EPCOS B72735D0050H062

CeraDiode
SMD type, array, case size 1012
Series/Type:
Ordering code:
CDA6C05GTH
B72735D0050H062
Date:
Version:
2007-02-20
3
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Identification/Classification 1:(header 1 + top left header bar)
CeraDiode
Identification/Classification 2:(header 2 + bottom left header
bar)
SMD type, array, case size 1012
Ordering code:
(top right header bar)
B72735D0050H062
Series/Type:
(top right header bar)
CDA6C05GTH
Preliminary data (optional):
(if necessary)
Department:
KB S PE
Published by
Hr. Pürstinger
Rlease signed PE
Release signed QS
Modification/Remarks
New important notes template from Mrs. Kopp have been added
Date:
2007-02-20
© EPCOS AG 2007. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information
contained therein without EPCOS' prior express consent is prohibited.
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Reliable ESD protection of multiple high-speed signal lines
1:1 drop-in replacement of SOT23-6L diode packages
without change of PCB layout.
Description
Due to the ongoing miniaturization, today’s electronic devices are more and more sensitive to
electrostatic discharges (ESD). Therefore reliable protection components become absolutely
necessary to safeguard your valuable electronics against the impact of ESD.
CeraDiodes are ceramic semiconductors optimized specifically for high performance in ESD
applications. They have a non-linear voltage/current characteristic for effectively suppressing
extremely fast voltage transients and offer superior parametric stability over the complete operating
range of –40 °C to +85 °C.
CeraDiodes are bi-directional devices. A single CeraDiode connected from signal/data line to ground
routes both positive and negative ESD transitions safely to the ground plane. This technique
eliminates the need to route ESD charge into the power plane, possibly damaging nearby integrated
circuits. CeraDiodes for high-speed lines exhibits a very low capacitance designed for maximum ESD
protection combined with minimal signal distortion.
Features
•
•
•
•
•
•
•
•
•
•
•
•
Bi-directional ESD protection to IEC 61000-4-2 (level 4)
Suitable for uni- and bi-directional lines
Bi-directional ESD protection of four data lines and one supply line in a 3-fold array
Routes all ESD events, both positive and negative, safely to ground
Suitable for DC working voltages up to 5.6 V
Low capacitance: 10 pF maximum
USB 2.0 compliant
No derating of maximum ratings up to 85 °C
Surface mount package in SOT23-6L case size (inch case size 1012)
Extremely fast response time < 0.5 ns
Lead-free nickel barrier terminations suitable for lead-free soldering
RoHS-compatible
Applications
•
•
•
•
•
•
•
Interfaces (e.g. USB, IEEE 1394, Ethernet)
EDP products (e.g. desktop and notebook computers)
Peripherals (e.g. printers, memory cards, etc.)
Portable handheld products (e.g. PDA)
Mobile communication
Consumer products (Flat TVs, set top boxes, MP3 players, digital cameras, etc.)
Liquid crystal displays (LCD) / monitors
2007-02-20
Please read Important notes at
the end of this document.
Page 2 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Application examples
VDC
d+
d+
USB 2.0
controller
USB
port
VDC
GND
d_
d_
GND
MLV0155-A-E
MLV0155-B-E
Note: USB 2.0 single port line protection with high-speed array CDA6C05GTA.
d1_
d1+
VDC
VDC
USB d1+
port 1 d1_
GND
USB 2.0
controller
GND
d2+
d2 _
VDC
USB d2+
port 2 d2 _
GND
MLV0156-B-E
MLV0156-A-E
Note: USB 2.0 dual port line protection with high-speed array CDA6C05GTA.
2007-02-20
Please read Important notes at
the end of this document.
Page 3 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
USB 2.0 compliance test
Note: USB 2.0 compliance test result of high-speed array CDA6C05GTA.
Pin configuration
Pin
P1
P2
P3
P4
P5
P6
Description
I/O Line 1
GND
I/O Line 2
I/O Line 3
VDC
I/O Line 4
P6
P5
P1
P2
P4
P3
MLV0151-W
Due to the symmetrical configuration no marking information is needed. P2 and P5 can be
interchanged. The part is also working without any VDC supply.
