® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB1EGLTPxxxP CZB1EGTTPxxxP 0402, 25% Bead Part Weight (mg): 1 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available Tin (Sn) Pb Nickel (Ni) Palladium Other material RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.2 2000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 1.8 0.2 2 0.09 18000 2000 20000 900 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 outer termination outer termination middle termination&inner termination inner termination & electrodes ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB2AFTTDxxxP CZB2AFTTDxxxP 0805, 25% Bead 1 Tin (Sn) Pb Nickel (Ni) Palladium Other material Now Available Now Available RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 2 0 2 0.09 20000 0 20000 900 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 outer termination middle termination&inner termination inner termination & electrodes ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB1JGLTExxxP CZB1JGTTExxxP 0402, 25% Bead Part Weight (mg): 2.7 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available Tin (Sn) Pb Nickel (Ni) Palladium Other material RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.2 2000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 1.8 0.2 2 0.09 18000 2000 20000 900 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 outer termination outer termination middle termination&inner termination inner termination & electrodes ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB1JGLTExxxP CZB1JGTTExxxP 0402, 25% Bead Part Weight (mg): 2.7 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available Tin (Sn) Pb Nickel (Ni) Palladium Other material RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.2 2000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 1.8 0.2 2 0.09 18000 2000 20000 900 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 outer termination outer termination middle termination&inner termination inner termination & electrodes ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB1JGTTExxxP CZB1JGTTExxxP 0603, 25% Bead 2.7 Tin (Sn) Now Available Now Available Nickel (Ni) Palladium Other material RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 2 20000 outer termination 2 0.09 20000 900 middle termination&inner termination inner termination & electrodes PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB1JGLTExxxP CZB1JGTTExxxP 0603, 25% Bead Part Weight (mg): 2.7 RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Now Available Now Available Tin (Sn) Pb Nickel (Ni) Palladium Other material RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight PPM 0.2 2000 0 0 0 0 0 0 0 0 0 0 0 0 Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 1.8 0.2 2 0.09 18000 2000 20000 900 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 outer termination outer termination middle termination&inner termination inner termination & electrodes ® RoHS and Pb-Free Component Material Declaration KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide CZB1EGTTPxxxP CZB1EGTTPxxxP 0402, 25% Bead 1 Tin (Sn) Pb Nickel (Ni) Palladium Other material Now Available Now Available RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 2 0 2 0.09 20000 0 20000 900 PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100 outer termination middle termination&inner termination inner termination & electrodes ® RoHS and Pb-Free Component Material Declaration material breakdown is for the KOA P/N in B7 KOA SPEER ELECTRONICS, INC. Product Information KOA Part Number: RoHS/Pb-Free Compliant Part Number: Part Description: Breakdown of all Materials CZB2AGTTExxxP CZB2AGTTExxxP 0805, 25% Bead Part Weight (mg): RoHS/Pb-Free Compliant Samples: RoHS/Pb-Free Compliant Production: Materials Silver (Ag) Triiron Tetroxide Nickel III oxide Zinc Oxide 1 Tin (Sn) Now Available Now Available Nickel (Ni) Palladium Other material RoHS Banned Substances Lead & Lead Compounds Mercury & Mercury Compounds Cadmium & Cadmium Compounds Hexavalent Chromium & Hexavalent Chromium Compounds Polybrominated Biphenyls (PBB) Polybrominated Diphenylethers (PBDE) % Weight Other Banned Substances Asbestos Azo Colorants Ozone Depleting Substances Polyclorinated Biphenyls (PCB) Polychlorinated Naphthalenes Radioactive Substances Short Chain Chlorinated Paraffins Tributyl Tin (TBT) and Triphenyl Tin (TPT) Tributyl Tin Oxide (TBTO) Ethylene Glycol Ethers % Weight (All materials in the part) PPM Where Used 29100 inner termination & electrodes 465000 Ferrite material (Homogeneous) 279000 Ferrite material (Homogeneous) 186000 Ferrite material (Homogeneous) % Weight 2.91 46.5 27.9 18.6 2 20000 outer termination 2 0.09 20000 900 middle termination&inner termination inner termination & electrodes PPM 0 0 0 0 0 0 0 0 0 0 0 0 0 0 PPM 0 0 0 0 0 0 0 0 0 0 % Weight PPM Reportable Substances Brominated Flame Retardants (Other than PBB or PBDE) 0 0 Selenium & Selenium Compounds 0 0 0 0 0 0 0 0 0 0 0 0 Process Data Peak Reflow (Deg. C) Time at Peak Temp. (s) Number of Reflows MSL Plating Material Plating Thickness Underplate Material Underplate Thickness Backward Process Compatable Reportable Substances (Con't) Antimony & Antimony Compounds Arsenic & Arsenic Compounds Beryllium & Beryllium Compounds Bizmuth & Bizmuth Compounds Copper & Copper Compounds Gold & Gold Compounds Magnesium Nickel & Nickel Compounds Palladium & Palladium Compounds Phthalates Silver & Silver Compounds 260 5 3 1 Sn 3µm Ni 3µm Yes minimum minimum % Weight PPM 0 0 0 0 0 0 0 2 0 0 0 0 0 0 0 20000 0.09 900 2.91 29100