Order this document by MBRS1100T3/D SEMICONDUCTOR TECHNICAL DATA Surface Mount Power Package Motorola Preferred Device Schottky Power Rectifiers employ the use of the Schottky Barrier principle in a large area metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for low voltage, high frequency rectification, or as free wheeling and polarity protection diodes, in surface mount applications where compact size and weight are critical to the system. These state-of-the-art devices have the following features: • • • • • • SCHOTTKY BARRIER RECTIFIER 1.0 AMPERE 100 VOLTS Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling Highly Stable Oxide Passivated Junction High Blocking Voltage — 100 Volts 150°C Operating Junction Temperature Guardring for Stress Protection Mechanical Characteristics • Case: Epoxy, Molded • Weight: 95 mg (approximately) • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds • Shipped in 12 mm Tape and Reel, 2500 units per reel • Polarity: Notch in Plastic Body Indicates Cathode Lead • Marking: B110 CASE 403A–03 MAXIMUM RATINGS Rating Symbol Value Unit VRRM VRWM VR 100 Volts IF(AV) 1.0 2.0 Amps IFSM 50 Amps TJ – 65 to +150 °C dv/dt 10 V/ns RθJL 22 °C/W Maximum Instantaneous Forward Voltage (1) (iF = 1.0 A, TJ = 25°C) VF 0.75 Volts Maximum Instantaneous Reverse Current (1) (Rated dc Voltage, TJ = 25°C) (Rated dc Voltage, TJ = 100°C) iR Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current TL = 120°C TL = 100°C Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature Voltage Rate of Change THERMAL CHARACTERISTICS Thermal Resistance — Junction to Lead (TL = 25°C) ELECTRICAL CHARACTERISTICS mA 0.5 5.0 (1) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%. Preferred devices are Motorola recommended choices for future use and best overall value. Designer’s Data for “Worst Case” Conditions — The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves — representing boundaries on device characteristics — are given to facilitate “worst case” design. Rev 2 Device Rectifier Motorola, Inc. 1996 Data 1 MBRS1100T3 1K 400 200 100 40 20 10 4 2 1 0.4 0.2 0.1 0.04 0.02 0.01 20 10 2 100°C 1 0.5 25°C 0.2 0.1 0.05 0.02 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2 1.3 1.4 10 20 30 40 50 60 70 80 Figure 2. Typical Reverse Current I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 2.0 SQUARE WAVE 1.6 DC 1.2 0.8 0.4 0.5 0 Figure 1. Typical Forward Voltage TJ = 100°C 0 100°C VR, REVERSE VOLTAGE (VOLTS) 2.8 0 125°C vF, INSTANTANEOUS VOLTAGE (VOLTS) 3.2 2.4 TJ = 150°C I R , REVERSE CURRENT ( µA) TJ = 150°C 5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 100 RATED VR APPLIED RθJL = 22°C/W TJ = 100°C 3.5 3.0 DC 2.5 SQUARE WAVE 2.0 1.5 1.0 0.5 0 0 20 40 60 80 100 120 TL, LEAD TEMPERATURE (°C) Figure 3. Power Dissipation Figure 4. Current Derating, Lead 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 90 4.0 IF(AV), AVERAGE FORWARD CURRENT (AMPS) C, CAPACITANCE (pF) PF(AV), AVERAGE POWER DISSIPATION (WATTS) i F, INSTANTANEOUS FORWARD CURRENT (AMPS) TYPICAL ELECTRICAL CHARACTERISTICS 140 160 NOTE: TYPICAL CAPACITANCE NOTE: AT 0 V = 270 pF 0.1 0.2 0.5 1 2 5 10 20 50 100 VR, REVERSE VOLTAGE (VOLTS) Figure 5. Typical Capacitance 2 Rectifier Device Data MBRS1100T3 INFORMATION FOR USING THE SMB SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.089 2.261 0.108 2.743 0.085 2.159 inches mm MOUNTING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. • Always preheat the device. • The delta temperature between the preheat and soldering should be 100°C or less.* • When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10°C. Rectifier Device Data • The soldering temperature and time shall not exceed 260°C for more than 5 seconds. • When shifting from preheating to soldering, the maximum temperature gradient shall be 5°C or less. • After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. • Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. 3 MBRS1100T3 PACKAGE DIMENSIONS S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. D B C K P J INCHES DIM MIN MAX A 0.160 0.180 B 0.130 0.150 C 0.075 0.095 D 0.077 0.083 H 0.0020 0.0060 J 0.006 0.012 K 0.030 0.050 P 0.020 REF S 0.205 0.220 MILLIMETERS MIN MAX 4.06 4.57 3.30 3.81 1.90 2.41 1.96 2.11 0.051 0.152 0.15 0.30 0.76 1.27 0.51 REF 5.21 5.59 H CASE 403A–03 ISSUE B Motorola reserves the right to make changes without further notice to any products herein. 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