RClamp3346P

RClamp3346P
Low Capacitance RClamp®
6-Line ESD protection
PROTECTION PRODUCTS - RailClamp®
Description
PRELIMINARY
Features
The RClamp 3346P provides ESD protection for highspeed data interfaces. It features a high maximum
ESD withstand voltage of ±17kV contact and ±20kV
air discharge per IEC 61000-4-2. RClamp3346P is
designed to minimize both the ESD peak clamping and
the TLP clamping. Package inductance is reduced at
each pin resulting in lower peak ESD clamping voltage.
The dynamic resistance is among the industry’s lowest
at 0.15 Ohms (typical). Maximum capacitance on each
line to ground is 0.65pF allowing the RClamp3346P to
be used in applications operating in excess of 5GHz
without signal attenuation. Each device will protect up
to six lines (three high-speed pairs).
The RClamp3346P is in a 7-pin SGP2708N7 package
measuring 2.7 x 0.8mm with a nominal height of 0.50mm.
The leads have a nominal pin-to-pin pitch of 0.40mm.
Flow- through package design simplifies PCB layout and
maintains signal integrity on high-speed lines.
The combination of low peak ESD clamping, low dynamic
resistance, and innovative package design enables this
device to provide the highest level of ESD protection for
applications such as USB 3.0, eSATA, and DisplayPort.
®
 ESD protection for high-speed data lines to








IEC 61000-4-2 (ESD) ±20kV (air), ±17kV (contact)
IEC 61000-4-5 (Lightning) 5A (8/20μs)
IEC 61000-4-4 (EFT) 40A (5/50ns)
Package design optimized for high speed lines
Flow-Through design
Protects six high-speed lines
Low capacitance: 0.65pF Maximum (I/O to Ground)
Low ESD clamping voltage
Low dynamic resistance: 0.15 Ohms (Typ)
Qualified to AEC-Q100
Solid-state silicon-avalanche technology
Mechanical Characteristics






SGP2708N7 7-pin package (2.7 x 0.8 x 0.50mm)
Pb-Free, Halogen Free, RoHS/WEEE Compliant
Lead Pitch: 0.4mm (intra-pair)
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Applications




Dimensions
USB 3.0
eSATA
Display Port
LVDS
Circuit Diagram
0.80 BSC
0.40 BSC
0.80
Pin 1
Pin 3
Pin 4
Pin 5
Pin 6
Pin 7
2.70
Pin 2
0.50
Nominal Dimensions in mm (Bottom View)
Revision 11/12/2013
6-Line Protection
1
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Absolute Maximum Rating
R ating
Symbol
Value
Units
Peak Pulse Current (tp = 8/20μs)
IP P
4.5
A
ESD per IEC 61000-4-2 (Air)1
ESD per IEC 61000-4-2 (Contact)1
VESD
+/- 20
+/- 17
kV
TJ
-55 to +125
°C
TSTG
-55 to +150
°C
Operating Temperature
Storage Temperature
Electrical Characteristics (T=25oC)
Parameter
Symbol
Conditions
Reverse Stand-Off Voltage
VRWM
Any I/O to GN D
Trigger Voltage2
V T R IG
tlp = 0.2/100ns
8
IR
VRWM = 3.3V, T=25oC
Any I/O to GN D
0.01
Reverse Leakage Current
Minimum
Typical
VRWM = 3.3V, T=125oC
Any I/O to GN D
Maximum
Units
3.3
V
V
0.05
μA
0.150
μA
Clamping Voltage
VC
IPP = 1A, tp = 8/20μs
Any I/O to GN D
2.5
3.5
V
Clamping Voltage
VC
IPP = 4.5A, tp = 8/20μs
Any I/O to GN D
3.5
4.5
V
ESD Clamping Voltage2
VC
IPP = 16A,
tlp = 0.2/100ns
5.5
V
ESD Clamping Voltage2
VC
IPP = -16A,
tlp = 0.2/100ns
3
V
Dynamic Resistance (Positive)2,3
RD
tlp = 0.2/100ns
0.15
Ohms
Dynamic Resistance
(N egative)2,3
RD
tlp = 0.2/100ns
0.14
Ohms
Junction Capacitance
Cj
VR = 0V, f = 1MHz,
Any I/O to GN D
0.60
0.65
pF
VR = 0V, f = 1MHz,
Between I/O pins
0.30
0.4
pF
Notes
1)Measured with a 20dB attenuator, 50 Ohm scope input impedance, 2GHz bandwidth. ESD gun return path connected to ESD
ground plane.
