PRELIMINARY DATA SHEET SMP1334-084LF: 100 W High-Power Silicon PIN Diode Applications Low-loss, high-power switches Low-distortion attenuators Features High RF power handling: 100 W Low thermal resistance: 10 °C/W Low series resistance: 0.45 Ω typical @ 100 mA Low total capacitance: 0.45 pF maximum @ 30 V Small QFN (2 x 2 mm) package (MSL1, 260 °C per JEDEC JSTD-020) Skyworks Green™ products are compliant with all applicable legislation and are halogen-free. For additional information, refer to Skyworks Definition of Green™, document number SQ04-0074. Description The SMP1334-084LF is a surface-mountable, low-capacitance silicon PIN diode designed as a series-connected PIN diode for high-power, high-volume switch and attenuator applications from 10 MHz to beyond 6 GHz. Typical resistance at 100 mA is 0.45 Ω and maximum capacitance at 30 V is 0.45 pF. The combination of low capacitance, low parasitic inductance, and nominal 50 μm I-region width, makes the SMP1334-084LF useful in large signal switches and attenuator applications. The device has a 1 W dissipation power rating, which makes it capable of handling up to 100 W @ 25 °C Continuous Wave (CW) in a series-connected transmit/receive (T/R) switch. Design information for high power switches may be found in the Skyworks Application Note, Design With PIN Diodes (document number 200312). Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202999B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 5, 2013 1 PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE Table 1. SMP1334-084LF Absolute Maximum Ratings Parameter Symbol Maximum Units IF 200 mA Reverse voltage VR 200 V Dissipated power @ 85 °C PD 1 W Forward current Minimum Peak pulse power dissipation @ 85 °C (10% duty cycle) 10 W Operating temperature TA –55 +85 C Storage temperature TSTG –55 +200 C Junction temperature TJ –55 +175 C Electrostatic discharge: Charged-Device Model (CDM), Class 4 Human Body Model (HBM), Class 3A Machine Model (MM), Class C ESD 1100 5000 400 V V V Note: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device. CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 2. SMP1334-084LF Electrical Specifications (Note 1) (TA = +25 C, Unless Otherwise Noted) Parameter Symbol Test Condition Forward voltage VF IF = 10 mA Reverse leakage current IR VR = 200 V Series resistance RS1 IF = 1 mA, f = 100 MHz Min Typical Max 0.75 V 10 μA 16.5 20 Ω 2.5 Ω RS10 IF = 10 mA, f = 100 MHz 2.0 RS100 IF = 100 mA, f = 100 MHz 0.45 Total capacitance CT30 VR = 30 V, f = 1 MHz Series inductance LS Minority carrier lifetime TL 0.40 Ω 0.45 pF 0.37 nH IF = 10 mA 700 ns I region width W 50 μm Thermal resistance (Note 2) ΘJC Junction-to-case 10 °C/W Peak thermal resistance ΘP Single, 1 μs pulse width, junction-to-case (10% duty cycle) 1 °C/W Note 1: Performance is guaranteed only under the conditions listed in this Table. Note 2: Assume a thermal resistance of 90 °C/W for the junction-to-bottom of the circuit board. Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 2 Units November 5, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202999B PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE Electrical and Mechanical Specifications Package dimensions for the SMP1334-084LF are provided in Figure 12, and tape and reel dimensions are provided in Figure 13. The absolute maximum ratings of the SMP1334-084LF are provided in Table 1. Electrical specifications are provided in Table 2. Typical DC performance characteristics of the SMP1334-084LF are illustrated in Figures 1, 2, and 3. Package and Handling Information Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SMP1334-084LF Evaluation Board is used to test the performance of the SMP1334-084LF PIN Diode. Figure 4 shows a bias schematic, and Table 3 lists the Evaluation Board Bill of Materials. Typical RF performance of the SMP1334-084LF using the schematic shown in Figure 4 is summarized in Table 4 and illustrated in Figures 5, 6, and 7. The SMP1334-084LF is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. An assembly drawing for the Evaluation Board is shown in Figure 8. The layer detail physical characteristics are provided in Figure 9. