your innovation. our memory.

your innovation.
our memory.
2014 2H
Micron Product Guide
®
your innovation. our memory.
We have the
right device for
your design.
Micron has one of the most
comprehensive, cost-competitive
memory product portfolios in the
industry. We’re committed to
meeting our customers’ needs with
a broad continuum of memory
solutions, from legacy designs to
long-term stability for current
designs, new innovations, and
emerging technologies.
6
Segment Directory
13
DRAM
10
DDR3 SDRAM 240-pin ECC UDIMM
16
DDR3 SDRAM 240-pin VLP ECC UDIMM
DDR SDRAM 184-pin RDIMM
DDR3 SDRAM 244-pin Mini-UDIMM
DDR SDRAM 184-pin VLP RDIMM
DDR3 SDRAM 244-pin VLP Mini-UDIMM
SDRAM 168-pin UDIMM
MT40 and EDY DDR4 SDRAM
DDR3 SDRAM 204-pin SODIMM
SDRAM 168-pin ECC UDIMM
MT41 and EDJ DDR3 SDRAM
DDR3 SDRAM 204-pin ECC SODIMM
MT47 DDR2 SDRAM
DDR3 SDRAM 200-pin SORDIMM
17
14
MT48 SDRAM
DDR3 SDRAM 240-pin RDIMM
DDR3 SDRAM 240-pin VLP RDIMM
12
MT44 RLDRAM 3 Memory
DDR3 SDRAM 244-pin Mini-RDIMM
MT49 RLDRAM 2 Memory
DDR3 SDRAM 244-pin VLP Mini-RDIMM
MT52 Mobile LPDDR3
DDR2 SDRAM 240-pin UDIMM
MT42 Mobile LPDDR2
DDR2 SDRAM 240-pin ECC UDIMM
MT46 Mobile LPDDR
DDR2 SDRAM 200-pin SODIMM
®
DDR2 SDRAM 200-pin SORDIMM
MT45 PSRAM CellularRAM Memory
15
17
Hybrid Memory Cube
17
Bare Die and Wafer-Level Products
NAND Flash
DDR2 SDRAM 244-pin VLP Mini-RDIMM
DDR SDRAM 100-pin UDIMM
DDR4 SDRAM 260-pin SODIMM
DDR SDRAM 168-pin UDIMM
DDR4 SDRAM 288-pin ECC SODIMM
DDR SDRAM 184-pin UDIMM
DDR4 SDRAM 288-pin RDIMM
DDR SDRAM 168-pin ECC UDIMM
DDR4 SDRAM 288-pin VLP RDIMM
16
MT29 SLC NAND Flash
NAND Small Page (SP) Flash
MT29 MLC NAND Flash
MT29 Serial NAND Flash
DDR2 SDRAM 244-pin Mini-RDIMM
DDR4 SDRAM 288-pin ECC UDIMM
DDR3 SDRAM 240-pin UDIMM
18
DDR2 SDRAM 240-pin FBDIMM
DDR4 SDRAM 288-pin UDIMM
DDR4 SDRAM 288-pin LRDIMM
DDR2 SDRAM 240-pin RDIMM
DDR2 SDRAM 240-pin VLP RDIMM
Modules
13
Hybrid Memory Cube (HMC)
®
EDW GDDR5 SGRAM Memory
12
SDRAM 144-pin SODIMM
SDRAM 168-pin RDIMM
MT46 DDR SDRAM
11
DDR SDRAM 200-pin ECC SODIMM
Managed NAND
19
MTFC e •MMC Memory for Embedded
MTED and MTFD Embedded USBs
MT29 Enhanced ClearNAND Flash Memory
DDR SDRAM 184-pin ECC UDIMM
DDR SDRAM 144-pin SODIMM
DDR SDRAM 200-pin SODIMM
3
your innovation. our memory.
Product
NOR Flash
20
25
M25PE Serial NOR Flash Embedded
M25PX Serial NOR Flash Embedded
M29AW Parallel NOR Flash Automotive
M45PE Serial NOR Flash Embedded
M29DW Parallel NOR Flash Automotive
N25Q Serial NOR Flash Embedded
31
DRAM Components
33
GDDR5,
Hybrid Memory Cube
N25Q Serial NOR Flash Embedded (con’t.)
34
NOR MCP
MT25Q Serial NOR Flash Embedded
35
MCP NAND/NOR + LPDDR1
37
MCP e •MMC/NAND + LPDDR
Solid State Drives (SSDs)
39
e •MMC Memory Legacy
40
e •MMC Memory Next Generation
27
M500 Self-Encrypting Drive Client SATA SSD
41
DDR4 Module
M550 Self-Encrypting Drive Client SATA SSD
42
DDR3 Module
M29F Parallel NOR Flash Automotive
M29W Parallel NOR Flash Automotive
21
26
M58BW Parallel NOR Flash Automotive
M58WR Parallel NOR Flash Automotive
G18 Parallel NOR Flash Automotive
J3 Parallel NOR Flash Embedded
M28W Parallel NOR Flash Embedded
22
43
DDR2 Module
M510 Self-Encrypting Drive Client SATA SSD
M29EW Parallel NOR Flash Embedded
44
DDR and SDRAM Module
M550 Client SATA SSD
M29W Parallel NOR Flash Embedded
45
PSRAM CellularRAM Memory
M510 Client SATA SSD
46
NAND Flash
M500 Enterprise SATA SSD
47
P30 Parallel NOR Flash Embedded (con’t.)
NAND Small Page Flash Memory,
N25Q Serial NOR Flash Memory
M500DC Enterprise SATA SSD
P33 Parallel NOR Flash Embedded
48
M25/M45 Serial NOR Flash Memory
P320h Enterprise PCIe SSD
M25P Serial NOR Flash Automotive (Legacy)
P420m Enterprise PCIe SSD
49
M29 Parallel NOR Flash Memory,
M29AW Automotive Uniform Block MLC Flash
50
M29DW Parallel NOR Flash,
M29EW Parallel NOR Flash
51
M29F Automotive Single-Bank 5V Flash Memory
52
P30/P33 Parallel NOR Flash Memory,
P30/P33 Stacked
53
G18 Parallel NOR Flash Memory,
J3 Parallel NOR Flash Memory
MT25T Serial NOR Flash Automotive
(Twin QSPI, x8)
54
M28W Parallel NOR Flash Memory,
M58BW Parallel NOR Flash Memory
M25P Serial NOR Flash Embedded
55
M58WR Parallel NOR Flash Memory
M29DW Parallel NOR Flash Embedded
28
P30 Parallel NOR Flash Embedded
29
23
M25PE Serial NOR Flash Automotive
(Page Erase)
24
M25PE Serial NOR Flash Automotive
(Dual I/O)
N25Q Serial NOR Flash Automotive
(Multiple I/O)
4
Part Numbering Guides
Multichip Packages (MCPs)
30
MT29C NAND Flash + LPDDR MCPs
MT29R NAND Flash + LPDDR2 MCPs
MT38 NOR Flash-Based MCPs
56
3xx and 4xx SSD
57
4xx and 5xx SSD
58
Product Lifecycle Solutions
59
Web Tools
5
Automotive
Solutions for
the road
Power and
efficiency
Connected
Home
Powering smart
innovations
Graphics
and Consumer
6
Balancing cost
and performance
From workstations and netbooks, to tablets and
ultrathins, computing designs require a multitude of
packages, densities, and speeds. Our products enable
you to optimize performance in key areas like signaling
speeds and bandwidth and to find the right
combination of power, efficiency, and cost. From
components to modules to SSDs, we manufacture our
products from start to finish. We invest time up front,
rigorously testing and validating that our products are
right the first time. Plus, our experienced technical
support will help you get your design to market faster,
easier, and better.
Today’s network-connected home enables consumers
to receive, access, and share content of all types via
devices like set-top boxes and wireless modems. It
also provides consumers the ability to automatically or
manually monitor and manage connected home
systems—like lighting, appliances, heating/cooling,
and security—from locations both in and away from
the home, over a secured connection. Our memory
plays a key role in making these innovations possible.
We offer a wide range of high-performance, highquality memory solutions that support all connectivity
options.
The convergence of applications in the graphics
and consumer segment is bringing TV, social media,
home entertainment, and gaming to end consumers
through one piece of equipment. Micron offers one
of the industry’s broadest portfolios to meet this very
competitive segment’s demands for high-performance,
cost-efficient memory solutions. We’ve got the memory
you need for a broad range of designs, including digital
TVs, Blu-ray Disc™ players, video game consoles,
portable game systems, personal media players, PC
graphics cards, media tablets, cameras, or printers.
