VISHAY SI4392DY_06

Si4392DY
Vishay Siliconix
N-Channel Reduced Qg, Fast Switching WFET®
FEATURES
PRODUCT SUMMARY
VDS (V)
30
rDS(on) (Ω)
ID (A)
0.00975 at VGS = 10 V
12.5
0.01375 at VGS = 4.5 V
10.0
• Extremely Low Qgd WFET Technology for
Switching Losses
• TrenchFET® Power MOSFET
• 100 % Rg Tested
Available
RoHS*
COMPLIANT
APPLICATIONS
• High-Side DC/DC Conversion
- Notebook
- Server
SO-8
S
S
S
G
8
D
2
7
D
3
6
D
4
5
D
1
D
G
Top View
S
Ordering Information: Si4392DY-T1
Si4392DY-T1-E3 (Lead (Pb)-free)
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noteda
Parameter
Symbol
Limits
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
± 20
Continuous Drain Current (TJ = 150 °C)a
TA = 25 °C
TA = 70 °C
Pulsed Drain Current
Continuous Source Current (Diode
Conduction)a
Single Pulse Avalanche Current
Avalanche Energy
Maximum Power Dissipationa
L = 0.1 mH
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
Unit
V
12.5
ID
10
IDM
50
IS
2.7
IAS
30
EAS
45
A
mJ
3.0
PD
W
1.9
TJ, Tstg
- 55 to 150
°C
THERMAL RESISTANCE RATINGSa
Parameter
Symbol
Typical
Maximum
Maximum Junction-to-Ambient
RthJA
33
42
Maximum Junction-to-Foot (Drain)
RthJF
16
20
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 Board, t ≤ 10 sec.
* Pb containing terminations are not RoHS compliant, exemptions may apply.
Document Number: 72151
S-61013-Rev. E, 12-Jun-06
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Si4392DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
1.0
Typ
Max
Unit
Static
VGS(th)
VDS = VGS, ID = 250 µA
Gate-Body Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Gate Threshold Voltage
Forward Transconductancea
Diode Forward Voltage
a
3.0
V
± 100
nA
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
5
VDS ≥ 5 V, VGS = 10 V
µA
30
A
VGS = 10 V, ID = 12.5 A
0.008
0.00975
VGS = 4.5 V, ID = 10.0 A
0.011
0.01375
gfs
VDS = 15 V, ID = 12.5 A
40
VSD
IS = 2.7 A, VGS = 0 V
0.73
1.1
10
15
Ω
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Rg
VDS = 15 V, VGS = 4.5 V, ID = 12.5 A
0.5
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
3.5
2.6
1.6
2.7
15
25
VDD = 15 V, RL = 15 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
5
10
45
70
8
15
IF = 2.7 A, di/dt = 100 A/µs
30
60
Ω
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
TYPICAL CHARACTERISTICS 25 °C unless noted
50
50
VGS = 10 thru 4 V
40
I D - Drain Current (A)
I D - Drain Current (A)
40
30
3V
20
10
30
20
TC = 125 °C
10
25 °C
- 55 °C
0
0
1
2
3
4
VDS - Drain-to-Source Voltage (V)
Output Characteristics
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2
5
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
Document Number: 72151
S-61013-Rev. E, 12-Jun-06
Si4392DY
Vishay Siliconix
TYPICAL CHARACTERISTICS
25 °C unless noted
1800
Ciss
1500
0.024
C - Capacitance (pF)
r DS(on) - On-Resistance (Ω)
0.030
0.018
VGS = 4.5 V
0.012
VGS = 10 V
0.006
1200
900
Coss
600
Crss
300
0
0.000
0
10
20
30
40
0
50
6
12
30
Capacitance
1.8
6
VDS = 15 V
ID = 12.5 A
5
VGS = 10 V
ID = 12.5 A
1.6
rDS(on) - On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
24
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current
4
3
2
1.4
1.2
1.0
0.8
1
0.6
- 50
0
0
3
6
9
12
15
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
Gate Charge
On-Resistance vs. Junction Temperature
150
0.040
r DS(on) - On-Resistance (Ω)
TJ = 150 °C
10
1
TJ = 25 °C
0.1
0.0
- 25
TJ - Junction Temperature (°C)
50
I S - Source Current (A)
18
0.032
ID = 12.5 A
0.024
0.016
0.008
0.000
0.2
0.4
0.6
0.8
1.0
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
Document Number: 72151
S-61013-Rev. E, 12-Jun-06
1.2
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
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Si4392DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
0.6
30
0.4
0.2
18
Power (W)
V GS(th) Variance (V)
24
ID = 250 µA
0.0
- 0.2
12
- 0.4
6
- 0.6
- 0.8
- 50
0
- 25
0
25
50
75
100
125
10- 2
150
10- 1
1
TJ - Temperature (°C)
10
100
600
Time (sec)
Single Pulse Power
Threshold Voltage
100
Limited by
rDS(on)
I D - Drain Current (A)
10
1 ms
10 ms
1
100 ms
1s
0.1
10 s
TC = 25 °C
Single Pulse
dc
0.01
0.1
1
10
100
VDS - Drain-to-Source Voltage (V)
Safe Operating Area, Junction-to-Case
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = R thJA = 70 °C/W
0.02
3. T JM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10- 4
10- 3
10- 2
10- 1
1
Square Wave Pulse Duration (sec)
10
100
600
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 72151
S-61013-Rev. E, 12-Jun-06
Si4392DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C unless noted
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10- 4
10- 3
10- 2
10- 1
Square Wave Pulse Duration (sec)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and reliability
data, see http://www.vishay.com/ppg?72151
Document Number: 72151
S-61013-Rev. E, 12-Jun-06
www.vishay.com
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Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
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or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
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Document Number: 91000
Revision: 08-Apr-05
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