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. Package Dimensions The PCB layout footprint for the SMP1334-084LF is provided in Figure 10. Typical case markings are shown in Figure 11. Typical DC Performance Characteristics (TA = 25 °C, Unless Otherwise Noted) Series Resistance (Ω) 100 0.600 0.500 0.400 0.300 0 5 10 15 20 25 Reverse Voltage (V) 10 1 30 1 10 Forward Current (mA) Y0159 Figure 1. Capacitance vs Reverse Voltage @ 1 MHz 100 Y0160 Figure 2. Series Resistance vs Forward Current @ 100 MHz 0.900 0.800 Forward Voltage (V) Capacitance (pF) 0.700 0.700 0.600 0.500 0.400 0.300 0 10 20 30 40 Forward Current (mA) 50 Y0161 Figure 3. Forward Voltage vs Forward Current Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202999B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 5, 2013 3 PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE +5 V R 82 Ω C 100 pF L 22 nH C 100 pF C 100 pF SMP1334-084LF 50 Ω Term 50 Ω Term L 22 nH C 100 pF Y0162 Figure 4. SMP1334-084LF Bias Schematic Table 3. Evaluation Board Bill of Materials for EN33-D515-01_V3 (Tuned Circuit) Value Size QTY Manufacturer Mfg. Part Number Characteristics C Component 100 pF 0402 4 Murata GRM1555C1H101JZ01 5% C0G 50 V L 22 nH 0402 2 Murata HK100522NJ-T 5% R 82 0402 1 Panasonic ERJ2GEJ820X 5%, 0.1 W Table 4. Typical RF Performance @ 25 °C, f = 2.6 GHz Parameter Typical Units 0.22 dB 15 dB –6.4 dB Insertion loss 0.5 dB Return loss 11.7 dB Isolation –8.2 dB Max power +50 dBm Un-tuned Insertion loss Return loss Isolation With 22 nH Bias Circuit Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 4 November 5, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202999B PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE Typical RF Performance Characteristics 0 0 –10 –10 |S-Parameters| (dB) |S-Parameters| (dB) (TOP = +25 °C, Characteristic Impedance [ZO] = 50 Ω, EVB Optimized with Bias Circuit, Unless Otherwise Noted) –20 –30 –40 S11 S21 –50 –20 –30 –40 –60 –60 0 1 2 3 4 5 6 7 0 8 Frequency (GHz) S11 S21 –50 1 2 3 4 5 6 Frequency (GHz) Y0165 7 8 Y0164 Figure 6. S-Parameter Magnitude vs Frequency VREV = –30 V Figure 5. S-Parameter Magnitude vs Frequency If = 50 mA 0 If=50 mA If=100 mA Insertion Loss (dB) -0.1 -0.2 -0.3 -0.4 -0.5 -0.6 -0.7 0 10 20 30 40 50 CW Input Power (dBm) 60 Y0166 Figure 7. Insertion Loss vs CW Input Power f=2.6 GHz Figure 8. SMP1334-084LF Evaluation Board Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202999B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 5, 2013 5 PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE Cross Section Name Thickness (in) Material Top Soldermask L1 (0.0028) Cu foil 0.012 ± 0.0006 Rogers RO4003C Core L2 (0.0014) Cu foil Laminate (Note 1) FR4 Prepreg L3 (0.0014) Cu foil 0.010 ± 0.0006 FR4 Core (0.0028) Cu foil Laminate Laminate L4 Bottom Soldermask Note 1: Adjust this thickness to meet total thickness goal of 0.062 ± 0.005 inches. S2531 Figure 9. Board Layer Detail Physical Characteristics 0.25 Part Outline 0.55 Exposed Soldering Area, Typical 2X 0.80 Pin 1 Pin 2 0.80 0.35 Y0041 Figure 10. SMP1334-084LF PCB Layout Footprint (Top View) Pin 1 Indicator MG Skyworks Part Marking 1 1 2 2 Y0163 Figure 11. Typical Case Markings (Top View) Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 6 November 5, 2013 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 202999B PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE 2 1 C Pin 1 Indicator Exposed Pad Seating Plane A 2 B 1.15 + 0.1/–0.15 0.0 – 0.05 Detail A 2 1.6 + 0.1/–0.15 2 1 0.05 C 2X 0.90 ± 0.1 2X 2X 0.10 C 0.05 C Top View 0.20 Min. 3 0.20 0.08 C Side View Bottom View 0.4 ± 0.1 0.30 ± 0.05 5 0.10 M C A B Detail A All measurements are in millimeters. Dimensioning and tolerancing according to ASME Y14.5M-1994. Coplanarity applies to the exposed heat sink slug as well as the terminals.. Dimension applies to metalized terminal and is measured between 0.10 mm and 0.30 mm from terminal tip. S1989 Figure 12. SMP1334-084LF Package Dimensions ∅1.50+ 0.10/–0.00 0.30 ± 0.05 (T) Pin #1 4.00 ± 0.10 2.00 ± 0.05 4.00 (see Note 4) 1.75 ± 0.10 2.30 (Bo) A B 1.00 (Ko) 2.30 (Ao) 8.00 +0.30/–0.10 A 3.50 ± 0.05 B ∅1.00 Min. R0.30 Typ. B Notes: 1. Carrier tape: black conductive polystyrene. 2. Cover tape material: transparent conductive HSA. 3. Cover tape size: 5.40 mm width. 4. Ten sprocket hole pitch cumulative tolerance = ±0.20 mm. 5. ESD surface resistivity is ≤1 x 108 Ohms/square per EIA, JEDEC tape and reel specification. 6. Ao and Bo measurement point to be 0.30 mm from bottom pocket. 7. All measurements are in millimeters. A S1601 Figure 13. SMP1334-084LF Tape and Reel Dimensions Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 202999B • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • November 5, 2013 7 PRELIMINARY DATA SHEET • SMP1334-084LF: 100 W HIGH-POWER SILICON PIN DIODE Ordering Information Model Name SMP1334-084LF: 100 W High-Power Silicon PIN Diode Manufacturing Part Number SMP1334-084LF Evaluation Board Part Number SMP1334-084LF EVB Copyright © 2013 Skyworks Solutions, Inc. All Rights Reserved. Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. 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