Datasheet

TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP3374NUTG
SP3374NUTG 3.3V 40A Diode Array
RoHS
Pb GREEN
Description
The SP3374NUTG is a low-capacitance, TVS Diode Array
designed to provide protection against ESD (electrostatic
discharge), CDE (cable discharge events), EFT (electrical
fast transients), and lightning induced surges for highspeed, differential data lines. It’s packaged in a µDFN
package (3.0 x 2.0mm) and each device can protect up 4
channels or 2 differential pairs, up to 40A (IEC 61000-45 2nd edition,) and up to 30kV ESD (IEC 61000-4-2). The
“flow-through” design minimizes signal distortion, reduces
voltage overshoot, and provides a simplified PCB design.
The SP3374NUTG with its low capacitance and low
clamping voltage makes it ideal for high-speed data
interfaces such as 1GbE applications found in notebooks,
switches, etc.
Pinout
Features
10
9
8
7
• ESD, IEC 61000-4-2,
±30kV contact, ±30kV air
6
• EFT, IEC 61000-4-4, 40A
(5/50ns)
• Lightning, IEC 610004-5 2nd edition, 40A
(tP=8/20μs)
1
2
3
4
• Low capacitance of
[email protected] (TYP) per I/O
5
• Low leakage current of
0.1μA (TYP) at 3.3V
Functional Block Diagram
LINE1 IN (Pin 1)
LINE2 IN (Pin 2)
• μDFN-10 package is
optimized for high-speed
data line routing
• Provides protection for
two differential data pairs
(4 channels) up to 40A
• Low operating and
clamping voltage
• AEC-Q101 qualified
• Halogen free, Lead free
and RoHS compliant
Applications
LINE1 OUT (Pin 10)
LINE2 OUT (Pin 9)
•10/100/1000 Ethernet
• LVDS Interfaces
• WAN/LAN Equipment
• Integrated Magnetics
• Desktops, Servers and
Notebooks
• Smart TV
Application Example
GND
GND
RJ-45 Connector
LINE3 IN (Pin 4)
Ethernet PHY
TP0+
LINE3 OUT (Pin 7)
TP0LINE4_IN (Pin 5)
LINE4_OUT (Pin 6)
TP1+
TP1TP2+
TP2TP3+
TP3-
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 06/07/16
SP2574N
SP3374
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP3374NUTG
Absolute Maximum Ratings
Symbol
Parameter
Value
IPP
Peak Current (tp=8/20μs)
PPk
Peak Pulse Power (tp=8/20μs)
TOP
TSTOR
Units
40
A
1000
W
Operating Temperature
-40 to 125
°C
Storage Temperature
-55 to 150
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of
the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC)
Symbol
Test Conditions
Reverse Standoff Voltage
Parameter
VRWM
IR ≤ 1µA
Reverse Leakage Current
IR
VRWM = 3.3V, T = 25°C
Snap Back Voltage
Clamp Voltage
Dynamic Resistance2
ESD Withstand Voltage
Diode Capacitance
VSB
VC
RDYN
VESD
ISB = 50mA
Min
0.1
Revision: 06/07/16
Max
V
0.5
µA
2.8
V
5.5
IPP = 10A, tp = 8/20μs
Any I/O to Ground
10.5
IPP = 25A, tp = 8/20μs
Any I/O to Ground
18.0
IPP = 40A, tp = 8/20μs
Line-to-Line1, two I/O Pins
connected together on each line
25.0
TLP, tp=100ns, Any I/O to Ground
Units
3.3
IPP = 1A, tp = 8/20μs
Any I/O to Ground
0.15
V
Ω
IEC 61000-4-2 (Contact)
±30
kV
IEC 61000-4-2 (Air)
±30
kV
CI/O to GND
Between I/O Pins and Ground
VR = 0V, f = 1MHz
3.5
CI/O to I/O
Between I/O Pins
VR = 0V, f = 1MHz
1.7
Notes:
1. Rating with 2 pins connected together per sugguested diagram ( For example, pin1 is connected to pin 10,
pin 2 is connected to Pin 9, Pin 4 is connected to pin 7 and pin 5 is connected to pin 6)
2. Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Typ
5.0
pF
pF
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP3374NUTG
Clamping Voltage vs. IPP (I/O to GND)
15.0
15
12.0
12
Clamp Voltage (VC)
Capacitance (pF)
Capacitance vs. Reverse Bias
9.0
6.0
6
3
3.0
0.0
9
0
0
0.5
1
1.5
2
2.5
3
3.5
0
5
Bias Voltage (V)
Clamping Voltage vs. IPP (Line-to-Line)
15
20
25
25.0
30.0
8/20μS Pulse Waveform
25
110%
100%
20
Clamp Voltage (VC)
10
Peak Pulse Current-IPP (A)
90%
Percent of IPP
80%
15
10
70%
60%
50%
40%
30%
5
20%
10%
0
0
5
10
15
20
25
30
35
Transmission Line Pulsing(TLP) Plot
20
18
16
TLP Current (A)
14
12
10
8
6
4
2
0
2
4
6
TLP Voltage (V)
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 06/07/16
8
0%
0.0
5.0
10.0
15.0
Time (μs)
Peak Pulse Current-IPP (A)
0
40
10
20.0
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP3374NUTG
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL)
to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
260
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
time to peak temperature
Part Number
Package
Marking
Min. Order Qty.
