TVS Diode Arrays (SPA® Diodes) Diodes) Lightning Surge Protection - SP2502L Series SP2502L Series 3.3V 75A Diode Array RoHS Pb GREEN Description The SP2502L provides overvoltage protection for applications such as 10/100/1000 Base-T Ethernet and T3/ E3 interfaces. This device has a low capacitance of only 5pF making it suitable for PHY side Ethernet protection and the capability to protect against both longitudinal and differential transients. Furthermore, the SP2502L is rated up to 100A (tp=2/10µs) making it suitable for line side protection as well against lightning transients as defined by GR-1089 (intra-building), ITU, YD/T, etc. The application schematic provides the connection information for a PHY side protection scheme of a single differential pair. Pinout Features 1 8 2 7 • Clamping speed of nanoseconds • Lightning protection, IEC61000-4-5, 75A (8/20µs) • SOIC-8 surface mount package (JEDEC MS-012) • Low clamping voltage 3 6 • Low insertion loss, loglinear capacitance 4 5 • Combined longitudinal and metallic protection • UL 94V-0 epoxy molding • RoHS compliant SOIC-8 (Top View) Note: Pinout diagrams above shown as device footprint on circuit board. Functional Block Diagram Line in Pin 1 and 8 Applications Line out • T1/E1 Line cards • T3/E3 and DS3 Interfaces • 10/100/1000 BaseT Ethernet • STS-1 Interfaces Application Example Pin 2, 3, 6, and 7 1 8 2 7 3 6 TeleLink (0461 1.25) 5 4 Line out Line in SP2502L Pin 4 and 5 Additional Information Datasheet to chipset (Ethernet PHY, T3/E3 PHY, etc.) Resources Samples Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 The schematic shows protection for a single differential pair as part of a larger high-speed data interface such as Ethernet. The SP2502L provides both metallic (differential) and longitudinal (common mode) protection from lightning induced surge events as specified by regulatory standards such as Telcordia’s GR-1089 CORE and ITU K.20 and 21. The SP2502L protects against both positive and negative induced surge events while the TeleLink fuse provides overcurrent protection for the long term 50/60 Hz power fault events. TVS Diode Arrays (SPA® Diodes) Diodes) Lightning Surge Protection - SP2502L Series Parameter Parameter Rating Units 170 °C/W Operating Temperature Range –40 to 125 °C kV Storage Temperature Range –55 to 150 °C kV Maximum Junction Temperature 150 °C 100 A °C A Maximum Lead Temperature (Soldering 20-40s) (SOIC - Lead Tips Only) 260 20 Rating Units Peak Pulse Current (8/20µs) 75 A SOIC Package Peak Pulse Power (8/20µs) 2100 W IEC 61000-4-2, Direct Discharge, (Level 4) 30 IEC 61000-4-2, Air Discharge, (Level 4) 30 Telcordia GR 1089 (Intra-Building) (2/10µs) ITU K.20 (5/310µs) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP = 25°C) Parameter Symbol Test Conditions Min Typ Max Units VRWM IT≤1µA - - 3.3 V Reverse Breakdown Voltage VBR IT= 2µA 3.3 - - V Snap Back Voltage Reverse Stand-Off Voltage VSB IT= 50mA 3.3 - - V Reverse Leakage Current IR VRWM= 3.3V - - 1 µA Clamping Voltage, Line-Ground1 VC IPP= 40A, tp=8/20 µs - - 14 V Clamping Voltage, Line-Ground1 VC IPP= 75A, tp=8/20 µs - - 20 V VC IPP= 100A, tp=2/10 µs 20 V RDYN ( VC2-VC1)/(IPP2-IPP1) - 0.2 - W Clamping Voltage, Line-Line VC IPP= 40A, tp=8/20 µs - - 20 V Clamping