IRF IRG4PC50UD

PD 91471B
IRG4PC50UD
UltraFast CoPack IGBT
INSULATED GATE BIPOLAR TRANSISTOR WITH
ULTRAFAST SOFT RECOVERY DIODE
C
Features
• UltraFast: Optimized for high operating
frequencies 8-40 kHz in hard switching, >200
kHz in resonant mode
• Generation 4 IGBT design provides tighter
parameter distribution and higher efficiency than
Generation 3
• IGBT co-packaged with HEXFREDTM ultrafast,
ultra-soft-recovery anti-parallel diodes for use in
bridge configurations
• Industry standard TO-247AC package
VCES = 600V
VCE(on) typ. = 1.65V
G
@VGE = 15V, IC = 27A
E
n-ch an nel
Benefits
• Generation 4 IGBT's offer highest efficiencies
available
• IGBT's optimized for specific application conditions
• HEXFRED diodes optimized for performance with
IGBT's . Minimized recovery characteristics require
less/no snubbing
• Designed to be a "drop-in" replacement for equivalent
industry-standard Generation 3 IR IGBT's
TO-247AC
Absolute Maximum Ratings
Parameter
VCES
IC @ TC = 25°C
IC @ TC = 100°C
ICM
ILM
IF @ TC = 100°C
IFM
VGE
PD @ TC = 25°C
PD @ TC = 100°C
TJ
TSTG
Collector-to-Emitter Voltage
Continuous Collector Current
Continuous Collector Current
Pulsed Collector Current Q
Clamped Inductive Load Current R
Diode Continuous Forward Current
Diode Maximum Forward Current
Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 sec.
Mounting Torque, 6-32 or M3 Screw.
Max.
Units
600
55
27
220
220
25
220
± 20
200
78
-55 to +150
V
A
V
W
°C
300 (0.063 in. (1.6mm) from case)
10 lbf•in (1.1 N•m)
Thermal Resistance
Parameter
RθJC
RθJC
RθCS
RθJA
Wt
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Junction-to-Case - IGBT
Junction-to-Case - Diode
Case-to-Sink, flat, greased surface
Junction-to-Ambient, typical socket mount
Weight
Min.
Typ.
Max.
-------------------------
----------0.24
----6 (0.21)
0.64
0.83
-----40
------
Units
°C/W
g (oz)
1
12/30/00
IRG4PC50UD
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min. Typ. Max. Units
Conditions
Collector-to-Emitter Breakdown VoltageS 600 ------V
VGE = 0V, IC = 250µA
∆V(BR)CES/∆TJ Temperature Coeff. of Breakdown Voltage ---- 0.60 ---V/°C VGE = 0V, IC = 1.0mA
VCE(on)
Collector-to-Emitter Saturation Voltage
---- 1.65 2.0
IC = 27A
VGE = 15V
---- 2.0 ---V
IC = 55A
See Fig. 2, 5
---- 1.6 ---IC = 27A, TJ = 150°C
Gate Threshold Voltage
3.0 ---- 6.0
VCE = VGE, IC = 250µA
VGE(th)
∆VGE(th)/∆TJ Temperature Coeff. of Threshold Voltage ---- -13 ---- mV/°C VCE = VGE, IC = 250µA
gfe
Forward Transconductance T
16
24
---S
VCE = 100V, IC = 27A
Zero Gate Voltage Collector Current
------- 250
µA
VGE = 0V, VCE = 600V
ICES
------- 6500
VGE = 0V, VCE = 600V, TJ = 150°C
VFM
Diode Forward Voltage Drop
---- 1.3 1.7
V
IC = 25A
See Fig. 13
---- 1.2 1.5
IC = 25A, TJ = 150°C
IGES
Gate-to-Emitter Leakage Current
------- ±100 nA
VGE = ±20V
V(BR)CES
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
td(on)
tr
td(off)
tf
Eon
Eoff
Ets
td(on)
tr
td(off)
tf
Ets
LE
Cies
Coes
Cres
trr
Parameter
Total Gate Charge (turn-on)
Gate - Emitter Charge (turn-on)
Gate - Collector Charge (turn-on)
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Switching Loss
Internal Emitter Inductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Diode Reverse Recovery Time
Irr
Diode Peak Reverse Recovery Current
Qrr
Diode Reverse Recovery Charge
di(rec)M/dt
Diode Peak Rate of Fall of Recovery
During tb
2
Min.
