VISHAY BS107KL

TN2404K/TN2404KL/BS107KL
Vishay Siliconix
N-Channel 240 -V (D-S) MOSFET
PRODUCT SUMMARY
Part Number
VDS Min (V)
TN2404K
240
TN2404KL/BS107KL
FEATURES
D
D
D
D
D
rDS(on) (W)
VGS(th) (V)
ID (A)
4 @ VGS = 10 V
0.8 to 2.0
0.2
4 @ VGS = 10 V
0.8 to 2.0
0.3
BENEFITS
Low On-Resistance: 4 W
Secondary Breakdown Free: 260 V
Low Power/Voltage Driven
Low Input and Output Leakage
Excellent Thermal Stability
D
D
D
D
D
G
1
S
2
D High-Voltage Drivers: Relays, Solenoids,
Lamps, Hammers, Displays,
Transistors, etc.
D Telephone Mute Switches, Ringer Circuits
D Power Supply, Converters
D Motor Control
TO-226AA
(TO-92)
3
S
1
G
TO-92-18RM
(TO-18 Lead Form)
Device Marking
Front View
D
1
2
“S” TN
2404KL
xxyy
G
2
“S” BS
107KL
xxyy
3
“S” = Siliconix Logo
xxyy = Date Code
S
3
“S” = Siliconix Logo
xxyy = Date Code
D
D
Top View
4 87
4.87
APPLICATIONS
Low Offset Voltage
Full-Voltage Operation
Easily Driven Without Buffer
Low Error Voltage
No High-Temperature
“Run-Away”
TO-236
(SOT-23)
Qg (Typ)
Device Marking
Front View
TN2404K
Marking Code: K1ywl
K1 = Part Number Code for TN2404K
y = Year Code
w = Week Code
l = Lot Traceability
Top View
Top View
TN2404KL
BS107KL
ORDERING INFORMATION
Standard
Part Number
Lead (Pb)-Free
Part Number
TN2404K-T1
TN2404K-T1—E3
TN2404KL-TR1
TN2404KL-TR1—E3
BS107KL-TR1
BS107KL-TR1—E3
Option
With Tape and Reel Folding Option
Spool Option
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)
Parameter
Symbol
TN2404K
TN2404KL/BS107KL
Drain-Source Voltage
VDS
240
Gate-Source Voltage
VGS
"20
Continuous Drain Current (TJ = 150_C)
TA= 25_C
TA= 70_C
Pulsed Drain Currenta
Power Dissipation
ID
IDM
TA= 25_C
TA= 70_C
Thermal Resistance, Junction-to-Ambient
Operating Junction and Storage Temperature Range
PD
RthJA
TJ, Tstg
V
0.2
0.3
0.16
0.25
0.8
1.4
0.36
0.8
0.23
0.51
350b
156
−55 to 150
Unit
A
W
_C/W
_C
Notes
a. Pulse width limited by maximum junction temperature.
b. Surface mounted on an FR4 board.
Document Number: 72225
S-41761—Rev. B , 04-Oct-04
www.vishay.com
1
TN2404K/TN2404KL/BS107KL
Vishay Siliconix
SPECIFICATIONS (TA = 25_C UNLESS OTHERWISE NOTED)
Limits
Symbol
Test Conditions
Min
Typa
V(BR)DSS
VGS = 0 V, ID = 100 mA
240
257
VGS(th)
VDS = VGS, ID = 250 mA
0.8
1.65
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = "20 V
Zero Gate Voltage Drain Current
IDSS
On State Drain Currentb
On-State
ID(on)
D( )
Parameter
Max
Unit
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Drain-Source
On-Resistanceb
Forward Transconductanceb
Diode Forward Voltage
2.0
"100
VDS = 192 V, VGS = 0 V
1
10
TJ = 55_C
VDS = 10 V, VGS =10 V
0.8
VDS = 10 V, VGS = 4.5 V
0.5
nA
mA
A
VGS = 10 V, ID = 0.3 A
2.2
4
VGS = 4.5 V, ID = 0.2 A
2.3
4
VGS = 2.5 V, ID = 0.1 A
2.4
6
gfs
VDS = 10 V, ID = 0.3 A
1.6
VSD
IS = 0.3 A, VGS = 0 V
0.8
1.2
4.87
8
rDS(on)
( )
V
W
S
V
Dynamica
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
1.53
td(on)
5
10
12
20
35
60
16
25
Turn On Time
Turn-On
turn-Off Time
tr
td(off)
tr
VDS = 192 V, VGS = 10 V, ID = 0.5 A
VDD = 60 V, RL = 200 W
ID ] 0.3 A, VGEN = 10 V, RG = 25 W
0.56
nC
nS
Notes
a. For DESIGN AID ONLY, not subject to production testing.
