MA4PBL027
Rev. V3
HMIC Silicon Beam Lead PIN Diode
Features
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Outline Drawing and Dimensions
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch and Impact Protection
Low Parasitic Capacitance and Inductance
Ultra Low Capacitance < 40 fF
Excellent RC Product < 0.10 ps
High Switching Cutoff Frequency > 110 GHz
110 Nanosecond Minority Carrier Lifetime
Driven by Standard +5 V TTL PIN Diode Driver
Description
The MA4PBL027 is a silicon beam lead PIN diode
fabricated with MACOM’s HMIC™ process. It
features one silicon pedestal embedded in a low
loss, low dispersion glass which supports the
beam-leads. The diode is formed on the top of the
pedestal, and air-bridges connect the diode to the
beam-leads. The topside is fully encapsulated with
silicon nitride and also has an additional polymer
layer for scratch and impact protection. These
protective coatings prevent damage to the diode
junction and air-bridge during handling and
assembly. The diodes exhibit low series resistance,
low capacitance, and extremely fast switching speed.
INCHES
MM
DIM
MIN.
MAX.
MIN.
MAX.
A
0.033
0.035
0.838
0.889
B
0.0148
0.0164
0.376
0.416
C
0.004
0.006
0.1016
0.1524
D
0.0115
0.0135
0.2921
0.343
Applications
E
0.0048
0.0065
0.1220
0.165
The ultra low capacitance, low RC product and low
profile of the MA4PBL027 makes it an ideal choice
for use in microwave and millimeter wave switch
designs, where low insertion loss and high isolation
are required. The low bias levels of 10 mA in the low
loss state and 0 V in the isolation state allows the
use of a simple 5 V TTL gate driver. These diodes
can be used as switching arrays on radar systems,
high speed ECM circuits, optical switching networks,
instrumentation, and other wideband multi-throw
switch assemblies.
F
0.0082
0.010
0.208
0.254
Ordering Information
Part Number
Package
MA4PBL027
100 piece Gel Pack1
1. Parts packed circuit side down.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4PBL027
Rev. V3
HMIC Silicon Beam Lead PIN Diode
Electrical Specifications at TA = +25°C
Parameter
Test Conditions
Total Capacitance
-10 V, 1 MHz
-40 V, 1 MHz
-10 V,100 MHz
-40 V,100 MHz
Series Resistance
Units
Min.
Typ.
Max.
pF
—
0.030
0.026
0.018
0.015
0.040
—
—
—
10 mA / 100 MHz
20 mA, 100 MHz
10 mA, 1 GHz
Ω
—
3.5
3.0
3.5
4.0
—
—
Forward Voltage
20 mA
V
0.7
0.91
0.95
Leakage Current
-90 V
µA
—
—
1
Minority Carrier Lifetime
IF = +10 mA, IR = 6 mA
ns
—
150
200
2. Total capacitance (CT) is equivalent to the sum of Junction Capacitance (CJ) and Parasitic Capacitance (CPAR).
3. Series resistance (RS) is equivalent to the total diode resistance: RS = Junction Resistance (RJ) + Ohmic Resistance (RC).
Absolute Maximum Ratings4,5
Parameter
Absolute Maximum
Forward Current
100 mA
Reverse Voltage
90 V
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
Junction Temperature
+175°C
RF CW Incident Power
30 dBm CW
RF & DC Dissipated Power
150 mW
Mounting Temperature
235°C for 10 sec.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these HBM class 1
devices.
General Handling
4. Exceeding any one or combination of these limits may cause
permanent damage to this device.
5. MACOM does not recommend sustained operation near these
survivability limits.
A polymer layer provides scratch protection for the
diode junction area and anode air bridge.
However, the leads of beam lead devices are very
fragile and must be handled with extreme care. The
leads can easily be distorted or broken by the
normal pressures if not careful while handling with
tweezers. A vacuum pencil with a #27 tip is the
preferred choice for picking and placing.
Attachment
These devices were designed to be inserted onto
hard or soft substrates. Recommended methods of
attachment include thermo-compression bonding,
parallel-gap welding and electrically conductive
silver epoxy.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4PBL027
Rev. V3
HMIC Silicon Beam Lead PIN Diode
C parasitic = 8 fF
Rs
Input
Output
Ls = 0.15 nH
Cj
MA4PBL027 SPICE Model
NLPINM1
wBv= 90 V
Is=1.0E-14 A
wPmax= 150 mW
Vi=0.0 V
Ffe= 1.0
Un = 900 cm^2/V-sec
M= 0.5
Wi= 14 um
Fc= 0.5
Rr= 100 KΩ
Imax= 1.1E+5 A/m^2
Cjmin= 0.030 pF
Kf= 0.0
Tau= 110 nsec
Af=1.0
Rs(I)= Rc + Rj(I) = 0.05 Ω
Vj= 0.7 V
Cj0= 0.040 pF
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4PBL027
HMIC Silicon Beam Lead PIN Diode
Rev. V3
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
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assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
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4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support