AVAGO ASMT-MWE2

ASMT-Mx22 / ASMT-MxE2
Moonstone 3 W High Brightness Power LED Light Source
Data Sheet
Description
Features
The Moonstone 3W High Brightness Power LED Light
Source is a high performance energy efficient device
which can handle high thermal and high driving current.
The exposed pad design has excellent heat transfer from
the package to the motherboard.
 Available in Cool White & Warm White color
The Cool White Power LED is available in various color
temperature ranging from 4000 K to 10000 K and Warm
White Power LED ranging from 2600 K to 4000 K.
 High current operation
The low profile package design is suitable for a wide
variety of applications especially where height is a constraint.
 Silicone encapsulation
The package is compatible with reflow soldering. This
will give more freedom and flexibility to the light source
designer.
 Energy efficient
 Exposed pad for excellent heat transfer
 Suitable for reflow soldering process
 Long operation life
 Wide viewing angle
 Non-ESD sensitive (threshold > 16 kV)
 MSL 4 products
Specifications
 InGaN Technology
Applications
 3.5 V (max) at 350 mA
 Sign backlight
 110° viewing angle
 Safety, exit and emergency sign lightings
 Specialty lighting such as task lighting and reading
lights
 Retail display
 Commercial lighting
 Accent or marker lightings, strip or step lightings
 Portable lightings, bicycle head lamp, torch lights.
 Decorative lighting
 Architectural lighting
 Pathway lighting
 Street lighting
 Pedestrian street lighting
 Tunnel lighting
Package Dimensions
10.00
1
Anode
2 Cathode
3
Heat Sink
3.30
8.50
Metal Slug
1.27
3
LED
Ø 5.26
10.60
8.50
Ø 8.00
2.00
5.25
1.30
2
1
5.08
0.81
Figure 1. ASMT-Mx22 / ASMT-MxE2 package outline drawing.
Notes:
1. All dimensions are in millimeters.
2. Unless otherwise stated, the tolerance for dimension is ±0.1 mm.
3. Metal slug is connected to anode for electrically non-isolated option.
2
+
−
ZENER
Part Numbering System
ASMT – M x1 x2 x3 – N x4 x5 x6 x7
Packaging Option
Color Bin Selection
Max Flux Bin Selection
Min Flux Bin Selection
Heat Sink
2 – Electrically Isolated
Silicone Type
2 – Non-diffused
E – Diffused
Color
W – Cool White
Y – Warm White
Note:
1. Please refer to Page 8 for selection details.
Device Selection Guide (TJ = 25° C)
Luminous Flux, v [1,2] (lm)
Part Number
Color
Min.
Typ.
Max.
Test
Current
(mA)
Die
Technology
Electrically
Isolated
Metal Slug
ASMT-MW22-NNP00
Cool White
110
120
140
350
InGaN
Yes
ASMT-MY22-NMP00
Warm White
95
100
140
350
InGaN
Yes
ASMT-MWE2-NNP00
Cool White Diffused
110
115
140
350
InGaN
Yes
ASMT-MYE2-NMP00
Warm White Diffused
95
98
140
350
InGaN
Yes
Notes:
1. V is the total luminous flux output as measured with an integrating sphere at 25 ms mono pulse condition.
2. Flux tolerance is ±10%.
3
Absolute Maximum Ratings
Parameter
ASMT- Mx22 / ASMT-MxE2
Units
DC Forward Current [1]
700
mA
Peak Pulsing Current
2400
mA
Power Dissipation
2730
mW
LED Junction Temperature
125
°C
Operating Metal Slug Temperature Range at 350 mA
-40 to +110
°C
Operating Metal Slug Temperature Range at 700 mA
-40 to +95
°C
Storage Temperature Range
-40 to +120
°C
Soldering Temperature
Refer to Figure 11
Reverse Voltage [2]
Not recommended
Note:
1. Derate linearly based on Figure 9.
2. Not designed for reverse bias operation.
Optical Characteristics at 350 mA (TJ = 25° C)
Correlated Color Temperature, CCT
(Kelvin)
Viewing Angle
2½ [1] (°)
Luminous
Efficiency
(lm/W)
Part Number
Color
Min.
