AD ADSP-21371_07

SHARC® Processor
ADSP-21371
SUMMARY
High performance 32-bit/40-bit floating point processor
optimized for high performance audio processing
Single-instruction, multiple-data (SIMD) computational
architecture
On-chip memory—1M bit of on-chip SRAM and a dedicated
4M bit of on-chip mask-programmable ROM
Code compatible with all other members of the SHARC family
The ADSP-21371 is available with a 266 MHz core instruction
rate with unique audiocentric peripherals such as the digi­
tal applications interface, serial ports, precision clock
generators, and more. For complete ordering information,
see Ordering Guide on Page 48.
CORE PRO CESSOR
TIMERS
DAG1
8 4 32
DAG2
8 4 32
JTAG TEST & EMULATIO N
4 BLOCKS O F
ON-CHIP MEMORY
INSTRUCTIO N
CACHE
3248-BIT
1M BIT RAM, 4M BIT ROM
PROGRAM
SEQUENCER
ADDR
DATA
32
64
PWM
FLAGS4-15
32
EXTERNAL PORT
4
PROCESSING
ELEMENT
(PEY)
GPIO FLAGS/
IRQ/TIMEXP
PM DA TA B U S
64
D M D A TA B U S
64
PRECISION CLOCK
G ENERATORS (4)
3
ASYNCHRONOUS
MEMO RY
INTERFACE
IOA(24)
PX REGISTER
S/PDIF (RX/TX)
S
32
DATA
11
CONTROL
24
IOD(32)
ADDRESS
IOP REGISTER (MEMORY MAPPED)
CONTROL, STATUS, & DATA BUFFERS
DAI RO UTI NG UNIT
PROCESSING
ELEMENT
(PEX)
7
SDRAM
CONTRO LLER
CONTROL PINS
DM A DD R ES S B U S
32
SERIAL PORTS (8)
SPI PORT (2)
INPUT DATA POR T/
PDAP
TWO WIRE
INTERFACE
DAI PINS
DPI PINS
DMA CONTROLLER
(30 CHANNELS)
MEMO RY-TO-MEMORY
DMA (2)
DPI ROUTING UN IT
P M A D D RE SS BU S
UART (1)
TIMERS (2)
DIGITAL PERIP HERAL INTE RFACE
DIGITAL APPLICATIONS INTERFACE
14
20
I/O PROCESSOR
Figure 1. Functional Block Diagram
SHARC and the SHARC logo are registered trademarks of Analog Devices, Inc.
Rev. 0
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However, no responsibility is assumed by Analog Devices for its use, nor for any
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Specifications subject to change without notice. No license is granted by implication
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Fax: 781.326.3113
©2007 Analog Devices, Inc. All rights reserved.
ADSP-21371
KEY FEATURES—PROCESSOR CORE
At 266 MHz (3.75 ns) core instruction rate, the ADSP-21371
performs 1.596 GFLOPs/533 MMACs
1M bit on-chip, SRAM for simultaneous access by the core
processor and DMA
4M bit on-chip, mask-programmable ROM
Dual data address generators (DAGs) with modulo and bitreverse addressing
Zero-overhead looping with single-cycle loop setup, provid­
ing efficient program sequencing
Single instruction multiple data (SIMD) architecture
provides:
Two computational processing elements
Concurrent execution
Code compatibility with other SHARC family members at
the assembly level
Parallelism in buses and computational units allows:
Single cycle executions (with or without SIMD) of a mul­
tiply operation, an ALU operation, a dual memory read
or write, and an instruction fetch
Transfers between memory and core at a sustained
4.25G bytes/second bandwidth at 266 MHz core instruc­
tion rate
INPUT/OUTPUT FEATURES
DMA controller supports:
32 DMA channels for transfers between ADSP-21371 inter­
nal memory and a variety of peripherals
32-bit DMA transfers at peripheral clock speed, in parallel
with full-speed processor execution
32-bit wide external port provides glueless connection to
both synchronous (SDRAM) and asynchronous memory
devices
Programmable wait state options: 2 to 31 SDCLK cycles
Delay-line DMA engine maintains circular buffers in exter­
nal memory with tap/offset based reads
SDRAM accesses at 133 MHz and asynchronous accesses at
44.4 MHz
4 memory select lines allows multiple external memory
devices
Digital audio interface (DAI) includes eight serial ports, four
precision clock generators, an input data port, an S/PDIF
transceiver, and a signal routing unit
Digital peripheral interface (DPI) includes, two timers, one
UART, and two SPI ports, and a 2-wire interface port
Outputs of PCG’s A and B can be routed through DAI pins
Outputs of PCG's C and D can be driven on to DAI as well as
DPI pins
Eight dual data line serial ports that operate at up to 50 Mbps
on each data line — each has a clock, frame sync, and two
data lines that can be configured as either a receiver or
transmitter pair
TDM support for telecommunications interfaces including
128 TDM channel support for newer telephony interfaces
such as H.100/H.110
Rev. 0 |
Up to 16 TDM stream support, each with 128 channels per
frame
Companding selection on a per channel basis in TDM mode
Input data port, configurable as eight channels of serial data
or seven channels of serial data and up to a 20-bit wide
parallel data channel
Signal routing unit provides configurable and flexible con­
nections between the various peripherals and the DAI/DPI
components
2 muxed flag/IRQ lines
1 muxed flag/IRQ /MS pin
1 muxed flag/Timer expired line /MS pin
S/PDIF-compatible digital audio receiver/transmitter sup­
ports EIAJ CP-340 (CP-1201), IEC-958, AES/EBU standards
Left-justified, I2S or right-justified serial data input with
16-, 18-, 20- or 24-bit word widths (transmitter)
Pulse-width modulation provides:
16 PWM outputs configured as four groups of four outputs
supports center-aligned or edge-aligned PWM waveforms
ROM based security features include:
JTAG access to memory permitted with a 64-bit key
Protected memory regions that can be assigned to limit
access under program control to sensitive code
PLL has a wide variety of software and hardware multi­
plier/divider ratios
Newly introduced “Running Reset” feature that allows a reset
of the processor core and peripherals, but without reset­
ting the PLL and SDRAM controller, or performing a boot
Dual voltage: 3.3 V I/O, 1.2 V core
Available in 208-lead MQFP package (see Ordering Guide on
Page 48)
Page 2 of 48 |
June 2007
ADSP-21371
TABLE OF CONTENTS
Summary ................................................................1
Key Features—Processor Core ..................................2
Input/Output Features ............................................2
General Description ..................................................4
ADSP-21371 Family Core Architecture .......................4
ADSP-21371 Memory .............................................5
External Memory ...................................................5
ADSP-21371 Input/Output Features ...........................7
System Design ..................................................... 10
Development Tools .............................................. 10
Additional Information ......................................... 11
Pin Function Descriptions ........................................ 12
Data Modes ........................................................ 14
Boot Modes ........................................................ 14
Core Instruction Rate to CLKIN Ratio Modes ............. 14
ADSP-21371 Specifications ....................................... 15
Operating Conditions ........................................... 15
Electrical Characteristics ........................................ 15
Absolute Maximum Ratings ................................... 16
Maximum Power Dissipation ................................. 16
Package Information ............................................ 16
ESD Sensitivity .................................................... 16
Timing Specifications ........................................... 17
Output Drive Currents .......................................... 44
Test Conditions ................................................... 44
Capacitive Loading ............................................... 44
Thermal Characteristics ........................................ 45
208-Lead MQFP Pinout ............................................ 46
Outline Dimensions ................................................ 48
Ordering Guide ...................................................... 48
REVISION HISTORY
6/07—Revision PrA to Rev. 0
Change to Table, ADSP-21371 Internal Memory Space ......6
Change to CLKOUT/RESETOUT/RUNRSTIN, Pin List ... 12
Changes in values, Memory Read—Bus Master .............. 27
Changes in values, Memory Write—Bus Master ............. 28
Changes, S/PDIF Transmitter .................................... 36
Add Diagrams for Capacitive Loading ......................... 44
Rev. 0 |
Page 3 of 48 |
June 2007
ADSP-21371
GENERAL DESCRIPTION
The ADSP-21371 SHARC processor is a member of the SIMD
SHARC family of DSPs that feature Analog Devices' Super Har­
vard Architecture. The ADSP-21371 is source code compatible
with the ADSP-2126x, ADSP-2136x, and ADSP-2116x DSPs as
well as with first generation ADSP-2106x SHARC processors in
SISD (single-instruction, single-data) mode. The ADSP-21371
is a 32-bit/40-bit floating point processors optimized for high
performance automotive audio applications with its large onchip SRAM and mask-programmable ROM, multiple internal
buses to eliminate I/O bottlenecks, and an innovative digital
applications interface (DAI).
As shown in the functional block diagram on Page 1, the
ADSP-21371 uses two computational units to deliver a signifi­
cant performance increase over the previous SHARC processors
on a range of DSP algorithms. Fabricated in a state-of-the-art,
high speed, CMOS process, the ADSP-21371 processor achieves
an instruction cycle time of 3.75 ns at 266 MHz. With its SIMD
computational hardware, the ADSP-21371 can perform
1.596 GFLOPS running at 266 MHz.
Table 1 shows performance benchmarks for the ADSP-21371.
Table 1. ADSP-21371 Benchmarks (at 266 MHz)
Speed
Benchmark Algorithm
(at 266 MHz)
1024 Point Complex FFT (Radix 4, With Reversal)
34.5 μs
FIR Filter (per Tap)1
1.88 ns
1
IIR Filter (per Biquad)
7.5 ns
Matrix Multiply (Pipelined)
[3 3] × [3 1]
16.91 ns
[4 4] × [4 1]
30.07 ns
Divide (y/×)
13.1 ns
Inverse Square Root
20.4 ns
1
Assumes two files in multichannel SIMD mode
The ADSP-21371 continues SHARC’s industry-leading stan­
dards of integration for DSPs, combining a high performance
32-bit DSP core with integrated, on-chip system features.
The block diagram of the ADSP-21371 on Page 1 illustrates the
following architectural features:
• Two processing elements, each of which comprises an
ALU, multiplier, shifter, and data register file
• On-chip mask-programmable ROM (4M bit)
• JTAG test access port
The block diagram of the ADSP-21371 on Page 1 also illustrates
the following architectural features:
• DMA controller
• Digital applications interface that includes four precision
clock generators (PCG), an S/PDIF-compatible digital
audio receiver/transmitter, an input data port (IDP), eight
serial ports, eight serial interfaces, a 20-bit parallel input
port (PDAP), and a flexible signal routing unit (DAI SRU).
• Digital peripheral interface that includes two timers, one
UART, two serial peripheral interfaces (SPI), a 2-wire
interface (TWI), and a flexible signal routing unit
(DPI SRU).
ADSP-21371 FAMILY CORE ARCHITECTURE
The ADSP-21371 is code compatible at the assembly level with
the ADSP-21375, ADSP-2136x, ADSP-2126x, ADSP-21160, and
ADSP-21161, and with the first generation ADSP-2106x
SHARC processors. The ADSP-21371 shares architectural fea­
tures with the ADSP-2126x, ADSP-2136x, and ADSP-2116x
SIMD SHARC processors, as detailed in the following sections.
SIMD Computational Engine
The ADSP-21371 contains two computational processing ele­
ments that operate as a single-instruction, multiple-data
(SIMD) engine. The processing elements are referred to as PEX
and PEY and each contains an ALU, multiplier, shifter, and reg­
ister file. PEX is always active, and PEY may be enabled by
setting the PEYEN mode bit in the MODE1 register. When this
mode is enabled, the same instruction is executed in both pro­
cessing elements, but each processing element operates on
different data. This architecture is efficient at executing math
intensive DSP algorithms.
Entering SIMD mode also has an effect on the way data is trans­
ferred between memory and the processing elements. When in
SIMD mode, twice the data bandwidth is required to sustain
computational operation in the processing elements. Because of
this requirement, entering SIMD mode also doubles the band­
width between memory and the processing elements. When
using the DAGs to transfer data in SIMD mode, two data values
are transferred with each access of memory or the register file.
• Data address generators (DAG1, DAG2)
Independent, Parallel Computation Units
• Program sequencer with instruction cache
Within each processing element is a set of computational units.
The computational units consist of an arithmetic/logic unit
(ALU), multiplier, and shifter. These units perform all opera­
tions in a single cycle. The three units within each processing
element are arranged in parallel, maximizing computational
throughput. Single multifunction instructions execute parallel
ALU and multiplier operations. In SIMD mode, the parallel
ALU and multiplier operations occur in both processing ele-
• PM and DM buses capable of supporting four 32-bit data
transfers between memory and the core at every core pro­
cessor cycle
• Two programmable interval timers with external event
counter capabilities
• On-chip SRAM (1M bit)
Rev. 0 |
Page 4 of 48 |
June 2007
ADSP-21371
ADSP-21371 MEMORY
ments. These computation units support IEEE 32-bit singleprecision floating-point, 40-bit extended precision floatingpoint, and 32-bit fixed-point data formats.
The ADSP-21371 adds the following architectural features to
the SIMD SHARC family core.
Data Register File
On-Chip Memory
A general-purpose data register file is contained in each pro­
cessing element. The register files transfer data between the
computation units and the data buses, and store intermediate
results. These 10-port, 32-register (16 primary, 16 secondary)
register files, combined with the ADSP-2136x enhanced Har­
vard architecture, allow unconstrained data flow between
computation units and internal memory. The registers in PEX
are referred to as R0-R15 and in PEY as S0-S15.
Single-Cycle Fetch of Instruction and Four Operands
The ADSP-21371 features an enhanced Harvard architecture in
which the data memory (DM) bus transfers data and the pro­
gram memory (PM) bus transfers both instructions and data
(see Figure 1 on page 1). With the ADSP-21371’s separate pro­
gram and data memory buses and on-chip instruction cache,
the processor can simultaneously fetch four operands (two over
each data bus) and one instruction (from the cache), all in a sin­
gle cycle.
Instruction Cache
The ADSP-21371 includes an on-chip instruction cache that
enables three-bus operation for fetching an instruction and four
data values. The cache is selective—only the instructions whose
fetches conflict with PM bus data accesses are cached. This
cache allows full speed execution of core, looped operations
such as digital filter multiply-accumulates, and FFT butterfly
processing.
