APX9132 Hall Effect Micro Switch IC Features General Description • • • The APX9132 integrated circ uit is an ultra-sensit ive, • • Micro Power Operation for Battery Applications pole independent Hall-effect switch with a latched Chopper Stabilized Amplifier digital output . A 2.5 volt t o 3.5 volt operation and a Independent of North or South Pole Magnet, unique clocking scheme reduce the average operating Easy for Manufacture power requirements, Either a north or sout h pole of Small Size Package sufficient flux will turn the output on; in the absence of Lead Free Available (RoHS Compliant) a magnetic field, t he out put is off. The polarit y independence and minimal power requirement allow t his devic e t o be easily replac ed reed swit c h for Applications s uperior for s ignal c ondit ioning. A dvanc ed CMOS proc es s ing is used to take advantage of low-voltage • • • • and low-power requirements, SOT-23 package provided Micro Switch a optimized package for most applications. Handheld Wireless Application Wake Up Switch Pin Description Clamp Shell Type Application Switch Magnet Switch in Low Duty Cycle Applications GND APX9132 VDD Ordering Information Package Code A : SOT-23 AT : SOT-23 Thin Temp. Range I : -40 to 85° C Handling Code TR : Tape & Reel Lead Free Code L : Lead Free Device Blank : Original Device APX9132 Lead Free Code Handling Code Temp. Range Package Code APX9132 A/AT: VOUT SOT-23 X: Date Code X32X No tes : ANPEC lea d-free p rod ucts contai n m old ing co mp oun ds/die attach materi als and 100 % m atte in pla te te rmin atio n fi nish ; wh ich are full y compl iant with Ro HS and compa tibl e wi th both SnPb an d le ad-free sold ieri ng op era tio ns. AN PEC le ad-free produ cts me et or exceed th e l ead -free req uireme nts of IPC /JEDEC J STD -02 0C fo r MSL classi ficati on at lea d-fre e p eak re flo w temp era ture. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 1 www.anpec.com.tw APX9132 Function Pin Descriptions No Name Function 1 VDD 2 VOUT Power Input When a magnetic field enters the hall element and exceeds the operate point BOPS (or less than BOPN ) the output turns on (output is low). When the magnetic field is below the release point BRPS (or above BRPN ), the output turns off (output is high). 3 GND Ground Connection Block Diagram VDD Awake & Sleep Timing Logic Dynamic Offset Cancellation Hall Plane Latch Circuit Chopper Amplifier Hysteresis Control VOUT GND Typical Applications VOUT VDD + APX9132 2.5V-3.5V 0.1uF GND - SOT-23 (Top View) C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 2 www.anpec.com.tw APX9132 Absolute Maximum Ratings Symbol TA = 25°C unless otherwise noted Parameter Rating Unit VDD Supply Voltage 5 V VOUT Output Voltage 5 V IOUT Output Current ±1 mA °C TJ Junction Temperature Range 150 TSTG Storage Temperature Range -65 to +150 Electrical Characteristics Symbol VDD Characteristic Supply Voltage Range TA = 25°C, VDD=3V unless otherwise noted Test Condition Operating APX9132 Min. Typ. 2.5 Supply Current V 5 10 µA Awake 1.2 2 Sleep 2 8 µA 1.0 µA IOFF Output Leakage Current VOUT=3.5V, B RPN <B<BRPS VOH Output High Voltage ISINK=-1mA VOL Output Low Voltage ISINK=1mA BRPN Bhys mV mS Duty Cycle 0.3 % Chopping Frequency 11 KHz Magnetic Characteristics BRPS 40 60 d.c. BOPN 20 Period tperiod BOPS V µs Wake up Time Symbol VDD -0.4 mA 180 tawake fc Unit 3.5 Average IDD Max. Characteristic TA = 25°C, VDD=3V unless otherwise noted Test Condition Operate Points Release Points Min. Typ. Max. 30 45 G -30 G 10 20 G 10 3 Unit -45 -20 Hysteresis C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 APX9132 -10 G G www.anpec.com.tw