10
DRAM Components
12
PSRAM CellularRAM Memory
18
NAND Flash
20
NOR Flash
11
Mobile LPDRAM
19
e •MMC Memory
12
DRAM Modules
27
Solid State Drives (SSDs)
10
DDR3/DDR4 SDRAM Components
20
NOR Flash
10
DRAM Components
20
NOR Flash
18
NAND Flash
19
Managed NAND
30
Multichip Packages (MCPs)
10
DRAM and GDDR5 Components
20
NOR Flash
18
NAND Flash
19
Managed NAND Flash
30
Multichip Packages (MCPs)
Segment
Directory
Product
Client
Building on our decades of experience in the memory
business, we’ve established a broad portfolio of
products and technologies that maximize the
functionality of today’s sophisticated automotive
electronics. Our engineers have the technical
background to help you choose the best of our
high-quality, rigorously tested automotive memory
solutions to optimize your design.
7
IMM
Mobile/Tablet
Staying connected
in a wireless world
Networking
Enabling applications
now and into
the future
Enterprise
and Cloud
Rigorously tested
for reliability
We’ve developed some of the industry’s highestperformance mobile memory solutions, but we
deliver more than just great products. We strive to
solve design challenges through better engineering—
raising the bar on features, functionality, and
performance. We work with chipset vendors, OS
designers, and other enablers to ensure our parts are
optimized for your design. You get a comprehensive
product portfolio of mobile memory solutions that
maximize performance, along with the technical
experts to help you make it work for your applications.
The unique requirements of communications and
networking applications demand high-performance,
specialty memory with low latency, rigorous thermal
specifications, pristine signal integrity, and ECC data
protection. Choosing the right memory technology
for your design is a critical decision you make on the
initial board layout; so is choosing a memory supplier
to provide it. Micron engineers and manufactures
a broad portfolio of specific solutions to meet the
needs of your mission-critical networking applications.
Server designs demand reliability, performance, and low
power consumption. We’ve developed a host of
solutions—from professional-grade SSDs to the industry’s
lowest-voltage modules—that can help you address
these challenges and overcome power and space
constraints in data centers. We design and build our
memory solutions from start to finish—beginning with
memory component design—rigorously testing at each
stage of the manufacturing process. We also work with
board makers and industry organizations to define and
develop the leading technologies that will enable your
next server design.
10
DRAM Components
11
Mobile LPDRAM
20
NOR Flash
19
e •MMC Memory
12
PSRAM CellularRAM Memory
18
NAND Flash
11
Mobile LPDRAM
18
NAND Flash
12
PSRAM CellularRAM Memory
30
NAND and NOR Flash-Based
Multichip Packages (MCPs)
7
Segment
Directory
One source for
industrial/multi-market
applications
Our exacting quality standards, broad product
portfolio, individualized category support, and
commitment to supply stability set us apart as the
memory provider that IMM customers can rely on to
serve mission-critical application needs. Our memory
solutions are the top choice for PC, network
infrastructure, and communications equipment used
in extreme environments—empowering the newest
technology developments in the fields of science,
medicine, and manufacturing.
e •MMC Memory
10
DRAM and RLDRAM Components
12
DRAM Modules
18
NAND Flash
19
eUSB, e •MMC Memory
27
Solid State Drives (SSDs)
20
NOR Flash
17
Hybrid Memory Cube (HMC)
12
GDDR5
13
LRDIMMs
12
RDIMMs
18
NAND Flash
27
SATA and PCIe Solid State Drives (SSDs)
17
Hybrid Memory Cube (HMC)
9
Density
DRAM
Bus Width
Voltage
Clock Rate
Package
Temp Range
MT44 RLDRAM® 3 Memory
576Mb
x18, x36
1.35V
800–1067 MHz
168-ball FBGA
0˚C to +95˚C, –40˚C to +95˚C
1.15Gb
x18, x36
(576Mb DDP)
1.35V
800 MHz
168-ball FBGA
0˚C to +95˚C, –40˚C to +95˚C
Note: Products meet RoHS 5/6 standards.
Bus Width
Voltage
Clock Rate
Package
Temp Range
MT40 and EDY DDR4 SDRAM
288Mb
x9, x18, x36
1.8V
300–400 MHz
144-ball uBGA
0˚C to +95˚C, –40˚C to +95˚C
4Gb
576Mb
x9, x18, x36
1.8V
300–533 MHz
144-ball uBGA
0˚C to +95˚C, –40˚C to +95˚C
1.2V
667–800 MHz
216-ball UFBGA
–30˚C to +85˚C
–30˚C to +85˚C
8Gb
x4, x8, x16
1.2V
1067–1600 MHz
78-, 96-ball FBGA
0˚C to +95˚C
Note: Products meet RoHS 5/6 standards.
x4, x8, x16 (SDP),
x4 (4Gb DDP)
1.2V
1067–1600 MHz
78-, 96-ball FBGA
0˚C to +95˚C
Note: Products meet RoHS standards.
1Gb
x4, x8, x16
1.35–1.5V
667–1067 MHz
78-, 96-ball FBGA
0˚C to +95˚C, –40˚C to +95˚C, –40˚C to +105˚C
2Gb
x4, x8, x16
1.35–1.5V
800–1067 MHz
78-, 96-ball FBGA
0˚C to +95˚C, –40˚C to +85˚C,
–40˚C to +95˚C, –40˚C to +105˚C
4Gb
x4, x8, x16
1.35–1.5V
800–1067 MHz
78-, 96-ball FBGA
0˚C to +95˚C, –40˚C to +95˚C, –40˚C to +105˚C
8Gb
x4, x8, x16 (SDP
and 4Gb DDP)
1.35V
800–1067 MHz
78-, 96-ball FBGA
0˚C to +95˚C, –40˚C to +95˚C
16Gb
x16 (8Gb DDP)
1.35V
933 MHz
78-ball FBGA
0˚C to +95˚C
MT47 DDR2 SDRAM
512Mb
x4, x8, x16
1.8V
400–533 MHz
60-, 84-ball FBGA
0˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C
1Gb
x4, x8, x16
1.8V
333–533 MHz
60-, 84-ball FBGA
0˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C
2Gb
x4, x8, x16 (SDP);
x4, x8 (2Gb DDP)
1.8V
400–533 MHz
60-, 63-, 84-ball FBGA
0˚C to +85˚C, –40˚C to +95˚C, –40˚C to +105˚C
4Gb
x4, x8 (2Gb DDP)
1.8V
400 MHz
63-ball FBGA
0˚C to +85˚C
Note: Products meet RoHS standards.
your innovation. our memory.
x8, x16
2.5V
200 MHz
60-ball FBGA, 66-pin TSOP
0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C
512Mb
x4, x8, x16
2.5V
200 MHz
60-ball FBGA, 66-pin TSOP
0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C
Note: Products meet RoHS 5/6 standards.
MT48 SDRAM
x8, x16, x32
3.3V
3.3V
133–200 MHz
54-, 86-pin TSOP,
54-, 90-ball VFBGA
133–167 MHz
54-, 86-pin TSOP,
54-, 90-ball VFBGA,
60-ball FBGA
0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C
0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C
256Mb
x4, x8, x16
3.3V
133–167 MHz
54-pin TSOP,
54-ball VFBGA, 60-ball FBGA
0˚C to +70˚C, –40˚C to +85˚C, –40˚C to +105˚C
512Mb
x4, x8, x16
3.3V
133 MHz
54-pin TSOP
0˚C to +70˚C, –40˚C to +85˚C
Note: Products meet RoHS 5/6 standards.
x32, x64
1.2V
667–800 MHz
12Gb
x32, x64
1.2V
667–800 MHz
216-ball FBGA
–30˚C to +85˚C
16Gb
x32, x64
1.2V
667–800 MHz
216-ball VFBGA, 216-ball WFBGA,
253-ball TFBGA
–30˚C to +85˚C
134-ball VFBGA
–25˚C to +85˚C, –40˚C to +105˚C
MT42 Mobile LPDDR2
1Gb
x32
1.2V
400 MHz
2Gb
x16, x32
1.2V
333–400 MHz
168-ball PoP
–25˚C to +85˚C
–25˚C to +85˚C
4Gb
x32, x64
1.2V
333–533 MHz
168-, 216-ball PoP,
134-, 168-, 240-ball WFBGA,
216-ball UFBGA
6Gb
x32
1.2V
333–400 MHz
168-ball VFBGA
–25˚C to +85˚C
8Gb
x32, x64
1.2V
333–533 MHz
168-, 216-, 240-ball PoP,
168-, 216-, 272-ball WFBGA
–25˚C to +85˚C
16Gb
x64
1.2V
400–533 MHz
216-, 220-, 253-ball VFBGA
–25˚C to +85˚C
MT46 Mobile LPDDR
256Mb
128Mb
8Gb
216-, 253-ball WFBGA,
178-, 253-ball VFBGA
Note: Products meet RoHS standards.
