MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
Package Dimensions2
Features
Surface Mount Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Ultra-Low Parasitic Capacitance and Inductance
Higher Power Handling (Efficient Heat sinking)
RoHS* Compliant
A
B
Description
The MA4SPS552 is a silicon-glass PIN diode chip
fabricated with MACOM’s patented HMIC process.
This device features two silicon pedestals
embedded in a low loss glass. The diode is formed
on the top of one pedestal and connections to the
backside of the device are facilitated by making the
pedestal sidewalls conductive. Selective backside
metallization is applied producing a surface mount
device. The topside is fully encapsulated with
silicon nitride and has an additional polymer layer
for scratch protection. These protective coatings
prevent damage to the junction and the anode
air-bridge during handling and assembly.
These packageless devices are suitable for usage
in moderate incident power (5 W CW) or higher
incident peak power (200 W, 1 µs, 0.001 Duty)
series, shunt, or series-shunt switches. Small
parasitic inductance, 0.7 nH, and excellent RC
constant (0.20 ps) make the devices ideal for TR
switch and accessory switch circuits, where higher
P1db and IP3 values are required.
These diodes can also be used in π, T, Tapered
Resistance, and Switched-Pad Attenuator Control
Circuits for 50 Ω or 75 Ω systems.
Ordering Information1
C
D
E
F
G
DIM
INCHES
MM
MIN
MAX
MIN
MAX
A
0.0207
0.0226
0.525
0.575
B
0.0108
0.0128
0.275
0.325
C
0.0040
0.0080
0.102
0.203
D
0.0075
0.0095
0.190
0.241
Part Number
Package
E
0.0032
0.004
0.081
0.101
MA4SPS552
100 pc. die in carrier
F
0.0061
0.0081
0.155
0.205
MADP-000552-12810T
3000 pc. pocket tape on reel
G
0.0069
0.0089
0.175
0.225
1. Reference Application Note M513 for reel size information.
2. Backside metal: 0.1 μm thick.
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
Electrical Specifications @ +25°C
Symbol
Parameter
Conditions
Units
Min.
Typ.
Max.
CT
Capacitance
-40 V, 1 MHz
-40 V, 1 GHz
pF
—
0.08
0.06
0.14
—
RS
Resistance
Ω
—
VF
Forward Voltage
V
—
VR
Reverse Voltage
-10 µA
V
IR
Reverse Leakage Current
-40 V
RӨJC
Thermal Resistance
TL
Lifetime
100 mA, 100 MHz
20 mA, 100 MHz
100 mA
10 mA
1.7
2.4
1.00
0.88
1.25
1.00
| - 200 |
| - 275 |
—
nA
—
| - 10 |
—
Steady State
°C/W
—
30
—
+10 mA / -6 mA
( 50% - 90% V )
µs
—
2.5
—
—
Absolute Maximum Ratings3,4
Parameter
Absolute Maximum
Dissipated RF & DC Power
1W
Forward Current
100 mA
Reverse Voltage
-200 V
Operating Temperature
-65°C to +150°C
Static Sensitivity
Storage Temperature
-65°C to +150°C
Junction Temperature
+175°C
Mounting Temperature
+260°C
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these devices.
Handling Procedures
Please observe the following precautions to avoid
damage:
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near these
survivability limits.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
Typical Performance Curves
Capacitance vs. Voltage
Capacitance vs. Frequency
0.20
0.20
0.18
0.18
0V
-5 V
-40 V
0.16
0.14
CT (pF)
CT (pF)
0.16
0.12
0.10
0.12
0.10
0.08
0.08
0.06
0.06
0.04
0.0
0.2
0.4
0.6
0.8
0.04
1.0
100 MHz
1 GHz
0.14
0
10
Frequency (GHz)
20
30
Voltage (V)
Series Resistance vs. Frequency
Series Resistance vs. Current
100.0
4.0
100 MHz
1 GHz
RS (ohm)
RS (ohm)
3.0
2.0
1.0
10.0
10 mA
20 mA
50 mA
100 mA
0.0
0.0
0.1
0.2
0.3
0.4
0.6
0.7
0.8
0.9
1.0
Frequency (GHz)
1.0
0.01
0.1
1
10
Current (mA)
Series Resistance vs. Reverse Bias
1,000,000
100,000
RP (ohm)
100 MHz
1 GHz
10,000
1,000
3
40
0
-10
-20
-30
-40
Reverse Bias (-V)
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
100
MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
Typical Performance Curves
Isolation vs. Frequency
0.0
0
-0.2
-10
S21 (dB)
S21 (dB)
Insertion Loss vs. Frequency
-0.4
-0.6
-0.8
-20
-30
0
1
2
3
4
5
-40
6
0
1
Frequency (GHz)
2
3
4
5
6
5
6
Frequency (GHz)
Input Return Loss vs. Frequency
Output Return Loss vs. Frequency
-20
-20
S22 (dB)
-10
S11 (dB)
-10
-30
-40
-30
0
1
2
3
4
Frequency (GHz)
5
6
-40
0
1
2
3
4
Frequency (GHz)
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
Handling
All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin
oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.
Bulk handling should insure that abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are
conveniently located on the bottom surface of these devices and are removed from the active junction locations.
These devices are well suited for solder attachment onto hard and soft substrates. The use of 80Au/20Sn and
60Sn/40Pb solder is recommended. Conductive epoxy for attachment may also be used.
When soldering these devices to a hard substrate, hot gas die bonding is preferred. We re-commend utilizing a
vacuum tip and force of 60 to 100 grams applied normal to the top surface of the device.
When soldering to soft substrates, it is recommended to use a lead-tin interface at the circuit board mounting
pads. Position the die so that its mounting pads are aligned with the circuit board mounting pads and reflow the
solder by heating the circuit trace near the mounting pad while applying 60 to 100 grams of force perpendicular to
the top surface of the die. Equal Heat must be applied to both ohmic contacts. Since the HMIC glass is transparent, the edges of the mounting pads closest to each other can be visually inspected through the die after attach is
completed.
Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in
Application Note M538 , “Surface Mounting Instructions“.
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MA4SPS552
SURMOUNTTM PIN Diode
Rev. V3
M/A-COM Technology Solutions Inc. All rights reserved.
Information in this document is provided in connection with M/A-COM Technology Solutions Inc ("MACOM")
products. These materials are provided by MACOM as a service to its customers and may be used for
informational purposes only. Except as provided in MACOM's Terms and Conditions of Sale for such products or
in any separate agreement related to this document, MACOM assumes no liability whatsoever. MACOM
assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
specifications and product descriptions at any time, without notice. MACOM makes no commitment to update
the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to its specifications and product descriptions. No license, express or implied, by estoppels or otherwise,
to any intellectual property rights is granted by this document.
THESE MATERIALS ARE PROVIDED "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR
IMPLIED, RELATING TO SALE AND/OR USE OF MACOM PRODUCTS INCLUDING LIABILITY OR
WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, CONSEQUENTIAL OR
INCIDENTAL DAMAGES, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR
OTHER INTELLECTUAL PROPERTY RIGHT. MACOM FURTHER DOES NOT WARRANT THE ACCURACY
OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN
THESE MATERIALS. MACOM SHALL NOT BE LIABLE FOR ANY SPECIAL, INDIRECT, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS,
WHICH MAY RESULT FROM THE USE OF THESE MATERIALS.
MACOM products are not intended for use in medical, lifesaving or life sustaining applications. MACOM
customers using or selling MACOM products for use in such applications do so at their own risk and agree to
fully indemnify MACOM for any damages resulting from such improper use or sale.
6
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support