[AP1016AEN] AP1016AEN 9.0V Dual H-Bridge Motor Driver IC 1. Genaral Description The AP1016 includes 2 channel H-bridge drivers in one package. It also includes Under Voltage Detection and Thermal Shut Down circuits. It is suitable for driving stepper motor and voice coil motors. 2. Features 2 channel H-bridge drivers in one package Power Supply Voltage Range Control (VC) 2.7V ~ 5.5V Motor (VM) 2.0V ~ 9.0V Output Current 0.7A(DC) H-Bridge ON Resistance ： RDSON (TOP+BOT)=0.54Ω @25C or 0.72Ω @85C PWM Pulse Input max 200kHz Built in Flow-through Current Protection Circuit Built in Charge Pump Circuit Built in UVLO & TSD Circuits Package 16-pin QFN 3mm×3mm MS1589-E-03 -1- 2014/12 [AP1016AEN] 3. Table of Contents 1. 2. 3. 4. 5. 6. Genaral Description ........................................................................................................................................... 1 Features .............................................................................................................................................................. 1 Table of Contents ............................................................................................................................................... 2 Block Diagram ................................................................................................................................................... 3 Ordering Guide .................................................................................................................................................. 3 Pin Configurations and Functions ...................................................................................................................... 4 ■ Pin Configurations ............................................................................................................................................ 4 ■ Function ............................................................................................................................................................ 4 7. Absolute Maximum Ratings .............................................................................................................................. 5 8. Recommended Operating Conditions ................................................................................................................ 6 9. Electrical Characteristics.................................................................................................................................... 6 10. Description ..................................................................................................................................................... 9 11. Recommended External Circuits .................................................................................................................. 11 12. Package ........................................................................................................................................................ 12 ■ Outline Dimensions ........................................................................................................................................ 12 ■ Recommended foot pattern ............................................................................................................................. 12 ■ Marking .......................................................................................................................................................... 13 13. Revise History .............................................................................................................................................. 14 IMPORTANT NOTICE .......................................................................................................................................... 