SEOUL AWT803-S

Z-Power LED
X10490
Technical
Data
Sheet
Specification
AWT803-S
SSC
Drawn
Approval
CUSTOMER
Approval
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
Contents
1. Description
2.
Absolute Maximum Ratings
3. Electro-Optical Characteristics
4. Characteristic Graph
5.
Reliability Test Item and Condition
6. Color & Binning
7. Outline Dimension
8. Packing
9. Soldering
10. Precaution for use
11. Handling of Silicone Resin LEDs
Rev. 01
April 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
AWT803-S
1. Description
This surface-mount LED comes in PLCC
standard package dimension. It has a
substrate made up of a molded plastic
reflector sitting on top of a bent lead
frame. The die is attached within the
reflector cavity and the cavity is
encapsulated by epoxy or silicone.
The package design coupled with careful
selection of component materials allow
these products to perform with high
reliability in a larger temperature range -40℃
to 100℃. The high reliability feature is
crucial to Automotive interior and Indoor
ESS.
Features
• White colored SMT package
• InGaN/Sic material
• Suitable for all SMT assembly
and soldering methods
• Pb-Free Reflow soldering
application
• RoHS compliant
Applications
• White Back-light
• Electric Signs and Signals
• Interior automotive
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings*1
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
111
mW
Forward Current
IF
30
mA
90
mA
Peak Forward Current
IFM
*2
Reverse Voltage
VR
5
V
Operating Temperature
Topr
-40 ~ +100
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electro-Optical characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
VF
IF =20mA
2.7
3.3
3.7
V
Reverse Current
IR
VR=5V
-
-
10
µA
Luminous Intensity*1
IV
IF =20mA
1,100
1,500
2,100
mcd
IF =20mA
-
115
-
deg.
1.5kΩ ;
100pF
1
-
-
KV
Viewing Angle *2
ESD ( HBM )
2θ
½
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical
axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
Rev. 01
April 2008
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Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
(Ta=25 OC )
(Ta=25 OC )
2.0
Relative Luminous Intensity [%]
Forward Current IF [mA]
1.8
1
10
0
10
2.6
2.8
3.0
3.2
3.4
3.6
3.8
4.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
4.2
0
10
Forward Voltage VF (V)
20
30
40
Forward Current IF [mA]
Forward Current Derating Curve
Radiation Diagram
40
0
Forward Current IF [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Characteristic Graph
-30
30
30
-60
20
60
10
90
-90
0
-40
-20
0
20
40
60
80
100
120
Ambient Temperature TA [OC]
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
5 Reliability
Item
Reference
Test Condition
Duration
/ Cycle
Number
of
Damage
Thermal Shock
Internal
Reference
Ta =-40oC (30MIN) ~ 100oC (30MIN)
100 Cycle
0/22
Temperature
Cycle
EIAJ ED-4701
Ta =-40oC (30MIN) ~ 25oC (5MIN)
~ 100oC (30MIN) ~ 25oC (5MIN)
100 Cycle
0/22
High Temperature
Storage
EIAJ ED-4701
Ta =100oC
1000
Hours
0/22
High Temperature
High Humidity
Storage
EIAJ ED-4701
Ta =85oC, RH=85%
1000
Hours
0/22
Low Temperature
Storage
EIAJ ED-4701
Ta =-40oC
1000
Hours
0/22
Operating
Endurance Test
Internal
Reference
Ta =25oC, IF =30mA
1000
Hours
0/22
High Temperature
High Humidity
Life Test
Internal
Reference
Ta =85oC, RH=85%, IF =15mA
1000
Hours
0/22
High Temperature
Life Test
Internal
Reference
Ta =100oC, IF =5mA
1000
Hours
0/22
Low Temperature
Life Test
Internal
Reference
Ta =-40oC, IF =30mA
1000
Hours
0/22
ESD(HBM)
MIL-STD883D
1KV at 1.5kΩ; 100pF
3 Time
0/22
Criteria for Judging the Damage
Item
Symbol
Forward Voltage
VF
Reverse Current
Luminous
Intensity
Condition
Criteria for Judgement
MIN
MAX
IF =20mA
-
USL*1 × 1.2
IR
VR=5V
-
USL*1 × 2.0
IV
IF =20mA
LSL*2 × 0.5
-
Note : *1 USL : Upper Standard Level
*2 LSL : Lower Standard Level
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
6. Color & Binning
0.9
515
0.8
520 525
530
510
535
0.7
540
545
550
555
505
560
0.6
565
570
575
580
585
590
595
600
CIE (y)
500
0.5
0.4
0.3
0.2
0.1
0.0
0.0
495
610
620
630
830
490
485
480
475
470
460
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
CI E(x)
Rev. 01
April 2008
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2700K
0.44
3000K
T1
S1
4500K
RA
WA
VA
TA
SA
R0
0.36
T0
S0
R1
0.38
W0
V0
4000K
0.40
W1
V1
3500K
0.42
Y
Z-Power LED
X10490
Technical
Data
Sheet
0.46
WB
VB
TB
2500K
2900K
3200K
SB
3700K
RB
4200K
0.34
4700K
0.34
0.36
0.38
0.40
0.42
0.44
X
● COLOR RANK
0.46
0.48
0.50
<IF=20mA, Ta=25℃>
4500K
RB
X
0.3515
0.3500
0.3649
0.3676
RA
Y
0.3487
0.3400
0.3482
0.3600
X
0.3531
0.3515
0.3676
0.3704
R0
Y
0.3605
