Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) X5R Dielectric, 4 – 50 VDC (Commercial Grade) Overview KEMET’s X5R dielectric features an 85°C maximum operating temperature and is considered “semi-stable.” The Electronics Components, Assemblies & Materials Association (EIA) characterizes X5R dielectric as a Class II material. Components of this classification are fixed, ceramic dielectric capacitors suited for bypass and decoupling applications or for frequency discriminating circuits where Q and stability of capacitance characteristics are not critical. X5R exhibits a predictable change in capacitance with respect to time and voltage and boasts a minimal change in capacitance with reference to ambient temperature. Capacitance change is limited to ±15% from -55°C to +85°C. Benefits Applications • • • • • • • • • Typical applications include decoupling, bypass, and filtering. -55°C to +85°C operating temperature range Lead (Pb)-Free, RoHS and REACH compliant Temperature stable dielectric EIA 0201, 0402, 0603, 0805, 1206, 1210, and 1812 case sizes DC voltage ratings of 4 V, 6.3 V, 10 V, 16 V, 25 V, 35 V, and 50 V Capacitance offerings ranging from 0.01 μF to 100 μF Available capacitance tolerances of ±10% and ±20% Non-polar device, minimizing installation concerns 100% pure matte tin-plated termination finish allowing for excellent solderability Click image above for interactive 3D content Open PDF in Adobe Reader for full functionality Ordering Information C 1206 C 107 M 9 P A C TU Ceramic Case Size (L" x W") Specification/ Series Capacitance Code (pF) Capacitance Tolerance Rated Voltage (VDC) Dielectric Failure Rate/ Design Termination Finish1 Packaging/Grade (C–Spec)2 0201 0402 0603 0805 1206 1210 1812 C = Standard Two significant digits + number of zeros. K = ±10% M = ±20% 7=4 9 = 6.3 8 = 10 4 = 16 3 = 25 6 = 35 5 = 50 P = X5R A = N/A C = 100% Matte Sn Blank = Bulk TU = 7" Reel Unmarked TM = 7" Reel Marked Additional termination finish options may be available. Contact KEMET for details. Additional reeling or packaging options may be available. Contact KEMET for details. 2 The terms "Marked" and "Unmarked" pertain to laser marking option of components. 1 2 One world. One KEMET © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 1 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Dimensions – Millimeters (Inches) L W B T S 1 2 EIA Size Code Metric Size Code 0201 0603 1 0402 B Bandwidth S Separation Minimum 0.60 (0.024) ±0.03 (0.001) 0.30 (0.012) ±0.03 (0.001) 0.15 (0.006) ±0.05 (0.002) N/A 1005 1.00 (0.040) ±0.05 (0.002) 0.50 (0.020) ±0.05 (0.002) 0.30 (0.012) ±0.10 (0.004) 0.30 (0.012) 0603 1608 1.60 (0.063) ±0.15 (0.006) 0.80 (0.032) ±0.15 (0.006) 0.70 (0.028) 0805 2012 0.35 (0.014) ±0.15 (0.006) See Table 2 for Thickness 2.00 (0.079) ±0.20 (0.008) 1.25 (0.049) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) 1206 3216 3.20 (0.126) ±0.20 (0.008) 1.60 (0.063) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) 12102 3225 3.20 (0.126) ±0.20 (0.008) 2.50 (0.098) ±0.20 (0.008) 0.50 (0.02) ±0.25 (0.010) L Length W Width T Thickness 0.75 (0.030) N/A Mounting Technique Solder Reflow Only Solder Wave or Solder Reflow Solder Reflow Only For capacitance values ≥ 4.7 µF add 0.1 (0.004) to the width and length tolerance dimensions. For capacitance values ≥ 22 µF add 0.10 (0.004) to the length and width tolerance dimension and add 0.15 (0.006) to the positive bandwidth tolerance dimension. Qualification/Certification Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance & Reliability. Environmental Compliance Lead (Pb)-Free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 2 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Electrical