Chip Ferrite Bead SCGB-H Series Features u u u u u u u Monolithic inorganic material construction Closed magnetic circuit avoids crosstalk SMD Type & suitable for reflow and wave soldering Available in various sizes Excellent solderability and heat resistance High reliability With a sharp and frequency impedance characteristics which can effectively filter high frequency noise without attenuating high frequency signal Applications Filtering between analog and digital circuitry, clock generation circuitry, I/O interconnects, isolation between RF noisy circuits and logic devices susceptible to functional degradation, power supply filtering to prevent conducted RF energy from corrupting the power generation circuitry. Sharp impedance characteristics can effectively minimize attenuation, high frequency EMI prevention of LCD monitor, PDA, Computers, Computer peripherals, Cellular Equipment, Digital TV, Digital Cameras, Audio/Visual Equipment, DVD, Wireless Communication Devices, MP3. General Technical Data Operating temperature range -40 ~ +125ºC Storage Condition Less than 40℃ and 70% RH Storage Time 6 months(Size:1005), 12 months(Size:1608 above) Soldering method Reflow or Wave Soldering Part Numbering SCGB 1608 H 12 1 E P F (1) (2) (3) (4) (5) (6) (7) (8) 1 2 3 4 5 6 8 7 Series Name Size Code: the first two digitals : length(mm), the last two digitals : width(mm) Material Code Impedance(Ω), ±25% e.g.: 600=60 Ω, 121=120Ω Fixed Decimal Point Rated Current Cod A=50mA B=80mA C=100mA D=150mA E=200mA G=400mA H=500mA I=600mA J=700mA K=800mA P - Embossed paper tape, 7" reel T - Embossed plastic tape, 7" reel Soldering : Green Parts: S - Soldering Lead-Free F=300mA Packaging: F - Lead-Free for whole chip SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 1/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-H Series Electrical Characteristics (Continue) SCGB1005-H Series Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB1005H750FPF 75 100 0.40 300 Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB1608H200HPF 20 100 0.25 500 SCGB1608H750HPF 75 100 0.35 500 SCGB1608H800HPF 80 100 0.35 500 SCGB1608H121EPF 120 100 0.45 200 SCGB1608H301EPF 300 100 0.45 200 SCGB1608H601EPF 600 100 0.50 200 SCGB1608H102EPF 1000 100 0.60 200 Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB2012H121EPF 120 100 0.25 200 SCGB2012H221EPF 220 100 0.25 200 SCGB2012H301EPF 300 100 0.25 200 SCGB2012H601EPF 600 100 0.35 200 SCGB1608-H Series SCGB2012-H Series Test Level：250 mV l HP4291B RF IMPEDANCE / MATERIAL ANALYZER Test Instruments： l HP4338A/B MILLIOHM METER l Agilent 8720ES S-PARAMETER NETWORK ANALYZER l HP6632B SYSTEM DC POWER SUPPLY ** For special part number which is not shown in the above table, please refer to appendix. SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 2/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-H Series Recommended Soldering Conditions Pre-heating Soldering 60~120 Second ≥30 Second Temperature (℃) 260 217 200 150 25 Time (sec.) 60~150 Second For lead free solder Construction & Dimensions Unit: mm Symbol 1005 (EIA 0402) 1608 (EIA 0603) 2012 (EIA 0805) L 1.00±0.10 1.60±0.15 2.00±0.20 W 0.50±0.10 0.80±0.15 1.25±0.20 T 0.50±0.10 0.80±0.15 0.90±0.20 E 0.25±0.10 0.30±0.20 0.50±0.30 Size A B C 1005 0.40~0.60 1.60~2.60 0.40~0.70 1608 0.50~0.70 2.10~3.10 0.65~0.95 2012 1.00~1.20 3.00~4.00 0.80~1.10 L W T E E Recommended Pad Layout Unit: mm SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 3/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-H Series Tape Specifications PAPER CARRIER Unit: mm Symbol 1005 1608 2012 Paper Paper Paper W 8.00±0.10 8.00±0.10 8.00±0.10 P 2.00±0.05 4.00±0.10 4.00±0.10 E 1.75±0.05 1.75±0.10 1.75±0.10 F 3.50±0.05 3.50±0.10 3.50±0.10 D 1.55±0.05 1.56±0.10 1.56±0.10 D1 NA NA NA P 4.00±0.10 4.00±0.10 4.00±0.10 P010 NA NA 40.0±0.20 P2 2.00±0.05 2.00±0.10 2.00±0.10 A0 0.62±0.03 1.05±0.05 1.50±0.05 B0 1.12±0.03 1.85±0.05 2.30±0.05 K0(T) 0.60±0.03 0.95±0.05 0.95±0.05 t NA NA NA Reel Specifications & Packaging Part Size(EIA Size) Packaging Option Quantity 1005 (0402) 7″Reel 10,000 1608 (0603) 7″Reel 4,000 2012 (0805) 7″Reel 4,000 The Contents of a box： 1005 (0402): 6 reels / inner box 1608 (0603): 6 reels / inner box 2012 (0805): 6 reels / inner box SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 4/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. Chip Ferrite Bead SCGB-H Series Reliability and Test Condition Test item Test condition Criteria a. Temperature : -40 ~ +85℃ Temperature Cycle b. Cycle : 100 cycles a. No mechanical damage c. Dwell time : 30minutes b. Induction value should be within Measurement : at ambient temperature 24 hrs after ±20 % of the initial value test completion a. Temperature : 125℃±5℃ Operational Life b. Test time : 1000 hrs a. No mechanical damage c. Apply current : full rated current b. Induction value should be within Measurement : at ambient temperature 24 hrs after ±20 % of the initial value test completion a. Temperature : 40℃±2℃ b. Humidity : 90 ~ 95 % RH Biased Humidity a. No mechanical damage c. Test time : 1000 hrs d. Apply current : full rated current Measurement : at ambient temperature 24 hrs after b. Induction value should be within ±20 % of the initial value test completion a. More than 95 % of terminal a. Solder temperature : 260±5℃ Resistance to Solder Heat b. Flux : Rosin electrode should be covered with new solder b. No mechanical damage c. DIP time : 10±1 sec c. Induction value should be within ±20 % of the initial value a. Reflow temperature : 245℃ It shall be Soldered on the substrate applying direction parallel to the Adhesive Test substrate b. Apply force(F) : 5 N Test time : 10 sec Rated Current Test a. Apply current : full rated current / 5min a. No mechanical damage b. Soldering the products on PCB after the pulling test force > 5 N Temperature rise should be less than 25℃ a. Temperature : 93℃ b. Test time : 4hrs Steam Aging Test Others: 8hrs More than 95 % of terminal electrode c. Solder temperature : 235±5℃ should be covered with new solder d. Flux : Rosin e. DIP time : 5±1 sec SOCAY Electronics Co., Ltd. Revision February 13, 2014 www.socay.com 5/5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information.