0.1 ±1 %FS (max) NGE Negative Gain Error 0.18 ±1 %FS (max) TC PGE Positive Gain Error Tempco −40°C ≤ TA ≤ +85°C -3 ppm/°C TC NGE Negative Gain Error Tempco −40°C ≤ TA ≤ +85°C -7 ppm/°C VOFF Offset Error TC VOFF Offset Error Tempco 0.01 −40°C ≤ TA ≤ +85°C ±0.55 -4 %FS (max) ppm/°C Under Range Output Code 0 0 Over Range Output Code 4095 4095 REFERENCE AND ANALOG INPUT CHARACTERISTICS VCMO Common Mode Output Voltage 1.5 1.45 1.56 V (min) V (max) VCM Analog Input Common Mode Voltage 1.5 1.4 1.6 V (min) V (max) CIN VIN Input Capacitance (each pin to GND) VIN = 1.5 Vdc (Note 12) ± 0.5 V VREF Internal Reference Voltage TC VREF Internal Reference Voltage Tempco (CLK LOW) 8.5 pF (CLK HIGH) 3.5 pF 1.2 −40°C ≤ TA ≤ +85°C 1.176 1.224 V (min) V (max) 18 ppm/°C VRP Internal Reference Top 2 V VRN Internal Reference Bottom 1 V 5 www.national.com ADC12DC105 Operating Ratings Absolute Maximum Ratings (Notes 1, 3) ADC12DC105 Symbol Parameter Internal Reference Accuracy Conditions (VRP-VRN) EXTVREF External Reference Voltage Typical Limits (Note 10) Units (Limits) 1 0.89 1.06 V (Min) V (max) 1.20 1.176 1.224 V (min) V (max) Dynamic Converter Electrical Characteristics Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.3V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 105 MHz, VCM = VCMO, CL = 5 pF/pin, . Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 3, 1) Symbol Parameter Conditions Typical Limits (Note 10) Units (Limits) (Note 2) DYNAMIC CONVERTER CHARACTERISTICS, AIN = -1dBFS FPBW SNR SFDR ENOB THD H2 H3 Full Power Bandwidth Signal-to-Noise Ratio Spurious Free Dynamic Range Effective Number of Bits Total Harmonic Disortion Second Harmonic Distortion Third Harmonic Distortion SINAD Signal-to-Noise and Distortion Ratio IMD Intermodulation Distortion Crosstalk www.national.com -1 dBFS Input, −3 dB Corner 1.0 GHz fIN = 10 MHz 71 dBFS fIN = 70 MHz 70.5 dBFS fIN =170 MHz 69.1 fIN = 240 MHz 68.5 dBFS fIN = 10 MHz 90 dBFS fIN = 70 MHz 86 dBFS fIN = 170 MHz 83 fIN = 240 MHz 81 dBFS fIN = 10 MHz 11.5 Bits fIN = 70 MHz 11.4 Bits fIN = 170 MHz 11.2 fIN = 240 MHz 11 dBFS fIN = 10 MHz −86 dBFS fIN = 70 MHz −85 dBFS fIN = 170 MHz −84 fIN = 240 MHz -80 dBFS fIN = 10 MHz −95 dBFS fIN = 70 MHz −90 dBFS fIN = 170 MHz −83 fIN = 240 MHz -84 dBFS fIN = 10 MHz −90 dBFS fIN = 70 MHz −86 fIN = 170 MHz −83 68 78 10.9 -76.5 -78 dBFS dBFS Bits dBFS dBFS dBFS -78 dBFS fIN = 240 MHz -81 dBFS fIN = 10 MHz 70.9 dBFS fIN = 70 MHz 70.3 fIN = 170 MHz 69 dBFS 67.4 dBFS fIN = 240 MHz 68.2 dBFS fIN = 20 MHz and 21 MHz, each -7dBFS -84 dBFS 0 MHz tested channel, fIN = 10 MHz at -1dBFS other channel -100 dBFS 6 Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.3V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 105 MHz, VCM = VCMO, CL = 5 pF/pin. Typical values are for TA = 25°C. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9) Symbol Parameter Conditions Typical (Note 10) Limits Units (Limits) 2.0 V (min) 0.8 V (max) DIGITAL INPUT CHARACTERISTICS (CLK, PD_A,PD_B) VIN(1) Logical “1” Input Voltage VD = 3.3V VIN(0) Logical “0” Input Voltage VD = 3.0V IIN(1) Logical “1” Input Current VIN = 3.3V 10 µA IIN(0) Logical “0” Input Current VIN = 0V −10 µA CIN Digital Input Capacitance 5 pF DIGITAL OUTPUT CHARACTERISTICS (DA0-DA11,DB0-DB11,DRDY) VOUT(1) Logical “1” Output Voltage IOUT = −0.5 mA , VDR = 2.4V VOUT(0) Logical “0” Output Voltage IOUT = 1.6 mA, VDR = 2.4V +ISC Output Short Circuit Source Current VOUT = 0V −10 mA −ISC Output Short Circuit Sink Current VOUT = VDR 10 mA COUT Digital Output Capacitance 5 pF 2.0 V (min) 0.4 V (max) POWER SUPPLY CHARACTERISTICS IA Analog Supply Current Full Operation IDR Digital Output Supply Current Full Operation (Note 13) 32 Power Consumption Excludes IDR (Note 13) 800 Power Down Power Consumption PD_A=PD_B=VA 33 242 7 273 mA (max) 900 mW (max) mA mW www.national.com ADC12DC105 Logic and Power Supply Electrical Characteristics ADC12DC105 Timing and AC Characteristics Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.3V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 105 MHz, VCM = VCMO, CL = 5 pF/pin. Typical values are for TA = 25°C. Timing measurements are taken at 50% of the signal amplitude. Boldface limits apply for TMIN ≤ TA ≤ TMAX. All other limits apply for TA = 25°C (Notes 8, 