Parameters/Characteristics Item Parameters/Characteristics Operating Temperature Range -55°C to +85°C Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) ±15% Aging Rate (Maximum % Capacitance Loss/Decade Hour) 5.0% Dielectric Withstanding Voltage (DWV) Dissipation Factor (DF) Maximum Limit at 25ºC Insulation Resistance (IR) Limit at 25°C 250% of rated voltage (5 ±1 seconds and charge/discharge not exceeding 50 mA) See Dissipation Factor Limit Table See Insulation Resistance Limit Table (Rated voltage applied for 120 ±5 seconds at 25°C) Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 48 or 1,000 hours. Please refer to a part number specific datasheet for referee time details. To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and dissipation factor (DF) measured under the following conditions: 1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF 120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as Automatic Level Control (ALC). The ALC feature should be switched to "ON." Post Environmental Limits High Temperature Life, Biased Humidity, Moisture Resistance Dielectric X5R Rated DC Voltage Capacitance Value Dissipation Factor (Maximum %) > 25 All 3.0 < 2.2 µF 7.5 ≥ 2.2 µF 20.0 < 25 < 0.56 µF 7.5 < 25 ≥ 0.56 µF 20.0 25 Capacitance Shift Insulation Resistance ±20% 10% of Initial Limit Dissipation Factor Limit Table Rated DC Voltage Capacitance Dissipation Factor (Maximum %) > 25 All 2.5 < 2.2 µF 5.0 ≥ 2.2 µF 10.0 < 0.56 µF 5.0 ≥ 0.56 µF 10.0 25 < 25 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 3 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Insulation Resistance Limit Table EIA Case Size 1,000 Megohm Microfarads or 100 GΩ 500 Megohm Microfarads or 10 GΩ 0201 N/A ALL 0402 < 0.012 µF ≥ 0.012 µF 0603 < 0.047 µF ≥ 0.047 µF 0805 < 0.15 µF ≥ 0.15 µF 1206 < 0.47 µF ≥ 0.47 µF 1210 < 0.39 µF ≥ 0.39 µF © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 4 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 1 – Capacitance Range/Selection Waterfall (0201 – 0805 Case Sizes) 5 7 9 8 4 3 5 7 9 8 4 3 5 50 4 6.3 10 16 25 50 4 6.3 10 16 25 50 AB 3 25 AB 4 16 AB 8 Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions AB AB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB BB¹ BB BB BB BB BB BB BB BB BB BB BB BB BB CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG CG BB CG CG CG CG CG CG CG CG CG CG CG CG CG BB¹ CG¹ CG¹ BC¹ CG CG DG DG DG DG DG DP DP DP DP DP DP DP DP DP DE DF DF DF DF DF DP DP DP DP DG DN DN DN DN DN DN DN DN DP DP DP DP DG DG DG DG DG DL DL DL DL DL DL DL DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG CJ CG CG¹ CG¹ DG DG DG DG DG DH¹ DG DH DG Rated Voltage (VDC) 16 4 6.3 10 16 25 50 4 6.3 10 16 25 50 4 6.3 10 16 25 50 DH¹ DH¹ 10 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 9 6.3 Capacitance Cap Code K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 7 4 103 123 153 183 223 273 333 393 473 563 683 823 104 124 154 184 224 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 186 226 276 336 396 476 4 10 AB Cap Tolerance 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 39,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 µF 0.12 µF 0.15 µF 0.18 µF 0.22 µF 0.27 µF 0.33 µF 0.39 µF 0.47 µF 0.56 µF 0.68 µF 0.82 µF 1.0 µF 1.2 µF 1.5 µF 1.8 µF 2.2 µF 2.7 µF 3.3 µF 3.9 µF 4.7 µF 5.6 µF 6.8 µF 8.2 µF 10 µF 12 µF 15 µF 18 µF 22 µF 27 µF 33 µF 39 µF 47 µF 8 6.3 Rated Voltage (VDC) C0805C 4 9 C0603C 16 7 C0402C 10 Voltage Code 6.3 Capacitance Code C0201C 4 Capacitance Case Size/ Series Voltage Code 7 9 8 4 7 9 8 3 5 4 7 9 8 4 3 5 7 9 8 4 3 5 Case Size/Series C0201C C0402C C0603C C0805C xx¹ Available only in M tolerance. