XSL-370-TB-4

XSL-370-TB-4
TECHNICAL DATA
UV LED, TO46 with glass ball lens
Drawing
Absolute Maximum Ratings (Ta=25°C)
Item
DC Forward Current
Peak Pulse Forward Current *1
Power Dissipation
Operating Temperature
Storage Temperature
Soldering Temperature *2
Symbol
IF
IFP
PD
TOP
TSTG
TSOL
Value
25
100
100
-30 … +80
-30 … +100
260
Unit
mA
mA
mW
°C
°C
°C
1
* pulse width ≤ 0.1 ms, duty ratio ≤ 1/10
2
* for 10 sec.
Specifications (If=20mA, Ta=25°C)
Item
Electrical Specification
Forward Voltage *1
Optical Specification
Optical Power
Peak Wavelength *2
Spectral Half Width (FWHM)
Viewing Angle
Symbol
Min.
Typ.
Max.
Unit
UF
3.2
3.6
4.2
V
PO
λP
λ
φ
0.8
370
-
12
15
1.2
375
-
mW
nm
nm
deg.
* Note:
1. measurement tolerance is ± 0.2 V
2. measurement tolerance is ± 2 nm
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Typical Performance Curves
forward voltage vs. forward current:
forward voltage vs. relative output power:
ambient temperature vs. relative output power:
ambient temperature vs. forward voltage:
ambient temp. vs. maximum forward current:
spectrum:
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directivity:
Device Materials
Item
Glass lens
Header
Lead
Material
Hard glass
Ni-plated iron alloy
Au-plated iron alloy
XSL-370-TB is RoHS compliant
Precaution for Use
1. Cautions
• This device is a UV LED, which radiates intense UV light during operation.
• DO NOT look directly into the UV light or look through the optical system. To prevent
inadequate exposure of UV radiation, wearing UV protective glasses is recommended
2. Lead Forming
• When forming leads, the leads should be bent at a point at least 3 mm from the base of the
lead. DO NOT use the base of the leadframe as a fulcrum during lead forming.
• Lead forming should be done before soldering.
• DO NOT apply any bending stress to the base of the lead. The stress to the base may
damage the LED’s characteristics or it may break the LEDs.
• When mounted the LEDs onto the printed circuit board, the holes on the circuit board should
be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it
causes deterioration of the lead and it will degrade the LEDs.
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3. Soldering Conditions
• Solder the LEDs no closer than 3 mm from the base of the lead.
• Recommended soldering conditions:
Dip Soldering
Pre-Heat
120 °C Max.
Pre-Heat Time
60 Seconds Max.
Solder Bath Temperature 260 °C Max.
Dipping Time
5 Seconds Max.
No lower than 3 mm from
Dipping Position
the base of the epoxy bulb
•
•
•
•
•
•
•
•
•
Hand Soldering
Temperature
350 °C Max.
Soldering Time 3 Seconds Max.
Position
Not closer than 3 mm from
the base of the epoxy bulb
Although the recommended soldering conditions are specified in the above table, dip or hand
soldering at the lowest possible temperature is desirable for the LEDs.
A rapid-rate process is not recommended for cooling the LEDs down from the peak
temperature.
Dip soldering and hand soldering should not be done more than one time.
Do not apply any stress to the lead particularly when heated.
The LEDs must not be repositioned after soldering.
After soldering the LEDs, the lead should be protected from mechanical shock or vibration
until the LEDs return to room temperature.
Direct soldering onto a PC board should be avoided. Mechanical stress to the resin may be
caused from warping of the PC board or from the clinching and cutting of the lead frames.
When it is absolutely necessary, the LEDs may be mounted in this fashion but the customer
will assume responsibility for any problems. Direct soldering should only be done adter
testing has confirmed that no damage, such as wire bond failure or resin deterioration, will
occur. Those LEDs should not be soldered directly to double sided PC boards because the
heat will deteriorate the epoxy resin.
When it is necessary to clamp the LEDs to prevent soldering failure, it is important to
minimize the mechanical stress on the LEDs.
Cut the LED leads at room temperature. Cutting the leads at high temperature may cause
the failure of the LEDs.
4. Static Electricity
• The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended
that a wrist band or an anti-electrostatic glove be used when handling the LEDs.
• All devices, equipment and machinery must be grounded properly. It is recommended that
precautions should be taken against surge voltage to the equipment that mounts the LEDs.
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5. Heat Generation
• Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when making the system design. The coefficient of temperature
increase per input electric power is affected by the thermal resistance of the circuit board and
density of LED placement on the board, as well as other components. It is necessary to
avoid intense heat generation and operate within the maximum ratings given in the
specification.
• The operating current should be desided after sonsidering the ambient maximum
temperature of LEDs.
6. Storage
• The LEDs should be stored at 30°C or less and 70%RH or less after being shippedand the
sorage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be
stored for a year in a sealed container with nitrogen atmosphere and moisture absorbent
material.
• Please avoid rapid transistions in ambient temperature, especially in high humidity
environments where condensation can occur.
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