MT46 DDR SDRAM
x8, x16, x32
x32
Note: Products meet RoHS standards.
Note: Products meet RoHS standards.
64Mb
MT52 Mobile LPDDR3
4Gb
MT41 and EDJ DDR3 SDRAM
10
MT49 RLDRAM 2 Memory
DRAM
Density
128Mb
x16
1.8V
167–200 MHz
60-ball VFBGA
0˚C to +70˚C, –40˚C to +85˚C,
–40˚C to +105˚C
256Mb
x16, x32
1.8V
167–200 MHz
60-, 90-ball VFBGA
0˚C to +70˚C, –40˚C to +85˚C,
–40˚C to +105˚C
512Mb
x16, x32
1.8V
167–200 MHz
60-, 90-ball VFBGA, WFBGA,
152-ball PoP
–40˚C to +85˚C
1Gb
x16, x32
1.8V
167–200 MHz
60-, 90-ball VFBGA,
168-ball PoP
–40˚C to +85˚C, –40˚C to +105˚C
2Gb
x16, x32
1.8V
167–200 MHz
60-, 90-ball VFBGA,
168-ball PoP, 60-ball WFBGA
–25˚C to +85˚C, –40˚C to +85˚C
4Gb
x32
1.8V
167–200 MHz
168-, 240-ball PoP
–25˚C to +85˚C, –40˚C to +85˚C
8Gb
x32
1.8V
167–200 MHz
168-ball PoP
–25˚C to +85˚C, –40˚C to +85˚C
Note: Products meet RoHS standards.
11
Density
Bus Width
RoHS
I/O Voltage
Access Time
Package
Temp Range
MT45 PSRAM CellularRAM® Memory
Component
Count
RoHS
x16
32Mb
x16
Green
1.8V
64Mb
x16
Green
1.8V
70ns
48-, 54-ball VFBGA
–40˚C to +85˚C, –30˚C to +85˚C
DDR3 SDRAM 240-pin UDIMM
128Mb
x16
Green
1.8V
70ns, 85ns
54-ball VFBGA
–40˚C to +85˚C, –40˚C to +105˚C
1GB
x64
8
2GB
x64
4, 8
4GB
x64
8GB
16GB
1.8V
70ns
48-, 54-ball VFBGA
–40˚C to +85˚C, –40˚C to +105˚C
70ns
48-, 54-ball VFBGA
–40˚C to +85˚C, –40˚C to +105˚C
I/O Voltage
Data Rate
Module Ranks
Temp Range
Depth
Package
Temp Range
16GB
x72
36
Green
1.2V
2133 MT/s
Dual
0˚C to +95˚C
32GB
x72
72
Green
1.2V
2133 MT/s
Quad
0˚C to +95˚C
Green
1.35 V
1333 MT/s
Single
0˚C to +95˚C
Green
1.35 –1.5V
1600 MT/s
Single
0˚C to +95˚C
8
Green
1.35–1.5V
1600–1866 MT/s
Single
0˚C to +95˚C
x64
16
Green
1.35 –1.5V
1600–1866 MT/s
Dual
0˚C to +95˚C
x64
16
Green
1.35V
1866 MT/s
Dual
0˚C to +95˚C
x32
1.5V
64Mb
170-, 238-ball FBGA
0˚C to +95˚C
DDR3 SDRAM 240-pin ECC UDIMM
4Gb
x32
1.5V
128Mb
170-, 238-ball FBGA
0˚C to +95˚C
1GB
x72
9
Green
1.5V
1333 MT/s
Single
0˚C to +95˚C
2GB
x72
9, 18
Green
1.35 –1.5V
1333–2133 MT/s
Single, Dual
0˚C to +95˚C
4GB
x72
9, 18
Green
1.35–1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C
8GB
x72
18
Green
1.35 –1.5V
1333–1866 MT/s
Dual
0˚C to +95˚C
16GB
x72
18
Green
1.35 –1.5V
1600–1866 MT/s
Dual
0˚C to +95˚C
Modules
Density
Bus Width
Component
Count
DDR3 SDRAM 240-pin VLP ECC UDIMM
RoHS
Voltage
Data Rate
Module Ranks
Temp Range
4GB
x64
8
Green
1.2V
2133 MT/s
Single
0˚C to +95˚C
8GB
x64
16
Green
1.2V
2133 MT/s
Dual
0˚C to +95˚C
DDR4 SDRAM 288-pin ECC UDIMM
x72
9
Green
1.2V
2133 MT/s
Single
0˚C to +95˚C
8GB
x72
18
Green
1.2V
2133 MT/s
Dual
0˚C to +95˚C
DDR4 SDRAM 260-pin SODIMM
4GB
x64
8
Green
1.2V
2133–2400 MT/s
Single
0˚C to +95˚C
8GB
x64
16
Green
1.2V
2133–2400 MT/s
Dual
0˚C to +95˚C
DDR4 SDRAM 288-pin ECC SODIMM
18
Green
x72
9
Green
1.35V
1333 MT/s
Single
0˚C to +95˚C
4GB
x72
9, 18
Green
1.35 –1.5V
1333–1600 MT/s
Single, Dual
0˚C to +95˚C
8GB
x72
18
Green
1.35–1.5V
1333–1600 MT/s
Dual
0˚C to +95˚C
16GB
x72
18
Green
1.35V
1600 MT/s
Dual
0˚C to +95˚C
2GB
x72
9
Green
1.35 –1.5V
1333–1600 MT/s
Single
0˚C to +95˚C
4GB
x72
9, 18
Green
1.35 –1.5V
1333 MT/s
Single, Dual
0˚C to +95˚C
8GB
x72
18
Green
1.35V
1600 MT/s
Dual
–40˚C to +95˚C
DDR3 SDRAM 244-pin VLP Mini-UDIMM
4GB
x72
2GB
DDR3 SDRAM 244-pin Mini UDIMM
DDR4 SDRAM 288-pin UDIMM
8GB
Modules
2Gb
DRAM
16Mb
Bus Width
Voltage
DDR4 SDRAM 288-pin LRDIMM
EDW GDDR5 SGRAM Memory
1.2V
2133–2400 MT/s
Dual
0˚C to +95˚C
2GB
x72
4GB
8GB
9
Green
1.5V
1333 MT/s
Single
0˚C to +95˚C, –40˚C to +95˚C
x72
9
Green
1.35 V
1333 MT/s
Single
0˚C to +95˚C, –40˚C to +95˚C
x72
18
Green
1.35V
1600 MT/s
Dual
0˚C to +95˚C
DDR3 SDRAM 204-pin SODIMM
1GB
x64
4, 8
Green
1.35V
1333– 1600 MT/s
Single
0˚C to +95˚C
2GB
x64
4, 8, 16
Green
1.35–1.5V
1333– 1866 MT/s
Single, Dual
0˚C to +95˚C
1600– 1866 MT/s
Single, Dual
0˚C to +95˚C
4GB
x64
8, 16
Green
1.35V
and RS
8GB
x64
16
Green
1.35–1.5V
and RS
1600–1866 MT/s
Dual
0˚C to +95˚C
x64
16
Green
1.35V
1866 MT/s
Dual
0˚C to +95˚C
DDR4 SDRAM 288-pin RDIMM
4GB
x72
9
Green
1.2V
2133 MT/s
Single
0˚C to +95˚C
8GB
x72
18
Green
1.2V
2133 MT/s
Single, Dual
0˚C to +95˚C
16GB
16GB
x72
36
Green
1.2V
2133 MT/s
Dual
0˚C to +95˚C
DDR3 SDRAM 204-pin ECC SODIMM
DDR4 SDRAM 288-pin VLP RDIMM
4GB
x72
18
Green
1.35 V
1333–1600 MT/s
Dual
0˚C to +95˚C
x72
18
Green
1.35V
1333–1600 MT/s
Dual
0˚C to +95˚C
1.35 V
1600 MT/s
Quad
0˚C to +95˚C
4GB
x72
18
Green
1.2V
2133 MT/s
Single
0˚C to +95˚C
8GB
8GB
x72
36
Green
1.2V
2133 MT/s
Dual
0˚C to +95˚C
DDR3 SDRAM 200-pin SORDIMM
16GB
12
Bus Width
Yes,
Green
Density
your innovation. our memory.