SP3374NUTG
µDFN-10
(3.0x2.0mm)
bG4
3000
Part Numbering System
Product Characteristics
Lead Plating
Pre-Plated Frame
Lead Material
Copper Alloy
Lead Coplanarity
0.004 inches(0.102mm)
Substrate material
Silicon
Body Material
Molded Epoxy
Flammability
UL 94 V-0
MSL Rating
Level 1
Part Marking System
SP3374N U T G
Series
G= Green
T= Tape & Reel
Package
μDFN-10 (3.0x2.0mm)
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 06/07/16
Time
°C
Ordering Information
TVS Diode Arrays
(SPA® Diodes)
Critical Zone
TL to TP
Ramp-up
TL
TS(max)
25
Peak Temperature (TP)
+0/-5
tP
TP
Temperature
Reflow Condition
bG4
TVS Diode Arrays (SPA® Diodes)
Lightning Surge Protection - SP3374NUTG
Package Dimensions — µDFN-10 (3.0x2.0mm)
D
L
b1
E
Package
µDFN-10 (3.0x2.0mm)
JEDEC
MO-229
L1
Symbol
e
PIN1 INDICATOR
b
e1
A
A1
0.95mm
0.25mm
0.95mm
1.40mm
0.85mm
0.40mm
0.60mm
1.40mm
0.60mm
0.40mm
1.98mm
0.25mm
0.95mm
1.00mm
1.98mm
0.95mm
0.60mm 0.65mm 0.65mm 0.60mm
0.60mm 0.65mm 0.65mm 0.60mm
Recommended Soldering Pads Layout
Recommended Stencil Apertures
Recommended Stencil thickness 5mils
Inches
Nom
Max
Min
Nom
Max
A
0.50
0.60
0.65
0.020
0.024
0.026
A1
0.00
0.03
0.05
0.000
0.001
0.002
0.15 Ref
A3
e2
A3
Millimeters
Min
0.006 Ref
b
0.15
0.20
0.25
0.006
0.008
0.010
b1
0.25
0.35
0.45
0.010
0.014
0.018
D
2.90
3.00
3.10
0.114
0.118
0.122
E
1.90
2.00
2.10
0.075
0.079
0.083
e
0.60 BSC
0.024 BSC
e1
0.65 BSC
0.026 BSC
e2
0.95 BSC
0.037
L
0.25
0.30
0.35
0.010
0.012
0.014
L1
0.95
1.00
1.05
0.037
0.039
0.041
Notes :
1. All dimensions are in millimeters
2. Dimensions include solder plating.
3. Dimensions are exclusive of mold flash & metal burr.
4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
5. Package surface matte finish VDI 11-13.
Tape & Reel Specification — µDFN-10 (3.0x2.0mm)
P0
T
P2
ø1.55±0.05
Package
Device Orientation in Tape
E
Top
Cover
Tape
5° Max
K0
W
A0
F
B0
P
©2016 Littelfuse, Inc.
Specifications are subject to change without notice.
Revision: 06/07/16
ø1.0±0.1
Pin1 Location
µDFN-10 (3.0x2.0mm)
Symbol
Millimeters
A0
2.30 +/- 0.10
B0
3.20 +/- 0.10
E
1.75 +/- 0.10
F
3.50 +/- 0.05
K0
1.0 +/- 0.10
P
4.00 +/- 0.10
P0
4.00 +/- 0.10
P2
2.00 +/- 0.10
T
0.3 +/- 0.05
W
8.00 +0.30/- 0.10