Max.
Typ.
Typ.
ASMT-MW22-NNP00
Cool White
4000
10000
110
107
ASMT-MY22-NMP00
Warm White
2600
4000
110
89
ASMT-MWE2-NNP00
Cool White Diffused
4000
10000
110
103
ASMT-MYE2-NMP00
Warm White Diffused
2600
4000
110
88
Notes:
1. ½ is the off-axis angle where the luminous intensity is ½ the peak intensity.
4
Electrical Characteristic at 350 mA (TJ = 25° C)
Forward Voltage,
VF (Volts)
Thermal Resistance,
Rj-ms (°C/W) [1]
Temperature Coefficient of
Forward Voltage (mV/°C),
VF/TJ
Dice Type
Min.
Typ.
Max.
Typ.
Typ.
InGaN
2.8
3.2
3.5
10
-1.5 to -3.5
Note:
1. Rj-ms is the Thermal Resistance from LED junction to metal slug.
Typical Characteristic at 700 mA (TJ = 25° C)
Luminous Flux,
V (lm)
Forward Voltage,
VF (Volts)
Typ.
Typ.
Part Number
Color
ASMT-MW22-NNP00
Cool White
205
3.6
ASMT-MY22-NMP00
Warm White
170
3.6
ASMT-MWE2-NNP00
Cool White Diffused
196
3.6
ASMT-MYE2-NMP00
Warm White Diffused
167
3.6
5
WARM WHITE
COOL WHITE
380
430
480
530 580 630
WAVELENGTH - nm
680
730
RELATIVE LUMINOUS FLUX
(NORMALIZED AT 350 mA)
RELATIVE INTENSITY
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
780
700
650
600
550
500
450
400
350
300
250
200
150
100
50
0
0.5
1
1.5
2
2.5
FORWARD VOLTAGE - V
3
3.5
4
IF
D=
0.05
0.10
0.25
0.50
1.00
0.001
0.1
PULSE DURATION, tp - sec
600
700
-60
-30
0
30
60
ANGULAR DISPLACEMENT - DEGREES
Figure 5. Radiation Pattern.
tp
T
200
300
400
500
MONO PULSE CURRENT - mA
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-90
PULSE CURRENT, Ip - A
PULSE CURRENT, IP - A
3.4
3.2
3.0 D = tp
2.8
T
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00001
100
Figure 3. Relative Luminous Flux vs. Forward Current.
Figure 4. Forward Current vs. Forward Voltage.
10
Figure 6. Maximum pulse current vs. pulse duration. Derated based on
TA = 25° C, RJ-A = 30°C/W.
6
0
NORMALIZED INTENSITY
FORWARD CURRENT - mA
Figure 2. Relative Intensity vs. Wavelength.
0
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
3.4
3.2
3.0 D = tp
2.8
T
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.00001
tp
IF
T
D=
0.05
0.10
0.25
0.50
1.00
0.001
0.1
PULSE DURATION, tp - sec
10
Figure 7. Maximum pulse current vs. pulse duration. Derated based on
TA = 85° C, RJ-A = 30°C/W.
90
RELATIVE LIGHT OUTPUT (%)
(NORMALIZED AT 25° C)
120.0
110.0
100.0
90.0
80.0
70.0
60.0
50.0
40.0
30.0
20.0
10.0
0.0
WARM WHITE
COOL WHITE
-50
-25
0
25
50
75 100
JUNCTION TEMPERATURE, TJ - °C
125
150
Figure 8. Relative Light Output vs. Junction Temperature.
800
MAX ALLOWABLE DC CURRENT - mA
MAX ALLOWABLE DC CURRENT - mA
800
700
600
500
400
RTJ-A = 20°C/W
RTJ-A = 25°C/W
RTJ-A = 30°C/W
300
200
100
0
0
20
40
60
80
100
TA - AMBIENT TEMPERATURE - °C
120
140
Figure 9. Maximum Forward Current vs. Ambient Temperature.