Density
x72
36
Green
13
Density
Bus Width
Component
Count
RoHS
Voltage
Data Rate
Module Ranks
Temp Range
Component
Count
RoHS
Voltage
Data Rate
Module Ranks
Temp Range
Yes
1.8V
667 MT/s
Single
0˚C to +85˚C
9
Green
1.5V
1333 MT/s
Single
0˚C to +95˚C
512MB
x72
x72
9, 18
Green
1.35 –1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C
1GB
x72
9, 18
Yes
1.8V
667– 800 MT/s
Single, Dual
0˚C to +85˚C
x72
9, 18, 36
Green
1.35–1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C
2GB
x72
18, 36
Yes, Green
1.8V
667– 800 MT/s
Single, Dual
0˚C to +85˚C
8GB
x72
18, 36
Green
1.35 –1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C
4GB
x72
18, 36
Yes
1.8V
667– 800 MT/s
Dual
0˚C to +85˚C
16GB
x72
18, 36
Green
1.35 –1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C
8GB
x72
36, 72
Yes
1.8V
667– 800 MT/s
Dual, Quad
0˚C to +85˚C
32GB
x72
36, 72
Green
1.35 –1.5V
1066–1866 MT/s
Dual, Quad
0˚C to +95˚C
DDR2 SDRAM 240-pin VLP RDIMM
512MB
x72
9
Yes
1.8V
667 MT/s
Single
0˚C to +85˚C
1.35–1.5V
1333–1600 MT/s
Single, Dual
0˚C to +95˚C
1GB
x72
9
Yes
1.8V
667– 800 MT/s
Single
0˚C to +85˚C
1GB
x72
2GB
4GB
DDR3 SDRAM 240-pin VLP RDIMM
9
x72
9, 18
Green
4GB
x72
18
Green
1.35–1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C, –40˚C to +95˚C
2GB
x72
18
Yes
1.8V
667– 800 MT/s
Single, Dual
0˚C to +85˚C
8GB
x72
18
Green
1.35 –1.5V
1333–1866 MT/s
Single, Dual
0˚C to +95˚C
4GB
x72
18, 36
Yes
1.8V
667– 800 MT/s
Dual
0˚C to +85˚C
16GB
x72
36
Green
1.35–1.5V
1333–1866 MT/s
Dual, Quad
0˚C to +95˚C
DDR2 SDRAM 240-pin FBDIMM
1GB
x72
9
Yes
1.8V
667– 800 MT/s
Single
0˚C to +95˚C
16GB
x72
36
Green
1.35V
1600 MT/s
Quad
0˚C to +95˚C
2GB
x72
18
Yes
1.8V
667– 800 MT/s
Dual
0˚C to +95˚C
32GB
x72
72
Green
1.35V–1.5V
1333–1866 MT/s
Quad
0˚C to +95˚C
4GB
x72
36
Yes
1.8V
667– 800 MT/s
Dual, Quad
0˚C to +95˚C
8GB
x72
36, 72
Yes
1.8V
667– 800 MT/s
Dual, Quad
0˚C to +95˚C
DDR3 SDRAM 244-pin Mini-RDIMM
4GB
x72
18
Green
1.5V
1333 MT/s
Dual
0˚C to +95˚C
8GB
x72
18
Green
1.35V
1333 MT/s
Dual
–40˚C to +95˚C
DDR3 SDRAM 244-pin VLP Mini-RDIMM
4GB
x72
9
Green
1.35 V
1333 MT/s
Single
–40˚C to +95˚C
8GB
x72
18
Green
1.35V
1333 MT/s
Dual
0˚C to +95˚C, –40˚C to +95˚C
DDR2 SDRAM 240-pin UDIMM
512MB
x64
4
Yes
1.8V
800 MT/s
Single
0˚C to +85˚C
1GB
x64
8
Green
1.8V
800 MT/s
Single
0˚C to +85˚C
2GB
x64
16
Yes
1.8V
800 MT/s
Dual
0˚C to +85˚C
DDR2 SDRAM 240-pin ECC UDIMM
DDR2 SDRAM 244-pin Mini-RDIMM
512MB
x72
9
Yes
1.8V
667 MT/s
Single
0˚C to +85˚C
1GB
x72
9
Yes
1.8V
800 MT/s
Single
0˚C to +85˚C
2GB
x72
18
Yes, Green
1.8V
800 MT/s
Dual
0˚C to +85˚C
DDR2 SDRAM 244-pin VLP Mini-RDIMM
512MB
x72
9
Yes
1.8V
667 MT/s
Single
0˚C to +85˚C
1GB
x72
9
Yes
1.8V
800 MT/s
Single
0˚C to +85˚C
2GB
x72
18
Yes
1.8V
800 MT/s
Dual
0˚C to +85˚C
4GB
x72
18
Yes
1.8V
667 MT/s
Dual
0˚C to +85˚C
Yes
2.5V
400 MT/s
Single
0˚C to +70˚C
DDR SDRAM 100-pin UDIMM
512MB
x32
8
1GB
x72
9
Yes
1.8V
667 – 800 MT/s
Single
0˚C to +85˚C
2GB
x72
9, 18
Yes
1.8V
667 – 800 MT/s
Single, Dual
0˚C to +85˚C
DDR SDRAM 168-pin UDIMM
4GB
x72
18
Yes
1.8V
667 MT/s
Dual
0˚C to +85˚C
64MB
x64
4
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
128MB
x64
4
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
256MB
x64
8, 16
Yes
3.3V
133 MHz
Single, Dual
0˚C to +70˚C
4
Yes
2.5V
400 MT/s
Single
0˚C to +70˚C
DDR2 SDRAM 200-pin SODIMM
256MB
x64
4
Yes
1.8V
667– 800 MT/s
Single
0˚C to +85˚C
512MB
x64
4, 8
Yes, Green
1.8V
667– 800 MT/s
Single, Dual
0˚C to +85˚C
1GB
x64
8, 16
Yes, Green
1.8V
667– 800 MT/s
Single, Dual
0˚C to +85˚C, –40˚C to 95˚C
256MB
x64
2GB
x64
8, 16
Yes
1.8V
667– 800 MT/s
Single, Dual
0˚C to +85˚C, –40˚C to 95˚C
512MB
x64
8
Yes
2.5V
400 MT/s
Single
0˚C to +70˚C
4GB
x64
16
Yes
1.8V
800 MT/s
Dual
0˚C to +85˚C
1GB
x64
16
Yes
2.5V
400 MT/s
Dual
0˚C to +70˚C
x72
1GB
2GB
DDR SDRAM 184-pin UDIMM
DDR SDRAM 168-pin ECC UDIMM
DDR2 SDRAM 200-pin SORDIMM
512MB
Modules
2GB
DDR3 SDRAM 240-pin LRDIMM
your innovation. our memory.