Data Address Generators With Zero-Overhead Hardware
Circular Buffer Support
The ADSP-21371 contains 1 megabit of internal RAM and four
megabits of internal mask-programmable ROM. Each block can
be configured for different combinations of code and data stor­
age (see Table 2 on Page 6). Each memory block supports
single-cycle, independent accesses by the core processor and I/O
processor. The ADSP-21371 memory architecture, in combina­
tion with its separate on-chip buses, allow two data transfers
from the core and one from the I/O processor, in a single cycle.
The ADSP-21371’s SRAM can be configured as a maximum of
32k words of 32-bit data, 64k words of 16-bit data, 21.3k words
of 48-bit instructions (or 40-bit data), or combinations of differ­
ent word sizes up to 1 megabit. All of the memory can be
accessed as 16-bit, 32-bit, 48-bit, or 64-bit words. A 16-bit float­
ing-point storage format is supported that effectively doubles
the amount of data that may be stored on-chip. Conversion
between the 32-bit floating-point and 16-bit floating-point for­
mats is performed in a single instruction. While each memory
block can store combinations of code and data, accesses are
most efficient when one block stores data using the DM bus for
transfers, and the other block stores instructions and data using
the PM bus for transfers.
Using the DM bus and PM buses, with one bus dedicated to a
memory block, assures single-cycle execution with two data
transfers. In this case, the instruction must be available in the
cache.
EXTERNAL MEMORY
The ADSP-21371’s two data address generators (DAGs) are
used for indirect addressing and implementing circular data
buffers in hardware. Circular buffers allow efficient program­
ming of delay lines and other data structures required in digital
signal processing, and are commonly used in digital filters and
Fourier transforms. The two DAGs of the ADSP-21371 contain
sufficient registers to allow the creation of up to 32 circular buff­
ers (16 primary register sets, 16 secondary). The DAGs
automatically handle address pointer wraparound, reduce over­
head, increase performance, and simplify implementation.
Circular buffers can start and end at any memory location.
The external port on the ADSP-21371 SHARC provides a high
performance, glueless interface to a wide variety of industrystandard memory devices. The 32-bit wide bus may be used to
interface to synchronous and/or asynchronous memory devices
through the use of its separate internal memory controllers: the
first is an SDRAM controller for connection of industry-stan­
dard synchronous DRAM devices and DIMMs (dual inline
memory module), while the second is an asynchronous memory
controller intended to interface to a variety of memory devices.
Four memory select pins enable up to four separate devices to
coexist, supporting any desired combination of synchronous
and asynchronous device types. Non SDRAM external memory
address space is shown in Table 3.
Flexible Instruction Set
External Memory Execution
The 48-bit instruction word accommodates a variety of parallel
operations, for concise programming. For example, the
ADSP-21371 can conditionally execute a multiply, an add, and a
subtract in both processing elements while branching and fetch­
ing up to four 32-bit values from memory—all in a single
instruction.
In the ADSP-21371, the program sequencer can execute code
directly from external memory bank 0 (SRAM, SDRAM). This
allows a reduction in internal memory size, thereby reducing
the die area. With external execution, programs run at slower
speeds since 48-bit instructions are fetched in parts from a 32­
bit external bus coupled with the inherent latency of fetching
instructions from SDRAM. Fetching instructions from external
memory generally takes 1.5 peripheral clock cycles per
instruction.
Rev. 0 |
Page 5 of 48 |
June 2007
ADSP-21371
Table 2. ADSP-21371 Internal Memory Space
IOP Registers 0x0000 0000–0x0003 FFFF
Long Word (64 bits)
Extended Precision Normal or
Instruction Word (48 bits)
Normal Word (32 bits)
Short Word (16 bits)
BLOCK 0 ROM
0x0004 0000–0x0004 7FFF
BLOCK 0 ROM
0x0008 0000–0x0008 AAA9
BLOCK 0 ROM
0x0008 0000–0x0008 FFFF
BLOCK 0 ROM
0x0010 0000–0x0011 FFFF
Reserved
0x0004 8000–0x0004 BFFF
Reserved
0x0008 AAAA–0x0008 FFFF
Reserved
0x0009 0000–0x0009 7FFF
Reserved
0x0012 0000–0x0012 FFFF
BLOCK 0 RAM
0x0004 C000–0x0004 CFFF
BLOCK 0 RAM
0x0009 0000–0x0009 1554
BLOCK 0 RAM
0x0009 8000–0x0009 9FFF
BLOCK 0 RAM
0x0013 0000–0x0013 3FFF
Reserved
0x0004 D000–0x0004 FFFF
Reserved
0x0009 1555–0x0009 FFFF
Reserved
0x0009 A000–0x0009 FFFF
Reserved
0x0013 4000–0x0013 FFFF
BLOCK 1 ROM
0x0005 0000–0x0005 7FFF
BLOCK 1 ROM
0x000A 0000–0x000A AAA9
BLOCK 1 ROM
0x000A 0000–0x000A FFFF
BLOCK 1 ROM
0x0014 0000–0x0015 FFFF
Reserved
0x0005 8000–0x0005 BFFF
Reserved
0x000A AAAA–0x000A FFFF
Reserved
0x000B 0000–0x000B 7FFF
Reserved
0x0016 0000–0x0016 FFFF
BLOCK 1 RAM
0x0005 C000–0x0005 CFFF
BLOCK 1 RAM
0x000B 0000–0x000B 1554
BLOCK 1 RAM
0x000B 8000–0x000B 9FFF
BLOCK 1 RAM
0x0017 0000–0x0017 3FFF
Reserved
0x0005 D000–0x0005 FFFF
Reserved
0x000B 1555–0X000B FFFF
Reserved
0x000B A000–0x000B FFFF
Reserved
0x0017 4000–0x0017 FFFF
BLOCK 2 RAM
0x0006 0000–0x0006 0FFF
BLOCK 2 RAM
0x000C 0000–0x000C 1554
BLOCK 2 RAM
0X000C 0000–0X000C 1FFF
BLOCK 2 RAM
0x0018 0000–0x001B 3FFF
Reserved
0x0006 1000–0x0006 FFFF
Reserved
0x000C 1555–0x000D FFFF
Reserved
0x000C 2000–0x000D FFFF
Reserved
0x0018 4000–0x001B FFFF
BLOCK 3 RAM
0x0007 0000–0x0007 0FFF
BLOCK 3 RAM
0x000E 0000–0x000E 1554
BLOCK 3 RAM
0x000E 0000–0x000E 1FFF
BLOCK 3 RAM
0x001C 0000–0x001C 3FFF
Reserved
0x0007 1000–0x0007 FFFF
Reserved
0x000E 1555–0x000F FFFF
Reserved
0x000E 2000–0x000F FFFF
Reserved
0x001C 4000–0x001F FFFF
Rev. 0 |
Page 6 of 48 |
June 2007
ADSP-21371
SDRAM Controller
The SDRAM controller provides an interface to up to four sepa­
rate banks of industry-standard SDRAM devices or DIMMs.
Fully compliant with the SDRAM standard, each bank can has
its own memory select line (MS0–MS3), and can be configured
to contain between 16M bytes and 128M bytes of memory.
SDRAM external memory address space is shown in Table 4.
The controller maintains all of the banks as a contiguous
address space so that the processor sees this as a single address
space, even if different size devices are used in the different
banks.
A set of programmable timing parameters is available to config­
ure the SDRAM banks to support slower memory devices. The
memory banks can be configured as 16 bits wide or as 32 bits
wide.
The SDRAM controller address, data, clock, and command pins
can drive loads up to 30 pF. For larger memory systems, the
SDRAM controller external buffer timing should be selected
and external buffering should be provided so that the load on
the SDRAM controller pins does not exceed 30 pF.
ferent timing parameters, enabling connection to a wide variety
of memory devices including SRAM, ROM, flash, and EPROM,
as well as I/O devices that interface with standard memory con­
trol lines. Bank 0 occupies a 14.7M word window and banks 1, 2,
and 3 occupy a 16M word window in the processor’s address
space but, if not fully populated, these windows are not made
contiguous by the memory controller logic. The banks can also
be configured as 8-bit or 16-bit wide buses for ease of interfac­
ing to a range of memories and I/O devices tailored either to
high performance or to low cost and power.
The asynchronous memory controller is capable of a maximum
throughput of 176 Mbps using a 44 MHz external bus speed.
Other features include 8 to 32-bit and 16 to 32-bit packing and
unpacking, booting from bank select 1, and support for delay
line DMA.
ADSP-21371 INPUT/OUTPUT FEATURES
The ADSP-21371 I/O processor provides 32 channels of DMA,
as well as an extensive set of peripherals. These include a 20 lead
digital applications interface, which controls:
• Eight serial ports
• S/PDIF receiver/transmitter
Table 3. External Memory for Non SDRAM Addresses
• Four precision clock generators
Bank
Size in
Words
Address Range
Bank 0
14M
0x0020 0000 – 0x00FF FFFF
Bank 1
16M
0x0400 0000 – 0x04FF FFFF
• Two general-purpose timers
Bank 2
16M
0x0800 0000 – 0x08FF FFFF
• Two serial peripheral interfaces
Bank 3
16M
0x0C00 0000 – 0x0CFF FFFF
• One universal asynchronous receiver/transmitter (UART)
• Input data port/parallel data acquisition port
The ADSP-21371 processor also contains a 14 lead digital
peripheral interface, which controls:
• An I2C®-compatible 2-wire interface
Table 4. External Memory for SDRAM Addresses
DMA Controller
Bank
Size in
Words
Address Range
Bank 0
62M
0x0020 0000 – 0x03FF FFFF
Bank 1
64M
0x0400 0000 – 0x07FF FFFF
Bank 2
64M
0x0800 0000 – 0x0BFF FFFF
Bank 3
64M
0x0C00 0000 – 0x0FFF FFFF
Note that the external memory bank addresses shown are for
normal word accesses. If 48-bit instructions are placed in any
such bank (with two instructions packed into three 32-bit loca­
tions), then care must be taken to map data buffers in the same
bank. For example, if 2k instructions are placed starting at the
bank 0 base address (0x0020 0000), then the data buffers can be
placed starting at an address that is offset by 3k words
(0x0020 0C00).
Asynchronous Controller
The asynchronous memory controller provides a configurable
interface for up to four separate banks of memory or I/O
devices. Each bank can be independently programmed with dif­
Rev. 0 |
The ADSP-21371’s on-chip DMA controller allows data trans­
fers without processor intervention. The DMA controller
operates independently and invisibly to the processor core,
allowing DMA operations to occur while the core is simulta­
neously executing its program instructions. DMA transfers can
occur between the ADSP-21371’s internal memory and its serial
ports, the SPI-compatible (serial peripheral interface) ports, the
IDP (input data port), the parallel data acquisition port (PDAP)
or the UART. Thirty-two channels of DMA are available on the
ADSP-21371, 16 via the serial ports, eight via the input data
port, two for the UART, two for the SPI interface, two for the
external port, and two for memory-to-memory transfers. Pro­
grams can be downloaded to the ADSP-21371 using DMA
transfers. Other DMA features include interrupt generation
upon completion of DMA transfers, and DMA chaining for
automatic linked DMA transfers.
Delay Line DMA
The ADSP-21371 processor provides delay line DMA function­
ality. This allows processor reads and writes to external delay
line buffers (and hence to external memory) with limited core
interaction.
Page 7 of 48 |
June 2007
ADSP-21371
Digital Applications Interface (DAI)
The digital applications interface (DAI) provides the ability to
connect various peripherals to any of the DSP DAI pins
(DAI_P20–1).
Programs make these connections using the signal routing unit
(SRU), shown in Figure 1.
The SRU is a matrix routing unit (or group of multiplexers) that
enables the peripherals provided by the DAI to be intercon­
nected under software control. This allows easy use of the DAI
associated peripherals for a much wider variety of applications
by using a larger set of algorithms than is possible with noncon­
figurable signal paths.
The DAI also includes eight serial ports, four precision clock
generators (PCG), and an input data port (IDP). The IDP pro­
vides an additional input path to the ADSP-21371 core,
configurable as either eight channels of I2S serial data, or a sin­
gle 20-bit wide synchronous parallel data acquisition port. Each
data channel has its own DMA channel that is independent
from the ADSP-21371’s serial ports.
Serial Ports
The ADSP-21371 features eight synchronous serial ports that
provide an inexpensive interface to a wide variety of digital and
mixed-signal peripheral devices such as Analog Devices’
AD183x family of audio codecs, ADCs, and DACs. The serial
ports are made up of two data lines, a clock, and frame sync. The
data lines can be programmed to either transmit or receive and
each data line has a dedicated DMA channel.
Serial ports are enabled via eight programmable pins and simul­
taneous receive or transmit pins that support up to 16 transmit
or 16 receive channels of audio data when all four SPORTs are
enabled, or four full duplex TDM streams of 128 channels per
frame.
The serial ports operate at a maximum data rate of 50 Mbps.
Serial port data can be automatically transferred to and from
on-chip memory via dedicated DMA channels. Each of the
serial ports can work in conjunction with another serial port to
provide TDM support. One SPORT provides two transmit sig­
nals while the other SPORT provides the two receive signals.
The frame sync and clock are shared.
Serial ports operate in five modes:
• Standard DSP serial mode
• Multichannel (TDM) mode with support for packed I2S
mode
• I2S mode
• Packed I2S mode
• Left-justified sample pair mode
Left-justified sample pair mode is a mode where in each frame
sync cycle two samples of data are transmitted/received—one
sample on the high segment of the frame sync, the other on the
low segment of the frame sync. Programs have control over var­
ious attributes of this mode.
Rev. 0 |
Each of the serial ports supports the left-justified sample pair
and I2S protocols (I2S is an industry-standard interface com­
monly used by audio codecs, ADCs, and DACs such as the
Analog Devices AD183x family), with two data pins, allowing
four left-justified sample pair or I2S channels (using two stereo
devices) per serial port, with a maximum of up to 32 I2S chan­
nels. The serial ports permit little-endian or big-endian
transmission formats and word lengths selectable from 3 bits to
32 bits. For the left-justified sample pair and I2S modes, dataword lengths are selectable between 8 bits and 32 bits. Serial
ports offer selectable synchronization and transmit modes as
well as optional μ-law or A-law companding selection on a per
channel basis. Serial port clocks and frame syncs can be inter­
nally or externally generated.