----------------------------------------------------------------------------------
Typ.
180
25
61
46
25
140
74
0.99
0.59
1.58
44
27
240
130
2.3
13
4000
250
52
50
105
4.5
8.0
112
420
250
160
Max. Units
Conditions
270
IC = 27A
38
nC
VCC = 400V
See Fig. 8
90
VGE = 15V
---TJ = 25°C
---ns
IC = 27A, VCC = 480V
230
VGE = 15V, RG = 5.0Ω
110
Energy losses include "tail" and
---diode reverse recovery.
---mJ See Fig. 9, 10, 11, 18
1.9
---TJ = 150°C, See Fig. 9, 10, 11, 18
---ns
IC = 27A, VCC = 480V
---VGE = 15V, RG = 5.0Ω
---Energy losses include "tail" and
---mJ diode reverse recovery.
---nH
Measured 5mm from package
---VGE = 0V
---pF
VCC = 30V
See Fig. 7
---ƒ = 1.0MHz
75
ns
TJ = 25°C See Fig.
160
TJ = 125°C
14
IF = 25A
10
A
TJ = 25°C See Fig.
15
TJ = 125°C
15
VR = 200V
375
nC
TJ = 25°C See Fig.
1200
TJ = 125°C
16
di/dt 200A/µs
---A/µs TJ = 25°C
---TJ = 125°C
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IRG4PC50UD
40
D u ty c ycl e: 5 0%
T J = 1 25 °C
T sin k = 90 °C
Ga te d rive a s spe cifi ed
Tu rn -on lo sses inclu de
effe cts o f reve rse re cov ery
P o w e r D issipa tion = 4 0 W
Loa d C urre nt (A)
30
6 0 % o f rate d
v o lta g e
20
10
A
0
0.1
1
10
100
f, Freq uen cy (kH z)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = IRMS of fundamental)
1000
I C , C ollec to r-to-Em itte r C u rre nt (A)
I C , C o lle ctor-to-E m itter Cu rre n t (A )
1000
100
T J = 1 5 0 °C
10
T J = 2 5 °C
1
VGE = 15V
2 0 µ s P U L S E W ID T H
0.1
0
1
A
10
VC E , C o lle c to r-to -E m itte r V o lta g e (V )
Fig. 2 - Typical Output Characteristics
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100
TJ = 1 5 0°C
T J = 2 5 °C
10
VC C = 1 0 V
5 µ s P U LS E W ID TH A
1
4
6
8
10
12
VG E , G a te -to -E m itte r V o lta g e (V )
Fig. 3 - Typical Transfer Characteristics
3
IRG4PC50UD
2.5
V G E = 15 V
V CE , C olle ctor-to-E m itte r V oltage (V)
M aximum D C Collector Current (A )
60
50
40
30
20
10
0
25
50
75
100
125
IC = 5 4 A
2.0
IC = 2 7 A
1.5
IC = 14 A
A
1.0
150
-60
T C , C ase Tem perature (°C)
Fig. 4 - Maximum Collector Current vs.
Temperature
V G E = 1 5V
8 0 µs P U L S E W ID TH
-40
-20
0
20
40
60
80
100 120
140 160
T J , Ju n c tio n Te m p e ra tu re (°C )
Case
Fig. 5 - Typical Collector-to-Emitter Voltage
vs. Junction Temperature
T h e rm a l R e s p o n se (Z thJ C )
1
D = 0 .5 0
0 .2 0
0 .1
0 .1 0
PD M
0 .0 5
t
S IN G L E P U L S E
(T H E R M A L R E S P O N S E )
0 .0 2
t2
N ote s :
1 . D u ty f ac t or D = t
0 .0 1
0 .0 1
0 .0 0 0 0 1
1
1
/t
2
2 . P e a k TJ = P D M x Z th J C + T C
0 .0 0 0 1
0 .0 0 1
0 .0 1
0 .1
1
10
t 1 , R e c ta n g u la r P u ls e D ura tio n (s e c )
Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case
4
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IRG4PC50UD
20
V GE
C ie s
C re s
C oes
6000
=
=
=
=
0V ,
f = 1M Hz
C ge + C gc , C ce SH O R TED
C gc
C ce + C gc
V G E , Gate-to-Emitter Voltage (V)
C, Capacitance (pF)
8000
C ie s
4000
C oes
2000
C res
A
0
1
10
VC E = 400V
I C = 27A
16
12
8
4
A
0
0
100
40
Fig. 7 - Typical Capacitance vs.
