socay.com

Wire-wound Type Power Inductor
SCWL201610 Series
Features
u
Low profile: 2.0mm×1.6mm×1.0mm
u
Magnetically
shielded structure to accomplish high
resolution in EMC protection
u
Halogen free, Lead free, RoHS compliance
Applications
SCWL series is generic applied in portable DC to DC converter
line.
u
Mobile phones
u
HDDs
u
DSCs
u
PADs
u
LCD, LED display, etc.
General Technical Data
Operating Temperature Range
-40 ~ +125ºC
Storage Temperature Range
-50 ~ +125ºC
Taping package
Storage condition
Storage Temperature
5 ~ 40ºC
Relative Humidity
< 65%
Storage Time
12 Months max
Part Numbering
SCWL
2016
10
R47
M
T
F
(1)
(2)
(3)
(4)
(5) (6) (7)
1
Series Name, wire-wound type power inductor
2
Size Code: the first two digitals : length(mm), the last two digitals : width(mm)
3
Thickness (mm)
4
Inductance (μH), eg. 2R2=2.2μH；R47=0.47μH
5
Inductance tolerance, M: ±20%
6
Packaging: T - Embossed plastic tape, 7" reel.
7
Soldering : Green Parts, F - Lead-Free for whole chip
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
www.socay.com
1/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL201610 Series
Electrical Characteristics
DC Resistance
RDC (mΩ)
Initial Inductance
Li (μH) @1mA
Part Number
SCWL201610R24MTF
SCWL201610R47MTF
SCWL201610R68MTF
SCWL2016101R0MTF
SCWL2016102R2MTF
0.24
0.47
0.68
1.0
2.2
Saturation Current
Isat (A)
Heat Rating Current
Irms (A)
Typical
Maximum
Typical
Maximum
Typical
Maximum
16
34
39
60
150
19
40
47
72
172
6.5
4.2
3.8
3.2
2.2
5.7
3.8
3.3
2.8
2.0
4.1
2.8
2.5
2.1
1.5
3.6
2.5
2.2
1.9
1.3
Note:
1. All test data is referenced to 25 ºC ambient.
2. Inductance is measured by LCR meter, Test frequency at 1MHz
3. Inductance Tolerance: ±20%.
4. Isat: DC current that will cause L0 to drop approximately 30% at ambient 25 ºC.
5. Idc: DC current that will cause an approximate △T or 40 ºC.
6. Rating Current: Value as listed is either the saturation current or the heating current, whichever is smaller.
7. The part temperature (Ambient + temp rise) should not exceed 125 ºC under worse case operating condition.
Current Characteristics
SCWL201610R24MTF
SCWL201610R47MTF
100
90
80
70
60
50
40
30
20
10
0
Temp. Rising (ºC)
0.1
0.05
0
1
2
3
4
5
0.4
Temp. Rising (ºC)
0.2
0.1
0
6
Inductance (μH)
0.3
0
1
2
DC Bias (A)
SCWL201610R68MTF
0.2
0.1
0
0.5
1
1.5
2
2.5
3
3.5
Inductance (μH)
Inductance (μH)
Temp. Rising (ºC)
0.3
0
5
1.2
Temp. Rising (ºC)
Inductance (μH)
0.6
0.5
4
SCWL2016101R0MTF
100
90
80
70
60
50
40
30
20
10
0
0.7
0.4
3
DC Bias (A)
0.8
Inductance (μH)
0.6
Temp. Rising (ºC)
0.4
0.2
0
4
100
90
80
70
60
50
40
30
20
10
0
1
Temp. Rising (ºC)
0
100
90
80
70
60
50
40
30
20
10
0
Temp. Rising (ºC)
Inductance (μH)
0.15
Inductance (μH)
0.2
0.5
Temp. Rising (ºC)
Inductance (μH)
0.25
0
0.5
1
1.5
2
2.5
3
3.5
4
DC Bias (A)
DC Bias (A)
Inductance (μH)
100
90
80
70
60
50
40
30
20
10
0
2
Inductance (μH)
1.5
Temp. Rising (ºC)
1
0.5
0
0
0.5
1
1.5
2
2.5
Temp. Rising (ºC)
SCWL2016102R2MTF
2.5
3
DC Bais (A)
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
www.socay.com
2/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL201610 Series
Tape Specifications
Direction of Feed
Symbol
252010
W
8.00±0.3
P
4.00±0.10
E
1.75±0.10
F
3.50±0.05
D
1.55±0.05
P
4.00±0.10
P0
4.00±0.10
P2
2.00±0.05
A0
1.80±0.10
B0
2.20±0.10
K0
1.15±0.10
t
0.22±0.05
Reel Specifications & Packaging
Unit: mm
Part Size
(EIA Size)
Packaging Option
Quantity
2016
7″Reel
3,000
The Contents of a box：
2016: 6 reels / inner box
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
www.socay.com
3/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL201610 Series
Soldering Parameters
Reflow Condition
TP
Ramp-up
Critical Zone
TL to TP
Pb free assembly
-Temperature Min (Ts(min))
+150°C
-Temperature Max (Ts(max))
+200°C
-Time (min to max) (TS)
60 -180 Seconds
TL
Pre Heat
Temperature
TS(max)
Ramp-down
TS(min)
Average ramp up rate ( Liquidus Temp TL)
to peak
3°C/Second Max
TS(max) to TL - Ramp-up Rate
3°C/Second Max
Preheat
25
Time to peak temperature
(t 25℃ to peak)
Time
- Temperature (TL) (Liquidus)
+217°C
- Time (min to max) (TL)
60 -150 Seconds
Reflow
Precaution for Soldering
Note that this product will be easily damaged by rapid heating,
rapid cooling or local heating.