The serial ports also contain frame sync error detection logic
where the serial ports detect frame syncs that arrive early (for
example frame syncs that arrive while the transmission/recep­
tion of the previous word is occurring). All the serial ports also
share one dedicated error interrupt.
S/PDIF-Compatible Digital Audio Receiver/Transmitter
The S/PDIF receiver/transmitter has no separate DMA chan­
nels. It receives audio data in serial format and converts it into a
biphase encoded signal. The serial data input to the
receiver/transmitter can be formatted as left justified, I2S or
right justified with word widths of 16, 18, 20, or 24 bits.
The serial data, clock, and frame sync inputs to the S/PDIF
receiver/transmitter are routed through the signal routing unit
(SRU). They can come from a variety of sources such as the
SPORTs, external pins, the precision clock generators (PCGs),
and are controlled by the SRU control registers.
Digital Peripheral Interface (DPI)
The digital peripheral interface provides connections to two
serial peripheral interface ports (SPI), one universal asynchro­
nous receiver-transmitter (UART), 12 flags, a 2-wire interface
(TWI), and two general-purpose timers.
Serial Peripheral (Compatible) Interface
The ADSP-21371 SHARC processor contains two serial periph­
eral interface ports (SPIs). The SPI is an industry-standard
synchronous serial link, enabling the ADSP-21371 SPI-compat­
ible port to communicate with other SPI compatible devices.
The SPI consists of two data pins, one device select pin, and one
clock pin. It is a full-duplex synchronous serial interface, sup­
porting both master and slave modes. The SPI port can operate
in a multimaster environment by interfacing with up to four
other SPI-compatible devices, either acting as a master or slave
device. The ADSP-21371 SPI-compatible peripheral implemen­
tation also features programmable baud rate and clock phase
and polarities. The ADSP-21371 SPI-compatible port uses open
drain drivers to support a multimaster configuration and to
avoid data contention.
Page 8 of 48 |
June 2007
ADSP-21371
UART Port
2-Wire Interface Port (TWI)
The ADSP-21371 processor provides a full-duplex Universal
Asynchronous Receiver/Transmitter (UART) port, which is
fully compatible with PC-standard UARTs. The UART port
provides a simplified UART interface to other peripherals or
hosts, supporting full-duplex, DMA-supported, asynchronous
transfers of serial data. The UART also has multiprocessor com­
munication capability using 9-bit address detection. This allows
it to be used in multidrop networks through the RS-485 data
interface standard. The UART port also includes support for 5
to 8 data bits, 1 or 2 stop bits, and none, even, or odd parity. The
UART port supports two modes of operation:
The TWI is a bidirectional 2-wire, serial bus used to move 8-bit
data while maintaining compliance with the I2C bus protocol.
The TWI master incorporates the following features:
• PIO (programmed I/O) – The processor sends or receives
data by writing or reading I/O-mapped UART registers.
The data is double-buffered on both transmit and receive.
• DMA (direct memory access) – The DMA controller trans­
fers both transmit and receive data. This reduces the
number and frequency of interrupts required to transfer
data to and from memory. The UART has two dedicated
DMA channels, one for transmit and one for receive. These
DMA channels have lower default priority than most DMA
channels because of their relatively low service rates.
The UART port's baud rate, serial data format, error code gen­
eration and status, and interrupts are programmable:
• Supporting bit rates ranging from (fPCLK/ 1,048,576) to (fPCLK/16) bits per second.
• Supporting data formats from 7 to 12 bits per frame.
• Both transmit and receive operations can be configured to
generate maskable interrupts to the processor.
In conjunction with the general-purpose timer functions, autobaud detection is supported.
Timers
The ADSP-21371 has a total of three timers: a core timer that
can generate periodic software interrupts and two general pur­
pose timers that can generate periodic interrupts and be
independently set to operate in one of three modes:
• Pulse waveform generation mode
• Pulse width count/capture mode
• External event watchdog mode
The core timer can be configured to use FLAG3 as a timer
expired signal, and each general-purpose timer has one bidirec­
tional pin and four registers that implement its mode of
operation: a 6-bit configuration register, a 32-bit count register,
a 32-bit period register, and a 32-bit pulse width register. A sin­
gle control and status register enables or disables both generalpurpose timers independently.
Rev. 0 |
• 7-bit addressing
• Simultaneous master and slave operation on multiple
device systems with support for multi master data arbitration
• Digital filtering and timed event processing
• 100 kbps and 400 kbps data rates
• Low interrupt rate
Pulse-Width Modulation
The PWM module is a flexible, programmable, PWM waveform
generator that can be programmed to generate the required
switching patterns for various applications related to motor and
engine control or audio power control. The PWM generator can
generate either center-aligned or edge-aligned PWM wave­
forms. In addition, it can generate complementary signals on
two outputs in paired mode or independent signals in nonpaired mode (applicable to a single group of four PWM
waveforms).
The entire PWM module has four groups of four PWM outputs
each. Therefore, this module generates 16 PWM outputs in
total. Each PWM group produces two pairs of PWM signals on
the four PWM outputs.
The PWM generator is capable of operating in two distinct
modes while generating center-aligned PWM waveforms: single
update mode or double update mode. In single update mode the
duty cycle values are programmable only once per PWM period.
This results in PWM patterns that are symmetrical about the
mid-point of the PWM period. In double update mode, a sec­
ond updating of the PWM registers is implemented at the mid­
point of the PWM period. In this mode, it is possible to produce
asymmetrical PWM patterns that produce lower harmonic dis­
tortion in three-phase PWM inverters.
ROM Based Security
The ADSP-21371 has a ROM security feature that provides
hardware support for securing user software code by preventing
unauthorized reading from the internal code when enabled.
When using this feature, the processor does not boot-load any
external code, executing exclusively from internal SRAM/ROM.
Additionally, the processor is not freely accessible via the JTAG
port. Instead, a unique 64-bit key, which must be scanned in
through the JTAG or Test Access Port will be assigned to each
customer. The device will ignore a wrong key. Emulation fea­
tures and external boot modes are only available after the
correct key is scanned.
Page 9 of 48 |
June 2007
ADSP-21371
SYSTEM DESIGN
The following sections provide an introduction to system design
options and power supply issues.
Program Booting
The internal memory of the ADSP-21371 boots at system
power-up from an 8-bit EPROM via the external port, an SPI
master, or an SPI slave. Booting is determined by the boot con­
figuration (BOOTCFG1–0) pins (see Table 7 on Page 14).
Selection of the boot source is controlled via the SPI as either a
master or slave device, or it can immediately begin executing
from ROM.
The newly introduced “Running Reset” feature allows a user to
perform a reset of the processor core and peripherals, but with­
out resetting the PLL and SDRAM controller, or performing a
Boot. The functionality of the CLKOUT/RESETOUT/RUN­
RSTIN pin has now been extended to also act as the input for
initiating a Running Reset. For more information, see the
ADSP-2136x SHARC Processor Hardware Reference for the
ADSP-21367/8/9 Processors.
translation of C/C++ code to DSP assembly. The SHARC has
architectural features that improve the efficiency of compiled
C/C++ code.
The VisualDSP++ debugger has a number of important fea­
tures. Data visualization is enhanced by a plotting package that
offers a significant level of flexibility. This graphical representa­
tion of user data enables the programmer to quickly determine
the performance of an algorithm. As algorithms grow in com­
plexity, this capability can have increasing significance on the
designer’s development schedule, increasing productivity. Sta­
tistical profiling enables the programmer to nonintrusively poll
the processor as it is running the program. This feature, unique
to VisualDSP++, enables the software developer to passively
gather important code execution metrics without interrupting
the real-time characteristics of the program. Essentially, the
developer can identify bottlenecks in software quickly and effi­
ciently. By using the profiler, the programmer can focus on
those areas in the program that impact performance and take
corrective action.
Debugging both C/C++ and assembly programs with the
VisualDSP++ debugger, programmers can:
Power Supplies
• View mixed C/C++ and assembly code (interleaved source
and object information)
The ADSP-21371 has separate power supply connections for the
internal (VDDINT), and external (VDDEXT) power supplies. The
internal supplies must meet the 1.2 V requirement. The external
supply must meet the 3.3 V requirement. All external supply
pins must be connected to the same power supply.
• Insert breakpoints
• Set conditional breakpoints on registers, memory, and stacks
• Perform linear or statistical profiling of program execution
Target Board JTAG Emulator Connector
Analog Devices DSP Tools product line of JTAG emulators uses
the IEEE 1149.1 JTAG test access port of the ADSP-21371 pro­
cessor to monitor and control the target board processor during
emulation. Analog Devices DSP Tools product line of JTAG
emulators provides emulation at full processor speed, allowing
inspection and modification of memory, registers, and proces­
sor stacks. The processor's JTAG interface ensures that the
emulator will not affect target system loading or timing.
• Fill, dump, and graphically plot the contents of memory
• Perform source level debugging
• Create custom debugger windows
The VisualDSP++ IDDE lets programmers define and manage
DSP software development. Its dialog boxes and property pages
let programmers configure and manage all of the SHARC devel­
opment tools, including the color syntax highlighting in the
VisualDSP++ editor. This capability permits programmers to:
For complete information on Analog Devices’ SHARC DSP
Tools product line of JTAG emulator operation, see the appro­
priate “Emulator Hardware User's Guide”.
• Control how the development tools process inputs and
generate outputs
• Maintain a one-to-one correspondence with the tool’s
command line switches
DEVELOPMENT TOOLS
The ADSP-21371 is supported with a complete set of
CROSSCORE® software and hardware development tools,
including Analog Devices emulators and VisualDSP++® devel­
opment environment. The same emulator hardware that
supports other SHARC processors also fully emulates the
ADSP-21371.
The VisualDSP++ project management environment lets pro­
grammers develop and debug an application. This environment
includes an easy to use assembler (which is based on an alge­
braic syntax), an archiver (librarian/library builder), a linker, a
loader, a cycle-accurate instruction-level simulator, a C/C++
compiler, and a C/C++ runtime library that includes DSP and
mathematical functions. A key point for these tools is C/C++
code efficiency. The compiler has been developed for efficient
Rev. 0 |
The VisualDSP++ Kernel (VDK) incorporates scheduling and
resource management tailored specifically to address the mem­
ory and timing constraints of DSP programming. These
capabilities enable engineers to develop code more effectively,
eliminating the need to start from the very beginning, when
developing new application code. The VDK features include
threads, critical and unscheduled regions, semaphores, events,
and device flags. The VDK also supports priority-based, pre­
emptive, cooperative, and time-sliced scheduling approaches. In
addition, the VDK was designed to be scalable. If the application
does not use a specific feature, the support code for that feature
is excluded from the target system.
Page 10 of 48 |
June 2007
ADSP-21371
Because the VDK is a library, a developer can decide whether to
use it or not. The VDK is integrated into the VisualDSP++
development environment, but can also be used via standard
command line tools. When the VDK is used, the development
environment assists the developer with many error-prone tasks
and assists in managing system resources, automating the gen­
eration of various VDK based objects, and visualizing the
system state, when debugging an application that uses the VDK.
VisualDSP++ Component Software Engineering (VCSE) is
Analog Devices’ technology for creating, using, and reusing
software components (independent modules of substantial
functionality) to quickly and reliably assemble software applica­
tions. Download components from the Web and drop them into
the application. Publish component archives from within
VisualDSP++. VCSE supports component implementation in
C/C++ or assembly language.
Use the Expert Linker to visually manipulate the placement of
code and data on the embedded system. View memory utiliza­
tion in a color-coded graphical form, easily move code and data
to different areas of the processor or external memory with the
drag of the mouse, examine run time stack and heap usage. The
Expert Linker is fully compatible with the existing Linker Defi­
nition File (LDF), allowing the developer to move between the
graphical and textual environments.
In addition to the software and hardware development tools
available from Analog Devices, third parties provide a wide
range of tools supporting the SHARC processor family. Hard­
ware tools include SHARC processor PC plug-in cards. Third
party software tools include DSP libraries, real-time operating
systems, and block diagram design tools.
Evaluation Kit
Analog Devices offers a range of EZ-KIT Lite® evaluation plat­
forms to use as a cost effective method to learn more about
developing or prototyping applications with Analog Devices
processors, platforms, and software tools. Each EZ-KIT Lite
includes an evaluation board along with an evaluation suite of
the VisualDSP++® development and debugging environment
with the C/C++ compiler, assembler, and linker. Also included
are sample application programs, power supply, and a USB
cable. All evaluation versions of the software tools are limited
for use only with the EZ-KIT Lite product.
The USB controller on the EZ-KIT Lite board connects the
board to the USB port of the user’s PC, enabling the
VisualDSP++ evaluation suite to emulate the on-board proces­
sor in-circuit. This permits the customer to download, execute,
and debug programs for the EZ-KIT Lite system. It also allows
in-circuit programming of the on-board Flash device to store
user-specific boot code, enabling the board to run as a standal­
one unit without being connected to the PC.
With a full version of VisualDSP++ installed (sold separately),
engineers can develop software for the EZ-KIT Lite or any cus­
tom defined system. Connecting one of Analog Devices JTAG
emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation.
ADDITIONAL INFORMATION
This data sheet provides a general overview of the ADSP-21371
architecture and functionality. For detailed information on the
ADSP-2137x family core architecture and instruction set, refer
to the ADSP-2136x SHARC Processor Programming Reference.
Designing an Emulator-Compatible DSP Board (Target)
The Analog Devices family of emulators are tools that every
DSP developer needs to test and debug hardware and software
systems. Analog Devices has supplied an IEEE 1149.1 JTAG
Test Access Port (TAP) on each JTAG DSP. Nonintrusive incircuit emulation is assured by the use of the processor’s JTAG
interface—the emulator does not affect target system loading or
timing. The emulator uses the TAP to access the internal fea­
tures of the processor, allowing the developer to load code, set
breakpoints, observe variables, observe memory, and examine
registers. The processor must be halted to send data and com­
mands, but once an operation has been completed by the
emulator, the DSP system is set running at full speed with no
impact on system timing.