9) Typical (Note 10) Limits Units (Limits) Maximum Clock Frequency 105 MHz (max) Minimum Clock Frequency 20 MHz (min) Symb Parameter Conditions tCH Clock High Time 4 ns tCL Clock Low Time 4 ns tCONV Conversion Latency 7 Clock Cycles 6.7 4.6 8.8 ns (min) ns (max) tOD Output Delay of CLK to DATA Relative to rising edge of CLK tSU Data Output Setup Time Relative to DRDY 4 3 ns (min) tH Data Output Hold Time Relative to DRDY 5.5 3.8 ns (min) tAD Aperture Delay 0.6 ns tAJ Aperture Jitter 0.1 ps rms Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is guaranteed to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Operation of the device beyond the maximum Operating Ratings is not recommended. Note 2: This parameter is specified in units of dBFS - indicating the value that would be attained with a full-scale input signal. Note 3: All voltages are measured with respect to GND = AGND = DRGND = 0V, unless otherwise specified. Note 4: When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be limited to ±5 mA. The ±50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of ±5 mA to 10. Note 5: The maximum allowable power dissipation is dictated by TJ,max, the junction-to-ambient thermal resistance, (θJA), and the ambient temperature, (TA), and can be calculated using the formula PD,max = (TJ,max - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is reversed). Such conditions should always be avoided. Note 6: Human Body Model is 100 pF discharged through a 1.5 kΩ resistor. Machine Model is 220 pF discharged through 0 Ω. Note 7: Reflow temperature profiles are different for lead-free and non-lead-free packages. Note 8: The inputs are protected as shown below. Input voltage magnitudes above VA or below GND will not damage this device, provided current is limited per (Note 4). However, errors in the A/D conversion can occur if the input goes above 2.6V or below GND as described in the Operating Ratings section. 30073911 Note 9: With a full scale differential input of 2VP-P , the 12-bit LSB is 488 µV. Note 10: Typical figures are at TA = 25°C and represent most likely parametric norms at the time of product characterization. The typical specifications are not guaranteed. Note 11: Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative full-scale. Note 12: The input capacitance is the sum of the package/pin capacitance and the sample and hold circuit capacitance. Note 13: IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage, VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x f11) where VDR is the output driver power supply voltage, Cn is total capacitance on the output pin, and fn is the average frequency at which that pin is toggling. Note 14: This parameter is guaranteed by design and/or characterization and is not tested in production. www.national.com 8 APERTURE DELAY is the time after the falling edge of the clock to when the input signal is acquired or held for conversion. APERTURE JITTER (APERTURE UNCERTAINTY) is the variation in aperture delay from sample to sample. Aperture jitter manifests itself as noise in the output. CLOCK DUTY CYCLE is the ratio of the time during one cycle that a repetitive digital waveform is high to the total time of one period. The specification here refers to the ADC clock input signal. COMMON MODE VOLTAGE (VCM) is the common DC voltage applied to both input terminals of the ADC. CONVERSION LATENCY is the number of clock cycles between initiation of conversion and when that data is presented to the output driver stage. Data for any given sample is available at the output pins the Pipeline Delay plus the Output Delay after the sample is taken. New data is available at every clock cycle, but the data lags the conversion by the pipeline delay. CROSSTALK is coupling of energy from one channel into the other channel. DIFFERENTIAL NON-LINEARITY (DNL) is the measure of the maximum deviation from the ideal step size of 1 LSB. EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE BITS) is another method of specifying Signal-to-Noise and Distortion Ratio or SINAD. ENOB is defined as (SINAD 1.76) / 6.02 and says that the converter is equivalent to a perfect ADC of this (ENOB) number of bits. FULL POWER BANDWIDTH is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below its