Maximum ratings (TA = 85 °C)
Rating
Maximum DC working voltage
Peak current @ 8/20 µs (VDC to
GND)
Air discharge ESD capability
(to IEC 61000-4-2 method)
Contact discharge ESD capability
(to IEC 61000-4-2 method)
Operating temperature
(without derating)
Storage temperature
Symbol
VDC
IPP
Value
5.6
20
Unit
V
A
VESD
15
kV
VESD
8
kV
Top
–40 to +85
°C
Tstg
–40 to +125
°C
2007-02-20
Please read Important notes at
the end of this document.
Page 4 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Characteristics (TA = 25 °C)
Parameter
Symbol
Conditions
Breakdown
voltage
VBR
IBR = 1 mA
(any I/O Pin to GND)
IBR = 1 mA
(VDC to GND)
Vleak = 5.6 V
IPP = 1 A, 8/20 µs
(any I/O Pin to GND)
IPP = 1 A, 8/20 µs
(VDC to GND)
V = 1 V, f = 1 MHz
(any I/O Pin to GND)
V = 1 V, f = 1 MHz
(Any I/O Pin to I/O Pin)
VBR
Leakage current
Clamping voltage
Ileak
Vclamp
Vclamp
Capacitance
C
C
Minim
um
52
Typical
Maximum
Unit
-
-
V
14
-
-
V
-
-
1
195
µA
V
-
-
40
V
-
7
10
pF
-
3.5
5
pF
Note: Any operating voltage lower than 5.6 V results in lower leakage current.
Typical characteristics
MLV0013-Q-E
110
%
90
Permissible percentage
of max. ratings
80
70
60
50
40
30
20
10
0_
55
70
80
90
100 110 120 130
˚C
150
TA
2007-02-20
Please read Important notes at
the end of this document.
Page 5 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Dimensional drawing
Dimensions in mm
d
w
Max.
3.50
2.75
1.2
0.65
1.1
0.45
h
Min.
2.90
2.25
0.35
0.8
-
k
Symbol
l
w
h
d
e
k
e
MLV0047-C
Recommended solder pad
Dimensions in mm
E
C
Dim.
0.7
1.0
1.4
0.95
B
Symbol
A
B
C
E
A
MLV0036-R
2007-02-20
Please read Important notes at
the end of this document.
Page 6 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Recommended infrared reflow soldering temperature profile
tp
Temperature
Tp
Ramp-up
Critical zone
TL to Tp
TL
tL
T Smax
T Smin
t S Preheat
Ramp-down
25
t 25 ˚C to peak
Time
TPT0892-3-E
Profile feature
Average ramp-up rate (TSmax to
Tp)
Preheat
- Temperature min (TSmin)
- Temperature max (TSmax)
- Time (tSmin to tSmax)
Time maintained above
- Temperature min (TL)
- Time (tL)
Peak classification temperature
(Tp)
Time within 5 °C of actual peak
temperature (tp)
Ramp-down rate
Time 25 °C to peak temperature
Sn-Pb eutectic assembly
3 °C/ second max.
Pb-free assembly
3 °C/ second max.
100 °C
150 °C
60 … 120 seconds
150 °C
200 °C
60 … 180 seconds
183 °C
60 … 150 seconds
220 °C … 240 °C
217 °C
60 … 150 seconds
240 °C … 260 °C
10 … 30 seconds
20 … 40 seconds
6 °C/ second max.
6 minutes max.
6 °C/ second max.
8 minutes max.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Soldering guidelines
The usage of mild, non-activated fluxes for soldering is recommended, as well as proper cleaning of
the PCB.
The components are suitable for reflow soldering to JEDEC J-STD-020C.
2007-02-20
Please read Important notes at
the end of this document.
Page 7 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Storage conditions
As far as possible, the components shall be employed within 12 months. They should be left in their
original packing to avoid soldering problems due to oxidized contacts.
Storage temperature: –25 °C up to 45 °C
Relative humidity: < 75 % annual average, < 95 % on max. 30 days in a year.
