TESDF5V0AU Taiwan Semiconductor Small Signal Product ESD Protection Array FEATURES - Meet IEC61000-4-2 (ESD) ±15kV (air), ±8kV (contact) - Meet IEC61000-4-4 (EFT) rating. 40A (5/50ns) - Meet IEC61000-4-5 (Lightning) rating. 12A (8/20μs) - Protects two directional I/O lines - Working voltage: 5V - Pb free version and RoHS compliant - Packing code with suffix "G" means green compound (halogen-free) SOT-23 MECHANICAL DATA - Case: SOT-23 small outline plastic package - Terminal: Matte tin plated, lead free., solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Weight: 8 ± 0.5 mg - Marking code: M05 APPLICATIONS - Cell Phone Handsets and Accessories - Microprocessor Based Equipment - Industrial Controls - Notebooks, Desktops, and Servers - Set-Top Box MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER SYMBOL VALUE UNIT Peak Pulse Power (tp=8/20μs waveform) PPP 300 W Peak Pulse Current (tp=8/20μs) IPP 5 A ESD per IEC 61000-4-2 (Air) ± 15 VESD ESD per IEC 61000-4-2 (Contact) Junction and Storage Temperature Range PARAMETER Reverse Stand-Off Voltage KV ±8 TJ , TSTG o -55 to +150 C SYMBOL MIN MAX UNIT VRWM - 5 V Reverse Breakdown Voltage IR = 1 mA V(BR) 6 - V Reverse Leakage Current VR = 5 V IR - 10 μA - 9.8 - 15 Clamping Voltage Junction Capacitance Document Number: DS_S1501019 IPP = 1 A IPP = 5 A VR = 0 V , f = 1.0 MHz VC CJ 350 V pF Version: B15 TESDF5V0AU Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25°C unless otherwise noted) Fig. 2 Pulse Waveform Fig. 1 Non-Repetitive Peak Pulse Power VS. Pulse Time 110 100 Waveform parameters: tr = 8 μs , td = 20 μs 90 80 1 Percent of IPP Peak Pulse Power Ppp (KW) 10 0.1 70 60 50 e-1 40 30 td = Ipp / 2 20 10 0 0.01 0.1 1 10 100 0 1000 5 10 15 25 30 Time (us) Pulse Duration (μs) Fig. 3 Admissible Power Dissipation Curve Fig. 4 Typical Junction Capacitance 400 120 Normalized Capacitance (pF) 100 Power Rating (%) 20 80 60 40 20 320 240 160 f = 1.0 MHz 80 0 0 0 20 40 60 80 100 120 140 160 180 0 1 2 3 4 5 Reverse Voltage (V) Ambient Temperature (oC) Fig. 5 Clamping Voltage VS. Peak Pulse Current Clamping Voltage (V) 15 10 5 Waveform parameters: tr = 8 μs , td = 20 μs 0 0 1 2 3 4 5 Peak Pulse Current (A) Document Number: DS_S1501019 Version: B15 TESDF5V0AU Taiwan Semiconductor Small Signal Product ORDER INFORMATION (EXAMPLE) TESDF5V0AU RFG Green compound code Packing code Part no. PACKAGE OUTLINE DIMENSIONS SOT-23 DIM. Unit (mm) Unit (inch) Min Max Min Max A 2.70 3.10 0.106 0.122 B 1.10 1.50 0.043 0.059 C 0.30 0.51 0.012 0.020 D 1.78 2.04 0.070 0.080 E 2.10 2.64 0.083 0.104 F 0.89 1.30 0.035 0.051 G 0.55 REF 0.022 REF H 0.10 REF 0.004 REF Unit (mm) Unit (inch) Typ. Typ. Z 2.8 0.110 X 0.7 0.028 Y 0.9 0.035 C 1.9 0.075 E 1.0 0.039 SUGGEST PAD LAYOUT DIM. Note: 1. The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. Document Number: DS_S1501019 Version: B15 TESDF5V0AU Taiwan Semiconductor Small Signal Product Applications Information ◇ Designed for the uni-directional protection of 2 lines form the damage caused by Electro Static Discharge (ESD) and surge pulses ◇ Be used on lines where the signal polarities are above and below ground ◇ Provides a surge capability of 300 Watts peak Ppp per line for an 8/20 ms waveform Circuit Board Layout Recommendations ◇ Place the ESD Protection array as close to the input terminal or connector as possible ◇ Keep parallel signal paths to a minimum ◇ Minimize all printed-circuit board conductive loops including power and group loops ◇ Advoid using shared transient return paths to a common ground point ◇ Ground planes should be used. For multilayer printed-circuit boards, use ground vias ◇ Below picture is the typical application for bi-directional protection of two lines To Protect Device IO#1 IO#2 TESDF5V0AU Document Number: DS_S1501019 Version: B15 TESDF5V0AU Taiwan Semiconductor Small Signal Product Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_S1501019 Version: B15