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 5 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 1 – Capacitance Range/Selection Waterfall (1206 – 1812 Case Sizes) 3 6 5 3 6.3 10 16 25 35 50 25 5 9 8 4 3 FS¹ FS¹ 5 9 8 4 C1206C FS GK 50 Voltage Code FS¹ FS¹ FT 35 Rated Voltage (VDC) FS¹ FS¹ EH FH 25 EH¹ EH FD FD FD FD FF FH 50 EH¹ EH¹ FD FD FD FD FF FH FD FD FD FJ FG FH FJ FT FG FJ FK FT FG FG FH FS 35 EH¹ FD FD FD FD FF FH FD FD FD FJ FG FH FJ FT FG FJ FK FT FD FF FG FS 25 EH¹ FD FD FD FD FF FH FD FD FD FJ FG FH FJ FT FG FJ FK FT FD FF FG FS 16 EH 25 EB EB EB EC ED EE EF EP EC EC EC EC EF EH ED EH 10 EB EB EB EC ED EE EF EP EC EC EC EC EF EH ED EH EH EH EH EH 6.3 EB EB EB EC ED EE EF EP EC EC EC EC EF EH ED EH EK EK ED EH 50 EB EB EB EC ED EE EF EP EC EC EC EC EF EH ED EH EK EK ED EH Case Size/Series 6 50 4 35 8 16 M M M M M M M M M M M M M M M M M M M M M M M M M M M M M 9 10 Capacitance Capacitance Code K K K K K K K K K K K K K K K K K K K K K K K K K K K K K 5 6.3 274 334 394 474 564 684 824 105 125 155 185 225 275 335 395 475 565 685 825 106 126 156 186 226 276 336 396 476 107 3 Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions Cap Tolerance 0.27 µF 0.33 µF 0.39 µF 0.47 µF 0.56 µF 0.68 µF 0.82 µF 1.0 µF 1.2 µF 1.5 µF 1.8 µF 2.2 µF 2.7 µF 3.3 µF 3.9 µF 4.7 µF 5.6 µF 6.8 µF 8.2 µF 10 µF 12 µF 15 µF 18 µF 22 µF 27 µF 33 µF 39 µF 47 µF 100 µF 4 50 Rated Voltage (VDC) 8 25 9 C1812C 16 Voltage Code C1210C 10 Capacitance Code C1206C 6.3 Capacitance Case Size/ Series FD FD FD FD FF FH FD FD FD FJ FG FH FJ FT FE FJ FG FT 3 6 5 3 6 5 FS C1210C C1812C xx¹ Available only in M tolerance. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 6 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 2 – Chip Thickness/Packaging Quantities Paper Quantity Plastic Quantity Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel AB BB BC CG CJ DN DP DL DE DF DG DH EB EK EC ED EE EF EP EH FD FE FF FG FH FJ FT FK FS GK 0201 0402 0402 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 0.30 ± 0.03 0.50 ± 0.05 0.50 ± 0.10 0.80 ± 0.10* 0.80 ± 0.15* 0.78 ± 0.10* 0.90 ± 0.10* 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.25 ± 0.20 0.78 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.20 ± 0.20 1.60 ± 0.20 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.55 ± 0.15 1.85 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 2.50 ± 0.30 1.60 ± 0.20 15,000 10,000 10,000 4,000 4,000 4,000 4,000 0 0 0 0 0 4,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 50,000 50,000 15,000 15,000 15,000 15,000 0 0 0 0 0 10,000 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 4,000 2,500 2,500 2,500 2,500 4,000 2,000 4,000 2,500 2,500 2,500 2,500 2,000 4,000 2,500 2,500 2,500 2,000 2,000 1,500 2,000 1,000 1,000 0 0 0 0 0 0 0 10,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 10,000 8,000 10,000 10,000 10,000 10,000 8,000 8,000 4,000 8,000 4,000 4,000 Thickness Code Case Size Thickness ± Range (mm) 7" Reel 13" Reel 7" Reel 13" Reel Paper Quantity Plastic Quantity Package quantity based on finished chip thickness specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 7 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 EIA Size Code Metric Size Code 0201 Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) C Y X V1 V2 C Y X V1 V2 C Y X V1 V2 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60 0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80 0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20 0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70 1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00 1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90 1210 3225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00 1 Only for capacitance values ≥ 22 µF Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351). 