Voltage, Line-Line VC IPP= 75A, tp=8/20 µs - - 30 V VC IPP= 100A, tp=2/10 µs Clamping Voltage, Line-Ground 1 Dynamic Resistance, Line-Ground 1 1 1 Clamping Voltage, Line-Line 1 Dynamic Resistance, Line-Line 1 Junction Capacitance1 1 RDYN Cj 30 V ( VC2-VC1)/(IPP2-IPP1) - 0.3 - W Line to Ground VR=0V, f= 1MHz - 5 8 pF Line to Line, VR=0V, f= 1MHz - 2.5 5 pF Parameter is guaranteed by design and/or device characterization. © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 SP4040 Thermal Information Absolute Maximum Ratings TVS Diode Arrays (SPA® Diodes) Diodes) Lightning Surge Protection - SP2502L Series Pulse Waveform Clamping Voltage vs. IPP 30 110% 100% 25 Clamp Voltage-VC (V) 90% Percent of IPP 80% 70% 60% 50% 40% 30% Line-Line 20 15 10 Line-Gound 5 20% 0 10% 0% 0 0.0 5.0 10.0 15.0 20.0 25.0 10 20 30 30.0 40 50 60 Peak Pulse Current -I PP (A) Time (μs) Capacitance vs. Reverse Bias at 1MHz Current Derating Curve 6.0 Percentage of Rated Current (% IP) 120 Line-Gound 5.0 Capacitance (pF) 4.0 3.0 2.0 Line-Line 1.0 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Peak Pulse Power (kW) 10 1 0.1 10 100 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 60 40 20 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Ambient Temperature (ºC) Non-Repetitive Peak Pulse Power vs. Pulse Time Peak Pulse Duraon - tP (µs) 80 0 Bias Voltage (V) 1 100 1000 70 TVS Diode Arrays (SPA® Diodes) Diodes) Lightning Surge Protection - SP2502L Series Soldering Parameters 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C CYYWW Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time Product Characteristics Part Marking System LF SP2502 Temperature Pre Heat - Temperature Min (Ts(min)) tP TP Marking Date code Pin1 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Substitute Material Silicon Body Material Molded Epoxy Flammability UL 94 V-0 Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13. Ordering Information Part Numbering System SP2502L B T G TVS Diode Arrays (SPA® Diodes) Series G= Green Part Number Package Marking Min. Order Qty. SP2502LBTG SOIC-8 SP2502 2500 T= Tape & Reel Package B = SOIC-8 © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 SP4040 Pb – Free assembly Reflow Condition TVS Diode Arrays (SPA® Diodes) Diodes) Lightning Surge Protection - SP2502L Series Package Dimensions — Mechanical Drawings and Recommended Solder Pad Outline Package LF SOIC Pins 8 JEDEC MS-012 Millimetres o Recommended Soldering Pad Outline (Reference Only) Inches Min Max Min Max A 1.35 1.75 0.053 0.069 A1 0.10 0.25 0.004 0.010 A2 1.25 1.65 0.050 0.065 B 0.31 0.51 0.012 0.020 c 0.17 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 5.80 6.20 0.228 0.244 E1 3.80 4.00 0.150 0.157 1.27 BSC e L 0.050 BSC 1.27 0.40 0.050 0.016 Embossed Carrier Tape & Reel Specification — SOIC Package Millimetres User Feeding Direction E Pin 1 Location Max Min Max 1.65 1.85 0.065 0.073 F 5.4 5.6 0.213 0.22 P2 1.95 2.05 0.077 0.081 D 1.5 1.6 0.059 0.063 D1 P0 10P0 1.50 Min 3.9 4.1 40.0 ± 0.20 0.059 Min 0.154 0.161 1.574 ± 0.008 W 11.9 12.1 0.468 0.476 P 7.9 8.1 0.311 0.319 A0 6.3 6.5 0.248 0.256 B0 5.1 5.3 0.2 0.209 K0 2 2.2 0.079 0.087 t © 2013 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/20/13 Inches Min 0.30 ± 0.05 0.012 ± 0.002