Derated based on TJMAX = 125° C, RJ-A = 20°C/W, 25°C/W and 30°C/W.
700
600
500
400
RTJ-MS = 10°C/W
300
200
100
0
0
20
40
60
80
100
120
TMS - METAL SLUG TEMPERATURE - °C
140
Figure 10. Maximum Forward Current vs. Metal Slug Temperature.
Derated based on TJMAX = 125° C, RJ-MS = 10°C/W.
10.70±0.10
TEMPERATURE
10 - 30 SEC.
217°C
200°C
255 - 260°C
3°C/SEC. MAX.
6°C/SEC. MAX.
150°C
8.40±0.10
17.00±0.20
1.00±0.10
3°C/SEC. MAX.
3.1±0.10
100 SEC. MAX.
60 - 120 SEC.
TIME
Figure 11. Recommended Reflow Soldering.
5.08±0.10
(Acc. to J-STD-020C)
Figure 12. Recommended soldering land pattern.
Note:
For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED
Indicator Components.
7
Option Selection Details
Flux Bin Limit [x4, x5]
Luminous Flux (lm) at IF = 350mA
ASMT – M x1 x2 x3 – N x4 x5 x6 x7
x4 – Minimum Flux Bin
x5 – Maximum Flux Bin
x6 – Color Bin Selection
x7 – Packaging Option
Bin
Min.
Max.
K
56.0
73.0
L
73.0
95.0
M
95.0
110.0
N
110.0
125.0
P
125.0
140.0
Tolerance for each bin limits is ±10%.
Color Bin Selections [x3]
Individual reel will contain parts from one color bin selection only.
Cool White
Warm White
Selection
Bin ID
Selection
Bin ID
0
Full Distribution
0
Full Distribution
A
A only
A
A only
B
B only
B
B only
C
C only
C
C only
D
D only
D
D only
E
E only
E
E only
F
F only
F
F only
G
G only
N
A and C only
H
H only
P
B and D only
L
A and G only
Q
E and C only
M
B and H only
R
F and D only
N
A and C only
U
E and F only
P
B and D only
W
C and D only
Q
E and C only
Z
A and B only
R
F and D only
1
A, B, C and D only
S
G and H only
4
C, D, E and F only
U
E and F only
W
C and D only
Z
A and B only
1
A, B, C and D only
2
G, H, A and B only
4
C, D, E and F only
8
Color Bin Limit
Cool
White
Color Limits
(Chromaticity Coordinates)
Warm
White
Color Limits
(Chromaticity Coordinates)
Bin A
X
Y
0.367
0.400
0.362
0.372
0.329
0.345
0.329
0.369
Bin A
X
Y
0.452
0.434
0.488
0.447
0.470
0.414
0.438
0.403
Bin B
X
Y
0.362
0.372
0.356
0.330
0.329
0.302
0.329
0.345
Bin B
X
Y
0.438
0.403
0.470
0.414
0.452
0.384
0.424
0.376
Bin C
X
Y
0.329
0.369
0.329
0.345
0.305
0.322
0.301
0.342
Bin C
X
Y
0.407
0.393
0.418
0.422
0.452
0.434
0.438
0.403
Bin D
X
Y
0.329
0.345
0.329
0.302
0.311
0.285
0.305
0.322
Bin D
X
Y
0.395
0.362
0.407
0.393
0.438
0.403
0.424
0.376
Bin E
X
Y
0.303
0.333
0.307
0.311
0.283
0.284
0.274
0.301
Bin E
X
Y
0.381
0.377
0.387
0.404
0.418
0.422
0.407
0.393
Bin F
X
Y
0.307
0.311
0.311
0.285
0.290
0.265
0.283
0.284
Bin F
X
Y
0.373
0.349
0.381
0.377
0.407
0.393
0.395
0.362
Bin G
X
Y
0.388
0.417
0.379
0.383
0.362
0.372
0.367
0.400
Tolerance: ± 0.01
Bin H
X
Y
0.379
0.383
0.369
0.343
0.356
0.330
0.362
0.372
0.44
0.42
0.40
G
0.38
A
4.0k
0.36
4.5k
C
B H
0.34
5.6k
Black Body Curve
0.32
7k D
E
0.30
10k
F
0.28
0.26
0.24
0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 0.42 0.44
X - COORDINATE
0.48
0.46
0.44
Y - COORDINATE
Y - COORDINATE
Tolerance: ± 0.01
A
0.42
C
0.40
0.38
0.36
E
4.0k
F
3.5k
D
3.0k
B
2.6k
Black Body Curve
0.34
0.32
0.34 0.36 0.38 0.40 0.42 0.44 0.46 0.48 0.50 0.52
X - COORDINATE
Figure 13. Color bins (Cool White).