1 Image below based on Density Level B for an EIA 1210 case size. V1 Y Y X X C C V2 Grid Placement Courtyard © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 8 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Preheat/Soak Temperature Minimum (TSmin) Temperature Maximum (TSmax) Time (tS) from TSmin to TSmax Ramp-Up Rate (TL to TP) Termination Finish SnPb 100% Matte Sn 100°C 150°C 60 – 120 seconds 150°C 200°C 60 – 120 seconds 183°C 217°C Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds Peak Temperature (TP) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (tP) 20 seconds maximum 30 seconds maximum Time 25°C to Peak Temperature TL tP Maximum Ramp Up Rate = 3°C/sec Maximum Ramp Down Rate = 6°C/sec tL Tsmax Tsmin tS 3°C/second maximum 3°C/second maximum Liquidous Temperature (TL) Ramp-Down Rate (TP to TL) TP Temperature Profile Feature 25 25° C to Peak Time 6°C/second maximum 6°C/second maximum 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 9 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Table 4 – Performance & Reliability: Test Methods and Conditions Stress Reference Test or Inspection Method Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds. Board Flex JIS–C–6429 Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm for C0G. Flexible termination system – 3.0 mm (minimum). Magnification 50 X. Conditions: Solderability J–STD–002 a) Method B, 4 hours at 155°C, dry heat at 235°C b) Method B at 215°C category 3 c) Method D, category 3 at 260°C Temperature Cycling JESD22 Method JA–104 Biased Humidity MIL–STD–202 Method 103 Moisture Resistance MIL–STD–202 Method 106 Thermal Shock MIL–STD–202 Method 107 High Temperature Life MIL–STD–202 Method 108 /EIA–198 1,000 Cycles (-55°C to +125°C). Measurement at 24 hours +/- 2 hours after test conclusion. Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours +/- 2 hours after test conclusion. t = 24 hours/cycle. Steps 7a and 7b not required. Unpowered. Measurement at 24 hours +/- 2 hours after test conclusion. -55°C/+125°C. Note: Number of cycles required – 300. Maximum transfer time – 20 seconds. Dwell time – 15 minutes. Air – Air. 1,000 hours at 85°C with 2 X rated voltage applied excluding the following: Case Size Capacitance 0402 ≥ 0.22 µF 0603 ≥ 1.0 µF 0805 ≥ 4.7 µF 1206 ≥ 2.2 µF 1210 ≥ 10 µF Applied Voltage 1.5 X Storage Life MIL–STD–202 Method 108 150°C, 0 VDC for 1,000 hours. Vibration MIL–STD–202 Method 204 5 g's for 20 minutes, 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of opposite sides. Parts mounted within 2" from any secure point. Test from 10 – 2,000 Hz Mechanical Shock MIL–STD–202 Method 213 Figure 1 of Method 213, Condition F. Resistance to Solvents MIL–STD–202 Method 215 Add aqueous wash chemical, OKEM Clean or equivalent. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 10 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Construction (Typical) Detailed Cross Section Dielectric Material (BaTiO3) Dielectric Material (BaTiO3) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Base Metal (Cu) Inner Electrodes (Ni) Base Metal (Cu) Barrier Layer (Ni) Termination Finish (100% Matte Sn) Inner Electrodes (Ni) © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 11 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Capacitor Marking (Optional): Thesesurfacemountmultilayerceramiccapacitorsare normallysuppliedunmarked.Ifrequired,theycanbemarked as an extra cost option. Marking is available on most KEMET devicesbutmustberequestedusingthecorrectordering codeidentifier(s).Ifthisoptionisrequested,twosidesofthe