To use these emulators, the target board must include a header
that connects the DSP’s JTAG port to the emulator.
For details on target board design issues including mechanical
layout, single processor connections, signal buffering, signal ter­
mination, and emulator pod logic, see the EE-68: Analog Devices
JTAG Emulation Technical Reference on the Analog Devices
website (www.analog.com)—use site search on “EE-68.” This
document is updated regularly to keep pace with improvements
to emulator support.
Rev. 0 |
Page 11 of 48 |
June 2007
ADSP-21371
PIN FUNCTION DESCRIPTIONS
The following symbols appear in the Type column of Table 5:
A = asynchronous, I = input, O = output, S = synchronous,
(A/D) = active drive, (O/D) = open drain, and T = three-state,
(pd) = pull-down resistor, (pu) = pull-up resistor.
Table 5. Pin List
State During
and After Reset
Pulled high/
driven low
Pulled high/
pulled high
Name
ADDR23–0
Type
O/T (pu)
DATA31–0
I/O (pu)
DAI _P20–1
I/O with
programmable pu1
Pulled high/
pulled high
DPI _P14–1
I/O with
programmable pu1
Pulled high/
pulled high
ACK
I (pu)
RD
O/T (pu)
WR
O/T (pu)
SDRAS
O/T (pu)
SDCAS
O/T (pu)
SDWE
O/T (pu)
SDCKE
O/T (pu)
SDA10
O/T (pu)
SDCLK
MS0–1
O/T
O/T (pu)
Pulled high/
driven high
Pulled high/
driven high
Pulled high/
driven high
Pulled high/
driven high
Pulled high/
driven high
Pulled high/
driven high
Pulled high/
driven low
High-Z/driving
Pulled high/
driven high
Description
External Address. The ADSP-21371 outputs addresses for external memory and periph­
erals on these pins.
External Data. The data pins can be multiplexed to support the external memory interface
data (I/O), the PDAP (I), FLAGS (I/O) and PWM (O). After reset, all DATA pins are in EMIF
mode and FLAG(0-3) pins will be in FLAGS mode (default). When configured in the
IDP_PDAP_CTL register, IDP channel 0 scans the DATA31–8 pins for parallel input
data.
Digital Applications Interface Pins. These pins provide the physical interface to the DAI
SRU. The DAI SRU configuration registers define the combination of on-chip audiocentric
peripheral inputs or outputs connected to the pin and to the pin’s output enable. The
configuration registers of these peripherals then determines the exact behavior of the pin.
Any input or output signal present in the DAI SRU may be routed to any of these pins. The
DAI SRU provides the connection from the serial ports, the S/PDIF module, input data ports
(2), and the precision clock generators (4), to the DAI_P20–1 pins. Pullups can be disabled
via the DAI_PIN_PULLUP register.
Digital Peripheral Interface. These pins provide the physical interface to the DPI SRU.
The DPI SRU configuration registers define the combination of on-chip peripheral inputs
or outputs connected to the pin and to the pin’s output enable. The configuration registers
of these peripherals then determines the exact behavior of the pin. Any input or output
signal present in the DPI SRU may be routed to any of these pins. The DPI SRU provides the
connection from the timers (2), SPIs (2), UART (1), flags (12), and general-purpose I/O (9) to
the DPI_P14–1 pins. Pull-ups can be disabled via the DPI_PIN_PULLUP register.
Memory Acknowledge. External devices can deassert ACK (low) to add wait states to an
external memory access. ACK is used by I/O devices, memory controllers, or other periph­
erals to hold off completion of an external memory access.
External Port Read Enable. RD is asserted whenever the ADSP-21371 reads a word from
external memory. RD has a 22.5 kΩ internal pull-up resistor.
External Port Write Enable. WR is asserted when the ADSP-21371 writes a word to
external memory. WR has a 22.5 kΩ internal pull-up resistor.
SDRAM Row Address Strobe. Connect to SDRAM’s RAS pin. In conjunction with other
SDRAM command pins, defines the operation for the SDRAM to perform.
SDRAM Column Address Select. Connect to SDRAM's CAS pin. In conjunction with other
SDRAM command pins, defines the operation for the SDRAM to perform.
SDRAM Write Enable. Connect to SDRAM’s WE or W buffer pin.
SDRAM Clock Enable. Connect to SDRAM’s CKE pin. Enables and disables the CLK signal.
For details, see the data sheet supplied with the SDRAM device.
SDRAM A10 Pin. Enables applications to refresh an SDRAM in parallel with a nonSDRAM accesses. This pin replaces the DSP’s A10 pin only during SDRAM accesses.
SDRAM Clock.
Memory Select Lines 0–1. These lines are asserted (low) as chip selects for the corre­
sponding banks of external memory. The MS3-0 lines are decoded memory address lines
that change at the same time as the other address lines. When no external memory access
is occurring the MS3-0 lines are inactive; they are active however when a conditional
memory access instruction is executed, whether or not the condition is true.
The MS1 pin can be used in EPORT/FLASH boot mode. For more information, see the
ADSP-2136x SHARC Processor Hardware Reference for the ADSP-21367/8/9 Processors.
Rev. 0 |
Page 12 of 48 |
June 2007
ADSP-21371
Table 5. Pin List (Continued)
Name
FLAG[0]/IRQ0
FLAG[1]/IRQ1
FLAG[2]/IRQ2/
MS2
Type
I/O
I/O
I/O with
programmable pu
(for MS mode)
FLAG[3]/TIMEXP/M I/O with
S3
programmable pu
(for MS mode)
TDI
I (pu)
TDO
TMS
O /T
I (pu)
TCK
I
TRST
I (pu)
EMU
O/T (pu)
CLK_CFG1–0
I
BOOT_CFG1–0
I
RESET
I
XTAL
CLKIN
O
I
CLKOUT/
RESETOUT/
RUNRSTIN
I/O (pu)
1
State During
and After Reset
High-Z/high-Z
High-Z/high-Z
High-Z/high-Z
Description
FLAG0/Interrupt Request0.
FLAG1/Interrupt Request1.
FLAG2/Interrupt Request/Memory Select2.
High-Z/high-Z
FLAG3/Timer Expired/Memory Select3.
Test Data Input (JTAG). Provides serial data for the boundary scan logic. TDI has a
22.5 kΩ internal pull-up resistor.
Test Data Output (JTAG). Serial scan output of the boundary scan path.
Test Mode Select (JTAG). Used to control the test state machine. TMS has a 22.5 kΩ
internal pull-up resistor.
Test Clock (JTAG). Provides a clock for JTAG boundary scan. TCK must be asserted (pulsed
low) after power-up or held low for proper operation of the ADSP-21371.
Test Reset (JTAG). Resets the test state machine. TRST must be asserted (pulsed low) after
power-up or held low for proper operation of the ADSP-21371. TRST has a 22.5 kΩ internal
pull-up resistor.
Emulation Status. Must be connected to the ADSP-21371 Analog Devices DSP Tools
product line of JTAG emulators target board connector only. EMU has a 22.5 kΩ internal
pull-up resistor.
Core to CLKIN Ratio Control. These pins set the start up clock frequency. See Table 8 for
a description of the clock configuration modes.
Note that the operating frequency can be changed by programming the PLL multiplier
and divider in the PMCTL register at any time after the core comes out of reset.
Boot Configuration Select. These pins select the boot mode for the processor. The
BOOTCFG pins must be valid before reset is asserted. See Table 7 for a description of the
boot modes.
Processor Reset. Resets the ADSP-21371 to a known state. Upon deassertion, there is a
4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program
execution from the hardware reset vector address. The RESET input must be asserted (low)
at power-up.
Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external crystal.
Local Clock In. Used in conjunction with XTAL. CLKIN is the ADSP-21371 clock input. It
configures the ADSP-21371 to use either its internal clock generator or an external clock
source. Connecting the necessary components to CLKIN and XTAL enables the internal
clock generator. Connecting the external clock to CLKIN while leaving XTAL unconnected
configures the ADSP-21371 to use the external clock source such as an external clock
oscillator. CLKIN may not be halted, changed, or operated below the specified frequency.
Clock Out/Reset Out/Running Reset In. The functionality can be switched between the
PLL output clock and reset out by setting Bit 12 of the PMCTREG register. The default is
reset out. This pin also has a third function as RUNRSTIN. The functionality of which is
enabled by setting bit 0 of the RUNRSTCTL register. For more information, see the
ADSP-2136x SHARC Processor Hardware Reference for the ADSP-21367/8/9 Processors.
Pull-up can be enabled/disabled, value of pull-up cannot be programmed.
Rev. 0 |
Page 13 of 48 |
June 2007
ADSP-21371
DATA MODES
The upper 32 data pins of the external memory interface are
muxed (using bits in the SYSCTL register) to support the exter­
nal memory interface data (input/output), the PDAP (input
only), and the FLAGS (input/output). Table 6 provides the pin
settings.
Table 6. Function of Data Pins
DATA PIN MODE
000
001
010
011
100
101
110
111
1
DATA31–16
DATA15–8
EPDATA32–0
FLAGS/PWM15–01
FLAGS/PWM15–01
FLAGS/PWM15–01
PDAP (DATA + CTRL)
PDAP (DATA + CTRL)
DATA7–0
EPDATA15–0
FLAGS15–8
EPDATA7–0
FLAGS15–0
EPDATA7–0
FLAGS7–0
Reserved
Three-state all pins
These signals can be FLAGS or PWM or a mix of both. However, they can be selected only in groups of four. Their function is determined by the control signals
FLAGS/PWM_SEL. For more information, see the ADSP-2136x SHARC Processor Hardware Reference for the ADSP-21367/8/9 Processors.
BOOT MODES
Table 7. Boot Mode Selection
BOOTCFG1–0
00
01
10
Booting Mode
SPI Slave Boot
SPI Master Boot
EPROM/FLASH Boot
CORE INSTRUCTION RATE TO CLKIN RATIO MODES
For details on processor timing, see Timing Specifications and
Figure 3 on Page 17.
Table 8. Core Instruction Rate/ CLKIN Ratio Selection
CLKCFG1–0
00
01
10
Core to CLKIN Ratio
6:1
32:1
16:1
Rev. 0 |
Page 14 of 48 |
June 2007
ADSP-21371
ADSP-21371 SPECIFICATIONS
OPERATING CONDITIONS
Parameter1
Description
Min
Max
Unit
VDDINT
VDDEXT
VIH2
VIL2
VIH_CLKIN3
VIL_CLKIN3
TJUNCTION
Internal (Core) Supply Voltage
External (I/O) Supply Voltage
High Level Input Voltage @ VDDEXT = max
Low Level Input Voltage @ VDDEXT = min
High Level Input Voltage @ VDDEXT = max
Low Level Input Voltage @ VDDEXT = min
Junction Temperature 208-Lead MQFP @ TAMBIENT 0C to +70C
1.14
3.13
2.0
–0.5
1.74
–0.5
0
1.26
3.47
VDDEXT + 0.5
+0.8
VDDEXT + 0.5
+1.10
115
V
V
V
V
V
V
C
1
Specifications subject to change without notice.
Applies to input and bidirectional pins: AD23–0, DATA31–0, FLAG3–0, DAI_Px, DPI_Px, SPIDS, BOOTCFGx, CLKCFGx, CLKOUT (RUNRSTIN), RESET, TCK, TMS,
TDI, TRST.
3
Applies to input pin CLKIN.
2
ELECTRICAL CHARACTERISTICS
Parameter1
Description
Test Conditions
Min
VOH2
High Level Output Voltage
@ VDDEXT = min, IOH = –1.0 mA3
2.4
VOL2
Low Level Output Voltage
@ VDDEXT = min, IOL = 1.0 mA3
0.4
V
4, 5
High Level Input Current
@ VDDEXT = max, VIN = VDDEXT max
10
μA
4
Low Level Input Current
@ VDDEXT = max, VIN = 0 V
10
μA
IILPU5
Low Level Input Current Pull-up
@ VDDEXT = max, VIN = 0 V
200
μA
IOZH6, 7
Three-State Leakage Current
@ VDDEXT = max, VIN = VDDEXT max
10
μA
Three-State Leakage Current
@ VDDEXT = max, VIN = 0 V
10
μA
200
μA
IIH
IIL
IOZL
6
7
IOZLPU
Three-State Leakage Current Pull-up @ VDDEXT = max, VIN = 0 V
IDD-INTYP8, 9
Supply Current (Internal)
tCCLK = 3.75 ns, VDDINT = 1.2 V, 25C
CIN10, 11
Input Capacitance
fIN = 1 MHz, TCASE = 25°C, VIN = 1.2 V
1
Typical
Max
Unit
V
600
mA
4.7
pF
Specifications subject to change without notice.
Applies to output and bidirectional pins: ADDR23-0, DATA31-0, RD, WR, FLAG3–0, DAI_Px, DPI_Px, EMU, TDO, CLKOUT, SDRAS, SDCAS, SDWE, SDCKE, SDA10,
and SDCLK0.
3
See Output Drive Currents on Page 44 for typical drive current capabilities.
4
Applies to input pins: BOOTCFGx, CLKCFGx, TCK, RESET, CLKIN.
5
Applies to input pins with 22.5 kΩ internal pull-ups: TRST, TMS, TDI.
6
Applies to three-statable pins: FLAG3–0.
7
Applies to three-statable pins with 22.5 kΩ pull-ups: DAI_Px, DPI_Px, EMU.
8
Typical internal current data reflects nominal operating conditions.
9
See Engineer-to-Engineer Note “Estimating Power Dissipation for ADSP-2137x SHARC Processors” (EE-319) for further information.
10
Applies to all signal pins.
11
Guaranteed, but not tested.
2
Rev. 0 |
Page 15 of 48 |
June 2007
ADSP-21371
PACKAGE INFORMATION
MAXIMUM POWER DISSIPATION
The information presented in Figure 2 provides details about
the package branding for the ADSP-21371 processor. For a
complete listing of product availability, see Ordering Guide on
Page 48.
