Features • • • • • • • • • • • Read Access Time – 100 ns Word-wide or Byte-wide Configurable 8-megabit Flash and Mask ROM Compatible Low-power CMOS Operation – 100 µA Maximum Standby – 50 mA Maximum Active at 5 MHz Wide Selection of JEDEC Standard Packages – 42-pin 600 mil PDIP – 44-lead PLCC – 44-lead SOIC (SOP) – 48-lead TSOP (12 mm x 20 mm) 5V ± 10% Power Supply High-reliability CMOS Technology – 2,000 ESD Protection – 200 mA Latch-up Immunity Rapid™ Programming Algorithm – 50 µs/Word (Typical) CMOS- and TTL-compatible Inputs and Outputs Integrated Product Identification Code Commercial and Industrial Temperature Ranges 8-megabit (512K x 16 or 1024K x 8) OTP EPROM AT27C800 Description The AT27C800 is a low-power, high-performance, 8,388,608-bit, UV-erasable, programmable read-only memory (EPROM) organized as either 512K by 16 or 1024K by (continued) Pin Configurations PDIP Top View Pin Name Function A0 - A18 Addresses O0 - O15 Outputs O15/A-1 Output/Address BYTE/VPP Byte Mode/ Program Supply CE Chip Enable OE Output Enable NC No Connect A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 Not Recommended for New Designs SOIC (SOP) NC A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC TSOP Type 1 NC A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 NC NC A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 6 5 4 3 2 1 44 43 42 41 40 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC O11 O3 O10 O2 O9 O1 O8 O0 OE GND CE A0 7 8 9 10 11 12 13 14 15 16 17 39 38 37 36 35 34 33 32 31 30 29 18 19 20 21 22 23 24 25 26 27 28 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A12 A13 A14 A15 A16 BYTE/VPP GND O15/A-1 O7 O14 O6 O9 O2 O10 O3 O11 NC VCC O4 O12 O5 O13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 A5 A6 A7 A17 A18 NC NC A8 A9 A10 A11 PLCC Top View A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC A18 A17 A7 A6 A5 A4 A3 A2 A1 Note: PLCC Package Pin 23 is DON’T CONNECT. Rev. 0801C–05/00 1 Powered by ICminer.com Electronic-Library Service CopyRight 2003 8 bits. It requires a single 5V power supply in normal read mode operation. Any word can be accessed in less than 100 ns, eliminating the need for speed-reducing WAIT states. The x16 organization makes this part ideal for highperformance 16- and 32-bit microprocessor systems. The AT27C800 can be organized as either word-wide or byte-wide. The organization is selected via the BYTE/VPP pin. When BYTE/VPP is asserted high (VIH), the word-wide organization is selected and the O15/A-1 pin is used for O15 data output. When BYTE/VPP is asserted low (VIL), the byte-wide organization is selected and the O15/A-1 pin is used for the address pin A-1. When the AT27C800 is logically regarded as x16 (word-wide), but read in the bytewide mode, then with A-1 = VIL the lower eight bits of the 16-bit word are selected; with A-1 = VIH the upper eight bits of the 16-bit word are selected. In read mode, the AT27C800 typically consumes 15 mA. Standby mode supply current is typically less than 10 µA. The AT27C800 is available in industry-standard, JEDECapproved, one-time programmable (OTP) PLCC, PDIP, SOIC (SOP) and TSOP, as well as UV-erasable windowed Cerdip packages. The device features two-line control (CE,OE) to eliminate bus contention in high-speed systems. With high-density 512K-word or 1024K-bit storage capability, the AT27C800 allows firmware to be stored reliably and to be accessed by the system without the delays of mass storage media. Block Diagram 2 AT27C800 Powered by ICminer.com Electronic-Library Service CopyRight 2003 Atmel’s AT27C800 has additional features that ensure high quality and efficient production use. The Rapid™ Programming Algorithm reduces the time required to program the part and guarantees reliable programming. Programming time is typically only 50 µs/word. The Integrated Product Identification Code electronically identifies the device and manufacturer. This feature is used by industry-standard programming equipment to select the proper programming equipment and