DHG 20 I 1200 PA

DHG 20 I 1200 PA
preliminary
V RRM =
I FAV =
t rr =
Sonic Fast Recovery Diode
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Single Diode
1200 V
20 A
200 ns
Part number
DHG 20 I 1200 PA
3
1
Backside: cathode
Features / Advantages:
Applications:
Package:
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable
operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Housing: TO-220
Conditions
●rIndustry standard outline
●rEpoxy meets UL 94V-0
●rRoHS compliant
Ratings
Symbol
Definition
VRRM
max. repetitive reverse voltage
IR
reverse current
VF
forward voltage
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
thermal resistance junction to case
T VJ
virtual junction temperature
Ptot
total power dissipation
I FSM
max. forward surge current
I RM
max. reverse recovery current
CJ
junction capacitance
IXYS reserves the right to change limits, conditions and dimensions.
© 2011 IXYS all rights reserved
max.
Unit
V
VR = 1200 V
30
µA
VR = 1200 V
TVJ = 125 °C
0.4
mA
IF =
20 A
TVJ = 25 °C
2.24
V
IF =
40 A
2.90
V
IF =
20 A
IF =
40 A
rectangular
TVJ = 125 °C
d = 0.5
2.25
V
3.17
V
TC = 95°C
20
A
TVJ = 150°C
1.25
V
45
mΩ
0.90
K/W
150
°C
TC = 25 °C
140
W
TVJ = 45°C
150
A
-55
t = 10 ms (50 Hz), sine
IF =
reverse recovery time
typ.
1200
for power loss calculation only
R thJC
t rr
min.
TVJ = 25 °C
TVJ = 25 °C
20 A; VR = 600 V
-di F /dt = 400 A/µs
VR = 600 V; f = 1 MHz
TVJ = 25 °C
15
A
TVJ = 125°C
20
A
TVJ = 25 °C
200
ns
TVJ = 125°C
350
ns
TVJ = 25 °C
8
pF
Data according to IEC 60747and per diode unless otherwise specified
20110616a
DHG 20 I 1200 PA
preliminary
Ratings
Symbol
Definition
Conditions
per terminal
I RMS
RMS current
R thCH
thermal resistance case to heatsink
Tstg
storage temperature
min.
typ.
max.
Unit
35
0.50
-55
Weight
150
2
MD
mounting torque
FC
mounting force with clip
A
K/W
°C
g
0.4
0.6
Nm
20
60
N
Product Marking
Part number
Marking on product
Logo
DateCode
Assembly Code
D
H
G
20
I
1200
PA
abcdef
YYWW Z
=
=
=
=
=
=
=
Diode
Sonic Fast Recovery Diode
extreme fast
Current Rating [A]
Single Diode
Reverse Voltage [V]
TO-220AC (2)
XXXXXX
Assembly Line
Ordering
Standard
Ordering Number
DHG 20 I 1200 PA
Similar Part
DHG20I1200HA
IXYS reserves the right to change limits, conditions and dimensions.
© 2011 IXYS all rights reserved
Marking on Product
DHG20I1200PA
Package
TO-247AD (2)
Delivery Mode
Tube
Quantity
50
Code No.
504934
Voltage Class
1200
Data according to IEC 60747and per diode unless otherwise specified
20110616a
DHG 20 I 1200 PA
preliminary
Outlines TO-220
Dim.
Millimeter
Min.
Max.
Inches
Min.
Max.
A
A1
A2
4.32
1.14
2.29
4.82
1.39
2.79
0.170
0.045
0.090
0.190
0.055
0.110
b
b2
0.64
1.15
1.01
1.65
0.025
0.045
0.040
0.065
C
D
0.35
14.73
0.56
16.00
0.014
0.580
0.022
0.630
E
e
H1
9.91
5.08
5.85
10.66
BSC
6.85
0.390
0.200
0.230
0.420
BSC
0.270
L
L1
12.70
2.79
13.97
5.84
0.500
0.110
0.550
0.230
ØP
Q
3.54
2.54
4.08
3.18
0.139
0.100
0.161
0.125
A
A1
ØP
H1
Q
E
D
4
3
L1
1
L
2x b2
2x b
e
C
A2
IXYS reserves the right to change limits, conditions and dimensions.
© 2011 IXYS all rights reserved
Data according to IEC 60747and per diode unless otherwise specified
20110616a
DHG 20 I 1200 PA
preliminary
40
5
TVJ = 125°C
VR = 600 V
30
4
40 A
IF
Qrr
20
3
[A]
20 A
[µC]
TVJ = 125°C
10
2
TVJ = 25°C
0
0.0
0.5
1.0
1.5
2.0
2.5
10 A
1
200
3.0
300
VF [V]
400
500
600
700
diF /dt [A/µs]
Fig. 1 Typ. Forward current versus VF
Fig. 2 Typ. reverse recov.charge Qrr vs. di/dt
35
700
40 A
TVJ = 125°C
30
TVJ = 125°C
600
VR = 600 V
20 A
25
VR = 600 V
500
10 A
IRM
20
[A]
15
[ns] 300
10
200
5
100
trr
0
200
300
400
500
600
400
40 A
20 A
10 A
0
200
700
300
400
500
600
700
diF /dt [A/µs]
diF /dt [A/µs]
Fig. 3 Typ. peak reverse current IRM vs. di/dt
Fig. 4 Typ. recovery time trr versus di/dt
1
1.4
TVJ = 125°C
VR = 600 V
1.2
1.0
40 A
Erec
ZthJC
0.8
20 A
[mJ]
[K/W]
0.6
10 A
1
2
3
4
0.4
0.2
200
300
400
500
600
diF /dt [A/µs]
Fig. 5 Typ. recovery energy Erec versus di/dt
IXYS reserves the right to change limits, conditions and dimensions.
© 2011 IXYS all rights reserved
700
0.1
0.001
0.01
0.1
Ri
0.231
0.212
0.19
0.267
ti
0.0005
0.004
0.02
0.15
1
10
tp [s]
Fig. 6 Typ. transient thermal impedance
Data according to IEC 60747and per diode unless otherwise specified
20110616a