See Engineer-to-Engineer Note “Estimating Power Dissipation
for ADSP-2137x SHARC Processors” (EE-319) for detailed
thermal and power information regarding maximum power dis­
sipation. For information on package thermal specifications, see
Thermal Characteristics on Page 45.
ABSOLUTE MAXIMUM RATINGS
a
Stresses greater than those listed in Table 10 may cause perma­
nent damage to the device. These are stress ratings only;
functional operation of the device at these or any other condi­
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
ADSP-2137x
tppZ-cc
vvvvvv.x n.n
yyww country_of_origin
S
Table 10. Absolute Maximum Ratings
Figure 2. Typical Package Brand
Parameter
Internal (Core) Supply Voltage (VDDINT)
External (I/O) Supply Voltage (VDDEXT)
Input Voltage –0.5 V to VDDEXT
Output Voltage Swing –0.5 V to VDDEXT
Load Capacitance
Storage Temperature Range
Junction Temperature under Bias
Table 9. Package Brand Information
Brand Key
t
pp
Z
ccc
vvvvvv.x
n.n
yyww
Field Description
Temperature Range
Package Type
RoHS Compliant Part
See Ordering Guide
Assembly Lot Code
Silicon Revision
Date Code
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary circuitry, damage may occur
on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be take to avoid
performance degradation or loss of functionality.
Rev. 0 |
Page 16 of 48 |
June 2007
Rating
–0.3 V to +1.5 V
–0.3 V to +4.6 V
+0.5 V
+0.5 V
200 pF
–65°C to +150°C
125°C
ADSP-21371
TIMING SPECIFICATIONS
Figure 3 shows core to CLKIN ratios of 6:1, 16:1, and 32:1 with
external oscillator or crystal. Note that more ratios are possible
and can be set through software using the power management
control register (PMCTL). For more information, see the ADSP­
2136x SHARC Processor Programming Reference.
The ADSP-21371’s internal clock (a multiple of CLKIN) pro­
vides the clock signal for timing internal memory, processor
core, and serial ports. During reset, program the ratio between
the processor’s internal clock frequency and external (CLKIN)
clock frequency with the CLKCFG1–0 pins (see Table 8 on
Page 14). To determine switching frequencies for the serial
ports, divide down the internal clock, using the programmable
divider control of each port (DIVx for the serial ports).
1 6 0 M H z < VC O_ OU T < 8 0 0M H z
1
0
+
CLKIN
÷2
3.1 2 5M H z
to
66 .7M H z
–
LOOP
FILTER
1
DIVEN[9]
÷2
MULTIPLIER
BLOCK
AMP
M
PLLM[5..0]
@BOOT, CLKCFG[]->PLLM[]
CLK_CFG[1..0]
PLLBP[15]
N
PLLD[7..6]
÷1- 64
C LK CFG[1..0]
1 00 M Hz
to
2 66 M Hz
0
1
I NDIV[8]
XTAL
CCLK
÷1, 2, 4, 8
VCO
PCLK
(IOP)
÷2, 2.5,
3, 3.5, 4
SDCLK
00 = 6
01 = 32
10 = 16
SDRATIO[20..18]
1
11 = 6
BUFF
PLL B YP AS S; R e se r v ed
0
DELAY
4096 CLKIN
RESET
CLKOUT
or
RSTO UT
CORERST
CLKOUTEN[12]
Figure 3. Core Clock and System Clock Relationship to CLKIN
The ADSP-21371’s internal clock switches at higher frequencies
than the system input clock (CLKIN). To generate the internal
clock, the processor uses an internal phase-locked loop (PLL).
This PLL-based clocking minimizes the skew between the sys­
tem clock (CLKIN) signal and the processor’s internal clock.
Note that in the user application, the PLL multiplier value
should be selected in such a way that the VCO frequency falls in
between 160 MHz and 800 MHz. The VCO frequency is calcu­
lated as follows:
Core clock frequency can be calculated as:
fVCO = VCO frequency.
CCLK = 1 tCCLK = fINPUT (PLLM/PLLD)
where:
PLLM = multiplier value programmed.
PLLD = divider value programmed.
fINPUT = input frequency to the PLL.
fINPUT = CLKIN when the input divider is disabled.
fINPUT = CLKIN/2 when the input divider is enabled.
Rev. 0 |
Page 17 of 48 |
June 2007
ADSP-21371
Note the definitions of various clock periods shown in Table 12
which are a function of CLKIN and the appropriate ratio con­
trol shown in Table 11.
Table 11. ADSP-21371 CLKOUT and CCLK Clock
Generation Operation
Timing
Requirements
CLKIN
CCLK
Description
Input Clock
Core Clock
Calculation
1/tCK
1/tCCLK
Table 12. Clock Periods
Timing
Requirements
tCK
tCCLK
tPCLK
tSCLK
tSDCLK
tSPICLK
1
Description1
CLKIN Clock Period
(Processor) Core Clock Period
(Peripheral) Clock Period = 2 × tCCLK
Serial Port Clock Period = (tPCLK) × SR
SDRAM Clock Period = (tCCLK) × SDR
SPI Clock Period = (tPCLLK) × SPIR
where:
SR = serial port-to-core clock ratio (wide range, determined by SPORT CLKDIV
bits in DIVx register)
SPIR = SPI-to-Core Clock Ratio (wide range, determined by SPIBAUD register
setting)
SDR=SDRAM-to-Core Clock Ratio (Values determined by bits 20-18 of the
PMCTL register)
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results
for an individual device, the values given in this data sheet
reflect statistical variations and worst cases. Consequently, it is
not meaningful to add parameters to derive longer times. See
Figure 36 on Page 44 under Test Conditions for voltage refer­
ence levels.
Switching Characteristics specify how the processor changes its
signals. Circuitry external to the processor must be designed for
compatibility with these signal characteristics. Switching char­
acteristics describe what the processor will do in a given
circumstance. Use switching characteristics to ensure that any
timing requirement of a device connected to the processor (such
as memory) is satisfied.
Timing Requirements apply to signals that are controlled by cir­
cuitry external to the processor, such as the data input for a read
operation. Timing requirements guarantee that the processor
operates correctly with other devices.
Rev. 0 |
Page 18 of 48 |
June 2007
ADSP-21371
Power-Up Sequencing
The timing requirements for processor startup are given in
Table 13.
Table 13. Power Up Sequencing Timing Requirements (Processor Startup)
Parameter
Timing Requirements
tRSTVDD
RESET Low Before VDDINT/VDDEXT On
tIVDDEVDD
VDDINT on Before VDDEXT
1
tCLKVDD
CLKIN Valid After VDDINT/VDDEXT Valid
tCLKRST
CLKIN Valid Before RESET Deasserted
PLL Control Setup Before RESET Deasserted
tPLLRST
Switching Characteristic
tCORERST
Core Reset Deasserted After RESET Deasserted
Min
0
–50
0
102
203
Max
200
200
Unit
ns
ms
ms
μs
μs
4096 tCK + 2 tCCLK 4, 5
1
Valid VDDINT/VDDEXT assumes that the supplies are fully ramped to their 1.2 and 3.3 volt rails. Voltage ramp rates can vary from microseconds to hundreds of milliseconds
depending on the design of the power supply subsystem.
2
Assumes a stable CLKIN signal, after meeting worst-case startup timing of crystal oscillators. Refer to your crystal oscillator manufacturer's datasheet for startup time.
Assume a 25 ms maximum oscillator startup time if using the XTAL pin and internal oscillator circuit in conjunction with an external crystal.
3
Based on CLKIN cycles.
4
Applies after the power-up sequence is complete. Subsequent resets require a minimum of four CLKIN cycles for RESET to be held low in order to properly initialize and
propagate default states at all I/O pins.
5
The 4096 cycle count depends on tSRST specification in Table 15. If setup time is not met, one additional CLKIN cycle may be added to the core reset time, resulting in
4097 cycles maximum.
RESET
tRSTVDD
VDDINT
tIVDDEVDD
tCLKVDD
VDDEXT
CLKIN
tCLKRST
CLK_CFG1-0
tCORERST
tPLLRST
RSTOUT
Figure 4. Power-Up Sequencing
Rev. 0 |
Page 19 of 48 |
June 2007
ADSP-21371
Clock Input
Table 14. Clock Input
Min
Parameter
Timing Requirements
tCK
CLKIN Period
tCKL
CLKIN Width Low
tCKH
CLKIN Width High
tCKRF
CLKIN Rise/Fall (0.4 V to 2.0 V)
tCCLK3
CCLK Period
22.51
101
101
3.751
1
Applies only for CLKCFG1–0 = 00 and default values for PLL control bits in PMCTL.
Applies only for CLKCFG1–0 = 01 and default values for PLL control bits in PMCTL.
3
Any changes to PLL control bits in the PMCTL register must meet core clock timing specification tCCLK.
2
tCK
CLKIN
tCKH
tCKL
Figure 5. Clock Input
Clock Signals
The ADSP-21371 can use an external clock or a crystal. See the
CLKIN pin description in Table 5. The programmer can config­
ure the ADSP-21371 to use its internal clock generator by
connecting the necessary components to CLKIN and XTAL.
Figure 6 shows the component connections used for a crystal
operating in fundamental mode. Note that the clock rate is
achieved using a 16.67 MHz crystal and a PLL multiplier ratio
16:1 (CCLK:CLKIN achieves a clock speed of 266 MHz). To
achieve the full core clock rate, programs need to configure the
multiplier bits in the PMCTL register.
ADSP-2137X
R1
1M�*
CLKIN
XTAL
R2
47�*
C1
22pF
Y1
C2
22pF
16.67 MHz
R2 SHOULD BE CHOSEN TO LIMIT CRYSTAL
DRIVE POWER. REFER TO CRYSTAL
MANUFACTURER’S SPECIFICATIONS
*TYPICAL VALUES
Figure 6. 266 MHz Operation (Fundamental Mode Crystal)
Rev. 0 |
Page 20 of 48 |
June 2007
266 MHz
Max
3202
1802
1802
6
10
Unit
ns
ns
ns
ns
ns
ADSP-21371
Reset
Table 15. Reset
Parameter
Timing Requirements
tWRST1
RESET Pulse Width Low
tSRST
RESET Setup Before CLKIN Low
1
Min
Max
4 tCK
8
Unit
ns
ns
Applies after the power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 100 ms while RESET is low, assuming
stable VDD and CLKIN (not including start-up time of external clock oscillator).
CLKIN
tRUNSRST
tRUNWRST
RESET
Figure 7. Reset
Running Reset
The following timing specification applies to CLKOUT/
RESETOUT/RUNRSTIN pin when it is configured as
RUNRSTIN.
Table 16. Running Reset
Parameter
Timing Requirements
tWRUNRST
Running RESET Pulse Width Low
Running RESET Setup Before CLKIN High
tSRUNRST
Min
Max
4 tCK
8
ns
ns
CLKIN
tWRUNRST
tSRUNRST
RUNRSTIN
Figure 8. Running Reset
Rev. 0 |
Unit
Page 21 of 48 |
June 2007
ADSP-21371
Interrupts
The following timing specification applies to the FLAG0,
FLAG1, and FLAG2 pins when they are configured as IRQ0,
IRQ1, and IRQ2 interrupts as well as the DAI_P20-1 and
DPI_P14-1 pins when they are configured as interrupts.
Table 17. Interrupts
Parameter
Timing Requirement
tIPW
IRQx Pulse Width
DAI_P20-1
DPI_P14-1
FLAG2 -0
(IRQ2-0)
Min
Max
2 × tPCLK +2
Unit
ns
tIPW
Figure 9. Interrupts
Core Timer
The following timing specification applies to FLAG3 when it is
configured as the core timer (CTIMER).
Table 18. Core Timer
Parameter
Switching Characteristic
tWCTIM
CTIMER Pulse Width
Min
Max
4 × tPCLK – 1
Unit
ns
tWCTIM
FLAG3
(CTIMER)
Figure 10. Core Timer
Timer PWM_OUT Cycle Timing
The following timing specification applies to Timer0 and
Timer1 in PWM_OUT (pulse-width modulation) mode. Timer
signals are routed to the DPI_P14–1 pins through the DPI SRU.
Therefore, the timing specifications provided below are valid at
the DPI_P14–1 pins.
Table 19. Timer PWM_OUT Timing
Parameter
Switching Characteristic
tPWMO
Timer Pulse Width Output
Min
Max
Unit
2 × tPCLK – 2
2 × (231 – 1) × tPCLK
ns
tPWMO
DPI_P14-1
(TIMER1 -0)
Figure 11. Timer PWM_OUT Timing
Rev. 0 |
Page 22 of 48 |
June 2007
ADSP-21371
Timer WDTH_CAP Timing
The following timing specification applies to timer0, and
timer1, and in WDTH_CAP (pulse width count and capture)
mode. Timer signals are routed to the DPI_P14–1 pins through
the SRU. Therefore, the timing specification provided below is
valid at the DPI_P14–1 pins.
Table 20. Timer Width Capture Timing
Parameter
Timing Requirement
tPWI
Timer Pulse Width
Min
Max
Unit
2 × tPCLK
2 ×(231– 1) × tPCLK
ns
tPWI
DPI_P14-1
(TIMER1-0)
Figure 12. Timer Width Capture Timing
Pin to Pin Direct Routing (DAI and DPI)
For direct pin connections only (for example DAI_PB01_I to
DAI_PB02_O).
Table 21. DAI Pin to Pin Routing
Parameter
Timing Requirement
tDPIO
Delay DAI/DPI Pin Input Valid to DAI Output Valid
Min
Max
Unit
1.5
10
ns
DAI_Pn
DPI_Pn
DAI_pm
DPI_Pm
tDPIO
Figure 13. DAI Pin to Pin Direct Routing
Rev. 0 |
Page 23 of 48 |
June 2007
ADSP-21371
Precision Clock Generator (Direct Pin Routing)
This timing is only valid when the SRU is configured such that
the precision clock generator (PCG) takes its inputs directly
from the DAI pins (via pin buffers) and sends its outputs
directly to the DAI pins. For the other cases, where the PCG’s
inputs and outputs are not directly routed to/from DAI pins (via
pin buffers) there is no timing data available. All timing param­
eters and switching characteristics apply to external DAI pins
(DAI_P01 – DAI_P20).