15 MS1589-E-03 -2- 2014/12 [AP1016AEN] 4. Block Diagram TSD Thermal Shut Down Under Voltage Detection UVD N VM1 VG CH Charg ePum p CL OUT1A OUT1B UVDN Level Shifter VC Pre-Driver VC GND1 VM2 TS D IN1A IN1B OUT2A Contro l Logic OUT2B IN2A IN2B GND2 Figure 1. Block Diagram ・ H-bridge driver block NMOS type FETs are applied both high side and low side FETs of a H-bridge. ・Charge pump block It generates the drive voltage (VG) of gate for a high side FET. ・Control logic block Each H-bridge driver is controlled by two input signal IN1/2A or IN1/2B. ・Level shifter & pre-driver block Control signals for the high side FET is shifted VG voltage and then drive the gate of the high side FET. ・Under Voltage Detection It is monitoring the control voltage (VC), if the VC is less than the specified voltage, the output of the H-bridge goes to high impedance. ・Thermal Shut Down If the temperature of the chip is more than the specified temperature, the output of the H-bridge goes to high impedance. 5. Ordering Guide AP1016AEN MS1589-E-03 -40~85℃ 16-pin QFN 3mm×3mm -3- 2014/12 [AP1016AEN] 6. Pin Configurations and Functions OUT2B 9 2 6 GND 2 GND1 OUT1A 7 3 4 OUT1B 1 VM1 Top View OUT2A 5 8 VM2 10 CH VG 11 CL 13 VC 15 IN1A 16 IN1B 14 12 IN2A IN2B ■ Pin Configurations ■ Function Pin No. Name I/O (Note 1) 1 CL I/O Charge pump capacitor 2 CH I/O Charge pump capacitor 3 VM1 P Motor driver power supply 4 OUT1B O Motor driver output CH1 5 OUT1A O Motor driver output CH1 6 GND1 P Power Ground 7 GND2 P Power Ground 8 OUT2A O Motor driver output CH2 9 OUT2B O Motor driver output CH2 10 VM2 P Motor driver power supply 11 IN2A I Control signal input CH2, 200k (Typ) pull down 12 IN2B I Control signal input CH2, 200k (Typ) pull down 13 IN1B I Control signal input CH1, 200k (Typ) pull down 14 IN1A I Control signal input CH1, 200k (Typ) pull down 15 VC P Control circuit power supply Functions 16 VG P Charge pump output capacitor Exposed EP Thermal pad Pad Note 1. I (Input terminal), O (Output terminal) and P (Power terminal) MS1589-E-03 -4- Comments The pad must be connected to the ground. 2014/12 [AP1016AEN] 7. Absolute Maximum Ratings Parameter Symbol min max Unit Comments Control supply voltage VC -0.5 6.0 V Motor supply voltage1 VM -0.5 9.5 V VC level terminal voltage Vterm1 -0.5 VC V (IN1A, IN1B, IN2A and IN2B) VM level terminal voltage Vterm2 -0.5 VM V (OUT1A, OUT1B, OUT2A, OUT2B and CL) VC+VM level terminal voltage Vterm3 -0.5 15.5 V (CH, VG) Iload1 Maximum output current 1.0 A Ta=25C Iload2 Maximum output current 0.7 A Ta=85C Maximum output peak current Iload3 1.4 A (Note 3) PD1 Power dissipation 2.0 W (Note 4),Ta=25C PD2 Power dissipation 1.0 W (Note 4),Ta=85C Storage temperature Tstg -40 150 C Note 2. All above voltage is defined to GND1/2=0V. Note 3. Under 10ms in 200ms Note 4. When the 2-layer (pattern rate: 150%) board is used. This is calculated by RθJ = (60)C /W. WARNING: Operation at or beyond these limits may result in permanent damage to the device. Normal operation is guaranteed at these extremes. Pwower dissipation, Pd ( W) 3.0 2.5 2.0 RθJA=60C/W at 2-layer PCB 1.5 1.0 0.5 0.0 0 25 50 75 85 100 125 Ambient Temperature (C) 150 175 Figure 2. Maximum Power Dissipation MS1589-E-03 -5- 2014/12 [AP1016AEN] 8. Recommended Operating Conditions Symbol min (Ta = 25C unless otherwise specified. (Note 2)) typ max Unit Comments Motor driver supply voltage VM 2.0 5.0 9.0 V Control supply voltage VC 2.7 3.0 5.5 V Input pulse frequency FIN - - 200 kHz Ambient temperature Ta -40 - 85 C Maximun junction temperature Tj - - 150 C Parameter Duty=50%(input pulse) 9. Electrical Characteristics (Operating conditions; Ta = 25C, VM=5.0V and VC = 3.0V, unless otherwise