Bus Width
DDR2 SDRAM 240-pin RDIMM
DDR3 SDRAM 240-pin RDIMM
14
Density
9
Yes
1.8V
667 MT/s
Single
0˚C to +85˚C
128MB
x72
9
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
x72
9
Yes
1.8V
667– 800 MT/s
Single
0˚C to +85˚C
256MB
x72
18
Yes
3.3V
133 MHz
Dual
0˚C to +70˚C
x72
18
Yes
1.8V
800 MT/s
Dual
0˚C to +85˚C
15
Density
Bus Width
Component
Count
RoHS
Voltage
Data Rate
Module Ranks
Temp Range
DDR SDRAM 184-pin ECC UDIMM
Density
Bus Width
Component
Count
RoHS
Voltage
Clock Rate
Module Ranks
Temp Range
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
SDRAM 144-pin SODIMM
512MB
x64
9
Yes
2.5V
400 MT/s
Single
0˚C to +70˚C
64MB
x64
4
1GB
x64
18
Yes
2.5V
400 MT/s
Dual
0˚C to +70˚C
128MB
x64
4, 8
Yes
3.3V
133 MHz
Single, Dual
0˚C to +70˚C
256MB
x64
8
Yes, 5/6
3.3V
133 MHz
Dual
0˚C to +70˚C
512MB
x64
16
Yes
3.3V
133 MHz
Dual
0˚C to +70˚C
DDR SDRAM 144-pin SODIMM
64MB
x64
4
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
128MB
x64
4, 8
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
SDRAM 168-pin RDIMM
256MB
x64
8
Yes
3.3V
133 MHz
Single, Dual
0˚C to +70˚C
128MB
x72
9
Yes, 5/6
3.3V
133 MHz
Single
0˚C to +70˚C
512MB
x64
16
Yes
3.3V
133 MHz
Dual
0˚C to +70˚C
256MB
x72
9
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
512MB
x72
18
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
DDR SDRAM 200-pin SODIMM
x64
4
Yes
2.5V
333 MT/s
Single
0˚C to +70˚C
256MB
x64
4
Yes
2.5V
512MB
x64
8
Yes
2.5V
333– 400 MT/s
Single
0˚C to +70˚C, –40˚C to +95˚C
333– 400 MT/s
Single, Dual
0˚C to +70˚C
1GB
x64
16
Yes
2.5V
400 MT/s
Dual
0˚C to +70˚C
DDR SDRAM 200-pin ECC SODIMM
256MB
x72
9
Yes
2.5V
333 MT/s
Single
0˚C to +70˚C, –40˚C to +95˚C
512MB
x72
9
Yes
2.5V
333– 400 MT/s
Single
0˚C to +70˚C
1GB
x72
18
Yes
2.5V
333– 400 MT/s
Dual
0˚C to +70˚C
9
Yes
2.5V
400 MT/s
Single
0˚C to +70˚C
Modules
128MB
Hybrid Memory
Cube (HMC)
DDR SDRAM 184-pin RDIMM
Package Description
15G SR
x4
160
896-ball BGA, 31mm x 31mm x 4mm
15G SR
x4
160
896-ball BGA, 31mm x 31mm x 4mm
2GB
15G SR
x2
120
666-ball FBGA, 16mm x19.5mm x 3.9mm
4GB
15G SR
x2
120
666-ball FBGA, 16mm x19.5mm x 3.9mm
512MB
x72
9
Yes
2.5V
333– 400 MT/s
Single
0˚C to +70˚C
1GB
x72
18
Yes
2.5V
333– 400 MT/s
Single, Dual
0˚C to +70˚C
Hybrid Memory Cube
2GB
x72
36
Yes
2.5V
400 MT/s
Dual
0˚C to +70˚C
2GB
4GB
0˚C to +70˚C
512MB
1GB
Density
x72
9
Yes
2.5V
400 MT/s
Single
x72
18
Yes
2.5V
333 MT/s
Dual
0˚C to +70˚C
Bus Width
Component
Count
RoHS
Voltage
Clock Rate
Module Ranks
Temp Range
SDRAM 168-pin UDIMM
64MB
x64
4
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
128MB
x64
4
Yes, 5/6
3.3V
133 MHz
Single
0˚C to +70˚C
256MB
x64
8, 16
Yes
3.3V
133 MHz
Single, Dual
0˚C to +70˚C
SDRAM 168-pin ECC UDIMM
128MB
x72
9
Yes
3.3V
133 MHz
Single
0˚C to +70˚C
256MB
x72
18
Yes
3.3V
133 MHz
Dual
0˚C to +70˚C
Bare Die and
Wafer-Level Products
Bare Die
your innovation. our memory.
MAX Effective BW
(GB/s)
Density
HMC
Links
x72
DDR SDRAM 184-pin VLP RDIMM
16
Link Description
(Gb/s)
256MB
Requirements for increasingly smaller form factors and higher memory densities are
fueling the need for an array of bare die memory solutions. Our bare die offerings
are designed to enable you to choose the wafer-level products that best meet your
project’s needs. And we’re committed to delivering bare die products that maintain
reliability and quality levels similar to our fully tested and burned-in packaged devices.
Find out more at micron.com/baredie.
17
NAND Flash
Bus
Width
Voltage
Interface
Package
Temp Range
MT29 SLC NAND Flash*
Voltage
Technology
JEDEC
Package
Temp Range
Applications
x8, x16
1.8, 3.3V
Async (ONFI 1.0)
48-pin TSOP, 63-ball VFBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
2Gb
x8, x16
1.8, 3.3V
Async (ONFI 1.0)
48-pin TSOP, 63-ball VFBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
4Gb
x8, x16
1.8, 3.3V
Async (ONFI 1.0)
48-pin TSOP, 63-ball VFBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
8Gb
x8, x16
1.8, 3.3V
Async (ONFI 1.0)/
Sync (ONFI 2.1)
48-pin TSOP, 63-ball VFBGA,
100-ball VBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
48-pin TSOP, 63-ball VFBGA,
100-ball VBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
16Gb
x8, x16
1.8, 3.3V
Async/Sync
(ONFI 2.1/2.2)
32Gb
x8
3.3V
Async/Sync
(ONFI 2.1/2.2/3.0)
48-pin TSOP, 100-ball VBGA, 132-ball VBGA
0˚C to +70˚C, –40˚C to +85˚C
64Gb
x8
3.3V
Async/Sync
(ONFI 2.1/2.2/3.0)
48-pin TSOP, 100-ball VBGA, 100-ball TBGA,
132-ball VBGA, 152-ball VBGA
0˚C to +70˚C, –40˚C to +85˚C
128Gb
x8
3.3V
Async/Sync
(ONFI 2.1/2.2/3.0)
48-pin TSOP, 100-ball TBGA, 100-ball LBGA,
132-ball TBGA, 152-ball VBGA
0˚C to +70˚C, –40˚C to +85˚C
256Gb
x8
3.3V
Async/Sync (ONFI 2.2/3.0)
100-, 132-ball LBGA, 152-ball TBGA
0˚C to +70˚C, –40˚C to +85˚C
512Gb
x8
3.3V
Async/Sync (ONFI 3.0)
152-ball LBGA
0˚C to +70˚C, –40˚C to +85˚C
128Mb
x8
3.3V
Async
48-pin TSOP
–40˚C to +85˚C
256Mb
x8
3.3V
Async
48-pin TSOP, 55-ball VFBGA
–40˚C to +85˚C
512Mb
x8
1.8, 3.3V
Async
48-pin TSOP, 63-ball VFBGA
–40˚C to +85˚C
2GB
x8
3.3VCC
(3.3V/1.8V VCCQ)
25nm MLC
4.41
153-ball WFBGA
–25˚C to +85˚C
Consumer
4GB
x8
3.3VCC
(3.3V/1.8V VCCQ)
25nm MLC/
20nm MLC
4.41,
4.51
100-ball LBGA, 153-ball TFBGA,
153-ball WFBGA
–25˚C to +85˚C,
–40˚C to +85˚C
Consumer, Industrial,
Automotive
8GB
x8
3.3VCC
(3.3V/1.8V VCCQ)
25nm MLC/
20nm MLC
4.41,
4.51,
5.0
100-ball LBGA, 153-ball TFBGA,
153-ball WFBGA
–25˚C to +85˚C,
–40˚C to +85˚C
Consumer, Industrial,
Automotive
16GB
x8
3.3VCC
(3.3V/1.8V VCCQ)
25nm MLC/
20nm MLC
4.41,
4.51,
5.0
100-ball LBGA, 169-ball TFBGA,
169-ball WFBGA
–25˚C to +85˚C,
–40˚C to +85˚C
Consumer, Industrial,
Automotive
32GB
x8
3.3VCC
(3.3V/1.8V VCCQ)
25nm MLC/
20nm MLC
4.41,
4.51,
5.0
100-ball LBGA, 169-ball TFBGA,
169-ball VFBGA
–25˚C to +85˚C,
–40˚C to +85˚C
Consumer, Industrial,
Automotive
64GB
x8
3.3VCC
(3.3V/1.8V VCCQ)
25nm MLC/
20nm MLC
4.41,
4.51,
5.0
169-ball LBGA/LFBGA
–25˚C to +85˚C,
–40˚C to +85˚C
Consumer, Industrial,
Automotive
Note: Products meet RoHS standards. Enhanced SLC partition up to 100% of the user area.