Table 22. Precision Clock Generator (Direct Pin Routing)
Parameter
Min
Max
Unit
Timing Requirements
tPCGIW
Input Clock Period
24
ns
tSTRIG
PCG Trigger Setup Before Falling Edge of PCG Input 4.5
ns
Clock
tHTRIG
PCG Trigger Hold After Falling Edge of PCG Input
3
ns
Clock
Switching Characteristics
tDPCGIO
PCG Output Clock and Frame Sync Active Edge Delay
After PCG Input Clock
2.5
10
ns
tDTRIGCLK
PCG Output Clock Delay After PCG Trigger
2.5 + ((2.5) × tPCGIW)
10 + ((2.5) × tPCGIW)
ns
tDTRIGFS
PCG Frame Sync Delay After PCG Trigger
2.5 + ((2.5 + D – PH) × tPCGIW)
10 + ((2.5 + D – PH) × tPCGIW)
ns
tPCGOW1
Output Clock Period
2 × tPCGIW – 1
ns
D = FSxDIV, PH = FSxPHASE. For more information, see the ADSP-2136x SHARC Processor Hardware Reference for the ADSP-21368 Processor,
“Precision Clock Generators” chapter.
1
Normal mode of operation.
tSTRIG
tHTRIG
DAI_Pn
DPI_Pn
PCG_TRIGx_I
tPCGIW
DAI_Pm
DPI_Pm
PCG_EXTx_I
(CLKIN)
tDPCGIO
DAI_Py
DPI_Py
PCG_CLKx_O
tDTRIGCLK
tDPCGIO
DAI_Pz
DPI_Pz
PCG_FSx_O
tDTRIGFS
Figure 14. Precision Clock Generator (Direct Pin Routing)
Rev. 0 |
Page 24 of 48 |
June 2007
tPCGOW
ADSP-21371
Flags
The timing specifications provided below apply to the FLAG3–0
and DPI_P14–1 pins, and the DATA31-0 pins. See Table 5 on
page 12 for more information on flag use.
Table 23. Flags
Parameter
Timing Requirement
tFIPW
DPI_P14-1, DATA31-0, FLAG3–0 IN Pulse Width
Switching Characteristic
tFOPW
DPI_P14-1, DATA31-0, FLAG3–0 OUT Pulse Width
Min
DPI_P14-1
(FLAG3- 0IN )
(DATA31- 0)
tFIPW
DPI_P14-1
(FLAG3- 0OUT )
(DATA31- 0)
tFOPW
Figure 15. Flags
Rev. 0 |
Page 25 of 48 |
June 2007
Max
Unit
2 × tPCLK + 3
ns
2 × tPCLK - 2
ns
ADSP-21371
SDRAM Interface Timing (133 MHz SDCLK)
Table 24. SDRAM Interface Timing1
Parameter
Timing Requirements
tSSDAT
DATA Setup Before SDCLK
tHSDAT
DATA Hold After SDCLK
Switching Characteristics
tSDCLK
SDCLK Period
tSDCLKH
SDCLK Width High
tSCCLKL
SDCLK Width Low
Command, ADDR, Data Delay After SDCLK2
tDCAD
tHCAD
Command, ADDR, Data Hold After SDCLK2
tDSDAT
Data Disable After SDCLK
tENSDAT
Data Enable After SDCLK
1
2
Min
Max
0.58
2.2
ns
ns
7.5
3
3
ns
ns
ns
ns
ns
ns
ns
5.3
1.3
5.3
1.6
For FCCLK = 133 MHz (SDCLK ratio = 1:2).
Command pins include: SDCAS, SDRAS, SDWE, MSx, SDA10, and SDCKE.
tSDCLK
tSDCLKH
SDCLK
tSSDAT
tSDCLKL
tHSDAT
DATA (IN)
tDCAD
tENSDAT
tDCAD
CMND ADDR
(OUT)
tHCAD
Figure 16. SDRAM Interface Timing for 133 MHz SDCLK
Rev. 0 |
Page 26 of 48 |
tDSDAT
tHCAD
DATA(OUT)
June 2007
Unit
ADSP-21371
Memory Read—Bus Master
Use these specifications for asynchronous interfacing to memo­
ries. Note that timing for ACK, DATA, RD, WR, and strobe
timing parameters only apply to asynchronous access mode.
Table 25. Memory Read—Bus Master
Parameter
Min
Timing Requirements
tDAD
Address, Selects Delay to Data Valid1, 2
tDRLD
RD Low to Data Valid1
tSDS
Data Setup to RD High
2.2
tHDRH
Data Hold from RD High3, 4
0
tDAAK
ACK Delay from Address, Selects2, 5
tDSAK
ACK Delay from RD Low4
Switching Characteristics
tDRHA
Address Selects Hold After RD High
RHC + 0.38
tDARL
Address Selects to RD Low2
tSDCLK –3.3
tRW
RD Pulse Width
W – 1.4
tRWR
RD High to WR, RD, Low
HI + tSDCLK –0.8
W = (number of wait states specified in AMICTLx register) × tSDCLK.
HI = RHC + IC (RHC = (number of Read Hold Cycles specified in AMICTLx register) x tSDCLK
IC = (number of idle cycles specified in AMICTLx register) x tSDCLK).
H = (number of hold cycles specified in AMICTLx register) x tSDCLK. Max
Unit
W+tSDCLK –5.12
W–3
ns
ns
ns
ns
ns
ns
tSDCLK –10.1+ W
W – 7.0
ns
ns
ns
ns
1
Data delay/setup: System must meet tDAD, tDRLD, or tSDS.
The falling edge of MSx, is referenced.
3
Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only apply to asynchronous access mode.
4
Data hold: User must meet tHDRH in asynchronous access mode. See Test Conditions on Page 44 for the calculation of hold times given capacitive and dc loads.
5
ACK delay/setup: User must meet tDAAK, or tDSAK, for deassertion of ACK (low). For asynchronous assertion of ACK (high) user must meet tDAAK or tDSAK. 2
ADDRESS
MSx
RD
tDRHA
tDARL
tRW
tDRLD
tSDS
tDAD
tHDRH
DATA
tDSAK
tDAAK
tRWR
ACK
WR
Figure 17. Memory Read—Bus Master
Rev. 0 |
Page 27 of 48 |
June 2007
ADSP-21371
Memory Write—Bus Master
Use these specifications for asynchronous interfacing to memo­
ries. Note that timing for ACK, DATA, RD, WR, and strobe
timing parameters only apply to asynchronous access mode.
Table 26. Memory Write—Bus Master
Parameter
Min
Timing Requirements
tDAAK
ACK Delay from Address, Selects1, 2
tDSAK
ACK Delay from WR Low 1, 3
Switching Characteristics
tDAWH
Address, Selects to WR Deasserted2
tSDCLK – 3.6+ W
tDAWL
Address, Selects to WR Low2
tSDCLK – 2.7
tWW
WR Pulse Width
W – 1.3
Data Setup Before WR High
tSDCLK – 3.0+ W
tDDWH
tDWHA
Address Hold After WR Deasserted
H + 0.15
tDWHD
Data Hold After WR Deasserted
H + 0.02
4
tDATRWH
Data Disable After WR Deasserted
tSDCLK – 1.37+ H
tWWR
WR High to WR, RD Low
tSDCLK – 1.5+ H
tDDWR
Data Disable Before RD Low
2tSDCLK – 5.1
WR Low to Data Enabled
tSDCLK – 4.1
tWDE
W = (number of wait states specified in AMICTLx register) × tSSDCLK
H = (number of hold cycles specified in AMICTLx register) x tSDCLK
Max
Unit
tSDCLK – 10.1 + W
W – 7.1
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
tSDCLK + 4.9+ H
1
ACK delay/setup: System must meet tDAAK, or tDSAK, for deassertion of ACK (low). For asynchronous assertion of ACK (high) user must meet tDAAK or tDSAK.
The falling edge of MSx is referenced.
3
Note that timing for ACK, DATA, RD, WR, and strobe timing parameters only applies to asynchronous access mode.
4
See Test Conditions on Page 44 for calculation of hold times given capacitive and dc loads.
2
ADDRESS
MSx
tDAWH
tDAWL
tDWHA
tWW
WR
tWWR
tWDE
tDATRWH
tDDWH
tDDWR
DATA
tDSAK
tDWHD
tDAAK
ACK
RD
Figure 18. Memory Write—Bus Master
Rev. 0 |
Page 28 of 48 |
June 2007
ADSP-21371
Serial Ports
To determine whether communication is possible between two
devices at clock speed n, the following specifications must be
confirmed: 1) frame sync delay and frame sync setup and hold,
2) data delay and data setup and hold, and 3) SCLK width.
Serial port signals (SCLK, FS, Data Channel A, Data Channel B)
are routed to the DAI_P20–1 pins using the SRU. Therefore, the
timing specifications provided below are valid at the
DAI_P20–1 pins.
Table 27. Serial Ports—External Clock
Parameter
Timing Requirements
tSFSE1
FS Setup Before SCLK
(Externally Generated FS in either Transmit or Receive Mode)
tHFSE1
FS Hold After SCLK
(Externally Generated FS in either Transmit or Receive Mode)
1
tSDRE
Receive Data Setup Before Receive SCLK
tHDRE1
Receive Data Hold After SCLK
tSCLKW
SCLK Width
tSCLK
SCLK Period
Switching Characteristics
tDFSE2
FS Delay After SCLK
(Internally Generated FS in either Transmit or Receive Mode)
FS Hold After SCLK
tHOFSE2
(Internally Generated FS in either Transmit or Receive Mode)
tDDTE2
Transmit Data Delay After Transmit SCLK
2
Transmit Data Hold After Transmit SCLK
tHDTE
Min
Max
Unit
2.5
ns
2.5
2.5
2.5
10
20
ns
ns
ns
ns
ns
10.5
ns
11
ns
ns
ns
2
2
1
Referenced to sample edge.
2
Referenced to drive edge.
Table 28. Serial Ports—Internal Clock
Parameter
Timing Requirements
tSFSI1
FS Setup Before SCLK
(Externally Generated FS in either Transmit or Receive Mode)
1
tHFSI
FS Hold After SCLK
(Externally Generated FS in either Transmit or Receive Mode)
1
Receive Data Setup Before SCLK
tSDRI
tHDRI1
Receive Data Hold After SCLK
Switching Characteristics
tDFSI2
FS Delay After SCLK (Internally Generated FS in Transmit Mode)
tHOFSI2
FS Hold After SCLK (Internally Generated FS in Transmit Mode)
tDFSIR2
FS Delay After SCLK (Internally Generated FS in Receive Mode)
2
FS Hold After SCLK (Internally Generated FS in Receive Mode)
tHOFSIR
tDDTI2
Transmit Data Delay After SCLK
tHDTI2
Transmit Data Hold After SCLK
tSCKLIW
Transmit or Receive SCLK Width
1
Referenced to the sample edge.
2
Referenced to drive edge.
Rev. 0 |
Page 29 of 48 |
June 2007
Min
Max
Unit
7
ns
2.5
7
2.5
ns
ns
ns
4
–1.0
10.7
–1.0
3.6
–1.0
0.5tSCLK – 2
0.5tSCLK + 2
ns
ns
ns
ns
ns
ns
ns
ADSP-21371
Table 29. Serial Ports—Enable and Three-State
Parameter
Switching Characteristics
tDDTEN1
Data Enable from External Transmit SCLK
Data Disable from External Transmit SCLK
tDDTTE1
tDDTIN1
Data Enable from Internal Transmit SCLK
1
Min
Max
Unit
10
ns
ns
ns
Max
Unit
10
ns
ns
2
–1
Referenced to drive edge.
Table 30. Serial Ports—External Late Frame Sync
Parameter
Min
Switching Characteristics
tDDTLFSE1
Data Delay from Late External Transmit FS or External Receive FS
with MCE = 1, MFD = 0
tDDTENFS1
Data Enable for MCE = 1, MFD = 0
0.5
1
The tDDTLFSE and tDDTENFS parameters apply to left-justified sample pair as well as DSP serial mode, and MCE = 1, MFD = 0.
Rev. 0 |
Page 30 of 48 |
June 2007
ADSP-21371
DATA RECEIVE—INTERNAL CLOCK
DRIVE EDGE
DATA RECEIVE—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20-1
(SCLK)
DAI_P20- 1
(SCLK)
tDFSIR
tDFSE
tHFSI
tSFSI
tHOFSIR
DAI_P20-1
(FS)
tHFSE
tSFSE
tHOFSE
DAI_P20-1
(FS)
tSDRI
tHDRI
DAI_P20-1
(DATA CHANNEL A/B)
tSDRE
tHDRE
DAI_P20-1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL) OR SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DATA TRANSMIT—INTERNAL CLOCK
DRIVE EDGE
DATA TRANSMIT—EXTERNAL CLOCK
SAMPLE EDGE
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
tSCLKW
DAI_P20- 1
(SCLK)
DAI_P20- 1
(SCLK)
tDFSI
tHOFSI
tDFSE
tHFSI
tSFSI
DAI_P20- 1
(FS)
tHOFSE
tSFSE
tHFSE
DAI_P20-1
(FS)
tDDTI
tHDTI
tHDTE
DAI_P20-1
(DATA CHANNEL A/B)
tDDTE
DAI_P20- 1
(DATA CHANNEL A/B)
NOTE: EITHER THE RISING EDGE OR FALLING EDGE OF SCLK (EXTERNAL) OR SCLK (INTERNAL) CAN BE USED AS THE ACTIVE SAMPLING EDGE.