ceramicbodywillbelasermarkedwitha“K”toidentifyKEMET, followedbytwocharacters(perEIA–198-seetablebelow)to identifythecapacitancevalue.EIA0603casesizedevicesare limitedtothe“K”characteronly. Laser marking option is not available on: • C0G, Ultra Stable X8R and Y5V dielectric devices • EIA 0402 case size devices • EIA0603casesizedeviceswithFlexibleTerminationoption. • KPS Commercial and Automotive Grade stacked devices. • X7R dielectric products in capacitance values outlined below EIA Case Size Metric Size Code Capacitance 0603 0805 1206 1210 1808 1812 1825 2220 2225 1608 2012 3216 3225 4520 4532 4564 5650 5664 ≤170pF ≤150pF ≤910pF ≤2,000pF ≤3,900pF ≤6,700pF ≤0.018µF ≤0.027µF ≤0.033µF Marking appears in legible contrast. Illustrated below is an exampleofanMLCCwithlasermarkingof“KA8”,which designatesaKEMETdevicewithratedcapacitanceof100µF. Orientation of marking is vendor optional. KEMET ID © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com 2-Digit Capacitance Code C1006_X5R_SMD • 6/22/2015 12 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Capacitor Marking (Optional) cont’d Alpha Character 9 A Capacitance (pF) For Various Alpha/Numeral Identifiers Numeral 0 1 2 3 4 0.1 10 10 100 1,000 10,000 B 0.11 1.1 11 110 1,100 11,000 C 0.12 12 12 120 1,200 12,000 D 0.13 13 13 130 1,300 E 0.15 15 15 150 1,500 5 6 7 8 100,000 1,000,000 10,000,000 100,000,000 110,000 1,100,000 11,000,000 110,000,000 120,000 1,200,000 12,000,000 120,000,000 13,000 130,000 1,300,000 13,000,000 130,000,000 15,000 150,000 1,500,000 15,000,000 150,000,000 160,000,000 Capacitance (pF) F 0.16 16 16 160 1,600 16,000 160,000 1,600,000 16,000,000 G 0.18 18 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000 H 0.2 20 20 200 2,000 20,000 200,000 2,000,000 20,000,000 200,000,000 J 0.22 22 22 220 2,200 22,000 220,000 2,200,000 22,000,000 220,000,000 K 0.24 2.4 24 240 2,400 24,000 240,000 2,400,000 24,000,000 240,000,000 L 0.27 2.7 27 270 2,700 27,000 270,000 2,700,000 27,000,000 270,000,000 M 0.3 30 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000 N 0.33 33 33 330 3,300 33,000 330,000 3,300,000 33,000,000 330,000,000 P 0.36 36 36 360 3,600 36,000 360,000 3,600,000 36,000,000 360,000,000 Q 0.39 39 39 390 3,900 39,000 390,000 3,900,000 39,000,000 390,000,000 R 0.43 43 43 430 4,300 43,000 430,000 4,300,000 43,000,000 430,000,000 S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000 T 0.51 5.1 51 510 5,100 51,000 510,000 5,100,000 51,000,000 510,000,000 U 0.56 56 56 560 5,600 56,000 560,000 5,600,000 56,000,000 560,000,000 V 0.62 62 62 620 6,200 62,000 620,000 6,200,000 62,000,000 620,000,000 W 0.68 68 68 680 6,800 68,000 680,000 6,800,000 68,000,000 680,000,000 X 0.75 75 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000 Y 0.82 82 82 820 8,200 82,000 820,000 8,200,000 82,000,000 820,000,000 Z 0.91 9.1 91 910 9,100 91,000 910,000 9,100,000 91,000,000 910,000,000 a 0.25 25 25 250 2,500 25,000 250,000 2,500,000 25,000,000 250,000,000 b 0.35 35 35 350 3,500 35,000 350,000 3,500,000 35,000,000 350,000,000 d 0.4 40 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000 e 0.45 45 45 450 4,500 45,000 450,000 4,500,000 45,000,000 450,000,000 f 0.5 50 50 500 5,000 50,000 500,000 5,000,000 50,000,000 500,000,000 m 0.6 60 60 600 6,000 60,000 600,000 6,000,000 60,000,000 600,000,000 n 0.7 70 70 700 7,000 70,000 700,000 7,000,000 70,000,000 700,000,000 t 0.8 80 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000 y 0.9 90 90 900 9,000 90,000 900,000 9,000,000 90,000,000 900,000,000 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 13 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Tape & Reel Packaging Information KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewithEIA Standard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2fordetailson reelingquantitiesforcommercialchips. Bar Code Label Anti-Static Reel ® Embossed Plastic* or Punched Paper Carrier. ET KEM Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 and 2225 Military) Sprocket Holes Embossment or Punched Cavity 8 mm, 12 mm or 16 mm Carrier Tape 178 mm (7.00") or 330 mm (13.00") Anti-Static Cover Tape (.10 mm (.004") Maximum Thickness) *EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only. Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm) Embossed Plastic EIA Case Size Tape size (W)* 7" Reel 13" Reel Punched Paper 7" Reel Pitch(P1)* 13" Reel Pitch(P1)* 01005 – 0402 8 2 2 0603 8 4 4 0805 8 4 4 4 4 1206 – 1210 8 4 4 4 4 1805 – 1808 12 4 4 ≥1812 12 8 8 KPS 1210 12 8 8 KPS 1812 & 2220 16 12 12 Array 0508 & 0612 8 4 4 *Refer to Figures 1 & 2 for W and P1 carrier tape reference locations. *Refer to Tables 6 & 7 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 14 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] Po E1 Ao F Ko B1 E2 Bo S1 W P1 T1 Center Lines of Cavity ØD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) R Reference S1 Minimum Note 2 Note 3 25.0 (0.984) 2.0 ±0.05 0.600 (0.079 ±0.002) (0.024) 30 (1.181) P2 T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F P1 3.5 ±0.05 (0.138 ±0.002) 5.5 ±0.05 (0.217 ±0.002) 7.5 ±0.05 (0.138 ±0.002) 4.0 ±0.10 (0.157 ±0.004) 8.0 ±0.10 (0.315 ±0.004) 12.0 ±0.10 (0.157 ±0.004) T2 Maximum 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Maximum 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0 Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 6). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4). (e) for KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket. (f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 15 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 2 – Punched (Paper) Carrier Tape Dimensions P2 T Po ØDo [10 pitches cumulative tolerance on tape ± 0.2 mm] A0 F P1 T1 T1 Top Cover Tape W E2 B0 Bottom Cover Tape E1 G Cavity Size, See Note 1, Table 7 Center Lines of Cavity Bottom Cover Tape User Direction of Unreeling Table 7 – Punched (Paper) Carrier Tape Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size D0 E1 P0 P2 T1 Maximum G Minimum 8 mm 1.5 +0.10 -0.0 (0.059 +0.004 -0.0) 1.75 ±0.10 (0.069 ±0.004) 4.0 ±0.10 (0.157 ±0.004) 2.0 ±0.05 (0.079 ±0.002) 0.10 (0.004) Maximum 0.75 (0.030) R Reference Note 2 25 (0.984) T Maximum W Maximum A0 B 0 1.1 (0.098) 8.3 (0.327) 8.3 (0.327) Variable Dimensions — Millimeters (Inches) Tape Size Pitch 8 mm Half (2 mm) 8 mm Single (4 mm) E2 Minimum 6.25 (0.246) F 3.5 ±0.05 (0.138 ±0.002) P1 2.0 ±0.05 (0.079 ±0.002) 4.0 ±0.10 (0.157 ±0.004) Note 1 1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. c) rotation of the component is limited to 20° maximum (see Figure 3). d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 6). © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 16 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe165°to180° fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof300±10mm/minute. 3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA Standards 556 and 624. Figure 3 – Maximum Component Rotation ° T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 – 200 Bo Maximum Rotation ( 20 10 ° T) Typical Component Centerline Ao Figure 4 – Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape ° s Tape Maximum Width (mm) Rotation ( 8,12 20 16 – 56 10 72 – 200 5 ° S) Figure 5 – Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com R C1006_X5R_SMD • 6/22/2015 17 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 6 – Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (Ø 