voltages. System Considerations Switching between active and standby conditions via the Chip Enable pin may produce transient voltage excursions. Unless accommodated by the system design, these transients may exceed datasheet limits, resulting in device non-conformance. At a minimum, a 0.1 µF high-frequency, low inherent inductance, ceramic capacitor should be utilized for each device. This capacitor should be connected between the V CC and Ground terminals of the device, as close to the device as possible. Additionally, to stabilize the supply voltage level on printed circuit boards with large EPROM arrays, a 4.7 µF bulk electrolytic capacitor should be utilized, again connected between the VCC and Ground terminals. This capacitor should be positioned as close as possible to the point where the power supply is connected to the array. AT27C800 Absolute Maximum Ratings* Temperature under Bias ................................ -55°C to +125°C *NOTICE: Storage Temperature ..................................... -65°C to +150°C Voltage on Any Pin with with Respect to Ground ..................................-2.0V to +7.0V(1) Voltage on A9 with Respect to Ground ......................................-2.0V to +14.0V(1) Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. VPP Supply Voltage with Respect to Ground .......................................-2.0V to +14.0V(1) Note: 1. Minimum voltage is -0.6V DC, which may undershoot to -2.0V for pulses of less than 20 ns. Maximum output pin voltage is Vcc + 0.75V DC, which may overshoot to + 7.0V for pulses of less than 20 ns. Operating Modes Outputs Mode\Pin CE OE Ai BYTE/VPP O0 - O7 O8 - O14 O15/A-1 Read Word-wide VIL VIL X(1) VIH DOUT DOUT DOUT VIL (1) VIL DOUT High-Z VIH (1) VIL DOUT High-Z VIL (1) X High-Z Read Byte-wide Upper Read Byte-wide Lower VIL VIL VIL X X Output Disable (1) X VIH X Standby VIH X(1) X(1) X(5) High-Z Rapid Program(2) VIL VIH Ai VPP DIN PGM Verify X VIL Ai VPP DOUT VPP High-Z VIH Identification Code PGM Inhibit VIH (4) Product Identification Notes: VIL VIH VIL (1) X A9 = VH(3) A0 = VIH or VIL A1 - A18 = VIL 1. X can be VIL or VIH. 2. Refer to the programming characteristics tables in this datasheet. 3. VH = 12.0 ± 0.5V. 4. Two identifier words may be selected. All Ai inputs are held low (VIL) except A9, which is set to VH , and A0, which is toggled low (VIL) to select the Manufacturer’s Identification word and high (VIH) to select the Device Code word. 5. Standby VCC current (ISB) is specified with VPP = VCC . VCC > VPP will cause a slight increase in ISB . 3 Powered by ICminer.com Electronic-Library Service CopyRight 2003 DC and AC Operating Conditions for Read Operation AT27C800 -10 -12 -15 0°C - 70°C 0°C - 70°C 0°C - 70°C -40°C - 85°C -40°C - 85°C -40°C - 85°C 5V ± 10% 5V ± 10% 5V ± 10% Com. Operating Temperature (Case) Ind. VCC Power Supply DC and Operating Characteristics for Read Operation Symbol Parameter Condition ILI Input Load Current ILO IPP1(2) Max Units VIN = 0V to VCC ±1.0 µA Output Leakage Current VOUT = 0V to VCC ±5.0 µA VPP(1) Read/Standby Current VPP = VCC ±10 µA ISB1 (CMOS), CE = VCC=± 0.3V 100 µA ISB2 (TTL), CE = 2.0 to VCC + 0.5V 1.0 mA f = 5 MHz, IOUT = 0 mA, CE = VIL 50 mA VCC(1) Standby Current ISB VCC Active Current Min VIL Input Low Voltage -0.6 0.8 V VIH Input High Voltage 2.0 VCC + 0.5 V VOL Output Low Voltage IOL= 2.1 mA 0.4 V VOH Output High Voltage IOH = -400 mA Notes: 2.4 V 1. VCC must be applied simultaneously or before VPP, and removed simultaneously or after VPP. 2. VPP may be connected directly to VCC except during programming. The supply current would then be the sum of ICC and IPP. AC Characteristics for Read Operation AT27C800 -10 Symbol Parameter Condition tACC(3) tCE Min -12 Max Min -15 Max Min Max Units Address to Output Delay CE = OE = VIL 100 120 150 ns (2) CE to Output Delay OE = VIL 100 120 150 ns (2,3) OE to Output Delay CE = VIL 40 40 50 ns 30 35 40 ns tOE tDF(4,5) OE or CE High to Output Float, whichever occured first tOH(4) Output Hold from