Do not give heat shock over 100°C in the process of soldering.
We recommend to take preheating and gradual cooling
Soldering gun procedure
Note the follows, in case of using solder gun for replacement.
1) The tip temperature must be less than 280 for the period
within 3 seconds by using soldering gun under 30W
2) The soldering gun tip shall not touch this product directly.
Peak Temperature (TP)
260 +0/-5°C
Time within 5°C of actual peak
Temperature (TP)
20-40 Seconds
Ramp-down Rate
6°C/Second Max
Time 25°C to peak Temperature (TP)
8 minutes Max
Construction & Dimensions
Core Material: Iron
End termination: Ni / Sn
Soldering volume
Note that excess of soldering volume will easily get crack the
body of this product.
L
Precaution for Handling of Substrate
W
Do not exceed to bend the board after soldering this product
extremely. (reference examples)
T
l Mounting place must be as far as possible from the
position, which is close to the break line of board, or on the
line of large holes of board.
l Do not bend extremely the board, in mounting another
component. If necessary, use back-up pin (support pin) to
prevent from bending extremely.
l Do not break the board by hand. We recommend to use
the machine or the jig to break it.
E
E
Unit: mm
L
W
T
E
2.0±0.2
1.6±0.2
1.0 Max
0.5±0.3
Recommended Pad Layout
Unit: mm
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
A
B
C
0.9
2.0
1.6
www.socay.com
4/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.
Wire-wound Type Power Inductor
SCWL201610 Series
Reliability and Test Condition
Test Item
Test Condition
Criteria
1.
Resistance to Solder Heat
1.
2.
3.
Solder temperature : 260±5℃
Flux : Rosin
DIP time : 10±1 sec
1.
Reflow temperature : 245℃ It shall be
Soldered on the substrate applying
direction parallel to the substrate
Apply force(F) : 5 N
Test time : 10 sec
Adhesive Test
2.
3.
1.
Temperature Cycle
Dry Heat Test
Humidity Test
2.
3.
Temperature : -50 ~ +125℃ for 30
minutes each
Cycle : 500 cycles
Measurement : At ambient temperature
24 hours after test completion
1.
2.
3.
4.
Temperature : 85℃±5℃
Test time : 500 hours
Apply current : full rated current
Measurement : At ambient temperature
24 hours after test completion
1.
2.
3.
4.
5.
Temperature : 60℃±2℃
Humidity : 90 ~ 95 % RH
Apply current : full rated current
Test time : 500 hours
Measurement : At ambient temperature
24 hours after test completion
SOCAY Electronics Co., Ltd.
Revision February 12, 2014
2.
3.
More than 95 % of terminal electrode
should be covered with new solder
No mechanical damage
Induction value should be within ±20 %
of the initial value
1.
2.
No mechanical damage
Soldering the products on PCB after the
pulling test force > 5 N
1.
2.
No mechanical damage
Induction value should be within
of the initial value
±20 %
1.
2.
No mechanical damage
Induction value should be within
of the initial value
±20 %
1.
2.
No mechanical damage
Induction value should be within
of the initial value
±20 %
www.socay.com
5/5
@ SOCAY Electronics Co., Ltd. 2014
Specifications are subject to change without notice.
Please refer to www.socay.com for current information.