«Picture_Description» is depicted

Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
SEAF Series – Socket, Vertical Orientation
SEAM Series – Terminal, Vertical Orientation
Revision: E
Date: September 10, 2015
Page 1
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec’s SEAM/SEAF Series .050”
SEARAY™ High Density, High Speed Open Pin Field Array connectors. All information contained in this
specification is for a 7,00 mm mated height vertical configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
www.samtec.com?SEAM and www.samtec.com?SEAF.
3.0 TESTING
3.1
3.2
3.3
3.4
3.5
Current Rating: 1.1A (30 contacts, 10x3 Cluster)
Voltage Rating: 240 VAC
Operating Temperature Range: -55°C to +125°C
Operating Humidity Range: 90% to 95% (Per EIA-364-31)
Electrical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
725 VAC
Pass
Insulation Resistance
EIA-364-21 (5000 MΩ
minimum)
15,000 MΩ
Pass
Contact Resistance
(LLCR)
EIA-364-23
Δ 15 mΩ maximum
(Samtec defined)/ No damage
Pass
REQUIREMENT
STATUS
3.6 Mechanical:
ITEM
TEST CONDITION
Durability
EIA-364-09C
1000 cycles (50µ Au)
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 nanoseconds
Pass
Mechanical Shock
EIA-364-27 100 G, 6
milliseconds, sawtooth wave,
11.3 fps, 3 shocks/direction, 3
axis (18 total shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 nanoseconds
Pass
Normal Force
EIA-364-04
30 grams minimum for gold
interface
Pass
Revision: E
Date: September 10, 2015
Page 2
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
3.7 Environmental:
ITEM
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 725 VAC
IR: >15,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C Condition B
for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 725 VAC
IR: >15,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 725 VAC
IR: >15,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
Revision: E
TEST CONDITION
Date: September 10, 2015
Page 3
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
4.0 MATED SYSTEM
Mated view information can be found at link below:
http://www.samtec.com/documents/webfiles/cpdf/SEAX%20Mated%20Document-MKT.pdf
5.0 POLARIZING FEATURES
6.0 HIGH SPEED PERFORMANCE
6.1 Based on a 3 dB insertion loss
Stack Height
Single-Ended Signaling
Differential Pair Signaling
7 mm
12.50 GHz
13.00 GHz
6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair
Revision: E
Date: September 10, 2015
Page 4
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
7.0 PROCESSING RECOMMENDATIONS - For more information, please see our Processing Recommendations
Document
7.1 Mating Alignment Requirements:
Revision: E
7.1.1
Maximum guidance/capture in applications where at least one half of the interface is free to float.
7.1.2
The parts can be rigidly misaligned by no more than .005" (0,13mm) in the X- and .005” (0,13mm) in the
Y-direction to ensure a good mate.
Date: September 10, 2015
Page 5
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
7.2 Mating Angle Requirements: The connector can be zippered in the longitudinal direction only.
7.2.1
7.2.2
7.3 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of
260°C.
7.4 Stencil Thickness: The stencil thickness is .006” (0,15 mm).
7.5 Placement: Machine placement and complete seating of the parts in the Z-axis is strongly recommended.
7.6 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers
two different types:
Revision: E
7.6.1
Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See
options here: SO - Board Stacking Standoff
7.6.2
Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested
construction facilitates the mating and unmating process. This is especially helpful for multiple connector
applications where the mating and unmating forces increase with the number of connectors used. See
options here: JSO - Jack Screw Standoffs
Date: September 10, 2015
Page 6
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
7.7 Solder Screen Printing Process:
7.7.1
Complete solder pad coverage is critical. The recommended aperture size of .035" (0,89mm) is
intentionally larger than the pad to ensure that the solder charge comes into contact with the solder
paste. If this does not occur, proper wetting will not be achieved (see Fig. 7.7.3). Automated inspection
of each print is recommended. If solder paste does not completely cover the solder pad, the assembly
should be rejected, cleaned and re-printed.
7.7.2
Stencil cleaning may need to be monitored more frequently to ensure complete solder pad coverage is
maintained.
Fig. 7.7.3 - Solder charge location relative to solder print. Notice good contact
between solder charges and solder paste.
7.8 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved
through Nitrogen gas infusion) in the reflow process to improve solderability.
Revision: E
Date: September 10, 2015
Page 7
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
7.9 Thermal Profile: Due to variances in equipment, solder pastes and applications (board design, component
density, etc.), Samtec does not specify a recommended reflow profile for our connectors. The processing
parameters provided by the solder paste manufacturer should be employed and can usually be found on their
website.
All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile
parameters detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a
peak temperature of 260°C as well as 30 seconds above 255°C.
Samtec Recommended Temperature Profile Ranges (SMT)
Sn-Pb Eutectic Assembly
Preheat/Soak
(100°C-150°C)
Max Ramp Up
Rate
Reflow Time
(above 183°C)
Peak
Temp
Time within 5°C
of 235°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
235°C
20 sec. max.
6°C/s max.
6 min. max.
Preheat/Soak
(150°C-200°C)
Max Ramp Up
Rate
Reflow Time
(above 217°C)
Peak
Temp
Time within 5°C
of 260°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
260°C
30 sec. max.
6°C/s max.
8 min. max.
Pb-Free Assembly
7.9.1
These guidelines should not be considered design requirements for all applications.
Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.
Revision: E
Date: September 10, 2015
Page 8
© Samtec, Inc.
Product Specification
Series: SEAM / SEAF .050” (1,27 mm) SEARAY™ High Density, High Speed Open Pin Field Array
7.10 Rework Guidelines: Samtec recommends following these rework guidelines as needed: Grid Array Rework
Guidelines
7.10.1 Samtec recommends a minimum spacing of .125” (3,18mm) between adjacent connectors to allow
adequate room for hot-air rework equipment.
7.11 Handling:
7.11.1 These connectors are typically packaged in trays or tape-and-reel which protect the solder charges from
damage. They should be handled like any other BGA or IC device.
7.11.2 Avoid resting the connector on the solder charges except during final placement onto the board.
7.11.3 When using tape-and-reel packaging, ensure the bottom of the pocket is protected as it travels through
the feeder.
7.11.4 Avoid touching the solder charges.
7.11.5 When a partially used tray needs to be stored, use the flat cover from the original shipment or an empty
tray to cover connectors. Band trays using flex wrap or rubber bands.
For more detailed processing information, please visit the Technical Library on the SEAF Series Technical
Specification page: http://www.samtec.com/technical-specifications/Default.aspx?SeriesMaster=SEAF
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
USE OF PRODUCT SPECIFICATION SHEET
This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should
only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not
limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This
PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec
does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the
PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or
indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all
intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS
is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or
relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES
EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED.
Revision: E
Date: September 10, 2015
Page 9
© Samtec, Inc.