low frequency value for a full scale input. GAIN ERROR is the deviation from the ideal slope of the transfer function. It can be calculated as: Gain Error = Positive Full Scale Error − Negative Full Scale Error It can also be expressed as Positive Gain Error and Negative Gain Error, which are calculated as: PGE = Positive Full Scale Error - Offset Error NGE = Offset Error - Negative Full Scale Error INTEGRAL NON LINEARITY (INL) is a measure of the deviation of each individual code from a best fit straight line. The deviation of any given code from this straight line is measured from the center of that code value. INTERMODULATION DISTORTION (IMD) is the creation of additional spectral components as a result of two sinusoidal frequencies being applied to the ADC input at the same time. It is defined as the ratio of the power in the intermodulation products to the total power in the original frequencies. IMD is usually expressed in dBFS. LSB (LEAST SIGNIFICANT BIT) is the bit that has the smallest value or weight of all bits. This value is VFS/2n, where “VFS” is the full scale input voltage and “n” is the ADC resolution in bits. MISSING CODES are those output codes that will never appear at the ADC outputs. The ADC is guaranteed not to have any missing codes. where f1 is the RMS power of the fundamental (output) frequency and f2 through f7 are the RMS power of the first 6 harmonic frequencies in the output spectrum. SECOND HARMONIC DISTORTION (2ND HARM) is the difference expressed in dB, between the RMS power in the input frequency at the output and the power in its 2nd harmonic level at the output. THIRD HARMONIC DISTORTION (3RD HARM) is the difference, expressed in dB, between the RMS power in the input frequency at the output and the power in its 3rd harmonic level at the output. 9 www.national.com ADC12DC105 MSB (MOST SIGNIFICANT BIT) is the bit that has the largest value or weight. Its value is one half of full scale. NEGATIVE FULL SCALE ERROR is the difference between the actual first code transition and its ideal value of ½ LSB above negative full scale. OFFSET ERROR is the difference between the two input voltages [(VIN+) – (VIN-)] required to cause a transition from code 2047 to 2048. OUTPUT DELAY is the time delay after the falling edge of the clock before the data update is presented at the output pins. PIPELINE DELAY (LATENCY) See CONVERSION LATENCY. POSITIVE FULL SCALE ERROR is the difference between the actual last code transition and its ideal value of 1½ LSB below positive full scale. POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well the ADC rejects a change in the power supply voltage. PSRR is the ratio of the Full-Scale output of the ADC with the supply at the minimum DC supply limit to the FullScale output of the ADC with the supply at the maximum DC supply limit, expressed in dB. SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in dB, of the rms value of the input signal to the rms value of the sum of all other spectral components below one-half the sampling frequency, not including harmonics or DC. SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD) Is the ratio, expressed in dB, of the rms value of the input signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics but excluding d.c. SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input signal and the peak spurious signal, where a spurious signal is any signal present in the output spectrum that is not present at the input. TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dB, of the rms total of the first six harmonic levels at the output to the level of the fundamental at the output. THD is calculated as: Specification Definitions ADC12DC105 Timing Diagrams 30073909 FIGURE 1. Output Timing Transfer Characteristic 30073910 FIGURE 2. Transfer Characteristic www.national.com 10 Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.3V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 105 MHz, 50% Duty Cycle, DCS disabled, VCM = VCMO, TA = 25°C. DNL INL 30073941 30073942 11 www.national.com ADC12DC105 Typical Performance Characteristics DNL, INL ADC12DC105 Typical Performance Characteristics Unless otherwise specified, the following specifications apply: AGND = DRGND = 0V, VA = +3.3V, VDR = +2.5V, Internal