0.3487
0.3600
0.3725
X
0.3546
0.3531
0.3704
0.3733
R1
Y
0.3717
0.3605
0.3725
0.3855
X
0.3562
0.3546
0.3733
0.3760
Y
0.3855
0.3725
0.3881
0.4020
X
0.376
0.3733
0.3997
0.4044
Y
0.3983
0.3843
0.3991
0.4127
X
0.4037
0.3985
0.4283
0.4356
Y
0.4127
0.3991
0.4058
0.4220
X
0.4356
0.4283
0.4541
0.4617
Y
0.422
0.4058
0.4150
0.4300
X
0.4617
0.4541
0.4867
0.4970
Y
0.3826
0.3717
0.3855
0.3974
4000K
SB
X
0.3676
0.3649
0.3866
0.3910
SA
Y
0.3600
0.3482
0.3618
0.3750
X
0.3704
0.3676
0.3910
0.3952
S0
Y
0.3725
0.3600
0.3750
0.3881
X
0.3733
0.3704
0.3952
0.3997
S1
Y
0.3974
0.3855
0.4020
0.4160
3500K
TB
X
0.3898
0.3860
0.4106
0.4158
TA
Y
0.3716
0.3600
0.372
0.3841
X
0.3940
0.3898
0.4158
0.4225
T0
Y
0.3843
0.3716
0.3841
0.3991
X
0.3985
0.3940
0.4225
0.4283
T1
Y
0.4140
0.3983
0.4127
0.4294
3000K
VB
X
0.4158
0.4106
0.4307
0.4381
VA
Y
0.3841
0.3720
0.3768
0.3910
X
0.4225
0.4158
0.4381
0.4457
V0
Y
0.3991
0.3841
0.3910
0.4058
X
0.4283
0.4225
0.4457
0.4541
V1
Y
0.4294
0.4127
0.422
0.4371
2700K
WB
X
0.4381
0.4307
0.4588
0.4670
WA
Y
0.3910
0.3768
0.3838
0.3979
X
0.4457
0.4381
0.4670
0.4780
W0
Y
0.4058
0.3910
0.3979
0.4150
X
0.4541
0.4457
0.4780
0.4867
* Measurement Uncertainty of the Color Coordinates : ± 0.01
W1
Y
0.4371
0.4220
0.4300
0.4466
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
Bin Code Description
Bin Code
Luminous
Intensity
CIE
Forward Voltage
J3
w0
Z3
4,700K
4,700K ~ 3,200K
Luminous Intensity (mcd)
@ IF = 20mA
Bin
Code
Min.
Max.
J2
1,200
1,500
J5
J8
1,500
1,800
1,800
2,100
Color Rank
@ IF = 20mA
RX
SX
TX
* X : B, A, 0, 1
Forward Voltage (V)
@ IF = 20mA
Bin
Code
Min.
Max.
Y
2.7
3.0
Z1
3.0
3.1
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
3,200K
3,200K ~ 2,500K
Luminous Intensity (mcd)
@ IF = 20mA
Bin
Code
Min.
Max.
J1
1,100
1,300
J3
1,300
1,600
J6
1,600
1,900
Color Rank
@ IF = 20mA
VX
WX
* X : B, A, 0, 1
Forward Voltage (V)
@ IF = 20mA
Bin
Code
Min.
Max.
Y
2.7
3.0
Z1
3.0
3.1
Z2
3.1
3.2
Z3
3.2
3.3
A1
3.3
3.4
[Note] All measurements were made under the standardized environment of SSC.
In order to ensure availability, single color rank will not be orderable.
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
7. Outline Dimension
Recommended Solder Pattern
( Tolerance: ±0.2, Unit: mm )
8. packing
( Tolerance: ±0.2, Unit: mm )
(1) Quantity : 3000pcs/Reel, 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from
the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 102 or 142
1 SIDE
c
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
RoHS
PART NUMBER :
SEOUL SEMICONDUCTOR CO., LTD.
b
a
Rev. 01
April 2008
www.ZLED.com
Z-Power LED
X10490
Technical
Data
Sheet
9. soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec. Max.
Peak-Temperature
240℃ Max.
Soldering time Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec. Max.
Peak-Temperature
260℃ Max.
Soldering time Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
(4) The encapsulated material of the LEDs is silicone.
Precautions should be taken to avoid the strong pressure on the encapsulated
part.
So when using the chip mounter, the picking up nozzle that does not affect
the silicone resign should be used.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
10. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 01
April 2008
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Z-Power LED
X10490
Technical
Data
Sheet
11. Handling of Silicone Resin LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as
possible. Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies
to LEDs without a silicone sealant, since the surface can also become scratched.
(3) When populating boards in SMT production, there are basically no restrictions
regarding the form of the pick and place nozzle, except that mechanical pressure on the
surface of the resin must be prevented.
This is assured by choosing a pick and place nozzle which is larger than the LED’s
reflector area.
(4) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to
standard encapsulants, silicone is generally softer, and the surface is more likely to
attract dust.
As mentioned previously, the increased sensitivity to dust requires special care
during processing. In cases where a minimal level of dirt and dust particles cannot be
guaranteed, a suitable cleaning solution must be applied to the surface after the
soldering of components.
(5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it
must be assured that these solvents do not dissolve the package or resin.
Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the
LED.
Rev. 01
April 2008
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