PANASONIC 2SK3539

Silicon MOSFETs (Small Signal)
2SK3539
Silicon N-channel MOSFET
(0.425)
Unit: mm
For switching
0.3+0.1
–0.0
0.15+0.10
–0.05
2.1±0.1
5˚
1.25±0.10
0.9+0.2
–0.1
• High-speed switching
• Wide frequency band
• Gate protection diode built-in
0.9±0.1
3
■ Features
2
0.2±0.1
1
(0.65) (0.65)
1.3±0.1
■ Absolute Maximum Ratings Ta = 25°C
Symbol
Rating
Unit
Drain-source voltage
VDS
50
V
Gate-source voltage (Drain open)
VGSO
±7
V
Drain current
ID
100
mA
Peak drain current
IDP
200
mA
Power dissipation
PD
150
mW
Channel temperature
Tch
150
°C
Storage temperature
Tstg
−55 to +150
°C
0 to 0.1
Parameter
2.0±0.2
10˚
1: Gate
2: Source
3: Drain
EIAJ: SC-70
SMini3-G1 Package
Marking Symbol: 5F
■ Electrical Characteristics Ta = 25°C ± 3°C
Parameter
Symbol
Conditions
Min
Typ
Max
ID = 10 µA, VGS = 0
Drain-source cutoff current
IDSS
VDS = 50 V, VGS = 0
1.0
µA
Gate-Source cutoff current
IGSS
VGS = ±7 V, VDS = 0
±5.0
µA
Vth
ID = 1.0 µA, VDS = 3 V
Gate threshold voltage
50
Unit
VDSS
Drain-source surrender voltage
0.9
Drain-source ON resistance
RDS(on)
ID = 10 mA, VGS = 2.5 V
Forward trancfer admitance
Yfs
ID = 10 mA, VDS = 3 V, f = 1 kHz
ID = 10 mA, VGS = 4.0 V
20
VDS = 3 V, VGS = 0, f = 1 MHz
V
1.2
1.5
V
8
15
Ω
6
12
60
mS
12
pF
Short-circuit forward transfer
capacitance (Common source)
Ciss
Short-circuit output capacitance (Common source)
Coss
7
pF
Reverse transfer capacitance (Common source)
Crss
3
pF
*
ton
VDD = 3 V, VGS = 0 V to 3 V, RL = 470 Ω
200
ns
Turn-off time *
toff
VDD = 3 V, VGS = 3 V to 0 V, RL = 470 Ω
200
ns
Turn-on time
100 µF
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: ton , toff test circuit
VOUT
470 Ω
90%
10%
VIN
VGS = 3.0 V
VDD = 3 V VOUT
10%
50 Ω
90%
ton
Publication date: January 2004
SJF00035BED
toff
1
2SK3539
PD  Ta
ID  VDS
160
VGS = 2.0 V
ID  VGS
250
Ta = 25°C
VDS = 3 V
40
Drain current ID (mA)
80
1.9 V
1.8 V
40
1.7 V
20
1.6 V
40
80
120
0
160
4
Yfs  VGS
Drain-source ON resistance RDS(on) (Ω)
VDS = 3 V
f = 1 MHz
Ta = 25°C
0.12
0.08
0.04
0
1.0
1.5
2.0
2.5
Gate-source voltage VGS (V)
3.0
3
VIN  IO
ID = 10 mA
VO = 5 V
TC = 25°C
50
40
30
20
25°C
1
Ta = 75°C
10
10−1
0
0.5
2
10
−25°C
0
1
Gate-source voltage VGS (V)
RDS(on)  VGS
60
Forward trancfer admitance Yfs (mS)
0
Drain-source voltage VDS (V)
Ambient temperature Ta (°C)
0.16
100
8
Input voltage VIN (V)
0
75°C
150
0
0
0
25°C
50
1.5 V
2
Ta = −25°C
200
120
Drain current ID (mA)
Power dissipation PD (mW)
60
0
2
4
Gate-source voltage VGS (V)
SJF00035BED
6
1
10
102
Output current IO (mA)
103
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and semiconductors described in this material
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the products or technical information described in this material and controlled under the "Foreign Exchange
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Consult our sales staff in advance for information on the following applications:
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required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
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(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
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2003 SEP