APX9132 Typical Characteristics Switching Points vs. Ambient Temperature Switching Points vs. Supply Voltage 40 40 30 Switching Points (G) Switching Points (G) 30 20 BRPS 10 0 BRPN -10 -20 -30 -40 -40 20 BRPS 10 0 -10 BRPN -20 -30 BOPN BOPN -40 -20 0 20 40 60 80 2.5 100 3 Ambient Temperature (°C) 4 4.5 5 Average Supply Current vs.Supply Voltage 10 20 Average Supply Current (uA) Average Supply Current (uA) 3.5 Supply Voltage (V) Average Supply Current vs. Ambient Temperature 8 6 4 2 0 -40 TA =25° C BOPS BOPS -20 0 20 40 60 80 Ambient Temperature (°C) C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 16 14 12 10 8 6 4 2 0 2.5 100 TA =25° C 18 3 3.5 4 4.5 5 Supply Voltage (V) 4 www.anpec.com.tw APX9132 Typical Characteristics Output Source Current vs. Output Voltage Output Sink Current vs. Output Voltage 10 9 Vcc=5V 4 Vcc=4V 3 2 Vcc=3V 1 0 0.2 0.4 0.6 0.8 1 Vcc=3V 5 4 3 2 1 0 0.2 0.4 0.6 0.8 1 Output Voltage (V) Output Switch Waveform Output Sink Voltage (0.5V/div) Output Switch Waveform Vcc=3V CL=12pF Vout (0.5V/div) Time (50us/div) C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 Vcc=5V 6 0 Output Voltage (V) Output Sink Voltage (0.5V/div) 7 0 0 Vcc=4V 8 Output Sink Current (mA) Output Source Current (mA) 5 Vcc=3V CL=12pF Vout (0.5V/div) Time (50us/div) 5 www.anpec.com.tw APX9132 Function Description Operation Pole-independent The output of APX9132 switches low (turns on) when The pole-independent sens ing technique allows for in pres ence of strong flux density facing the marked operat ion with either a north or south pole magnet side of package exceeds the operate point BOPS (or is orientat ion, enhancing t he manufacturabilit y of t he less than BOPN). After turn-on, the output is capable of device. The stat e-of-the-art technology provides the sinking up to 1mA and the output voltage is low (turns same output polarity for either pole in presence. on). In absence of flux density below the release point Awake & Sleep BRPS (or increased above BRPN), the APX9132 output Internal awake & sleep timing block circuit activates switc hes high (turns off). After turn-off, the output is the sensor for 180 us and deac tivates it for t he re- capable of sourcing up to 1mA and the output voltage mainder of the period (60 ms). A short “awake” time is high (turns off). The difference in the magnetic oper- allows for stabilizat ion prior t o the sensor sampling ated and released point is the hysteresis (Bhys) of the and data latching on the falling edge of the timing pulse. device. This built-in hysteresis allows clean switching While in sleep cycle the output is latched in its previ- of the output even in t he pres ence of ext ernal me- ous state. chanical bouncing vibration and electrical noise. Chopper Stabilized Technique The chopper stabiliz ed technique cancels t he misOUTPUT OFF 5V MAX BOPN matching of the hall element, the amplifier offset voltBOPS age and temperature sensitive drift by the dynamic OUTPUT VOLTAGE offset cancellation and switched capacitor technique. This technique produces devices have an extremely st able Hall output voltage, therefore t he magnet ic switch points are stable. BRPN 0 -B BRPS OUTPUT ON 0 +B MAGNETIC FLUX Application Information It is strongly recommended that an ex ternal bypass capacit or be connect ed (in close to the Hall sensor) bet ween the s upply and ground of the devic e to reduce both external noise and noise generated by the chopper-stabilization technique. This is especially true due to the relatively high impedance of battery supplies. C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 6 www.anpec.com.tw APX9132 Package Information