VISHAY VSMY3850_11

VSMY3850
www.vishay.com
Vishay Semiconductors
High Speed Infrared Emitting Diode, 850 nm,
Surface Emitter Technology
FEATURES
• Package type: surface mount
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94 8553
DESCRIPTION
Package form: PLCC-2
Dimensions (L x W x H in mm): 3.5 x 2.8 x 1.75
Peak wavelength: p = 850 nm
High reliability
High radiant power
High radiant intensity
Angle of half intensity:  = ± 60°
Designed for high pulse current operation
Floor life: 168 h, MSL 3, acc. J-STD-020
Lead (Pb)-free reflow soldering
Compliant to RoHS Directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
Note
** Please see document “Vishay Material Category Policy”:
www.vishay.com/doc?99902
VSMY3850 is an infrared, 850 nm emitting diode based on
surface emitter technology with high radiant intensity, high
optical power and high speed, molded in a PLCC-2 package
for surface mounting (SMD).
RELEASED FOR APPLICATIONS
• IR remote control
• 3D TV
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
 (deg)
P (nm)
tr (ns)
17
± 60
850
10
VSMY3850
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMY3850-GS08
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
PLCC-2
VSMY3850-GS18
Tape and reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
• MOQ: minimum order quantity
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
IF
not designed for DC
operation
mA
tp/T = 0.1, tp  100 μs
IFM
800
mA
tp = 100 μs
IFSM
1
A
PV
200
mW
Reverse voltage
Forward current
Pulse peak forward current
Surge forward current
Power dissipation
Junction temperature
Tj
100
°C
Operating temperature range
Tamb
- 40 to + 85
°C
Storage temperature range
Tstg
- 40 to + 100
°C
acc. figure 7, J-STD-020
Tsd
260
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
Soldering temperature
Thermal resistance junction/ambient
Rev. 1.1, 31-May-11
1
Document Number: 83399
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3850
www.vishay.com
Vishay Semiconductors
120
IF - Forward Current (mA)
PV - Power Dissipation (mW)
250
200
150
100
50
100
80
60
40
20
RthJA = 250 K/W
RthJA = 250 K/W
0
0
0
22541
20
40
60
80
100
0
Tamb - Ambient Temperature (°C)
20
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
40
60
80
100
Tamb - Ambient Temperature (°C)
22542
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Temperature coefficient of VF
TEST CONDITION
SYMBOL
TYP.
MAX.
UNIT
IF = 100 mA, tp = 20 ms
VF
1.6
2.0
V
IF = 1 A, tp = 100 μs
VF
2.9
V
IF = 1 mA
TKVF
- 1.45
mV/K
IF = 10 mA
TKVF
- 1.2
mV/K
IR
not designed for reverse operation
μA
Reverse current
Junction capacitance
Radiant intensity
VR = 0 V, f = 1 MHz, E = 0
Cj
IF = 100 mA, tp = 20 ms
Ie
MIN.
125
12
17
pF
25
mW/sr
IF = 1 A, tp = 100 μs
Ie
150
IF = 100 mA, tp = 20 ms
e
55
mW
IF = 100 mA
TKe
- 0.35
%/K
Peak wavelength
IF = 100 mA
p
Spectral bandwidth
IF = 30 mA

30
nm
Radiant power
Temperature coefficient of e

Angle of half intensity
mW/sr
± 60
840
850
deg
870
nm
Temperature coefficient of p
IF = 100 mA
TKp
0.25
nm/K
Rise time
IF = 100 mA
tr
10
ns
Fall time
IF = 100 mA
tf
10
ns
d
0.44
mm
Virtual source diameter
Rev. 1.1, 31-May-11
2
Document Number: 83399
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3850
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
0°
10
20°
Ie, rel - Relative Radiant Intensity
1
0.1
0.01
40°
1.0
0.9
50°
0.8
60°
70°
0.7
ϕ - Angular Displacement
30°
tp = 100 µs
IF - Forward Current (A)
10°
80°
0.001
0
0.5
1
1.5
2
2.5
3
0.6
0.4
0.2
0
94 8013
VF - Forward Voltage (V)
21892
Fig. 6 - Relative Radiant Intensity vs. Angular Displacement
Fig. 3 - Forward Current vs. Forward Voltage
1000
Ie - Radiant Intensity (mW/sr)
tp = 100 µs
100
10
1
0.1
0.001
0.01
0.1
1
IF - Forward Pulse Current (A)
21893
Fig. 4 - Radiant Intensity vs. Forward Current
Φe, rel - Relative Radiant Power
1
IF = 30 mA
0.75
0.5
0.25
0
650
21776-1
750
850
950
λ - Wavelength (nm)
Fig. 5 - Relative Radiant Power vs. Wavelength
Rev. 1.1, 31-May-11
3
Document Number: 83399
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3850
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
technical drawings
according to DIN
specifications
0.9
1.75 ± 0.1
3.5 ± 0.2
Mounting Pad Layout
Pin identification
4
C
area covered with
solder resist
2.6 (2.8)
A
2.2
2.8 ± 0.15
1.2
4
1.6 (1.9)
Ø 2.4
3 + 0.15
Drawing-No.: 6.541-5067.02-4
Issue: 4; 19.07.10
20767
SOLDER PROFILE
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
300
Temperature (°C)
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020.
200
max. 30 s
150
max. 100 s
max. 120 s
100
DRYING
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
0
0
19841
50
100
150
200
250
300
Time (s)
Fig. 7 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
Rev. 1.1, 31-May-11
4
Document Number: 83399
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VSMY3850
www.vishay.com
Vishay Semiconductors
Adhesive tape
10.0
9.0
120°
4.5
3.5
Blister tape
13.00
12.75
2.5
1.5
Component cavity
94 8670
Fig. 8 - Blister Tape
3.5
3.1
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
2.2
2.0
14.4 max.
180
178
94 8665
Fig. 11 - Dimensions of Reel-GS08
5.75
5.25
3.6
3.4
4.0
3.6
8.3
7.7
10.4
8.4
120°
1.85
1.65
1.6
1.4
4.1
3.9
4.1
3.9
4.5
3.5
0.25
2.05
1.95
13.00
12.75
2.5
1.5
94 8668
Fig. 9 - Tape Dimensions in mm for PLCC-2
62.5
60.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
14.4 max.
321
329
18857
Fig. 12 - Dimensions of Reel-GS18
De-reeling direction
COVER TAPE REMOVAL FORCE
94 8158
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
> 160 mm
Tape leader
40 empty
compartments
min. 75 empty
compartments
Carrier leader
Carrier trailer
Fig. 10 - Beginning and End of Reel
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
Rev. 1.1, 31-May-11
5
Document Number: 83399
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
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Document Number: 91000
Revision: 11-Mar-11
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1