Address CE or OE, whichever occured first tST BYTE High to Output Valid 100 120 150 ns tSTD BYTE Low to Output Transition 40 50 60 ns Note: 4 2,3,4,5. See the AC Waveforms for Read Operation diagram. AT27C800 Powered by ICminer.com Electronic-Library Service CopyRight 2003 5.0 5.0 5.0 ns AT27C800 Byte-wide Read Mode AC Waveforms(1) A18 Note: 1. BYTE/VPP = VIL Byte-wide Read Mode AC Waveforms(1) A18 Note: 1. BYTE/VPP = VIH BYTE Transition AC Waveforms A0 - A18 VALID A-1 VALID tOH tACC BYTE/VPP tST O0 - O7 DATA OUT tOH O8 - O15 DATA OUT HI-Z DATA OUT tSTD Notes: 1. Timing measurement references are 0.8V and 2.0V. Input AC drive levels are 0.45V and 2.4V, unless otherwise specified. 2. OE may be delayed up to tCE - tOE after the falling edge of CE without impact on tCE. 3. OE may be delayed up to tACC - tOE after the address is valid without impact on tACC. 4. This parameter is only sampled and is not 100% tested. 5. Output float is defined as the point when data is no longer driven. 5 Powered by ICminer.com Electronic-Library Service CopyRight 2003 Input Test Waveforms and Measurement Levels Output Test Load tR, tF < 20 ns (10% to 90%) Note: CL = 100 pF including jig capacitance. Pin Capacitance f = 1 MHz, T = 25°C(1) Symbol Typ Max Units Conditions CIN 4 10 pF VIN = 0V COUT 8 12 pF VOUT = 0V Note: 6 1. Typical values for nominal supply voltage. This parameter is only sampled and is not 100% tested. AT27C800 Powered by ICminer.com Electronic-Library Service CopyRight 2003 AT27C800 Programming Waveforms(1) Notes: 1. The Input Timing reference is 0.8V for VIL and 2.0V for VIH. 2. tOE and tDFP are characteristics of the device but must be accommodated by the programmer. 3. When programming the AT27C800, a 0.1 µF capacitor is required across VPP and ground to suppress voltage transients. DC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits Symbol Parameter Test Conditions ILI Input Load Current VIN = VIL, VIH VIL Input Low Level VIH Input High Level VOL Output Low Voltage IOL = 2.1 mA VOH Output High Voltage IOH = -400 µA ICC2 VCC Supply Current (Program and Verify) IPP2 VPP Supply Current VID A9 Product Identification Voltage Min Max Units ±10 µA -0.6 0.8 V 2.0 VCC + 0.5 V 0.4 V 2.4 CE = VIL 11.5 V 50 mA 30 mA 12.5 V 7 Powered by ICminer.com Electronic-Library Service CopyRight 2003 AC Programming Characteristics TA = 25 ± 5°C, VCC = 6.5 ± 0.25V, VPP = 13.0 ± 0.25V Limits (1) Symbol Parameter tAS Address Setup Time tOES OE Setup Time tDS Data Setup Time tAH Address Hold Time tDH Data Hold Time Input Rise and Fall Times: (10% to 90%) 20 ns Input Pulse Levels: 0.45V to 2.4V (2) tDFP OE High to Output Float Delay tVPS VPP Setup Time tVCS VCC Setup Time Input Pulse Levels: Input Timing Reference Level: 0.8V to 2.0V (3) CE Program Pulse Width tOE Data Valid from OE tPRT BYTE /VPP Pulse Rise Time During Programming Max Output Timing Reference Level: 0.8V to 2.0V Units 2 µs 2 µs 2 µs 0 µs 2 µs 0 0.8V to 2.0V tPW Notes: Min Test Conditions 130 ns 2 µs 2 µs 47.5 50 52.5 µs 150 ns ns 1. Vcc must be applied simultaneously or before VPP and removed simultaneously or after VPP. 2. This parameter is only sampled and is not 100% tested. Output Float is defined as the point where data is no longer driven— see timing diagram. 3. Program Pulse width tolerance is 50 µs ± 5%. Atmel’s 27C800 Integrated Product Identification Code Pins A0 Codes O15 O14 O13 O12 O11 O10 O9 O8 O7 O6 O5 O4 O3 O2 O1 O0 Hex Data Manufacturer 0 0 0 0 1 1 1 1 0 1E1E Device Type 1 1 1 1 1 1 0 0 0 F8F8 8 AT27C800 Powered by ICminer.com Electronic-Library Service CopyRight 2003 AT27C800 Rapid Programming Algorithm A 50 µs CE pulse width is used to program. The address is set to the first location. VCC is raised to 6.5V and BYTE/VPP is raised to 13.0V. Each address is first programmed with one 50 µs CE pulse without verification. Then a verification/reprogramming loop is executed for each address. In the event a word fails to pass verification, up to 10 successive 50 µs pulses are applied with a verification after each pulse. If the word fails to verify after 10 pulses have been applied, the part is considered failed. After the word verifies properly, the next address is selected until all have been checked. VPP is then lowered to 5.0V and VCC to 5.0V. All words are read again and compared with the original data to determine if the device passes or fails. 