Symbol Dim.
A
180
W1
8.4
Tolerance
+0/ –3
+1.5/ –0
W2
max.
14.4
A
Definition
Reel diameter
Reel width
(inside)
Reel width
(outside)
Direction of unreeling
Reel dimensions in mm
W1
Package: 8-mm tape
Reel material: Plastic
W2
13±0,2
_0
ø60 +2
KKE0058-I-E
Packing unit: 2000 pcs. / reel
2007-02-20
Please read Important notes at
the end of this document.
Page 8 of 10
CeraDiode
SMD type, array, case size 1012
B72735D0050H062
CDA6C05GTH
Taping to IEC 60286-3
Tape material: Blister
Section A-A
A
P0
D0
P2
F
B0
Cover tape
W
E
T
A0
T2
D1
P1
G
K0
Direction of unreeling
A
KKE0053-C-E
Dimensions and tolerances in mm:
Definition
Compartment width
Compartment length
Compartment height
Sprocket hole diameter
Compartment hole diameter
Sprocket hole pitch
Distance centre hole to centre
compartment
Pitch of the component
compartments
Tape width
Distance edge to centre of hole
Distance centre hole to centre
compartment
Distance compartment to edge
Thickness tape
Overall thickness
1) ≤ ± 0.2 mm over any 10 pitches
Symbol
A0
B0
K0
D0
D1
P0
P2
Dim.
2.8
3.5
1.8
1.5
1.0
4.0
2.0
Tolerance
± 0.2
± 0.2
max.
+0.1/ -0
min.
± 0.1 1)
± 0.05
P1
4.0
± 0.1
W
E
F
8.0
1.75
3.5
± 0.3
± 0.1
± 0.05
G
T
T2
0.75
0.3
2.5
min.
max.
max.
Note
CeraDiodes are not suitable for switching applications or for voltage stabilization, where static power
dissipation is required.
2007-02-20
Please read Important notes at
the end of this document.
Page 9 of 10
Important notes
The following applies to all products named in this publication:
1. Some parts of this publication contain statements about the suitability of our products for
certain areas of application. These statements are based on our knowledge of typical
requirements that are often placed on our products in the areas of application concerned. We
nevertheless expressly point out that such statements cannot be regarded as binding
statements about the suitability of our products for a particular customer application. As a
rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them
than the customers themselves. For these reasons, it is always ultimately incumbent on the
customer to check and decide whether an EPCOS product with the properties described in the
product specification is suitable for use in a particular customer application.
2. We also point out that in individual cases, a malfunction of passive electronic components
or failure before the end of their usual service life cannot be completely ruled out in the
current state of the art, even if they are operated as specified. In customer applications
requiring a very high level of operational safety and especially in customer applications in which
the malfunction or failure of a passive electronic component could endanger human life or health
(e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of
suitable design of the customer application or other action taken by the customer (e.g. installation
of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the
event of malfunction or failure of a passive electronic component.
3. The warnings, cautions and product-specific notes must be observed.
4. In order to satisfy certain technical requirements, some of the products described in this
publication may contain substances subject to restrictions in certain jurisdictions (e.g.
because they are classed as “hazardous”). Useful information on this will be found in our
Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more
detailed questions, please contact our sales offices.
5. We constantly strive to improve our products. Consequently, the products described in this
publication may change from time to time. The same is true of the corresponding product
specifications. Please check therefore to what extent product descriptions and specifications
contained in this publication are still applicable before or when you place an order.
We also reserve the right to discontinue production and delivery of products. Consequently,
we cannot guarantee that all products named in this publication will always be available.
6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of
the “General Terms of Delivery for Products and Services in the Electrical Industry”
published by the German Electrical and Electronics Industry Association (ZVEI).
7. The trade names EPCOS, EPCOS-JONES, BAOKE, Alu-X, CeraDiode, CSSP, MLSC,
PhaseCap, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMID, SIOV, SIP5D, SIP5K,
UltraCap, WindCap are trademarks registered or pending in Europe and in other countries.
Further information will be found on the Internet at www.epcos.com/trademarks.
Page 10 of 10