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A (See Note) N C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 8 – Reel Dimensions Metric will govern Constant Dimensions — Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 ±0.20 (7.008 ±0.008) or 330 ±0.20 (13.000 ±0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions — Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shallaccommodatetapewidth withoutinterference 8 mm 12 mm 16 mm © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 18 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Figure 7 – Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum 100 mm Minimum Leader 400 mm Minimum Components Top Cover Tape Figure 8 – Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm Bulk Cassette Packaging (Ceramic Chips Only) Meets Dimensional Requirements IEC–286 and EIAJ 7201 6 8 ± 0.1 8 8 ± 0.1 12.0 ± 0.1 Unit mm *Reference 19.0* 36 ± 00.2 31.5 ± 0.2 0 53 3* 10* 1.5 ± 2.0 ± 3.0 ± 0.1 0 0 0.1 0.2 0 5 0* 110 ± 0.7 Capacitor Dimensions for Bulk Cassette Cassette Packaging – Millimeters EIA Size Code Metric Size Code L Length W Width B Bandwidth S Separation Minimum T Thickness Number of Pieces/Cassette 0402 1005 1.0 ±0.05 0.5 ±0.05 0.2 to 0.4 0.3 0.5 ±0.05 50,000 0603 1608 1.6 ±0.07 0.8 ±0.07 0.2 to 0.5 0.7 0.8 ±0.07 15,000 © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 19 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) KEMET Corporation World Headquarters Europe Asia Southern Europe Sasso Marconi, Italy Tel: 39-051-939111 Northeast Asia Hong Kong Tel: 852-2305-1168 Mailing Address: P.O. Box 5928 Greenville, SC 29606 Skopje, Macedonia Tel: 389-2-55-14-623 Shenzhen,China Tel: 86-755-2518-1306 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521 Central Europe Landsberg, Germany Tel: 49-8191-3350800 Corporate Offices Fort Lauderdale, FL Tel: 954-766-2800 Kamen, Germany Tel: 49-2307-438110 North America Northern Europe Wyboston, United Kingdom Tel: 44-1480-273082 Taipei, Taiwan Tel: 886-2-27528585 Espoo, Finland Tel: 358-9-5406-5000 Southeast Asia Singapore Tel: 65-6701-8033 2835 KEMET Way Simpsonville, SC 29681 Southeast Lake Mary, FL Tel: 407-855-8886 Northeast Wilmington, MA Tel: 978-658-1663 Central Novi, MI Tel: 248-994-1030 Beijing,China Tel: 86-10-5877-1075 Shanghai,China Tel: 86-21-6447-0707 Seoul,SouthKorea Tel: 82-2-6294-0550 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817 West Milpitas, CA Tel: 408-433-9950 Mexico Guadalajara, Jalisco Tel: 52-33-3123-2141 Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 20 Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X5R Dielectric, 4 – 50 VDC (Commercial Grade) Disclaimer Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsibleforcheckingand verifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced. AllInformationgivenhereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied. StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butare notintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.TheInformationisintendedforuseonly bycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.AnytechnicaladviceinferredfromthisInformationorotherwise providedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesnoobligationorliabilityfortheadvicegivenorresultsobtained. AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponentfailuresmaystill occur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards(suchasinstallationofprotective circuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryorpropertydamage. Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatothermeasuresmaynot be required. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com C1006_X5R_SMD • 6/22/2015 21