Collector-to-Emitter Voltage
2.5
2.0
1.5
A
1.0
10
20
30
40
R G , G a te R e s is ta n c e (
50
Ω)
Fig. 9 - Typical Switching Losses vs. Gate
Resistance
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200
10
= 480V
= 15V
= 2 5 °C
= 27A
0
160
Fig. 8 - Typical Gate Charge vs.
Gate-to-Emitter Voltage
Total Switching Losses (mJ)
T ota l S w itching Loss es (m J)
VCC
VGE
TJ
IC
120
Q g , Total Gate Charge (nC)
V C E , C o lle c to r-to -E m itte r V o lta g e (V )
3.0
80
60
I C = 54A
I C = 27A
1
I C = 14A
0.1
RG = 5.0 Ω
VG E = 15V
VC C = 480V
-60
-40
-20
0
A
20
40
60
80
100
120
140
160
TJ , Junction Temperature (°C)
Fig. 10 - Typical Switching Losses vs.
Junction Temperature
5
IRG4PC50UD
1000
= 5 .0 Ω
= 1 5 0 °C
= 480V
= 15V
I C , Collector-to-E m itter C urrent (A)
RG
TJ
V CC
V GE
6.0
4.0
2.0
A
0.0
0
10
20
30
40
50
VGGE E= 2 0V
T J = 125 °C
S A FE O P E R A TIN G A R E A
100
10
1
60
1
I C , C o lle c to r-to-E m itte r C u rre n t (A )
10
100
1000
V C E , Collecto r-to-E m itter V oltage (V )
Fig. 12 - Turn-Off SOA
Fig. 11 - Typical Switching Losses vs.
Collector-to-Emitter Current
100
In sta n ta n e o u s F o rw a rd C u rre n t - I F (A )
T otal Sw itch ing Los ses (m J )
8.0
TJ = 1 50 °C
TJ = 1 25 °C
10
TJ = 25 °C
1
0.6
1.0
1.4
1.8
2.2
2.6
F o rw a rd V o lta g e D ro p - V FM (V )
Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current
6
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IRG4PC50UD
100
140
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
VR = 2 0 0 V
TJ = 125°C
TJ = 25°C
120
I IR R M - (A )
t rr - (ns)
100
I F = 50A
80
I F = 25A
I F = 5 0A
I F = 2 5A
10
I F = 10 A
IF = 10A
60
40
20
100
1
100
1000
di f /dt - (A/µs)
1000
d i f /d t - (A /µ s)
Fig. 14 - Typical Reverse Recovery vs. dif/dt
Fig. 15 - Typical Recovery Current vs. dif/dt
1500
10000
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
VR = 2 0 0 V
T J = 1 2 5 °C
T J = 2 5 °C
di(rec)M/dt - (A /µ s)
Q R R - (n C )
1200
900
I F = 5 0A
600
I F = 2 5A
1000
I F = 10 A
I F = 25 A
300
I F = 1 0A
0
100
d i f /d t - (A /µ s )
Fig. 16 - Typical Stored Charge vs. dif/dt
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I F = 5 0A
1000
100
100
1000
di f /dt - (A /µs)
Fig. 17 - Typical di(rec)M/dt vs. dif/dt
7
IRG4PC50UD
90% Vge
+Vge
Same ty pe
device as
D .U.T.
Vce
Ic
9 0 % Ic
10% Vce
Ic
5 % Ic
430µF
80%
of Vce
D .U .T.
td (o ff)
tf
Eoff =
∫
t1 + 5 µ S
V c e ic d t
t1
Fig. 18a - Test Circuit for Measurement of
ILM, Eon, Eoff(diode), trr, Qrr, Irr, td(on), tr, td(off), tf
t1
t2
Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining
Eoff, td(off), tf
G A T E V O L T A G E D .U .T .