VREF = +1.2V, fCLK = 105 MHz, 50% Duty Cycle, DCS disabled, VCM = VCMO, fIN = 170 MHz, TA = 25°C. SNR, SINAD, SFDR vs. VA Distortion vs. VA 30073951 30073952 SNR, SINAD, SFDR vs. Clock Duty Cycle, fIN=40 MHz Distortion vs. Clock Duty Cycle, fIN=40 MHz 30073957 30073958 SNR, SINAD, SFDR vs. Clock Duty Cycle, DCS Enabled, fIN=40 MHz Distortion vs. Clock Duty Cycle, DCS Enabled, fIN=40 MHz 30073960 30073959 www.national.com 12 ADC12DC105 SNR and SFDR vs. fIN POWER vs. fCLK 30073976 30073978 Spectral Response @ 10 MHz Input Spectral Response @ 70 MHz Input 30073968 30073969 Spectral Response @ 170 MHz Input IMD, fIN1 = 20 MHz, fIN2 = 21 MHz 30073970 30073971 13 www.national.com ADC12DC105 For single frequency sine waves the full scale error in LSB can be described as approximately: Functional Description Operating on a single +3.0V or +3.3V supply, the ADC12DC105 digitizes two differential analog input signals to 12 bits, using a differential pipelined architecture with error correction circuitry and an on-chip sample-and-hold circuit to ensure maximum performance. The user has the choice of using an internal 1.2V stable reference, or using an external 1.2V reference. Any external reference is buffered on-chip to ease the task of driving that pin. Duty cycle stabilization and output data format are selectable using the quad state function OF/DCS pin (pin 19). The output data can be set for offset binary or two's complement. EFS = 4096 ( 1 - sin (90° + dev)) Where dev is the angular difference in degrees between the two signals having a 180° relative phase relationship to each other (see Figure 4). For single frequency inputs, angular errors result in a reduction of the effective full scale input. For complex waveforms, however, angular errors will result in distortion. Applications Information 1.0 OPERATING CONDITIONS We recommend that the following conditions be observed for operation of the ADC12DC105: 2.7V ≤ VA ≤ 3.6V 2.4V ≤ VDR ≤ VA 20 MHz ≤ fCLK ≤ 105 MHz 1.2V internal reference VREF = 1.2V (for an external reference) VCM = 1.5V (from VCMO) 30073981 FIGURE 4. Angular Errors Between the Two Input Signals Will Reduce the Output Level or Cause Distortion It is recommended to drive the analog inputs with a source impedance less than 100Ω. Matching the source impedance for the differential inputs will improve even ordered harmonic performance (particularly second harmonic). Table 1 indicates the input to output relationship of the ADC12DC105. 2.0 ANALOG INPUTS 2.1 Signal Inputs 2.1.1 Differential Analog Input Pins The ADC12DC105 has a pair of analog signal input pins for each of two channels. V IN+ and VIN− form a differential input pair. The input signal, VIN, is defined as: VIN = (VIN+) – (VIN−) Figure 3 shows the expected input signal range. Note that the common mode input voltage, VCM, should be 1.5V. Using VCMO (pins 7,9) for VCM will ensure the proper input common mode level for the analog input signal. The positive peaks of the individual input signals should each never exceed 2.6V. Each analog input pin of the differential pair should have a maximum peak-to-peak voltage of 1V, be 180° out of phase with each other and be centered around VCM.The peak-topeak voltage swing at each analog input pin should not exceed the 1V or the output data will be clipped. 30073980 FIGURE 3. Expected Input Signal Range www.national.com 14 VIN+ VIN− Binary Output 2’s Complement Output VCM − VREF/2 VCM + VREF/2 00 0000 0000 00 10 0000 0000 00 VCM − VREF/4 VCM + VREF/4 01 0000 0000 00 11 0000 0000 00 VCM VCM 10 0000 0000 00 00 0000 0000 00 VCM + VREF/4 VCM − VREF/4 11 0000 0000 00 01 0000 0000 00 VCM + VREF/2 VCM − VREF/2 11 1111 1111 11 01 1111 1111 11 Negative Full-Scale Mid-Scale Positive Full-Scale Figure 5 and Figure 6 show examples of single-ended to differential conversion circuits. The circuit in Figure 5 works well for input frequencies up to approximately 70MHz, while the circuit inFigure 6 works well above 70MHz. 2.1.2 Driving the Analog Inputs The VIN+ and the VIN− inputs of the ADC12DC105 have an internal sample-and-hold circuit which consists of an analog switch followed by a switched-capacitor amplifier. 