2)Transmission Line Pulse Test (TLP) Settings: tp = 100ns, tr = 0.2ns, ITLP and VTLP averaging window: t1 = 70ns to t2 = 90ns.
3) Dynamic resistance calculated from ITLP = 4A to ITLP = 16A
© 2013 Semtech Corporation
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics
Junction Capacitance vs. Reverse Voltage
(Between any I/O and Ground)
4.0
1.00
3.5
0.90
0.80
3.0
Capacitance - CJ (pF)
Clamping Voltage - VC (V)
Clamping Voltage vs. Peak Pulse Current
(Between any I/O and Ground)
2.5
2.0
1.5
1.0
Waveform
Parameters:
tr = 8µs
td = 20µs
0.5
0.70
0.60
0.50
0.40
0.30
0.20
f = 1 MHz
T=25oC
0.10
0.00
0.0
0
1
2
3
4
0.0
5
0.5
1.0
ESD Clamping (+8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
70
3.0
3.5
10
0
-10
60
-20
Voltage (V)
Voltage (V)
2.5
ESD Clamping (-8kV Contact per IEC 61000-4-2)
(Between any I/O and Ground)
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane.
80
2.0
Reverse Voltage - VR (V)
Peak Pulse Current - IPP (A)
90
1.5
50
40
30
-30
-40
-50
20
Measured with 50 Ohm scope input
impedance, 2GHz bandwidth. Corrected
for 50 Ohm, 20dB attenuator. ESD gun
return path connected to ESD ground
plane.
-60
10
-70
0
-80
-10
-10
0
10
20
30
40
50
60
70
-10
80
0
10
20
30
TLP Characteristic (Positive)
50
60
70
80
TLP Characteristic (Negative)
30
0
Transmission Line Pulse Test (TLP)
Settings:
tp=100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t1=70ns to t2=90ns
25
Transmission Line Pulse Test (TLP)
Settings:
tp=100ns, tr=0.2ns,
ITLP and VTLP averaging window:
t1=70ns to t2=90ns
-5
-10
TLP Current (A)
20
TLP Current (A)
40
Time (ns)
Time (ns)
15
10
5
-15
-20
-25
0
-30
0
2
4
6
8
10
-10
Clamping Voltage (V)
© 2013 Semtech Corporation
-8
-6
-4
-2
0
Clamping Voltage (V)
3
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Typical Characteristics (Con’t)
Analog Crosstalk
0
0
-1
‐10
-2
‐20
-3
‐30
Cross Talk (dB)
Insertion Loss - (IL) dB
Typical Insertion Loss S21
-4
-5
-6
-7
Pin 1 to Pin 7
‐40
‐50
Pin 4 to Pin 5
‐60
Pin 5 to Pin 7
‐70
-8
‐80
-9
‐90
-10
‐100
0
1
10
1.00E+07
Frequency (GHz)
© 2013 Semtech Corporation
1.00E+08
1.00E+09
1.00E+10
Frequency (Hz)
4
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Protecting USB 3.0 Ports
RClamp3346P is designed to protect all six USB 3.0
SuperSpeed and high speed differential lines. PCB
traces enter and exit each I/O pin and ground is
connected at pin 2. For best results, it is
recommended that the ground connection be made
using a filled via-in-pad. The via should be filled with a
conductive paste. This technique saves board space
and reduces parasitic inductance in the ground path.
Figures 2 and 3 are examples of how to route high
speed differential traces through the RClamp3346P.