Density
Package
RoHS
Voltage
Interface
Temp Range
MTED and MTFD Embedded USBs
2GB
eUSB
Yes
5V, 3.3V
USB 2.0
0˚C to +70˚C, –40˚C to +85˚C
16Gb
x8
3.3V
Async/Sync (ONFI 2.2)
48-pin TSOP, Wafer
0˚C to +70˚C, –40˚C to +85˚C
4GB
eUSB
Yes
5V, 3.3V
USB 2.0
0˚C to +70˚C, –40˚C to +85˚C
32Gb
x8
3.3V
Async/Sync (ONFI 2.2/2.3)
48-pin TSOP, 100-ball VBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
8GB
eUSB
Yes
5V, 3.3V
USB 2.0
0˚C to +70˚C, –40˚C to +85˚C
64Gb
x8
3.3V
Async/Sync (ONFI 2.2/2.3)
48-pin TSOP, 100-ball VBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
16GB
eUSB
Yes
5V, 3.3V
USB 2.0
0˚C to +70˚C, –40˚C to +85˚C
48-pin TSOP, 100-ball LBGA, 100-ball TBGA,
132-ball TBGA, 152-ball VBGA, Wafer
0˚C to +70˚C, –40˚C to +85˚C
RoHS
Voltage
128Gb
x8
3.3V
Async/Sync
(ONFI 2.2/2.3/3.0)
196Gb
x8
3.3V
Async/Sync (ONFI 3.2)
272-ball VFBGA
0˚C to +70˚C
48-pin TSOP, 100-ball LBGA, 100-ball TBGA,
132-ball TBGA, 152-ball VBGA
0˚C to +70˚C, –40˚C to +85˚C
256Gb
x8
3.3V
Async/Sync
(ONFI 2.2/2.3/3.0)
512Gb
x8
3.3V
Async/Sync (ONFI 2.2/3.2)
132-ball LBGA, 152-ball TBGA, 272-ball TFBGA
0˚C to +70˚C, –40˚C to +85˚C
1Tb
x8
3.3V
Async/Sync (ONFI 3.2)
152-ball LBGA, 272-ball TFBGA/LFBGA
0˚C to +70˚C, –40˚C to +85˚C
2Tb
x8
3.3V
Async/Sync (ONFI 3.2)
152-ball LBGA, 272-ball LFBGA
0˚C to +70˚C
Density
Bus Width
Voltage
Technology
Package
Temp Range
Managed
NAND
1Gb
MT29 MLC NAND Flash*
your innovation. our memory.
Bus
Width
MTFC e •MMC Memory for Embedded
NAND Small Page (SP) Flash*
18
Density
NAND
Density
Managed NAND
Density
Bus Width
Bits/Cell
Package
Temp Range
MT29 Enhanced ClearNAND Flash Memory
32GB
x8
Yes
3.3V
MLC
100-ball LBGA
0˚C to +70˚C
64GB
x8
Yes
3.3V
MLC
100-ball LBGA
0˚C to +70˚C
MT29 Serial NAND Flash*
1Gb
x1
3.3V
SLC
63-ball VFBGA
0˚C to +70˚C, –40˚C to +85˚C
2Gb
x1
3.3V
SLC
63-ball VFBGA
0˚C to +70˚C, –40˚C to +85˚C
4Gb
x1
3.3V
SLC
63-ball VFBGA
0˚C to +70˚C, –40˚C to +85˚C
*Products meet RoHS standards.
19
Density
NOR Flash
Density
Bus Width
RoHS
Voltage
1Gb
x16
x16
Yes
Yes
2.7–3.6V
2.7–3.6V
Speed
Package
Boot Block
Temp Range
110ns,
100ns
110ns,
100ns
56-pin TSOP,
64-ball BGA
56-pin TSOP,
64-ball BGA
High/Low Lock
High/Low Lock
–40˚C to +85˚C
–40˚C to +85˚C
M29DW Parallel NOR Flash Automotive
Speed
Package
Boot Block
Temp Range
16Mb
x32
Yes, No
2.7–3.6V
45ns, 55ns,
70ns
80-ball LBGA,
80-pin PQFP
Bottom Boot
–40˚C to +125˚C
32Mb
x32
Yes, No
2.7–3.6V
45ns, 55ns
80-ball LBGA,
80-pin PQFP
Bottom Boot
–40˚C to +125˚C
Note: Available in tape and reel.
32Mb
x16
Yes
1.7–2.0V
70ns
56-ball VFBGA
Bottom Boot
–40˚C to +85˚C
64Mb
x16
Yes
1.7–2.0V
70ns
56-ball VFBGA
Bottom/Top Boot
–40˚C to +85˚C
64-ball TBGA
Uniform, A/D MUX
–40˚C to +105˚C
64-ball TBGA
Uniform, A/D MUX
–40˚C to +105˚C
64-ball TBGA
Uniform, A/D MUX
–40˚C to +105˚C
64-ball Easy BGA
Uniform,
AD, AA/D MUX
–40˚C to +85˚C
64-ball Easy BGA
Uniform,
AD, AA/D MUX
–40˚C to +85˚C
64-ball Easy BGA
Uniform,
AD, AA/D MUX
–40˚C to +85˚C
Note: Available in tray or tape and reel.
G18 Parallel NOR Flash Automotive
256Mb
x16
Yes
1.7–2.0V
32Mb
x8/x16
Yes
2.7–3.6V
70ns
48-pin TSOP
Multibank
–40˚C to +85˚C,
–40˚C to +125˚C
512Mb
x16
Yes
1.7–2.0V
256Mb
x16
Yes
2.7–3.6V
70ns
56-pin TSOP
Multibank
–40˚C to +85˚C,
–40˚C to +125˚C
1Gb
x16
Yes
1.7–2.0V
Note: Available in tray or tape and reel.
Note: Available in tray or tape and reel.
M29F Parallel NOR Flash Automotive
G18 Parallel NOR Flash Embedded
x8/x16
Yes
4.5–5.5V
55ns
44-pin SOIC,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
256Mb
x16
Yes
1.7–2.0V
4Mb
x8/x16
Yes, No
4.5–5.5V
55ns
44-pin SOIC,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
512Mb
x16
Yes
1.7–2.0V
8Mb
x8/x16
Yes
4.5–5.5V
55ns
44-pin SOIC,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
1Gb
x16
Yes
1.7–2.0V
16Mb
x8/x16
Yes
4.5–5.5V
55ns
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
M29W Parallel NOR Flash Automotive
104ns,
133 MHz/Sync
104ns,
133 MHz/Sync
104ns,
133 MHz/Sync
96ns,
133 MHz/Sync
96ns,
133 MHz/Sync
96ns,
133 MHz/Sync
Note: Available in tray or tape and reel. Also available in AD and AA/D MUX configurations for up to 50%-reduced active ball count.
J3 Parallel NOR Flash Embedded
32Mb
x8/x16
Yes
2.7–3.6V
75ns
56-pin TSOP,
64-ball Easy BGA
Uniform,
In-Sys Pgm
–40˚C to +85˚C
4Mb
x8/x16
Yes
2.7–3.6V
55ns
48-pin TSOP,
48-ball TFBGA
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
64Mb
x8/x16
Yes, No
2.7–3.6V
75ns
56-pin TSOP,
64-ball Easy BGA
Uniform,
In-Sys Pgm
–40˚C to +85˚C
8Mb
x8/x16
Yes
2.7–3.6V
70ns
48-pin TSOP,
48-ball TFBGA
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
128Mb
x8/x16
Yes, No
2.7–3.6V
75ns
56-pin TSOP,
64-ball Easy BGA
Uniform,
In-Sys Pgm
–40˚C to +85˚C
16Mb
x8/x16
Yes
2.7–3.6V
70ns, 80ns
48-pin TSOP,
48-ball TFBGA
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
256Mb
x8/x16
Yes, No
2.7–3.6V
95ns, 105ns
56-pin TSOP,
64-ball Easy BGA
Uniform
–40˚C to +85˚C
32Mb
x8/x16
Yes
2.7–3.6V
70ns, 80ns
48-pin TSOP,
48-ball TFBGA
Bottom/Top Boot
–40˚C to +85˚C,
–40˚C to +125˚C
M28W Parallel NOR Flash Embedded
x8/x16
Yes
2.7–3.6V
60ns, 70ns
48-, 56-pin TSOP,
48-ball TFBGA,
64-ball TBGA
Bottom/Top Boot,
High/Low Lock
–40˚C to +85˚C,
–40˚C to +125˚C
16Mb
x16
Yes
2.7–3.6V
70ns
48-pin TSOP,
46-ball TFBGA
Bottom/Top Boot
64Mb
–40˚C to +85˚C
32Mb
x16
Yes
2.7–3.6V
70ns
Bottom/Top Boot
–40˚C to +85˚C
High/Low Lock
–40˚C to +85˚C,
–40˚C to +125˚C
48-pin TSOP,
47-ball TFBGA
64Mb
x16
Yes
2.7–3.6V
70ns
48-pin TSOP,
48-ball TFBGA
Bottom/Top Boot
–40˚C to +85˚C
128Mb
x8/x16
Yes
2.7–3.6V
70ns
56-pin TSOP,
64-ball FBGA,
64-ball TBGA
256Mb
x8/x16
Yes
2.7–3.6V
70ns
56-pin TSOP,
64-ball FBGA
High/Low Lock
–40˚C to +85˚C,
–40˚C to +125˚C
512Mb
x8/x16
Yes
2.7–3.6V
70ns
56-pin TSOP
Low Lock
–40˚C to +85˚C,
–40˚C to +125˚C
NOR
2Mb
Note: Available in tray or tape and reel.
your innovation. our memory.