30073982 FIGURE 5. Low Input Frequency Transformer Drive Circuit 30073983 FIGURE 6. High Input Frequency Transformer Drive Circuit One short-coming of using a transformer to achieve the single-ended to differential conversion is that most RF transformers have poor low frequency performance. A differential amplifier can be used to drive the analog inputs for low frequency applications. The amplifier must be fast enough to settle from the charging glitches on the analog input resulting from the sample-and-hold operation before the clock goes high and the sample is passed to the ADC core. 2.2 Reference Pins The ADC12DC105 is designed to operate with an internal or external 1.2V reference. The internal 1.2 Volt reference is the default condition when no external reference input is applied to the VREF pin. If a voltage is applied to the VREF pin, then that voltage is used for the reference. The VREF pin should always be bypassed to ground with a 0.1 µF capacitor close to the reference input pin. Do not load this pin when using the internal reference. It is important that all grounds associated with the reference voltage and the analog input signal make connection to the ground plane at a single, quiet point to minimize the effects of noise currents in the ground path. The Reference Bypass Pins (VRP, VCMO, and VRN) for channels A and B are made available for bypass purposes. These pins should each be bypassed to AGND with a low ESL (equivalent series inductance) 0.1 µF capacitor placed very close to the pin to minimize stray inductance. A 0.1 µF capacitor should be placed between VRP and VRN as close to the pins as possible, and a 1 µF capacitor should be placed in parallel. This configuration is shown in Figure 7. It is nec- 2.1.3 Input Common Mode Voltage The input common mode voltage, VCM, should be in the range of 1.4V to 1.6V and be a value such that the peak excursions of the analog signal do not go more negative than ground or more positive than 2.6V. It is recommended to use VCMO (pins 7,9) as the input common mode voltage. If the ADC12DC105 is operated with VA=3.6V, a resistor of approximately 1KΩ should be used from the VCMO pin to AGND. This will help maintain stability over the entire temperature range when using a high supply voltage. 15 www.national.com ADC12DC105 TABLE 1. Input to Output Relationship ADC12DC105 essary to avoid reference oscillation, which could result in reduced SFDR and/or SNR. VCMO may be loaded to 1mA for use as a temperature stable 1.5V reference. The remaining pins should not be loaded. Smaller capacitor values than those specified will allow faster recovery from the power down mode, but may result in degraded noise performance. Loading any of these pins, other than VCMO may result in performance degradation. The nominal voltages for the reference bypass pins are as follows: VCMO = 1.5 V VRP = 2.0 V VRN = 1.0 V the internal capacitors can dissipate to the point where the accuracy of the output data will degrade. This is what limits the minimum sample rate. The clock line should be terminated at its source in the characteristic impedance of that line. Take care to maintain a constant clock line impedance throughout the length of the line. Refer to Application Note AN-905 for information on setting characteristic impedance. It is highly desirable that the the source driving the ADC clock pins only drive that pin. However, if that source is used to drive other devices, then each driven pin should be AC terminated with a series RC to ground, such that the resistor value is equal to the characteristic impedance of the clock line and the capacitor value is: 2.3 OF/DCS Pin Duty cycle stabilization and output data format are selectable using this quad state function pin. When enabled, duty cycle stabilization can compensate for clock inputs with duty cycles ranging from 30% to 70% and generate a stable internal clock, improving the performance of the part. With OF/DCS = VA the output data format is 2's complement and duty cycle stabilization is not used. With OF/DCS = AGND the output data format is offset binary and duty cycle stabilization is not used. With OF/DCS = (2/3)*VA the output data format is 2's complement and duty cycle stabilization is applied to the clock. If OF/DCS is (1/3)*VA the output data format is offset binary and duty cycle stabilization is applied to