b. Pulse test: PW v300 ms duty cycle v2%.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 72225
S-41761—Rev. B , 04-Oct-04
TN2404K/TN2404KL/BS107KL
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Output Characteristics
Transfer Characteristics
1.4
1.8
VGS = 10 thru 3 V
I D − Drain Current (A)
I D − Drain Current (A)
1.2
2.5 V
0.9
0.6
0.3
0.0
1.0
125_C
0.8
0.6
0.4
0.0
0
1
2
3
4
5
0
1
2
3
4
5
VDS − Drain-to-Source Voltage (V)
VGS − Gate-to-Source Voltage (V)
On-Resistance vs. Drain Current
Capacitance
6
300
5
250
3
C − Capacitance (pF)
4
VGS = 4.5 V
VGS = 10 V
2
1
200
Ciss
150
100
50
0
0.0
Crss
Coss
0
0.2
0.4
0.6
0.8
1.0
1.2
0
10
ID − Drain Current (A)
20
30
40
50
VDS − Drain-to-Source Voltage (V)
On-Resistance vs. Junction Temperature
Gate Charge
10
2.2
VDS = 192 V
ID = 0.5 A
VGS = 10 V
ID = 0.3 A
2.0
8
1.8
rDS(on) − On-Resiistance
(Normalized)
V GS − Gate-to-Source Voltage (V)
25_C
0.2
2V
r DS(on) − On-Resistance ( W )
TC = −55_C
1.2
1.5
6
4
2
1.6
1.4
VGS = 4.5 V
ID = 0.2 A
1.2
1.0
0.8
0.6
0
0
1
2
3
Qg − Total Gate Charge (nC)
Document Number: 72225
S-41761—Rev. B , 04-Oct-04
4
5
0.4
−50
−25
0
25
50
75
100
125
150
TJ − Junction Temperature (_C)
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TN2404K/TN2404KL/BS107KL
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
8
10
ID = 100 mA
r DS(on) − On-Resistance ( W )
I S − Source Current (A)
7
1
TJ = −55_C
0.1
TJ = 25_C
0.01
6
ID = 50 mA
5
4
3
2
TJ = 150_C
ID = 10 mA
1
0
0.001
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0
1.4
2
VSD − Source-to-Drain Voltage (V)
4
6
8
10
VGS − Gate-to-Source Voltage (V)
Threshold Voltage
0.3
0.2
V GS(th) Variance (V)
0.1
ID = 250 mA
−0.0
−0.1
−0.2
−0.3
−0.4
−0.5
−50
−25
0
25
50
75
100
125
150
TJ − Temperature (_C)
Normalized Thermal Transient Impedance, Junction-to-Ambient (TO-236, TN2404K Only)
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
0.02
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA =350_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10−4
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4
10−3
10−2
10−1
1
Square Wave Pulse Duration (sec)
10
100
600
Document Number: 72225
S-41761—Rev. B , 04-Oct-04
TN2404K/TN2404KL/BS107KL
Vishay Siliconix
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)
Normalized Effective Transient Thermal Impedance, Junction-to-Ambient
(TO-226AA, TN2404KL and TO-92-18RM, BS107KL Only)
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
Notes:
0.05
PDM
t1
t2
1. Duty Cycle, D =
0.02
0.01
2. Per Unit Base = RthJA = 156_C/W
3. TJM − TA = PDMZthJA(t)
Single Pulse
0.01
0.1
t1
t2
1
10
100
1K
10 K
t1 − Square Wave Pulse Duration (sec)
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and
Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability data, see
http://www.vishay.com/ppg?72225.
Document Number: 72225
S-41761—Rev. B , 04-Oct-04
www.vishay.com
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