Product Specification

Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
SS4 Series – Socket, Vertical Orientation
ST4 Series – Terminal, Vertical Orientation
See www.samtec.com for more information.
Revision: E
Date: August 27, 2015
Page 1
© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
1.0 SCOPE
1.1 This specification covers performance, testing and quality requirements for Samtec SS4/ST4 Series 0,40 mm (.016”)
Razor Beam™ LP Ultra Fine Low Profile Pitch Header / Socket. All information contained in this specification is for
a 4 mm mated height vertical configuration unless otherwise noted.
2.0 DETAILED INFORMATION
2.1 Product prints, footprints, catalog pages, test reports and other specific, detailed information can be found at
www.samtec.com?SS4 and www.samtec.com?ST4.
3.0 TESTING
3.1
3.2
3.3
3.4
3.5
Current Rating: 1.4A (One pin powered per row)
Voltage Rating: 130 VAC
Operating Temperature Range: -55°C to +125°C
Operating Humidity Range: 90% to 95% (Per EIA-364-31)
Electrical:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Withstanding Voltage
EIA-364-20 (No Flashover,
Sparkover, or Breakdown)
390 VAC
Pass
Insulation Resistance
EIA-364-21 (5000 MΩ
minimum)
5,000 MΩ
Pass
Contact Resistance
(LLCR)
EIA-364-23
Δ 15 mΩ maximum
(Samtec defined)/ No damage
Pass
REQUIREMENT
STATUS
3.6 Mechanical:
ITEM
TEST CONDITION
Durability
EIA-364-09C
100 cycles (10µ’’ Au)
Pass
Random Vibration
EIA-364-28 Condition V, Letter B
7.56 G 'RMS', 50 to 2000 Hz, 2
hours per axis, 3 axis total , PSD
0.04
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 nanoseconds
Pass
Mechanical Shock
EIA-364-27 100 G, 6
milliseconds, sawtooth wave,
11.3 fps, 3 shocks/direction, 3
axis (18 total shocks)
Visual Inspection: No Damage
LLCR: Δ 15 mΩ maximum
Event Detection: No interruption >
50 nanoseconds
Pass
Normal Force
EIA-364-04
30 grams minimum for gold
interface
Pass
Revision: E
Date: August 27, 2015
Page 2
© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
3.7 Environmental:
ITEM
TEST CONDITION
REQUIREMENT
STATUS
Thermal Shock
EIA-364-32
Thermal Cycles: 100 (30 minute dwell)
Hot Temp: +85°C
Cold Temp: -55°C
Hot/Cold Transition: Immediate
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 390 VAC
IR: >50,000 MΩ
Pass
Thermal Aging
(Temp Life)
EIA-364-17
Test Condition 4 @ 105°C Condition B
for 250 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 390 VAC
IR: >50,000 MΩ
Pass
Cyclic Humidity
EIA-364-31
Test Temp: +25°C to +65°C
Relative Humidity: 90 to 95%
Test Duration: 240 hours
Visual Inspection: No Damage
LLCR: Δ 15 mΩ
DWV: 390 VAC
IR: >50,000 MΩ
Pass
Gas Tight
EIA-364-36
Gas Exposure: Nitric Acid Vapor
Duration: 60 min.
Drying Temp.: 50°C +/- 3°C
Measurements: Within 1 hour of
Exposure
LLCR: Δ 15 mΩ
Pass
4.0 MATED SYSTEM
4.1 Mated Views
Mated view information can be found at link below:
http://cloud.samtec.com/Prints/SX4%20MATED%20DOCUMENT-MKT.pdf
Revision: E
Date: August 27, 2015
Page 3
© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
5.0 POLARIZING FEATURES
6.0 HIGH SPEED PERFORMANCE
6.1 Based on a 3 dB insertion loss
Stack Height
Single-Ended Signaling
Differential Pair Signaling
4 mm
13.5 GHz/ 27Gbps
15.5 GHz/ 31Gbps
6.2 System Impedance: 50 ohm for single-ended and 100 ohm for differential pair
Revision: E
Date: August 27, 2015
Page 4
© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
7.0 PROCESSING RECOMMENDATIONS
7.1 Mating Alignment Requirements:
7.1.1 Maximum guidance/capture is .013’’ (0,34 mm) in both the X- direction (length) and Y- direction (width).
7.1.2 The parts can be rigidly misaligned by no more than .003’’ (0,08 mm) in the X- and .003’’ (0,08 mm) in the
Y-direction to ensure a good mate.
Revision: E
Date: August 27, 2015
Page 5
© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
7.2 Mating Angle Requirements: Connectors to be mated and unmated axially only. Zippering angles may damage
connector and/or solder joints.
