LED430/565-04A TECHNICAL DATA Dual LED, 5 mm package GaN, GaP LED430/565-04A is a bi-color LED, containing a GaN (430 nm) and GaP (565 nm) LED chip die, which are mounted on a lead frame with a clear epoxy lens. On forward bias, it emits a power radiation of typical 0.4 mW and 0.2 mW at peak wavelengths of 430 nm and 565 nm. Specifications • • • • • • Structure: Peak Wavelength: Optical Output Power: Package: Resin Material: Lead Frame: GaN and GaP 430 and 565 nm 0.4 and 0.2 mW Ø 5 mm clear molding clear epoxy resin soldered (Unit: mm) Absolute Maximum Ratings (TA=25°C) Item Symbol Power Dissipation Forward Current Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature * Value 430 nm 250 PD IF VR Topr Tstg Tsol Unit 565 nm 130 mW mA V °C °C °C 50 10 -30 … +85 -30 … +100 240 * must be completed within 3 seconds at 260°C Electro-Optical Characteristics Item Peak Wavelength Half Width Total Radiated Power * Forward Voltage Reverse Current Reverse Current Viewing Half Angle Symbol Condition λP Δλ PO VF IR IR Θ1/2 Min. Typ. Max. 430nm 565nm 430nm 565nm 430nm 565nm IF = 20 mA 418 562 425 565 432 568 IF = 20 mA 50 35 IF = 20 mA 0.2 0.1 0.4 0.2 0.5 0.3 IF = 20 mA 4.0 2.2 5.0 2.4 VR = 5 V 10 VR = 10 V 100 IF = 20 mA ±20 - Unit nm nm mW V µA µA deg. 1 * measured by Photodyne #500 Note: The above specifications are for reference purpose only and subjected to change without prior notice. 01.08.2012 LED430/565-04A 1 of 2 Precaution for Use 1. Cautions • DO NOT look directly into the emitting area of the LED or through the optical system during operation! To prevent in adequate exposure of the radiation, wear protective glasses. 2. Lead Forming • Lead forming should be done before soldering. • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the lead frame as a fulcrum during lead forming! • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. • The LEDs must not be reposition after soldering. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. • Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. Soldering Conditions 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band and/or an antielectrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 01.08.2012 LED430/565-04A 2 of 2