Figure 14. Color bins (Warm White).
Packaging Option [x7]
Example
Selection
Option
ASMT-MW20-NLNZ0
0
Tube
1
Tape and Reel
ASMT-MW20-Nxxxx – Cool White, Electrically Non-isolated
Heat Sink, Non-diffused
x4 = L
– Minimum Flux Bin L
x5 = N
– Maximum Flux Bin N
x6 = Z
– Color Bin A and B only
x7 = 0
– Tube Option
9
Packing Tube – Option 0
1.00
5.80
4.65
5.50
37.00
5.45
10.10
8.30
535.00
SIDE VIEW
TOP VIEW
Figure 15. Tube dimensions
Tape & Reel – Option 1
E
A
Value
AO
8.80±0.10
BO
16.45±0.10
KO
3.60±0.1
E
1.75±0.10
F
11.50±0.10
W
24.0±0.10
P
16.0±0.10
Q'ty/Reel
250 units
B
Bo
W
F
Dim
2.5
B
A
Ko
P
SECTION A
All dimensions in millimeters.
Ao
SECTION B
Figure 16. Carrier tape dimensions
10
END
START
MINIMUM OF 160 mm
OF EMPTY COMPONENT
POCKETS SEALED WITH
COVER TAPE.
MOUNTED WITH
COMPONENTS
MINIMUM OF 390 mm OF EMPTY COMPONENT
POCKETS SEALED WITH COVER TAPE.
Figure 17. Carrier tape leader and trailer dimensions.
Reel Dimension
+1.00
24.0 −0.00
2.30
2.30
0
2.50 ± 0.50
0º
60.
99.50 ± 1.00
R10.0
0
0.5
268.00
R1
13.50
330.00 ± 1.00
120.0º
Figure 18. Reel dimensions.
11
.50
±0
± 0.50
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly or
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail information.
Moisture Sensitivity
This product is qualified as Moisture Sensitive Level 4
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
– Unopen moisture barrier bag (MBB) can be stored at
< 40°C/90%RH for 12 months. If the actual shelf life
has exceeded 12 months and the humidity indicator
card (HIC) indicates that baking is not required, then
it is safe to reflow the LEDs per the original MSL
rating.
– It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
– The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
– The LEDs must be kept at < 30°C/60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 72 hours.
C. Control for unfinished reel
– For any unused LEDs, they need to be stored in
sealed MBB with desiccant or desiccator at < 5%RH.
D. Control of assembly boards
– If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB
need to be stored in sealed MBB with desiccant
or desiccator at < 5%RH to ensure no LEDs have
exceeded their floor life of 72 hours.
E. Baking is required if
– HIC “10%” indicator is not blue and “5%” indicator is
pink.
– The LEDs are exposed to condition of > 30°C/60%RH
at any time.
– The LEDs floor life exceeded 72 hrs.
Recommended baking condition: 60±5°C for 20 hrs.
DISCLAIMER: Avago’s products and software are not specifically designed, manufactured or authorized for sale
as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear
facility or for use in medical devices or applications. Customer is solely responsible, and waives all rights to make
claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-3158EN - September 29, 2011