SEOUL SSC-HYT61021

*Customer:
SPECIFICATION
ITEM
MODEL
TOP LED DEVICE
SSC-HYT722
[Contents]
1. Features
------------------------------------------------------------- 2
2. Application ------------------------------------------------------------- 2
3. Absolute Maximum Ratings ------------------------------------------ 2
4. Electro-optical Characteristics ---------------------------------------- 3
5. Rank of HYT722
6. Soldering Profile
------------------------------------------
---------------------------------------------------- 5
7. Outline Dimension And Material
8. Packing
4
-------------------------------------- 6
-------------------------------------------------------------
7
9. Reel Packing Structure ------------------------------------------------- 8
10. Lot Number
-------------------------------------------------
9
11. Precaution for Use --------------------------------------------------- 10
12. Characteristic Diagram ---------------------------------------- 11
CUSTOMER
Checked by
Approved by
SUPPLIER
Drawn by
SSC-QP-7-03-08(REV.00)
Checked by
Approved by
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 1/11 -
SSC-HYT722
1. Features
Pb-free Reflow Soldering application
RoHS Compliant
Material : AlInGaP
Suitable for all SMT assembly methods ; Suitable for all soldering methods
White colored SMT package and colorless clear window
Encapsulating Resin : Epoxy Resin
2. Application
Indoor and outdoor displays
LCD Backlights etc.
Yellow – displays
Automotive
Signage and Channel letter
Indicator
3. Absolute Maximum Ratings *1
(Ta=25ºC)
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
252
mW
Forward Current
IF
90
mA
100
mA
Forward Peak Surge Current (per die)
IFM
*2
Reverse Voltage (per die)
VR
5
V
Operating Temperature
Topr
-30 ~ +85
ºC
Storage Temperature
Tstg
-40 ~ +100
ºC
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 2/11 -
SSC-HYT722
4. Electro-Optical Characteristics
(Ta=25ºC)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage (per die)
VF
IF =20 mA
1.6
2.2
2.8
V
Reverse Current (per die)
IR
VR=5V
-
-
10
µA
Luminance Intensity *1
IV
IF =60 mA
950
1400
1700
mcd
Luminance Flux
ΦV
IF =60 mA
-
4
-
lm
Dominant Wavelength
λd
IF =60 mA
582
590
598
nm
Peak Wavelength
λP
IF =60mA
-
593
-
nm
Spectral Bandwidth
∆λ
IF =60 mA
-
18
-
nm
Viewing Angle *2
2 θ½
IF =60 mA
-
120
-
deg
Optical Efficiency
η
IF =60 mA
-
30
-
lm/W
opt
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package.
Luminous Intensity Measurement allowance is ±10%.
*2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
[Note] All measurements were made under the standardized environment of SSC.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 3/11 -
SSC-HYT722
5. Rank of HYT722
▣ Rank Name Table
X1
Iv
▣ Luminous
Rank
Name
N
O
P
X2
λd
X3
Vf
Intensity [Iv ]
Iv (mcd)
MIN
MAX
950
1150
1150
1400
1400
1700
▣ Dominant Wavelength [λd]
Rank
λd (nm)
Name
MIN
MAX
582
586
A
B
586
594
C
594
598
▣ Forward Voltage
Vf (V)
Rank
Name
MIN
MAX
1
1.6
2.0
2
2.0
2.4
3
2.4
2.8
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 4/11 -
SSC-HYT722
6.Soldering Profile
(1) Reflow Soldering Conditions / Profile (Lead Free Solder)
Temp
[°C]
Tm : Reflow machine setting temp (max 30 sec.)
Ts : Surface temp of PCB (max)
Ts : Surface temp of PCB (recommend)
Ts : Surface temp of PCB (min)
260
240
220
200
Pre-heating
~
180
Cooling
-5 °C/sec
Rising
5 °C/sec
150
0
Time
[Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 5/11 -
SSC-HYT722
7. Outline Dimension And Material
Package Outlines
5
6
4
Package
Marking
(Anode)
1
2
3
Front View
Right View
Rear View
( Tolerance: ±0.2,
Recommended
Solder Pad
Circuit Diagram
Yellow
Cathode
Yellow
Cathode
Yellow
Cathode
6
5
4
Y1
Y2
Unit: mm )
Y3
1
2
3
Yellow
Anode
Yellow
Anode
Yellow
Anode
* MATERIALS
PARTS
Package
Encapsulating Resin
Electrodes
SSC-QP-7-03-08(REV.00)
MATERIALS
Heat-Resistant Polymer
Epoxy Resin
Ag Plating Copper Alloy
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 6/11 -
SSC-HYT722
8. Packing
Package
Marking
( Tolerance: ±0.2,
Unit: mm )
(1) Quantity : 700pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the
carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 7/11 -
SSC-HYT722
9. Reel Packing Structure
Reel
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER : XXXXXXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
XXX
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER : XXXXXXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
XXX
1
QUANTITY : XXXX
TOP LED
LOT NUMBER : XXXXXXXXXX
RoHS
PART NUMBER : XXXXXXXXXX
a
SEOUL SEMICONDUCTOR CO., LTD.
SSC-QP-7-03-08(REV.00)
b
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 8/11 -
SSC-HYT722
10. Lot Number
The lot number is composed of the following characters;
HYT○□□◎◎ # ~ #
HYT First Part Name
○ Year (6 for 2006, 7 for 2007, 8 for 2008 )
□□ Month ( 01 for Jan., 02 for Feb.,‥‥‥11 for Nov., 12 for Dec.)
◎◎ Day ( 01, 02, 03, 04, ‥‥‥‥‥‥28, 29, 30, 31.)
# ~# The number of the internal quality control
XXX
QUANTITY : 700
LOT NUMBER : HYT70426 01 512
PART NUMBER : HYT722
SEOUL SEMICONDUCTOR CO., LTD.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 9/11 -
SSC-HYT722
11. Precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator)
with a desiccant. Otherwise, to store them in the following environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light
transmission efficiency, causing the light intensity to drop. Attention in followed;
Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of indicator on desiccant,
components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to
normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When
washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after considering the ambient
maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry
place.
(12) The appearance and specifications of the product may be modified for improvement without notice.
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 10/11 -
SSC-HYT722
12. Characteristic Diagram
Relative Luminous Intensity vs Forward Current
Forward Current vs Forward Voltage
(per die)
(Total)
(Ta=25ºC)
(Ta=25ºC)
Relative Luminous Intensity IV/IV(25oC)[a.u.]
6
Forward Current IF[mA]
100
50
20
10
5
1
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
5
4
3
2
1
0
3.2
0
Forward Voltage VF[V]
30
(10)
60
(20)
90
(30)
120
(40)
150
(50)
180
(60)
210
(70)
240
(80)
270 300 < total
(90) (100)< per die
Forward Current IF[mA]
Forward Current Derating Curve
Radiation Diagram
(per die)
(TA=25ºC)
40
3 Chip ON
0
Foward Current IF[mA]
30
-30
30
20
-60
60
10
0
90
-90
0
20
40
60
80
100
o
Ambient Temperature TA[ C]
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD.
148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea
Phone : 82-2-2106-7305~6
- 11/11 -
SSC-HYT722