9 Powered by ICminer.com Electronic-Library Service CopyRight 2003 Ordering Information ICC (mA) tACC (ns) Active Standby Ordering Code Package 100 50 0.1 AT27C800-10JC AT27C800-10PC AT27C800-10RC AT27C800-10TC 44J 42P6 44R 48T Commercial (0°C to 70°C) 50 0.1 AT27C800-10JI AT27C800-10PI AT27C800-10RI AT27C800-10TI 44J 42P6 44R 48T Industrial (-40°C to 85°C) 50 0.1 AT27C800-12JC AT27C800-12PC AT27C800-12RC AT27C800-12TC 44J 42P6 44R 48T Commercial (0°C to 70°C) 50 0.1 AT27C800-12JI AT27C800-12PI AT27C800-12RI AT27C800-12TI 44J 42P6 44R 48T Industrial (-40°C to 85°C) 50 0.1 AT27C800-15JC AT27C800-15PC AT27C800-15RC AT27C800-15TC 44J 42P6 44R 48T Commercial (0°C to 70°C) 50 0.1 AT27C800-15JI AT27C800-15PI AT27C800-15RI AT27C800-15TI 44J 42P6 44R 48T Industrial (-40°C to 85°C) 120 150 Package Type 44J 44-lead, Plastic J-leaded Chip Carrier (PLCC) 42P6 42-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) 44R 44-lead, 0.525" Wide, Plastic Gull Wing Small Outline Package (SOIC/SOP) 48T 48-lead, Plastic Thin Small Outline Package (TSOP) 12 x 20 mm 10 AT27C800 Powered by ICminer.com Electronic-Library Service CopyRight 2003 Operation Range AT27C800 Packaging Information 44J, 44-lead, Plastic J-leaded Chip Carrier (PLCC) Dimensions in Inches and (Millimeters) .045(1.14) X 45° PIN NO. 1 IDENTIFY .045(1.14) X 30° - 45° .012(.305) .008(.203) .630(16.0) .590(15.0) .656(16.7) SQ .650(16.5) .032(.813) .026(.660) .695(17.7) SQ .685(17.4) .050(1.27) TYP .500(12.7) REF SQ 42P6, 42-pin, 0.600" Wide, Plastic Dual Inline Package (PDIP) Dimensions in Inches and (Millimeters) .021(.533) .013(.330) .043(1.09) .020(.508) .120(3.05) .090(2.29) .180(4.57) .165(4.19) .022(.559) X 45° MAX (3X) 44R, 44-lead, 0.525" Wide, Plastic Gull Wing Small Outline (SOIC) Dimensions in Inches and (Millimeters) 48T, 48-lead, Plastic Thin Small Outline Package (TSOP) Dimensions in Millimeters and (Inches)* JEDEC OUTLINE MO-142 DD *Controlling dimension: millimeters 11 Powered by ICminer.com Electronic-Library Service CopyRight 2003 Atmel Headquarters Atmel Operations Corporate Headquarters Atmel Colorado Springs 2325 Orchard Parkway San Jose, CA 95131 TEL (408) 441-0311 FAX (408) 487-2600 Europe 1150 E. Cheyenne Mtn. Blvd. Colorado Springs, CO 80906 TEL (719) 576-3300 FAX (719) 540-1759 Atmel Rousset Atmel U.K., Ltd. Coliseum Business Centre Riverside Way Camberley, Surrey GU15 3YL England TEL (44) 1276-686-677 FAX (44) 1276-686-697 Zone Industrielle 13106 Rousset Cedex France TEL (33) 4-4253-6000 FAX (33) 4-4253-6001 Asia Atmel Asia, Ltd. Room 1219 Chinachem Golden Plaza 77 Mody Road Tsimhatsui East Kowloon Hong Kong TEL (852) 2721-9778 FAX (852) 2722-1369 Japan Atmel Japan K.K. 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 Japan TEL (81) 3-3523-3551 FAX (81) 3-3523-7581 Fax-on-Demand North America: 1-(800) 292-8635 International: 1-(408) 441-0732 e-mail [email protected] Web Site http://www.atmel.com BBS 1-(408) 436-4309 © Atmel Corporation 2000. Atmel Corporation makes no warranty for the use of its products, other than those expressly contained in the Company’s standard warranty which is detailed in Atmel’s Terms and Conditions located on the Company’s web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Atmel are granted by the Company in connection with the sale of Atmel products, expressly or by implication. Atmel’s products are not authorized for use as critical components in life suppor t devices or systems. Marks bearing ® and/or ™ are registered trademarks and trademarks of Atmel Corporation. Terms and product names in this document may be trademarks of others. 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