Differential impedance of each pair can easily be
controlled for USB 3.0 (85 Ohms +/-15%).
The RClamp3346P should be placed as close to the
connector as possible for optimum ESD performance.
Internal construction of the RClamp3346P has been
optimized to minimize series inductance within the
package. This helps to reduce the ESD peak clamping
voltage. Dynamic resistance is extremely low (typically
0.15 Ohms) further reducing the ESD clamping voltage.
Figure 1 - USB 3.0 Eye Diagram with RClamp3346P
USB 3.0 - Type B
Device Connector
USB 3.0 - Type A
Device Connector
SSRX-
SSTX-
GND
SSTX+
D+
D-
SSRX+
GND
GND
GND
SSRX-
RClamp3346P
SSTX-
VBus
D+
D-
RClamp3346P
SSRX+
uClamp0541T
uClamp0541T
Figure 2 - Example USB 3.0 Layout
(Type B Device Connector)
© 2013 Semtech Corporation
SSTX+
VBus
Figure 3 - Example USB 3.0 Layout
(Type A Device Connector)
5
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Applications Information
Assembly Guidelines
The small size of this device means that some care
must be taken during the mounting process to insure
reliable solder joint. Semtech's recommended assembly guidelines for mounting this device are shown in
the Table 1. Figure 4 details Semtech’s recommended
aperture. Note that these are only recommendations
and should serve only as a starting point for design
since there are many factors that affect the assembly
process. Exact manufacturing parameters will require
some experimentation to get the desired solder
application.
Assembly Parameter
R ecommendation
Solder Stencil Design
Laser cut, Electro-polished
Aper ture shape
Rectangular with rounded
corners
Solder Stencil Thickness
0.100 mm (0.004")
Solder Paste Type
Type 4 size sphere or smaller
Solder Reflow Profile
Per JEDEC J-STD-020
PCB Solder Pad Design
N on-Solder mask defined
PCB Pad Finish
OSP OR N iAu
Table 1 - Recommended Assembly Parameters
0.200
0.400
0.025
0.700
0.800
0.350
0.025
0.200
2.700
All Dimensions are in mm.
Land Pad.
Stencil opening
Component
Figure 4 - Recommended Mounting Pattern
© 2013 Semtech Corporation
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Outline
OutlineDrawing
Drawing- -SO-8
SGP2708N7
D
A
DIMENSIONS
MILLIMETERS
MIN NOM MAX
B
PIN 1
INDICATOR
(LASER MARK)
DIM
A
A1
b
D
E
e
L
N
aaa
bbb
E
0.47 0.50 0.53
0.00 0.03 0.05
0.15 0.20 0.25
2.65 2.70 2.775
0.75 0.80 0.875
0.80 BSC
0.30 0.35 0.40
7
0.08
0.10
SEATING
PLANE
C
e
e/2
LxN
E/2
(0.025-0.075)
D/2
bxN
bbb
C A B
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).
Land Pattern - SGP2708N7
DIMENSIONS
Z
0.625
Y
P/2
DIM
P
X
Y
Z
MILLIMETERS
0.80
0.20
0.65
1.25
X
P
NOTES:
1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES ).
2. THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY .
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET .
© 2013 Semtech Corporation
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Marking Code
PIN1
INDICAT OR
Ordering Information
3346P
YYWW
Part Number
Qty per
Reel
Reel
Size
RClamp3346P.TN T
10,000
7 Inch
RailClamp and RClamp are trademarks of Semtech Corporation.
YYWW = Date Code
Carrier Tape Specification
Y YWW
3346 P
Y YWW
3346 P
Y YWW
3346 P
Y YWW
3346 P
Y YWW
3346 P
Y YWW
3346 P
Pin 1 Location (Towards Sprocket Holes )
User Direction of feed
Device Orientation in Tape
© 2013 Semtech Corporation
8
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RClamp3346P
PRELIMINARY
PROTECTION PRODUCTS
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Road, Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
© 2013 Semtech Corporation
9
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