1 0 % +V g
trr
Q rr =
Ic
∫
trr
id d t
tx
+Vg
tx
10% Vcc
1 0 % Irr
V cc
D UT VO LTAG E
AN D CU RRE NT
Vce
V pk
Irr
Vcc
1 0 % Ic
Ip k
9 0 % Ic
Ic
D IO D E R E C O V E R Y
W A V E FO R M S
tr
td (o n )
5% Vce
t1
∫
t2
E o n = V ce ie d t
t1
t2
E re c =
D IO D E R E V E R S E
REC OVERY ENER GY
t3
Fig. 18c - Test Waveforms for Circuit of Fig. 18a,
Defining Eon, td(on), tr
8
∫
t4
V d id d t
t3
t4
Fig. 18d - Test Waveforms for Circuit of Fig. 18a,
Defining Erec, trr, Qrr, Irr
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IRG4PC50UD
V g G A T E S IG N A L
D E V IC E U N D E R T E S T
C U R R E N T D .U .T .
V O L T A G E IN D .U .T .
C U R R E N T IN D 1
t0
t1
t2
Figure 18e. Macro Waveforms for Figure 18a's Test Circuit
L
1000V
D.U.T.
Vc*
RL=
480V
4 X IC @25°C
0 - 480V
50V
6000µ F
100 V
Figure 19. Clamped Inductive Load Test
Circuit
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Figure 20. Pulsed Collector Current
Test Circuit
9
IRG4PC50UD
Notes:
Q Repetitive rating: VGE = 20V; pulse width limited by maximum junction temperature
(figure 20)
R VCC = 80%(VCES), VGE = 20V, L = 10µH, RG = 5.0Ω (figure 19)
S Pulse width ≤ 80µs; duty factor ≤ 0.1%.
T Pulse width 5.0µs, single shot.
Case Outline — TO-247AC
3 .6 5 (.1 4 3 )
3 .5 5 (.1 4 0 )
0 .2 5 ( .0 1 0 )
1 5 .9 0 (.6 2 6 )
1 5 .3 0 (.6 0 2 )
-B-
-D-
M
D B M
-A5 .5 0 (.2 17 )
2 0 .3 0 (.8 0 0 )
1 9 .7 0 (.7 7 5 )
2X
1
2
5 .3 0 (.2 0 9 )
4 .7 0 (.1 8 5 )
2.5 0 ( .0 8 9)
1.5 0 ( .0 5 9)
4
5.5 0 (.2 1 7)
4.5 0 (.1 7 7)
LEAD
1234-
3
-C-
*
1 4 .8 0 (.5 8 3 )
1 4 .2 0 (.5 5 9 )
2 .4 0 (.0 9 4 )
2 .0 0 (.0 7 9 )
2X
5 .4 5 (.2 1 5 )
2X
4 .3 0 (.1 7 0 )
3 .7 0 (.1 4 5 )
3X
1 .4 0 ( .0 56 )
1 .0 0 ( .0 39 )
0.2 5 (.0 1 0 ) M
3 .4 0 (.1 3 3 )
3 .0 0 (.1 1 8 )
NOTE S:
1 D IM E N S IO N S & T O LE R A N C IN G
P E R A N S I Y 14 .5M , 1 98 2 .
2 C O N T R O L L IN G D IM E N S IO N : IN C H .
3 D IM E N S IO N S A R E S H O W N
M IL LIM E T E R S (IN C H E S ).
4 C O N F O R M S T O J E D E C O U T L IN E
T O -2 4 7A C .
*
A S S IG N M E N T S
GAT E
COLLECTO R
E M IT T E R
COLLECTO R
LO N G E R LE A D E D (2 0m m )
V E R S IO N A V A IL A B L E (T O -2 47 A D )
T O O R D E R A D D "-E " S U F F IX
TO PAR T NUM BER
0 .8 0 (.0 3 1 )
0 .4 0 (.0 1 6 )
2 .6 0 ( .1 0 2 )
2 .2 0 ( .0 8 7 )
3X
C A S
CO NF O RM S TO J EDEC O U TL IN E TO -2 47AC (T O -3P)
D im e n s io n s in M illim e te rs a n d (In c h e s )
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105
TAC Fax: (310) 252-7903
Visit us at www.irf.com for sales contact information.
Data and specifications subject to change without notice. 12/00
10
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