7.2.1
7.2.2
Revision: E
Date: August 27, 2015
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© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
7.3 Due to variances in equipment, solder pastes and applications (board design, component density, etc.), Samtec does
not specify a recommended reflow profile for our connectors. The processing parameters provided by the solder paste
manufacturer should be employed and can usually be found on their website.
All of Samtec’s surface mount components are lead free reflow compatible and compliant with the profile parameters
detailed in IPC/JEDEC J-STD-020E which requires that components be capable of withstanding a peak temperature
of 260°C as well as 30 seconds above 255°C.
Samtec Recommended Temperature Profile Ranges (SMT)
Sn-Pb Eutectic Assembly
Preheat/Soak
(100°C-150°C)
Max Ramp Up
Rate
Reflow Time
(above 183°C)
Peak
Temp
Time within 5°C
of 235°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
235°C
20 sec. max.
6°C/s max.
6 min. max.
Preheat/Soak
(150°C-200°C)
Max Ramp Up
Rate
Reflow Time
(above 217°C)
Peak
Temp
Time within 5°C
of 260°C
Max Ramp
Down Rate
Time 25°C to
Peak Temp
60-120 sec.
3°C/s max.
40-150 sec.
260°C
30 sec. max.
6°C/s max.
8 min. max.
Pb-Free Assembly
7.3.1
These guidelines should not be considered design requirements for all applications.
Samtec recommends testing interconnects on your boards in your process to guarantee optimum results.
7.4 Maximum Reflow Passes: The parts can withstand three reflow passes at a maximum component temperature of
260°C.
Revision: E
Date: August 27, 2015
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© Samtec, Inc.
Product Specification
Series: SS4 / ST4 0,40 mm (.016”) Razor Beam™ LP Ultra Fine Pitch Low Profile Header / Socket
7.5 Stencil Thickness: The recommended stencil thickness is .005” (0,13 mm).
7.6 Placement: Machine placement of the parts is strongly recommended.
7.7 Reflow Environment: Samtec recommends the use of a low level oxygen environment (typically achieved through
Nitrogen gas infusion) in the reflow process to improve solderability.
7.8 Hardware: Board-to-board standoffs are recommended to provide a robust mechanical connection. Samtec offers
two different types:
7.8.1
Traditional Standoffs (SO) – Rigid design to statically support board-to-board applications. See
options here: SO - Board Stacking Standoff
7.8.2
Jack Screw Standoffs (JSO) – Serve same function as traditional standoffs but unique, nested
construction facilitates the mating and unmating process. This is especially helpful for multiple
connector applications where the mating and unmating forces increase with the number of
connectors used. See options here: JSO - Jack Screw Standoffs
7.9 Cleaning: Samtec, Inc. has verified that our connectors may be cleaned in accordance with the solvents and
conditions designated in the EIA-364-11A standard.
8.0 ADDITIONAL RESOURCES
8.1 For additional mechanical testing or product information, contact our Customer Engineering Support Group at
[email protected]
8.2 For additional information on high speed performance testing, contact our Signal Integrity Group at
[email protected]
8.3 For additional processing information, contact our Interconnect Processing Group at [email protected]
8.4 For RoHS, REACH or other environmental compliance information, contact our Product Environmental
Compliance Group at [email protected]
USE OF PRODUCT SPECIFICATION SHEET
This Product Specification Sheet (“PSS”) is a brief summary of information related to the Product identified. As a summary, it should
only be used for the limited purpose of considering the purchase/use of Product. For specific, detailed information, including but not
limited to testing and Product footprint, refer to Section 2.0 of this document and the links there provided to test reports and prints. This
PSS is the property of Samtec, Inc. (“Samtec”) and contains proprietary information of Samtec, our various licensors, or both. Samtec
does not grant express or implied rights or license under any patent, copyright, trademark or other proprietary rights and the use of the
PSS for building, reverse engineering or replication is strictly prohibited. By using the PSS, the user agrees to not infringe, directly or
indirectly, upon any intellectual property rights of Samtec and acknowledges that Samtec, our various licensors, or both own all
intellectual property therein. The PSS is presented “AS IS”. While Samtec makes every effort to present excellent information, the PSS
is only provided as a guideline and does not, therefore, warrant it is without error or defect or that the PSS contains all necessary and/or
relevant information about the Product. The user agrees that all access and use of the PSS is at its own risk. NO WARRANTIES
EXPRESSED OR IMPLIED, INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR
PURPOSE OR OF ANY KIND WHATSOEVER ARE PROVIDED.
Revision: E
Date: August 27, 2015
Page 8
© Samtec, Inc.