MAX3670ETJ+ RELIABILITY REPORT FOR MAX3670ETJ+ PLASTIC ENCAPSULATED DEVICES August 7, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved. Page 1/5 MAX3670ETJ+ Conclusion The MAX3670ETJ+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards. Table of Contents I. ........Device Description V. ........Quality Assurance Information II. ........Manufacturing Information VI. .......Reliability Evaluation III. .......Packaging Information IV. .......Die Information .....Attachments I. Device Description A. General The MAX3670 is a low-jitter 155MHz/622MHz reference clock generator IC designed for system clock distribution and frequency synchronization in OC-48 and OC-192 SONET/SDH and WDM transmission systems. The MAX3670 integrates a phase/frequency detector, an operational amplifier (op amp), prescaler dividers and input/output buffers. Using an external VCO, the MAX3670 can be configured easily as a phase-lock loop with bandwidth programmable from 15Hz to 20kHz. The MAX3670 operates from a single +3.3V or +5.0V supply, and dissipates 150mW (typ) at 3.3V. The operating temperature range is from -40°C to +85°C. The chip is available in a 5mm x 5mm, 32-pin QFN package. Maxim Integrated Products. All rights reserved. Page 2/5 MAX3670ETJ+ II. Manufacturing Information A. Description/Function: Low-Jitter 155MHz/622MHz Clock Generator B. Process: GST2 C. Number of Device Transistors: 2478 D. Fabrication Location: Oregon E. Assembly Location: China, Thailand F. Date of Initial Production: September 28, 2001 III. Packaging Information A. Package Type: 32-pin TQFN 5x5 B. Lead Frame: Copper C. Lead Finish: 100% matte Tin D. Die Attach: Conductive E. Bondwire: Au (1.3 mil dia.) F. Mold Material: Epoxy with silica filler G. Assembly Diagram: #05-9000-3411 H. Flammability Rating: Class UL94-V0 I. Classification of Moisture Sensitivity per JEDEC standard J-STD-020-C Level 1 J. Single Layer Theta Ja: 47°C/W K. Single Layer Theta Jc: 1.7°C/W L. Multi Layer Theta Ja: 29°C/W M. Multi Layer Theta Jc: 2.7°C/W IV. Die Information A. Dimensions: 80 X 76 mils B. Passivation: Si3N4 (Silicon nitride) C. Interconnect: Au D. Backside Metallization: None E. Minimum Metal Width: 2 microns (as drawn) F. Minimum Metal Spacing: 2 microns (as drawn) G. Bondpad Dimensions: 5 mil. Sq. H. Isolation Dielectric: SiO2 I. Die Separation Method: Wafer Saw Maxim Integrated Products. All rights reserved. Page 3/5 MAX3670ETJ+ V. Quality Assurance Information A. Quality Assurance Contacts: Ken Wendel (Director, Reliability Engineering) Bryan Preeshl (Managing Director of QA) B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet. 0.1% For all Visual Defects. C. Observed Outgoing Defect Rate: < 50 ppm D. Sampling Plan: Mil-Std-105D VI. Reliability Evaluation A. Accelerated Life Test The results of the 150°C biased (static) life test are shown in table 1. Using these results, the Failurere Rate ( ) is calculated as follows: = 1 MTTF = 1.83 (Chi square value for MTTF upper limit) 192 x 4340 x 45 x 2 (where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV) = 10.93 x 10-9 = 10.93 F.I.T. (60% confidence level @ 25°C) The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/. Current monitor data for the GST2 Process results in a FIT Rate of 0.08 @ 25C and 1.42 @ 55C (0.8 eV, 60% UCL). B. Moisture Resistance Tests The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter. C. E.S.D. and Latch-Up Testing The HT17 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per Mil-Std 883 Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250mA. Maxim Integrated Products. All rights reserved. Page 4/5 MAX3670ETJ+ Table 1 Reliability Evaluation Test Results MAX3670ETJ+ TEST ITEM TEST CONDITION Static Life Test (Note 1) Ta = 150°C Biased FAILURE IDENTIFICATION SAMPLE SIZE NUMBER OF FAILURES DC Parameters & functionality 45 0 DC Parameters & functionality 77 0 DC Parameters & functionality 77 0 Time = 192 hrs. Moisture Testing (Note 2) 85/85 Ta = 85°C RH = 85% Biased Time = 1000hrs. Mechanical Stress (Note 2) -65°C/150°C Temperature 1000 Cycles Cycle Method 1010 Note 1: Life Test Data may represent plastic DIP qualification lots. Note 2: Generic Package/Process data Maxim Integrated Products. All rights reserved. Page 5/5