DRIVE EDGE
DRIVE EDGE
SCLK
DAI_P20-1
SCLK (EXT)
tDDTEN
tDDTTE
DAI_P20-1
(DATA CHANNEL A/B)
DRIVE EDGE
DAI_P20-1
SCLK (INT)
tDDTIN
DAI_P20-1
(DATA CHANNEL A/B)
Figure 19. Serial Ports
Rev. 0 |
Page 31 of 48 |
June 2007
ADSP-21371
EXTERNAL RECEIVE FS WITH MCE = 1, MFD = 0
DAI_P20 -1
(SCLK)
SAMPLE
DRIVE
DRIVE
tSFSE/I
tHFSE/I
DAI_P20 -1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20 -1
(DATA CHANNEL A/B)
2ND BIT
1ST BIT
tD DTLFSE
LATE EXTERNAL TRANSMIT FS
DAI_P20-1
(SCLK)
SAMPLE
DRIVE
tSFSE/I
DRIVE
tHFSE/I
DAI_P20 -1
(FS)
tDDTE/I
tDDTENFS
tHDTE/I
DAI_P20 -1
(DATA CHANNEL A/B)
1ST BIT
2ND BIT
tDDTLFSE
NOTE: SERIAL PORT SIGNALS (SCLK, FS, DATA CHANNEL A/B) ARE ROUTED TO THE DAI_P20 -1 PINS
USING THE SRU. THE TIMING SPECIFICATIONS PROVIDED HERE ARE VALID AT THE DAI_P20 -1 PINS.
THE CHARACTERIZED AC SPORT TIMINGS ARE APPLICABLE WHEN INTERNAL CLOCKS AND FRAMES
ARE LOOPED BACK FROM THE PIN, NOT ROUTED DIRECTLY THROUGH SAU.
Figure 20. External Late Frame Sync1
1
This figure reflects changes made to support left-justified sample pair mode.
Rev. 0 |
Page 32 of 48 |
June 2007
ADSP-21371
Input Data Port (IDP)
The timing requirements for the IDP are given in Table 31. IDP
signals (SCLK, FS, and SDATA) are routed to the DAI_P20–1
pins using the SRU. Therefore, the timing specifications pro­
vided below are valid at the DAI_P20–1 pins.
Table 31. Input Data Port (IDP)
Parameter
Timing Requirements
tSISFS1
FS Setup Before SCLK Rising Edge
1
tSIHFS
FS Hold After SCLK Rising Edge
SData Setup Before SCLK Rising Edge
tSISD1
tSIHD1
SData Hold After SCLK Rising Edge
tIDPCLKW
Clock Width
tIDPCLK
Clock Period
1
Min
3.8
2.5
2.5
2.5
9
24
Max
Unit
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG's input can be either CLKIN or any of the DAI pins.
SAMPLE EDGE
tIPDCLK
DAI_P20-1
(SCLK)
tIPDCLKW
tSISFS
tSIHFS
DAI_P20-1
(FS)
tSISD
tSIHD
DAI_P20- 1
(SDATA)
Figure 21. IDP Master Timing
Rev. 0 |
Page 33 of 48 |
June 2007
ADSP-21371
Reference. Note that the most significant 16 bits of external
PDAP data can be provided through the DATA31–16 pins. The
remaining four bits can only be sourced through DAI_P4–1.
The timing below is valid at the DATA31–16 pins.
Parallel Data Acquisition Port (PDAP)
The timing requirements for the PDAP are provided in
Table 32. PDAP is the parallel mode operation of Channel 0 of
the IDP. For details on the operation of the PDAP, see the
PDAP chapter of the ADSP-21368 SHARC Processor Hardware
Table 32. Parallel Data Acquisition Port (PDAP)
Parameter
Timing Requirements
tSPCLKEN1
PDAP_CLKEN Setup Before PDAP_CLK Sample Edge
1
tHPCLKEN
PDAP_CLKEN Hold After PDAP_CLK Sample Edge
PDAP_DAT Setup Before SCLK PDAP_CLK Sample Edge
tPDSD1
tPDHD1
PDAP_DAT Hold After SCLK PDAP_CLK Sample Edge
tPDCLKW
Clock Width
tPDCLK
Clock Period
Switching Characteristics
tPDHLDD
Delay of PDAP Strobe After Last PDAP_CLK Capture Edge for a Word
PDAP Strobe Pulse Width
tPDSTRB
1
Min
Max
Unit
2.5
2.5
3.85
2.5
7
24
ns
ns
ns
ns
ns
ns
2 × tPCLK + 3
2 × tPCLK – 1
ns
ns
Source pins of DATA are DATA31–12 or DAI pins. Source pins for SCLK and FS are: 1) DAI pins, 2) CLKIN through PCG, or 3) DAI pins through PCG.
SAMPLE EDGE
t PDCLK
t PDCLKW
DAI_P20 -1
(PDAP_CLK)
t SPCLKEN
t HPCLKEN
DAI_P20- 1
(PDAP_CLKEN)
t PDSD
t PDHD
DATA
DAI_P20-1
(PDAP_STROBE)
tPDSTRB
t PDHLDD
Figure 22. PDAP Timing
Rev. 0 |
Page 34 of 48 |
June 2007
ADSP-21371
Pulse-Width Modulation Generators (PWM)
The following timing specifications apply when the DATA31-16
pins are configured as PWM.
Table 33. Pulse-Width Modulation (PWM) Timing
Parameter
Switching Characteristics
tPWMW
PWM Output Pulse Width
tPWMP
PWM Output Period
Min
Max
Unit
tPCLK – 2.5
2 × tPCLK – 2.5
(216 – 2) × tPCLK – 2.5
(216 – 1) × tPCLK – 2.5
ns
ns
tPWMW
PWM
OUTPUTS
tPWMP
Figure 23. PWM Timing
Rev. 0 |
Page 35 of 48 |
June 2007
ADSP-21371
S/PDIF Transmitter
Serial data input to the S/PDIF transmitter can be formatted as
left justified, I2S, or right justified with word widths of 16-, 18-,
20-, or 24-bits. The following sections provide timing for the
transmitter.
S/PDIF Transmitter-Serial Input Waveforms
Figure 24 shows the right-justified mode. LRCLK is high for the
left channel and low for the right channel. Data is valid on the
rising edge of SCLK. The MSB is delayed 12-bit clock periods
(in 20-bit output mode) or 16-bit clock periods (in 16-bit output
DAI_P20-1
LRCLK
mode) from an LRCLK transition, so that when there are 64
SCLK periods per LRCLK period, the LSB of the data will be
right-justified to the next LRCLK transition.
RIGHT CHANNEL
LEFT CHANNEL
DAI_P20-1
SCLK
DAI_P20-1
SDATA
LSB
MSB
MSB-1
MSB-2
LSB+2 LSB+1
LSB
MSB
MSB-1
MSB-2
LSB+2
LSB+1
LSB
Figure 24. Right-Justified Mode
Figure 25 shows the default I2S-justified mode. LRCLK is low
for the left channel and HI for the right channel. Data is valid on
the rising edge of SCLK. The MSB is left-justified to an LRCLK
transition but with a single SCLK period delay.
RIGHT CHANNEL
DAI_P20-1
LRCLK
LEFT CHANNEL
DAI_P20-1
SCLK
DAI_P20-1
SDATA
MSB
MSB-1
MS B-2
LS B+2 LSB+1
LSB
MSB
MS B-1
MS B-2
LSB+2
LS B+1
LSB
MSB
Figure 25. I2S-Justified Mode
Figure 26 shows the left-justified mode. LRCLK is high for the
left channel and LO for the right channel. Data is valid on the
rising edge of SCLK. The MSB is left-justified to an LRCLK
transition with no MSB delay.
DAI_P20-1
LRCLK
RIGHT CHANNEL
LEFT CHANNEL
DAI_P20-1
SCLK
DAI_P20-1
SDATA
MSB
MSB-1
MSB-2
LS B+2
LSB+1
LSB
MSB
MSB-1
MSB-2
Figure 26. Left-Justified Mode
Rev. 0 |
Page 36 of 48 |
June 2007
LSB+2
LSB +1
LSB
MSB
MSB+1
ADSP-21371
S/PDIF Transmitter Input Data Timing
The timing requirements for the S/PDIF transmitter are given
in Table 34. Input signals (SCLK, FS, SDATA) are routed to the
DAI_P20–1 pins using the SRU. Therefore, the timing specifica­
tions provided below are valid at the DAI_P20–1 pins.
Table 34. S/PDIF Transmitter Input Data Timing
Parameter
Timing Requirements
tSISFS1
FS Setup Before SCLK Rising Edge
tSIHFS1
FS Hold After SCLK Rising Edge
tSISD1
SData Setup Before SCLK Rising Edge
tSIHD1
SData Hold After SCLK Rising Edge
Transmit Clock Width
tSITXCLKW
tSITXCLK
Transmit Clock Period
tSISCLKW
Clock Width
tSISCLK
Clock Period
1
Min
Max
3
3
3
3
9
20
36
80
Unit
ns
ns
ns
ns
ns
ns
ns
ns
DATA, SCLK, FS can come from any of the DAI pins. SCLK and FS can also come via PCG or SPORTs. PCG’s input can be either CLKIN or any of the DAI pins.
tSITXCLKW
SAMPLE EDGE
tSITXCLK
DAI_P20-1
(TXCLK)
tSISCLKW
DAI_P20-1
(SCLK)
tSISCLK
tSIHFS
tSISFS
DAI_P20-1
(FS)
tSISD
tSIHD
DAI_P20-1
(SDATA)
Figure 27. S/PDIF Transmitter Input Timing
Oversampling Clock (TxCLK) Switching Characteristics
The S/PDIF transmitter has an oversampling clock. This TxCLK
input is divided down to generate the biphase clock.
Table 35. Over Sampling Clock (TxCLK) Switching Characteristics
Parameter
TxCLK Frequency for TxCLK = 384 × FS
TxCLK Frequency for TxCLK = 256 × FS
Frame Rate
Min
Rev. 0 |
Page 37 of 48 |
June 2007
Max
73.8
49.2
192.0
Unit
MHz
MHz
kHz
ADSP-21371
S/PDIF Receiver
The following section describes timing as it relates to the
S/PDIF receiver.
Internal Digital PLL Mode
In the internal digital phase-locked loop mode the internal PLL
(digital PLL) generates the 512 × FS clock.
Table 36. S/PDIF Receiver Internal Digital PLL Mode Timing
Parameter
Switching Characteristics
tDFSI
LRCLK Delay After SCLK
tHOFSI
LRCLK Hold After SCLK
tDDTI
Transmit Data Delay After SCLK
tHDTI
Transmit Data Hold After SCLK
tSCLKIW1
Transmit SCLK Width
1
Min
Max
Unit
5
ns
ns
ns
ns
ns
–2
5
–2
38.5
SCLK frequency is 64 × FS where FS = the frequency of LRCLK.
DRIVE EDGE
SAMPLE EDGE
tSCLKIW
DAI_P20-1
(SCLK)
tDFSI
tHOFSI
DAI_P20-1
(FS)
tHDTI
tDDTI
DAI_P20-1
(DATA CHANNEL A/B)
Figure 28. S/PDIF Receiver Internal Digital PLL Mode Timing
Rev. 0 |
Page 38 of 48 |
June 2007
ADSP-21371
SPI Interface—Master
The ADSP-21371 contains two SPI ports. Both primary and sec­
ondary are available through DPI only. The timing provided in
Table 37 and Table 38 applies to both.
Table 37. SPI Interface Protocol—Master Switching and Timing Specifications
Parameter
Timing Requirements
tSSPIDM
Data Input Valid To SPICLK Edge (Data Input Setup Time)
tHSPIDM
SPICLK Last Sampling Edge To Data Input Not Valid
Switching Characteristics
tSPICLKM
Serial Clock Cycle
tSPICHM
Serial Clock High Period
tSPICLM
Serial Clock Low Period
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tDDSPIDM
tHDSPIDM
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tSDSCIM
FLAG3–0IN (SPI device select) Low to First SPICLK Edge
tHDSM
Last SPICLK Edge to FLAG3–0IN High
tSPITDM
Sequential Transfer Delay
Min
Max
8.2
2
ns
ns
8 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 2
ns
ns
ns
2.5
2
4 × tPCLK – 2
4 × tPCLK – 2
4 × tPCLK – 1
ns
ns
ns
ns
FLAG3-0
(OUTPUT)
t SDSCIM
t SPICHM
t SPICLM
t SPICL M
t SPICHM
t SPI CLKM
t HDSM
t SPIT DM
SPICLK
(CP = 0)
(OUTPUT)
SPICLK
(CP = 1)
(OUTPUT)
t HDSPIDM
t D DSPIDM
MOSI
(OUTPUT)
MSB
LSB
t SSPIDM
CPHASE = 1
t SSPIDM
MSB
VALID
LSB
VALID
t DDS PIDM
MOSI
(OUTPUT)
CPHASE = 0
MISO
(INPUT)
tHS PIDM
t HSPIDM
MISO
(INPUT)
t HDS PIDM
MSB
t SSPIDM
LSB
t HSPIDM
MSB
VALID
LSB
VALID
Figure 29. SPI Master Timing
Rev. 0 |
Page 39 of 48 |
Unit
June 2007
ADSP-21371
SPI Interface—Slave
Table 38. SPI Interface Protocol—Slave Switching and Timing Specifications
Parameter
Timing Requirements
tSPICLKS
tSPICHS
tSPICLS
tSDSCO
Min
Serial Clock Cycle
Serial Clock High Period
Serial Clock Low Period
SPIDS Assertion to First SPICLK Edge
CPHASE = 0
CPHASE = 1
tHDS
Last SPICLK Edge to SPIDS Not Asserted, CPHASE = 0
tSSPIDS
Data Input Valid to SPICLK edge (Data Input Set-up Time)
tHSPIDS
SPICLK Last Sampling Edge to Data Input Not Valid
tSDPPW
SPIDS Deassertion Pulse Width (CPHASE=0)
Switching Characteristics
tDSOE
SPIDS Assertion to Data Out Active
SPIDS Deassertion to Data High Impedance
tDSDHI
tDDSPIDS
SPICLK Edge to Data Out Valid (Data Out Delay Time)
tHDSPIDS
SPICLK Edge to Data Out Not Valid (Data Out Hold Time)
tDSOV
SPIDS Assertion to Data Out Valid (CPHAS E = 0)
Max
4 × tPCLK – 2
2 × tPCLK – 2
2 × tPCLK – 2
ns
ns
ns
ns
2 × tPCLK
2 × tPCLK
2 × tPCLK
2
2
2 × tPCLK
0
0
ns
ns
ns
ns
6.8
6.8
9.5
2 × tPCLK
5 × tPCLK
SPIDS
(INPUT)
t S P IC H S
tSPICLS
tSPICLKS
tHDS
SPICLK
(CP = 0)
(INPUT)
tSPICLS
tSDSCO
SPICLK
(CP = 1)
(INPUT)
tSDPPW
tSPICHS
tDSDHI
tDDSPIDS
tDSOE
tDDSPIDS
MISO
(OUTPUT)
tHDSPIDS
MSB
LSB
tHSPIDS
CPHASE = 1
tSSPIDS
tSSPIDS
MOSI
(INPUT)
MSB VALID
LSB VALID
tHDSPIDS
tDDSPIDS
MISO
(OUTPUT) t
DSOV
MSB
LSB
CPHASE = 0
MOSI
(INPUT)
tHSPIDS
tSSPIDS
MSB VALID
LSB VALID
Figure 30. SPI Slave Timing
Rev. 0 |
Page 40 of 48 |
June 2007
Unit
tDSDHI
ns
ns
ns
ns
ns
ADSP-21371
Universal Asynchronous Receiver-Transmitter
(UART) Port—Receive and Transmit Timing
Figure 31 describes UART port receive and transmit operations.