the clock. While the sense of this pin may be changed "on the fly," doing this is not recommended as the output data could be erroneous for a few clock cycles after this change is made. Note: This signal has no effect when SPI_EN is high and the serial control interface is enabled. where tPD is the signal propagation rate down the clock line, "L" is the line length and ZO is the characteristic impedance of the clock line. This termination should be as close as possible to the ADC clock pin but beyond it as seen from the clock source. Typical tPD is about 150 ps/inch (60 ps/cm) on FR-4 board material. The units of "L" and tPD should be the same (inches or centimeters). The duty cycle of the clock signal can affect the performance of the A/D Converter. Because achieving a precise duty cycle is difficult, the ADC12DC105 has a Duty Cycle Stabilizer. 4.0 DIGITAL OUTPUTS Digital outputs consist of the CMOS signals DA0-DA11, DB0DB11, and DRDY. The ADC12DC105 has 12 CMOS compatible data output pins corresponding to the converted input value for each channel, and a data ready (DRDY) signal that should be used to capture the output data. Valid data is present at these outputs while the PD pin is low. Data should be captured and latched with the rising edge of the DRDY signal. Be very careful when driving a high capacitance bus. The more capacitance the output drivers must charge for each conversion, the more instantaneous digital current flows through VDR and DRGND. These large charging current spikes can cause on-chip ground noise and couple into the analog circuitry, degrading dynamic performance. Adequate bypassing, limiting output capacitance and careful attention to the ground plane will reduce this problem. The result could be an apparent reduction in dynamic performance. 3.0 DIGITAL INPUTS Digital CMOS compatible inputs consist of CLK, PD_A, and PD_B. 3.1 Clock Input The CLK controls the timing of the sampling process. To achieve the optimum noise performance, the clock input should be driven with a stable, low jitter clock signal in the range indicated in the Electrical Table. The clock input signal should also have a short transition region. This can be achieved by passing a low-jitter sinusoidal clock source through a high speed buffer gate. The trace carrying the clock signal should be as short as possible and should not cross any other signal line, analog or digital, not even at 90°. The clock signal also drives an internal state machine. If the clock is interrupted, or its frequency is too low, the charge on www.national.com 16 FIGURE 7. Application Circuit 30073985 ADC12DC105 17 www.national.com ADC12DC105 The analog input should be isolated from noisy signal traces to avoid coupling of spurious signals into the input. Any external component (e.g., a filter capacitor) connected between the converter's input pins and ground or to the reference input pin and ground should be connected to a very clean point in the ground plane. All analog circuitry (input amplifiers, filters, reference components, etc.) should be placed in the analog area of the board. All digital circuitry and dynamic I/O lines should be placed in the digital area of the board. The ADC12DC105 should be between these two areas. Furthermore, all components in the reference circuitry and the input signal chain that are connected to ground should be connected together with short traces and enter the ground plane at a single, quiet point. All ground connections should have a low inductance path to ground. 5.0 POWER SUPPLY CONSIDERATIONS The power supply pins should be bypassed with a 0.1 µF capacitor and with a 100 pF ceramic chip capacitor close to each power pin. Leadless chip capacitors are preferred because they have low series inductance. As is the case with all high-speed converters, the ADC12DC105 is sensitive to power supply noise. Accordingly, the noise on the analog supply pin should be kept below 100 mVP-P. No pin should ever have a voltage on it that is in excess of the supply voltages, not even on a transient basis. Be especially careful of this during power turn on and turn off. 6.0 LAYOUT AND GROUNDING Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining separate analog and digital areas of the board, with the ADC12DC105 