specified.,(Note 2)) Parameter Current consumption VM stand by current VC stand by current VC current VM stand by current (In under voltage detection mode) Charge pump Charge pump voltage Charge pump wake up time (Figure 4, Figure 5) H-bridge driver H-bridge driver High or Low side ON resistance Symbol IVM STBY IN1A=IN1B=IN2A= IVC STBY IN2B=”L” IN1A=IN2A=”L” IVC IN1B=IN2B=200kHz VM = 5.0V IVM UVD VC = 0V min typ max Unit 35 135 100 400 μA μA 500 800 μA 0.1 1.0 μA 8.0 V VG VG = VM+VC、Iload=0A tVGON VC > VCUV 0.3 3.0 ms RON1 VC = 3V、Iload = 100mA Ta = 25C 0.27 0.31 Ω 0.32 0.37 Ω 0.36 0.43 Ω 0.8 1.2 V H-bridge driver High or Low side ON resistance RON2 H-bridge driver High or Low side ON resistance RON3 H-bridge driver Body diode forward voltage Vf MS1589-E-03 Condition VC = 3V、Iload = 700mA Ta = 25C Guaranteed by design (Note 6) VC = 3V、Iload = 700mA Ta = 85C Guaranteed by design (Note 6) If = 100mA -6- 2014/12 [AP1016AEN] Parameter Symbol Propagation delay time (“L”→”H”) tPDLH Propagation delay time (“H”→”L”) tPDHL Propagation delay time (Hi-Z→”H”) tPDZH Propagation delay time (“H”→ Hi-Z) tPDHZ Output pulse width tPW Control logic Input High level voltage VIH (IN1A, IN1B, IN2A, IN2B) Input Low level voltage VIL (IN1A, IN1B, IN2A, IN2B) Input High level voltage IIH (IN1A, IN1B, IN2A, IN2B) Input Low level current IIL (IN1A, IN1B, IN2A, IN2B) Input pulse rise time tr (IN1A, IN1B, IN2A, IN2B) Input pulse fall time tf (IN1A, IN1B, IN2A, IN2B) Protection functions (Figure 4, Figure 5) VC low level detection voltage Voltage hysteresis Condition Load=1 k between OUTA and OUTB Refer to Figure 3(a) IN1A=IN2A=L IN1B=IN2B=200kHz min (Note 5)the time from 50% input to 90% output Refer to Figure 3(c) Guaranteed by design(Note 6) (Note 5)the time from 50% input to 25% down output Refer to Figure 3(d) Guaranteed by design(Note 6) Load=20kΩ between OUTA and OUTB, Input puls width=1us,Refer to 0.7 Figure 3(b) Guaranteed by design (Note 6) typ max Unit 0.07 0.3 μs 0.17 0.3 μs 0.1 0.3 μs 0.1 0.3 μs 1.09 1.5 μs V 0.7×VC VC = 2.7V-5.5V Vterm1 = 3.0V 9 15 0.3×VC V 21 μA μA -1.0 VC = 2.7V-5.5V VCUV 1.9 2.2 1.0 μs 1.0 μs 2.5 V Guaranteed by design 0.02 0.05 0.1 V (Note 6) Thermal shut down Guaranteed by design TTSD 150 175 200 C temperature (Note 6) Temperature hysteresis Guaranteed by design TTSDHYS 20 30 40 C (Note 6) Note 5. 100k load resister is connected between VM and OUTA/B, and also between OUTA/B and GND. Note 6. Not tested in production. MS1589-E-03 VCUVHY S -7- 2014/12 [AP1016AEN] VC IN1/2A IN1/2B 50 % VC IN1/2A IN1/2B 50 % 50% 1us tPDLH tPDHL VM 90 % OUT1/2A OUT1/2B 10 % VM OUT1/2A OUT1/2B 50% tP W (a) Propagation delay time (b) Pulse width VC VC IN1A IN2A IN1A IN2A 50％ 50％ tPDHZ tPDZH OUT1B OUT2B VM VM x 0.9 OUT1B OUT2B Hi-z (c) Hi-z → “H” Propagation delay time (IN1/2B = “H”) VM VM x 0.75(VM25%down) Hi-z (d) “H” → Hi-z Propagation delay time (IN1/2B = “H”) Figure 3. Time chart of propagation delay time and pulse width MS1589-E-03 -8- 2014/12 [AP1016AEN] 10. Description The AP1016 is suitable to drive stepper motor and voice coil motor. If the input signals are fed to IN1A, IN1B, IN2A and IN2B, the output signals, OUT1A, OUT1B, OUT2A and OUT2B are defined by table 1.The AP1016 includes Under Voltage Detection and Thermal Shut Down (TSD) circuits. The under voltage detection circuit is monitoring the control voltage (VC), if the VC is less than the specified voltage(UVD), the output of the H-bridge goes to high impedance. The thermal shut down circuit is monitoring the chip temperature. If the temperature of the chip is more than the specified temperature, the output of the H-bridge goes to high impedance. Under voltage detection and thermal shut down circuit has each hysteresis level. Table 1. Control