SOT-23 D B 3 E H 2 1 e A L A1 Dim A A1 B C D E e H L C Millimeters Inches Min. Max. Min. Max. 1.00 0.00 0.35 0.10 2.70 1.40 1.30 0.10 0.51 0.25 3.10 1.80 0.039 0.000 0.014 0.004 0.106 0.055 0.051 0.004 0.020 0.010 0.122 0.071 1.90/2.1 BSC. 2.40 0.37 C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 0.075/0.083 BSC. 3.00 0.094 0.015 7 0.118 www.anpec.com.tw APX9132 Package Information SOT-23 Thin D b 3 E1 E 2 1 e e1 L1 R A2 A θ c L A1 Dim A A1 A2 b c D E E1 e e1 L L1 R θ Millimeters Min. 0.75 0.025 0.75 0.35 0.10 2.80 2.60 1.50 Inches Max. 0.80 0.05 0.775 0.51 0.20 3.00 3.00 1.70 Min. 0.028 0.001 0.029 0.014 0.004 0.109 0.101 0.059 0.95 BSC 0.037 BSC 1.90 BSC 0.37 Max. 0.031 0.002 0.030 0.020 0.008 0.117 0.117 0.066 0.074 BSC 0.60 0.014 0.10 - 0.004 - 0° 8° 0° 8° 0.60 REF C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 0.023 0.0234 REF 8 www.anpec.com.tw APX9132 Physical Specifications Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 3000 devices per reel Reflow Condition (IR/Convection or VPR Reflow) tp TP Critical Zone T L to T P Ramp-up Temperature TL tL Tsmax Tsmin Ramp-down ts Preheat 25 ° t 25 C to Peak Time Classificatin Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate 3°C/second max. 3°C/second max. (TL to T P) Preheat 100°C 150°C - Temperature Min (Tsmin) °C 150 200°C - Temperature Max (Tsmax) 60-120 seconds 60-180 seconds - Time (min to max) (ts) Time maintained above: 183°C 217°C - Temperature (TL) 60-150 seconds 60-150 seconds - Time (t L) Peak/Classificatioon Temperature (Tp) See table 1 See table 2 ° Time within 5 C of actual 10-30 seconds 20-40 seconds Peak Temperature (tp) Ramp-down Rate 6°C/second max. 6°C/second max. ° 6 minutes max. 8 minutes max. Time 25 C to Peak Temperature Notes: All temperatures refer to topside of the package .Measured on the body surface. C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 9 www.anpec.com.tw APX9132 Classificatin Reflow Profiles(Cont.) Table 1. SnPb Entectic Process – Package Peak Reflow Temperatures 3 3 Package Thickness Volume mm Volume mm <350 ≥ 350 <2.5 mm 240 +0/-5 °C 225 +0/- 5 ° C ≥ 2.5 mm 225 +0/-5 °C 225 +0/- 5 ° C Table 2. Pb-free Process – Package Classification Reflow Temperatures 3 3 3 Package Thickness Volume mm Volume mm Volume mm <350 350 -2000 >2000 <1.6 mm 260 +0 ° C * 260 +0° C* 260 +0 ° C * 1.6 mm – 2.5 mm 260 +0 ° C * 250 +0° C* 245 +0 ° C * ≥ 2.5 mm 250 +0 ° C * 245 +0° C* 245 +0 ° C * *Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0 °C. For example 260 ° C+0 °C) at the rated MSL level. Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description ° 245 C , 5 SEC 1000 Hrs Bias @ 125 °C 168 Hrs, 100 % RH , 121 ° C -65° C ~ 150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA Carrier Tape & Reel Dimensions t D P Po E P1 Bo F W Ko Ao C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 D1 10 www.anpec.com.tw APX9132 Carrier Tape & Reel Dimensions(Cont.) T2 J C A B T1 Application SOT-23 Application A B C J T1 T2 178±1 60 ± 1.0 12.0 2.5 ± 0.15 9.0 ± 0.5 1.4 F D D1 Po P1 φ0.1MIN C 4.0 J 60 ± 1.0 12.0 D φ 1.55+ 3.5 ± 0.05 0.05 3.5 ± 0.05 1.5 +0.1 A B 178±1 SOT-23 Thin P E 4.0 1.75 Ao W 8.0+ 0.3 - 0.3 Bo Ko t 2.0 ± 0.05 T1 3.1 T2 3.0 W 1.3 P 0.2 ±0.03 E 2.5 ± 0.15 9.0 ± 0.5 1.4 8.0+ 0.2 4.0 ±0.1 1.75±0.1 D1 Po P1 Ao Bo Ko t φ 1.1 ±0.1 4.0 ±0.1 2.0 ± 0.05 3.3±0.1 3.2±0.1 1.1±0.1 0.25±0.05 F (mm) Cover Tape Dimensions Application SOT- 23 SOT- 23 Thin Carrier Width 8 8 Cover Tape Width 5.3 5.3 Devices Per Reel 3000 3000 (mm) Customer Service Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 C opyright ANPEC Electronics C orp. Rev. A.1 - Nov., 2005 11 www.anpec.com.tw