between these areas, is required to achieve specified performance. Capacitive coupling between the typically noisy digital circuitry and the sensitive analog circuitry can lead to poor performance. The solution is to keep the analog circuitry separated from the digital circuitry, and to keep the clock line as short as possible. Since digital switching transients are composed largely of high frequency components, total ground plane copper weight will have little effect upon the logic-generated noise. This is because of the skin effect. Total surface area is more important than is total ground plane area. Generally, analog and digital lines should cross each other at 90° to avoid crosstalk. To maximize accuracy in high speed, high resolution systems, however, avoid crossing analog and digital lines altogether. It is important to keep clock lines as short as possible and isolated from ALL other lines, including other digital lines. Even the generally accepted 90° crossing should be avoided with the clock line as even a little coupling can cause problems at high frequencies. This is because other lines can introduce jitter into the clock line, which can lead to degradation of SNR. Also, the high speed clock can introduce noise into the analog chain. Best performance at high frequencies and at high resolution is obtained with a straight signal path. That is, the signal path through all components should form a straight line wherever possible. Be especially careful with the layout of inductors and transformers. Mutual inductance can change the characteristics of the circuit in which they are used. Inductors and transformers should not be placed side by side, even with just a small part of their bodies beside each other. For instance, place transformers for the analog input and the clock input at 90° to one another to avoid magnetic coupling. www.national.com 7.0 DYNAMIC PERFORMANCE To achieve the best dynamic performance, the clock source driving the CLK input must have a sharp transition region and be free of jitter. Isolate the ADC clock from any digital circuitry with buffers, as with the clock tree shown in Figure 8. The gates used in the clock tree must be capable of operating at frequencies much higher than those used if added jitter is to be prevented. As mentioned in Section 3.1 Clock Input, it is good practice to keep the ADC clock line as short as possible and to keep it well away from any other signals. Other signals can introduce jitter into the clock signal, which can lead to reduced SNR performance, and the clock can introduce noise into other lines. Even lines with 90° crossings have capacitive coupling, so try to avoid even these 90° crossings of the clock line. 30073986 FIGURE 8. Isolating the ADC Clock from other Circuitry with a Clock Tree 18 ADC12DC105 Physical Dimensions inches (millimeters) unless otherwise noted TOP View...............................SIDE View...............................BOTTOM View 60-Lead LLP Package Ordering Number: ADC12DC105CISQ NS Package Number SQA60A 19 www.national.com ADC12DC105 Dual 12-Bit, 105 MSPS A/D Converter with CMOS Outputs Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: Products Design Support Amplifiers www.national.com/amplifiers WEBENCH www.national.com/webench Audio www.national.com/audio Analog University www.national.com/AU Clock Conditioners www.national.com/timing App Notes www.national.com/appnotes Data Converters www.national.com/adc Distributors www.national.com/contacts Displays www.national.com/displays Green Compliance www.national.com/quality/green Ethernet www.national.com/ethernet Packaging www.national.com/packaging Interface www.national.com/interface Quality and Reliability www.national.com/quality LVDS www.national.com/lvds Reference Designs www.national.com/refdesigns Power Management www.national.com/power Feedback www.national.com/feedback Switching Regulators www.national.com/switchers LDOs www.national.com/ldo LED Lighting www.national.com/led PowerWise www.national.com/powerwise Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors Wireless (PLL/VCO) www.national.com/wireless THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION (“NATIONAL”) PRODUCTS. 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