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CHIP LED LAMPS GENERAL INFORMATION
1. Soldering
 Manual Of Soldering
The temperature of the iron tip should not be higher than 300℃(572℉) and
Soldering within 3 seconds per solder-land is to be observed.
 Reflow Soldering
Preheating: 140℃～160℃5℃, within 2 minutes.
Operatin heating: 260℃(MAX.) within 10 seconds. (Max)
Gradual Cooling (Avoid quenching).
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 DIP soldering (Wave Soldering)
Preheating : 120℃～150℃, within 120～180 sec.
Operation heating : 245℃5℃
within 5 sec.260℃
(Max)
Gradual Cooling (Avoid quenching).
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2. Handling
Care must be taken not to cause to the epoxy resin portion of LEDs while it is exposed to high temperature.
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Care must be taken not rub the epoxy resin portion of LEDs with hard or sharp article such as the sand blast and
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the metal hook.
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CHIP LED LAMPS GENERAL INFORMATION
3. Notes for designing :
Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated
figures.
Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and
OFF of the circuit.
figures.
When using the pulse drive care must be taken to keep the average current within the rated
Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs.
4. Storage :
In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after
unpacking the sealed envelope.
If the envelope is still packed, to store it in the environment as following:
(1) Temperature：5C-30C (41F) Humidity：RH 60% Max.
(2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent
soldering process must be:
a. Completed within 168 hours.
b. Stored at less than 30% RH.
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(3) Devices require baking before mounting, if:
(2) a or (2) b is not met.
(4) If baking is required, devices must be baked under below conditions:
48 hours at 60C 3C
5. Package of Products :
(1) Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag.
(2) Label:
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CHIP LED LAMPS GENERAL INFORMATION
ABSOLUTE
MAXIMUM RATINGS
1. Test Condition For Each Parameter:
Parameter
Symbol
Unit
Test Condition
Reverse Voltage
VR
IR = 100uA
Reverse Current
IR
V
A
Forward Voltage
VF
V
IF = 20mA
IV
2  12
mcd
IF = 20mA
Degree
IF = 20mA
Spectral Line Half-Width
Δ
nm
IF = 20mA
Power Dissipation
PD
mw
IF = 20mA
Peak Forward Current
IFP
mA
Duty 1/10, Pulse width = 0.1ms
Luminous Intensity
Viewing Angle
VR = 5V
2. Absolute Maximum Ratings :
Reverse Voltage
Reverse Current (VR = 5V)
5.0 Volt
≦100 A
Operating Temperature Range
40℃ ～ +85℃
40℃ ～
Storage Temperature Range
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+85℃
TYPICAL ELECTIEICAL-OPTICAL CHARACTERISTICS CURVES
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