logic truth table (X: don’t care) Protection detection Input Output IN1A IN1B OUT1A OUT1B UVDN TSD IN2A IN2B OUT2A OUT2B H L L L L L H L H L H L H L L H L H H L H H H H X X Hi-Z Hi-Z L X X X Note 7. Direction of Current Forward (CW) OFF OUTB Standby VM VM OFF OFF OUTB ON ON GND MS1589-E-03 OFF GND Brake OUTA OUTB ON GND OFF ON OUTA ON OFF Standby VM OFF OUTA Brake Forward (CW) Reverse (CCW) Reverse (CCW) VM ON Motion (Note 7) OFF OUTA OUTB OFF OFF GND -9- 2014/12 [AP1016AEN] VM VCU V VC VCU ‐VCUVHY V S VCU V VCU ‐VCUVHY V S UVDN VG tVGO N tVGON IN1/2 A IN1/2 B OUT1/2 A Hi-Z Hi-Z Hi-Z Hi-Z OUT1/2 B Hi-Z Hi-Z Hi-Z Hi-Z Brake Brake Figure 4. Time chart of input and output (in cace of VDUV detection) VM VCU ‐VCUVHY V S VCU V VC UVDN TTS D Tem p TTS ‐TTS HY D D S TS D VG tVGO N IN1/2 A IN1/2 B OUT1/2 A Hi-Z Hi-Z Hi-Z Hi-Z OUT1/2 B Hi-Z Hi-Z Hi-Z Hi-Z Brake Brake Figure 5. Time chart of input and output (in cace of TSD detection) MS1589-E-03 - 10 - 2014/12 [AP1016AEN] 11. Recommended External Circuits CHL MOTOR OUT1B VM1 CH 4 OUT1A VM CVM GND1 GND2 OUT2A 3 CL 2 1 5 CVG 16 6 15 E P 7 14 8 13 9 10 11 OUT2B VM2 IN2 A VG VC VC IN1 A IN1 B CVC 12 IN2 B MCU MOTOR ※Interface Level：VC Figure 6. Recommended External Circuits (Top view) Table 2. Recommended external components example Parameter Symbol min typ max Unit Condition Motor driver power supply 1 connection decupling CVM μF (Note 8) capacitor Control power supply 0.1 CVC μF (Note 8) connection bypass capacitor Charge pump CVG 0.047 0.1 0.22 μF capacitance1 Charge pump CHL 0.047 0.1 0.22 μF capacitance2 Note 8. Please adjust the connecting capacitor of CVM and CVC depending on the load current profile, the load capacitance, the line resistance and etc. with each application boards. MS1589-E-03 - 11 - 2014/12 [AP1016AEN] 12. Package ■ Outline Dimensions (Unit: mm) 0.58＋0.02 －0.03 3.00±0.05 3.00±0.05 . 10 C0 0.30 1.60 0.25 2.00 0.50 0.50 0.10 0.25 0.45 Φ0.50 Note) The EP-PAD is Thermal Pad. The EP-PAD is necessary soldered to PCB. ■ Recommended foot pattern Note) Please layout the foot pattern of EP-PAD not to surround the steam via of AP1016. Please locate thermal via for radiation improvement more than four halls. : example of steam via : example of thermal via MS1589-E-03 - 12 - 2014/12 [AP1016AEN] ■ Marking 1016 Market No. ABCD Date Code Pin #A1Indication YWWA: Date code (4 digit) A: Manage number WW: Producing week Y: Producing year (Ex: 2013 → “3”) MS1589-E-03 - 13 - 2014/12 [AP1016AEN] 13. Revise History Date (YY/MM/DD) 14/01/31 14/08/07 Revision 00 01 Page 7 Contents First edition Propagation delay time (Hi-z →“H”, “H”→Hi-z)Condition “the time from 50% to 75% output” → “the time from 50% input to 90% output” “the time from 75% to 50% output” → “the time from 50% input to 90% output” 8 14/10/09 14/12/24 MS1589-E-03 02 03 9 3 Propagation delay time (“H”→Hi-Z) typ 0.15μs → typ 0.1μs Figure 3 Time chart of propagation Hi-z →“H” and “H”→Hi-z were added. Figure of direction of current was corrected. Correct temperature range in ordering guide - 14 - 2014/12 [AP1016AEN] IMPORTANT NOTICE 0. Asahi Kasei Microdevices Corporation (“AKM”) reserves the right to make changes to the information contained in this document without notice. When you consider any use or application of AKM product stipulated in this document (“Product”), please make inquiries the sales office of AKM or authorized distributors as to current status of the Products. 1. All information included in this document are provided only to illustrate the operation and application examples of AKM Products. AKM neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of AKM or any third party with respect to the information in this document. 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