The maximum baud rate is PCLK/16 where PCLK = 1/tPCLK. As
shown in Figure 31 there is some latency between the genera-
tion of internal UART interrupts and the external data
operations. These latencies are negligible at the data transmis­
sion rates for the UART.
Table 39. UART Port
Parameter
Timing Requirement
tRXD1
Incoming Data Pulse Width
Switching Characteristic
tRXD1
Incoming Data Pulse Width
1
Min
Max
Unit
≥95
ns
≥95
ns
UART signals RXD and TXD are routed through DPI P14-1 pins using the SRU.
DPI_P14-1
[RXD]
DATA(5- 8)
STOP
RECEIVE
INTERNAL
UART RECEIVE
INTERRUPT
UART RECEIVE BIT SET BY DATA STOP;
CLEARED BY FIFO READ
START
DPI_P14-1
[TXD]
DATA(5- 8)
STOP(1-2)
TRANSMIT
INTERNAL
UART TRANSMIT
INTERRUPT
UART TRANSMIT BIT SET BY PROGRAM;
CLEARED BY WRITE TO TRANSMIT
Figure 31. UART Port—Receive and Transmit Timing
Rev. 0 |
Page 41 of 48 |
June 2007
ADSP-21371
TWI Controller Timing
Table 40 and Figure 32 provide timing information for the TWI
interface. Input Signals (SCL, SDA) are routed to the
DPI_P14–1 pins using the SRU. Therefore, the timing specifica­
tions provided below are valid at the DPI_P14–1 pins.
Table 40. Characteristics of the SDA and SCL Bus Lines for F/S-Mode TWI Bus Devices1
Parameter
fSCL
tHDSTA
tLOW
tHIGH
tSUSTA
tHDDAT
tSUDAT
tSUSTO
tBUF
tSP
1
SCL Clock Frequency
Hold Time (repeated) Start Condition. After This
Period, the First Clock Pulse is Generated.
Low Period of the SCL Clock
High Period of the SCL Clock
Setup Time for a Repeated Start Condition
Data Hold Time for TWI-bus Devices
Data Setup Time
Setup Time for Stop Condition
Bus Free Time Between a Stop and Start Condition
Pulse Width of Spikes Suppressed By the Input Filter
Min
0
Standard Mode
Max
100
4.0
4.7
4.0
4.7
0
250
4.0
4.7
n/a
n/a
Min
0
Fast Mode
Max
400
0.6
1.3
0.6
0.6
0
100
0.6
1.3
0
Unit
kHz
μs
μs
μs
μs
μs
ns
μs
μs
ns
50
All values referred to VIHmin and VILmax levels. For more information, see Electrical Characteristics on page 15.
DPI_P14-1
SDA
tSUDA T
tHDS TA
tLOW
DPI_P14-1
SCL
tHDS TA
S
tBUF
t SP
tH DDA T
tHIGH
tSUS TA
t SUSTO
Sr
Figure 32. Fast and Standard Mode Timing on the TWI Bus
Rev. 0 |
Page 42 of 48 |
June 2007
P
S
ADSP-21371
JTAG Test Access Port and Emulation
Table 41. JTAG Test Access Port and Emulation
Parameter
Timing Requirements
tTCK
TCK Period
tSTAP
TDI, TMS Setup Before TCK High
tHTAP
TDI, TMS Hold After TCK High
tSSYS1
System Inputs Setup Before TCK High
1
tHSYS
System Inputs Hold After TCK High
tTRSTW
TRST Pulse Width
Switching Characteristics
tDTDO
TDO Delay from TCK Low
2
tDSYS
System Outputs Delay After TCK Low
1
2
Min
Max
tCK
5
6
7
18
4 tCK
ns
ns
ns
ns
ns
ns
7
tCK / 2 + 7
System Inputs = AD15–0, CLKCFG1–0, RESET, BOOTCFG1–0, DAI_Px, and FLAG3–0.
System Outputs = DAI_Px, AD15–0, RD, WR, FLAG3–0, CLKOUT, EMU, and ALE.
tTCK
TCK
tSTAP
tHTAP
TMS
TDI
tDTDO
TDO
tSSYS
tHSYS
SYSTEM
INPUTS
tDSYS
SYSTEM
OUTPUTS
Figure 33. IEEE 1149.1 JTAG Test Access Port
Rev. 0 |
Page 43 of 48 |
June 2007
Unit
ns
ns
ADSP-21371
OUTPUT DRIVE CURRENTS
CAPACITIVE LOADING
Figure 34 shows typical I-V characteristics for the output driv­
ers of the ADSP-21371. The curves represent the current drive
capability of the output drivers as a function of output voltage.
Output delays and holds are based on standard capacitive loads:
30 pF on all pins (see Figure 35). Figure 39 shows graphically
how output delays and holds vary with load capacitance. The
graphs of Figure 37, Figure 38, and Figure 39 may not be linear
outside the ranges shown for Typical Output Delay vs. Load
Capacitance and Typical Output Rise Time (20% to 80%,
V = Min) vs. Load Capacitance.
40
VOH
3.3V, 25°C
20
3.47V, -45°C
10
12
3.11V, 125°C
10
0
- 10
3.11V, 125°C
- 20
3.3V, 25°C
VOL
- 30
3.47V, ­45°C
- 40
0
0.5
1.0
1.5
2.0
2.5
SWEEP (VDDEXT ) VOLTAGE (V)
3.0
y = 0.0467x + 1.6323
RISE AND FALL TIMES (ns)
SOURCE (VDDEXT) CURRENT (mA)
30
3.5
RISE
FALL
8
6
4
y = 0.045x + 1.524
2
Figure 34. ADSP-21371 Typical Drive at Junction Temperature
0
0
50
TEST CONDITIONS
100
150
200
250
LOAD CAPACITANCE (pF)
The ac signal specifications (timing parameters) appear in
Table 15 on Page 21 through Table 41 on Page 43. These include
output disable time, output enable time, and capacitive loading.
The timing specifications for the SHARC apply for the voltage
reference levels in Figure 35.
50�
TO
OUTPUT
PIN
1.5V
30pF
12
RISE
10
RISE AND FALL TIMES (ns)
Timing is measured on signals when they cross the 1.5 V level as
described in Figure 36. All delays (in nanoseconds) are mea­
sured between the point that the first signal reaches 1.5 V and
the point that the second signal reaches 1.5 V.
Figure 37. Typical Output Rise/Fall Time (20% to 80%,
VDDEXT = Max)
y = 0.049x + 1.5105
FALL
8
6
y = 0.0482x + 1.4604
4
2
0
0
Figure 35. Equivalent Device Loading for AC Measurements
(Includes All Fixtures)
INPUT
1.5V
OR
OUTPUT
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 38. Typical Output Rise/Fall Time (20% to 80%,
VDDEXT = Min)
1.5V
Figure 36. Voltage Reference Levels for AC Measurements
Rev. 0 |
Page 44 of 48 |
June 2007
250
ADSP-21371
Values of θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val­
ues provided in Table 42 are modeled values.
10
OUTPUT DELAY OR HOLD (ns)
8
Table 42. Thermal Characteristics for 208-Lead MQFP
Y = 0.0488X - 1.5923
6
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
4
2
0
-2
-4
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 39. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
THERMAL CHARACTERISTICS
The ADSP-21371 processor is rated for performance over the
temperature range specified in Operating Conditions on
Page 15.
Table 42 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure­
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (MQFP). The junction-to-case
measurement complies with MIL- STD-883. All measurements
use a 2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
T J = T CASE + ( Ψ JT × P D )
where:
TJ = junction temperature °C
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the Typical value from Table 42.
PD = power dissipation
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first order approxi­
mation of TJ by the equation:
T J = T A + ( θ JA × P D )
where:
TA = ambient temperature °C
Values of θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Rev. 0 |
Page 45 of 48 |
June 2007
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
30.82
27.53
26.22
14.04
2.0
2.65
3.12
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
ADSP-21371
208-LEAD MQFP PINOUT
Table 43. 208-Lead MQFP Pin Assignment (Numerically by Lead Number)
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Signal
VDDINIT
DATA28
DATA27
GND
VDDEXT
DATA26
DATA25
DATA24
DATA23
GND
VDDINT
DATA22
DATA21
DATA20
VDDEXT
GND
DATA19
DATA18
VDDINT
GND
DATA17
VDDINT
GND
VDDINT
GND
DATA16
DATA15
DATA14
DATA13
DATA12
VDDEXT
GND
VDDINT
GND
DATA11
DATA10
DATA9
DATA8
DATA7
DATA6
VDDEXT
GND
VDDINT
DATA4
Pin No.
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
Signal
VDD
GND
VDDEXT
ADDR0
ADDR2
ADDR1
ADDR4
ADDR3
ADDR5
GND
VDD
GND
VDDEXT
ADDR6
ADDR7
ADDR8
ADDR9
ADDR10
GND
VDD
GND
VDDEXT
ADDR11
ADDR12
ADDR13
GND
VDD
NC
NC
GND
CLKIN
XTAL
VDDEXT
GND
VDD
ADDR14
GND
VDDEXT
ADDR15
ADDR16
ADDR17
ADDR18
GND
VDDEXT
Rev. 0 |
Pin No.
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
Page 46 of 48 |
Signal
VDD
GND
VDDEXT
SDCAS
SDRAS
SDCKE
SDWE
WR
SDA10
GND
VDDEXT
SDCLK
GND
VDD
RD
ACK
FLAG3
FLAG2
FLAG1
FLAG0
DAI20
GND
VDD
GND
VDDEXT
DAI19
DAI18
DAI17
DAI16
DAI15
DAI14
DAI13
DAI12
VDD
VDDEXT
GND
VDD
GND
DAI11
DAI10
DAI8
DAI9
DAI6
DAI7
June 2007
Pin No.
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
Signal
VDD
VDD
GND
VDD
VDD
VDD
TDI
TRST
TCK
GND
VDD
TMS
CLK_CFG0
BOOTCFG0
CLK_CFG1
EMU
BOOTCFG1
TDO
DAI4
DAI2
DAI3
DAI1
VDDEXT
GND
VDD
GND
DPI14
DPI13
DPI12
DPI11
DPI10
DPI9
DPI8
DPI7
VDDEXT
GND
VDD
GND
DPI6
DPI5
DPI4
DPI3
DPI1
DPI2
ADSP-21371
Table 43. 208-Lead MQFP Pin Assignment (Numerically by Lead Number) (Continued)
Pin No.
45
Signal
DATA5
Pin No.
97
Signal
ADDR19
Pin No.
149
Signal
DAI5
Pin No.
201
46
47
48
49
50
51
52
DATA2
DATA3
DATA0
DATA1
VDDEXT
GND
VDDINT
98
99
100
101
102
103
104
ADDR20
ADDR21
ADDR23
ADDR22
MS1
MS0
VDD
150
151
152
153
154
155
156
VDDEXT
GND
VDD
GND
VDD
GND
VDD
202
203
204
205
206
207
208
Rev. 0 |
Page 47 of 48 |
June 2007
Signal
CLKOUT/
~RESETOUT/
~RUNRSTIN
RESET
VDDEXT
GND
DATA30
DATA31
DATA29
VDD
ADSP-21371
OUTLINE DIMENSIONS
The ADSP-21371 is available in a 208-lead Pb-free MQFP package.
0.75
0.60
0.45
30.60 SQ
BSC
4.10
MAX
208
1
SEATING
PLANE
157
156
PIN 1 INDICATOR
28.00 SQ
BSC
TOP VIEW
(PINS DOWN)
3.60
3.40
3.20
0.50
0.25
VIEW A
105
104
52
0.20
0.09
53
0.50
BSC
0.08 MAX
(LEAD COPLANARITY)
(LEAD PITCH)
0.27
0.17
(LEAD WIDTH)
VIEW A
ROTATED 90° CCW
NOTES:
1. THE ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 FROM ITS IDEAL
POSITION WHEN MEASURED IN THE LATERAL DIRECTION.
2. CENTER DIMENSIONS ARE TYPICAL UNLESS OTHERWISE NOTED.
3. DIMENSIONS ARE IN MILLIMETERS AND COMPLY WITH JEDEC
STANDARD MS-029, FA-1.
Figure 40. 208-Lead MQFP (S-208-2)
ORDERING GUIDE
Model
ADSP-21371KSZ-2B2
ADSP-21371KSZ-2A2,3
1
2
3
Temperature
Range1
0C to +70C
0C to +70C
On-Chip
SRAM
1M bit
1M bit
ROM
4M bit
4M bit
Operating Voltage Package Description
1.2 INT V/3.3 EXT V 208-Lead MQFP
1.2 INT V/3.3 EXT V 208-Lead MQFP
Package
Option
S-208-2
S-208-2
Referenced temperature is ambient temperature.
Z = RoHS Compliant Part
Available with a wide variety of audio algorithm combinations sold as part of a chipset and bundled with necessary software. For a complete list, visit our website at
www.analog.com/SHARC
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D06176-0-6/07(0)
Rev. 0 |
Page 48 of 48 |
June 2007