Voltage
M58WR Parallel NOR Flash Automotive
Note: Available in tape and reel.
20
RoHS
M58BW Parallel NOR Flash Automotive
M29AW Parallel NOR Flash Automotive
512Mb
Bus Width
Notes: Available in tray or tape and reel. Features: Hardware write protection, OTP space, OTP SD, Krypto® Flex Lock, Krypto Encrypted Access SD.
Note: Available in tray or tape and reel.
21
Density
Bus Width
RoHS
Voltage
Speed
Package
Boot Block
Temp Range
M29DW Parallel NOR Flash Embedded
32Mb
x8/x16
Yes
2.7–3.6V
Density
Bus Width
RoHS
Voltage
Speed
Package
Boot Block
Temp Range
P30 Parallel NOR Flash Embedded (continued)
70ns
48-pin TSOP,
48-ball-TFBGA
Multibank
–40˚C to +85˚C
Multibank
–40˚C to +85˚C
Multibank
–40˚C to +85˚C
128Mb
x8/x16, x16
Yes
2.7–3.6V
60ns, 70ns
64-ball TBGA,
56-pin TSOP
256Mb
x16
Yes
2.7–3.6V
70ns
56-pin TSOP
M29EW Parallel NOR Flash Embedded
64Mb
x8/x16
Yes
2.7–3.6V
60ns, 70ns
48-, 56-pin TSOP,
64-ball FBGA,
48-ball BGA
128Mb
x8/x16
Yes
2.7–3.6V
60ns, 70ns
56-pin TSOP,
64-ball FBGA
High/Low Lock,
Secure
256Mb
x8/x16
Yes
2.7–3.6V
100ns,
110ns
56-pin TSOP,
64-ball FBGA
512Mb
x8/x16
Yes
2.7–3.6V
100ns,
110ns
1Gb
x8/x16
Yes
2.7–3.6V
2Gb
x8/x16
Yes
2.7–3.6V
512Mb
x16
Yes
1.7–3.6V
100ns, 110ns
56-pin TSOP,
64-ball Easy BGA,
88-ball Quad+ BGA
Bottom/Top Boot,
Uniform
–40˚C to +85˚C
1Gb
x16
Yes
1.7–2.0V
100ns, 110ns
56-pin TSOP,
64-ball Easy BGA
Bottom/Top Boot,
Uniform
–40˚C to +85˚C
2Gb
x16
Yes
1.7–3.6V
105ns
64-ball Easy BGA
Uniform
–40˚C to +85˚C
P33 Parallel NOR Flash Embedded
Bottom/Top Boot,
High/Low Lock,
Secure
–40˚C to +85˚C
64Mb
x16
Yes
2.3–3.6V
60ns, 70ns
56-pin TSOP,
64-ball Easy BGA
Bottom/Top Boot
–40˚C to +85˚C
–40˚C to +85˚C
128Mb
x16
Yes
2.3–3.6V
60ns, 70ns
56-pin TSOP,
64-ball Easy BGA
Bottom/Top Boot,
OTP
–40˚C to +85˚C
High/Low Lock,
Secure
–40˚C to +85˚C
256Mb
x16
Yes, No
2.3–3.6V
85ns, 95ns
56-pin TSOP,
64-ball Easy BGA
Bottom/Top Boot,
OTP
–40˚C to +85˚C
56-pin TSOP,
64-ball FBGA
High/Low Lock,
Secure
–40˚C to +85˚C
512Mb
x16
Yes
2.3–3.6V
95ns, 105ns
56-pin TSOP,
64-ball FBGA
High/Low Lock,
Secure
Bottom/Top Boot,
Uniform, OTP
–40˚C to +85˚C
100ns,
110ns
56-pin TSOP,
64-ball Easy BGA
–40˚C to +85˚C
100ns
64-ball FBGA
High/Low Lock
–40˚C to +85˚C
1Gb
x16
Yes
2.3–3.6V
95ns, 105ns
56-pin TSOP,
64-ball Easy BGA
Bottom/Top Boot,
Uniform
–40˚C to +85˚C
Bus Width
RoHS
M29W Parallel NOR Flash Embedded
x8/x16
Yes
2.7–3.6V
55ns, 70ns
48-ball TFBGA,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C
8Mb
x8/x16
Yes
2.7–3.6V
45ns, 70ns
48-ball TFBGA,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C
M25P Serial NOR Flash Automotive (Legacy)
16Mb
x8/x16
Yes
2.7–3.6V
70ns
48-ball TFBGA,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C
1Mb
x1
Yes
2.3–3.6V
32Mb
x8/x16
Yes
2.7–3.6V
70ns
48-ball TFBGA,
48-pin TSOP
Bottom/Top Boot
–40˚C to +85˚C
2Mb
x1
Yes
Bottom/Top Boot,
High/Low Lock,
Secure
4Mb
x1
70ns
64-ball FBGA,
48-ball TFBGA,
48-, 56-pin TSOP,
64-ball TBGA
8Mb
64-ball FBGA,
64-pin LBGA
64-ball TBGA,
56-pin TSOP
High/Low Lock,
Secure
–40˚C to +85˚C
64-ball FBGA,
64-ball TBGA,
56-pin TSOP
High/Low Lock
–40˚C to +85˚C
your innovation. our memory.
64Mb
22
128Mb
256Mb
x8/x16
x8/x16
x8/x16
Yes
Yes
Yes
2.7–3.6V
2.7–3.6V
2.7–3.6V
70ns
70ns
Density
Voltage
Speed
Package
Type
Temp Range
50 MHz
8-pin SOP2 Narrow,
8-pin U-PDFN
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
2.7–3.6V
75 MHz
8-pin SOP2 Narrow
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
Yes
2.3–3.6V
75 MHz
8-pin SOP2 Narrow,
8-pin U-PDFN
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
x1
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Narrow,
8-pin SOP2 Wide
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
16Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Narrow,
8-pin SOP2 Wide
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
32Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Wide,
16-pin SOP2
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
64Mb
x1
Yes
2.7–3.6V
75 MHz
16-pin SOP2
Data Storage
–40˚C to +85˚C,
–40˚C to +125˚C
–40˚C to +85˚C
NOR
4Mb
Note: Available in tray, tube, or tape and reel.
P30 Parallel NOR Flash Embedded
M25PE Serial NOR Flash Automotive (Page Erase)
64Mb
x16
Yes
1.7–2.0V
65ns, 75ns
56-pin TSOP,
64-ball Easy BGA
Bottom/Top Boot
–40˚C to +85˚C
4Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Narrow
Page Erase
–40˚C to +85˚C
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Narrow
Page Erase
–40˚C to +85˚C
Yes, No
1.7–2.0V
65ns, 75ns
Bottom/Top Boot,
OTP
x1
x16
56-pin TSOP,
64-ball Easy BGA,
88-ball Quad+ BGA
8Mb
128Mb
–40˚C to +85˚C
Note: Available in tape and reel.
256Mb
x16
Yes, No
1.7–2.0V
100ns, 110ns
56-pin TSOP,
64-ball Easy BGA,
88-ball Quad+ BGA
Bottom/Top Boot
–40˚C to +85˚C
(P30 Parallel NOR Flash Embedded continued on next page)
23
Density
Bus Width
RoHS
Voltage
Speed
Package
Type
Temp Range
Density
Bus Width
RoHS
Voltage
Speed
Temp Range
64Mb**
x1
Yes
2.7–3.6V
75 MHz
16-pin SO16 Wide, 8-pin V-PDFN (8x6)
Data Storage
–40˚C to +85˚C
128Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin V-PDFN (8x6), 16-pin SO16 Wide
Data Storage
–40˚C to +85˚C
8Mb
x1/x2
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Narrow
Dual I/O
–40˚C to +85˚C,
–40˚C to +125˚C
16Mb
x1/x2
Yes
2.7–3.6V
75 MHz
8-pin SOP2 Narrow
Dual I/O
–40˚C to +85˚C
Note: Available in tray, tube, or tape and reel. *N25Q032 suggested for new design. **N25Q064 suggested for new design.
32Mb
x1/x2
Yes
2.7–3.6V
75 MHz
8-pin V-PDFN-8,
24-ball T-PBGA-24b05
Dual I/O
–40˚C to +85˚C
M25PE Serial NOR Flash Embedded
Note: Available in tube or tape and reel.
1Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow, KGD
Page Erase
–40˚C to +85˚C
N25Q Serial NOR Flash Automotive (Multiple I/O)
2Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow, KGD
Page Erase
–40˚C to +85˚C
4Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow, 8-pin V-PDFN (6x5),
KGD
Page Erase
–40˚C to +85˚C
8Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow, 8-pin SO8 Wide,
8-pin V-PDFN (6x5)
Page Erase
–40˚C to +85˚C
16Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Wide, 8-pin V-PDFN (6x5)
Page Erase
–40˚C to +85˚C
75 MHz
8-pin SO8 Narrow,
8-pin SO8 Wide,
8-pin V-PDFN (6x5)
Dual I/O
–40˚C to +85˚C
Dual I/O
–40˚C to +85˚C
32Mb
32Mb
x1/x2/x4
Yes
x1/x2/x4
Yes
2.7–3.6V
1.7–2.0V
8-pin SP2 Narrow,
16-pin SOP2 Wide,
16-pin SOP2
Multi I/O
108 MHz
8-pin SOP2 Wide
Multi I/O
–40˚C to +125˚C
Multi I/O
–40˚C to +85˚C,
–40˚C to +125˚C
108 MHz
–40˚C to +85˚C,
–40˚C to +125˚C
64Mb
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
8-pin V-PDFN-8,
8-pin SOP2 Wide,
16-pin SOP2 Wide,
24-ball T-PBGA-24b05
128Mb
x1/x2/x4
Yes
2.7–3.6V
108 MHz
8-pin V-PDFN-8,
16-pin SOP2,
24-ball T-PBGA-24b05
Multi I/O
–40˚C to +85˚C,
–40˚C to +105˚C,
–40˚C to +125˚C
256Mb
x1/x2/x4
Yes
2.7–3.6V
108 MHz
8-pin V-PDFN-8,
16-pin SOP2,
24-ball T-PBGA-24b05
Multi I/O
–40˚C to +85˚C,
–40˚C to +125˚C
16Mb
x1/x2
Yes
2.3–3.6V
75 MHz
512Mb
x1/x2/x4
Yes
2.7–3.6V
108 MHz
16-pin SOP2,
24-ball T-PBGA-24b05
Multi I/O
–40˚C to +85˚C,
–40˚C to +125˚C
8-pin SO8 Narrow,
8-pin SO8 Wide,
8-pin V-PDFN (6x5),
24-ball T-PBGA, KGD
32Mb*
x1/x2
Yes
2.7–3.6V
75 MHz
8-pin SO8 Wide, 16-pin SO16 Wide,
8-pin V-PDFN (6x5), 24-ball T-PBGA
Dual I/O
–40˚C to +85˚C
64Mb**
x1/x2
Yes
2.7–3.6V
75 MHz
8-pin V-PDFN (8x6),
16-pin SO16 Wide
Dual I/O
–40˚C to +85˚C
Note: Available in tray, tube, or tape and reel.
M25PX Serial NOR Flash Embedded
8Mb
x1/x2
Yes
2.3–3.6V
Note: Available in tape and reel.
256Mb
x1/x2/x4/x8
Yes
2.7–3.6V
108 MHz
16-pin SOP2
Dual QSPI
–40˚C to +105˚C
512Mb
x1/x2/x4/x8
Yes
2.7–3.6V
108 MHz
16-pin SOP2
Dual QSPI
–40˚C to +105˚C
Note: Available in tube or tape and reel. Available in 1S#/1CLK or 2S#/2CLK configuration, with or without HW RESET#.
Density
Bus Width
RoHS
Voltage
Speed
Package
Type
Temp Range
50 MHz
8-pin SO8 Narrow
Data Storage
–40˚C to +85˚C
50 MHz
8-pin U-PDFN (2x3), 8-pin SO8 Narrow,
8-pin V-PDFN (6x5), KGD
Data Storage
–40˚C to +85˚C
Data Storage
–40˚C to +85˚C
Note: Available in tray, tube, or tape and reel. *N25Q032 suggested for new design. **N25Q064 suggested for new design.
M45PE Serial NOR Flash Embedded
1Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow
Page Erase
–40˚C to +85˚C
2Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow
Page Erase
–40˚C to +85˚C
4Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow,
8-pin SO8 Wide,
8-pin V-PDFN (6x5)
Page Erase
–40˚C to +85˚C
8Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow,
8-pin SO8 Wide,
8-pin V-PDFN (6x5)
Page Erase
–40˚C to +85˚C
16Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin V-PDFN (6x5),
8-pin SO8 Wide
Page Erase
–40˚C to +85˚C
M25P Serial NOR Flash Embedded
512K
1Mb
x1
x1
Yes
Yes
2.3–3.6V
2.3–3.6V
2Mb
x1
Yes
2.3–3.6V
75 MHz
8-pin V-PDFN (6x5), 8-pin SO8 Narrow,
KGD
4Mb
x1
Yes
2.3–3.6V
75 MHz
8-pin SO8 Narrow, 8-pin SO8 Wide,
8-pin U-PDFN (2x3), 8-pin V-PDFN (6x5)
Data Storage
–40˚C to +85˚C
N25Q Serial NOR Flash Embedded
8Mb
x1
Yes
2.7–3.6V
75 MHz
8-pin SO8 Narrow, 8-pin SO8 Wide,
8-pin U-PDFN (4x3), 8-pin V-PDFN (6x5)
Data Storage
–40˚C to +85˚C
16Mb
x1/x2/x4
Yes
1.7–2.0V
108 MHz
8-pin XF-SCSP (2x2.8),
8-pin SO8 Narrow
Multi I/O
–40˚C to +85˚C
75 MHz
16-pin SO16 Wide, 8-pin SO8 Narrow,
8-pin SO8 Wide, 8-pin U-PDFN (4x3),
8-pin V-PDFN (6x5),
8-pin V-PDFN (8x6), KGD
Data Storage
32Mb
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
8-pin SO8 Wide, 8-pin SO8 Narrow,
8-pin SO16 Wide, 8-pin U-PDFN (4x3),
8-pin V-PDFN (6x5), KGD
Multi I/O
–40˚C to +85˚C
16-pin SO16 Wide, 8-pin SO8 Wide,
8-pin V-PDFN (6x5),
8-pin V-PDFN (8x6)
64Mb
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
8-pin SO8 Wide, 8-pin V-PDFN (6x5, 8x6),
16-pin SO16 Wide, 24-ball T-PBGA, KGD
Multi I/O
–40˚C to +85˚C
Data Storage
128Mb
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
16-pin SO16 Wide, 24-ball T-PBGA,
8-pin V-PDFN (6x5, 8x6),
8-pin SO8 Wide, KGD
Multi I/O
–40˚C to +85˚C
16Mb
32Mb*
x1
x1
Yes
Yes
2.7–3.6V
2.7–3.6V
75 MHz
–40˚C to +85˚C
Note: Available in tray, tube, or tape and reel.
–40˚C to +85˚C
Note: Available in tray, tube, or tape and reel. *N25Q032 suggested for new design.
(M25P Serial NOR Flash Embedded continued on next page)
NOR
MT25T Serial NOR Flash Automotive (Twin QSPI, x8)
your innovation. our memory.
Type
M25P Serial NOR Flash Embedded (continued)
M25PX Serial NOR Flash Automotive (Dual I/O)
24
Package
(N25Q Serial NOR Flash Embedded continued on next page)
25
Density
Bus Width
RoHS
Voltage
Speed
Package
Type
Temp Range
N25Q Serial NOR Flash Embedded (continued)
256Mb
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
8-pin V-PDFN (8x6),
16-pin SO16 Wide,
24-ball T-PBGA
Multi I/O
–40˚C to +85˚C
512Mb*
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
8-pin V-PDFN (8x6),
16-pin SO16 Wide,
24-ball T-PBGA
Multi I/O
–40˚C to +85˚C
1Gb**
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
108 MHz
16-pin SO16 Wide,
24-ball T-PBGA
Multi I/O
–40˚C to +85˚C
Solid State
Drives (SSDs)
Capacity
Form Factor
Height
MT/s
Read
Performance
Write
Performance
Voltage
Interface
Operating Temp
M500 Self-Encrypting Drive Client SATA SSD
Note: Available in tray, tube, or tape and reel. *MT25x512 suggested for new design. **MT25x01 suggested for new design.
120GB 2.5in 7mm 6.0 Gb/s 500 MB/s 130 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
MT25Q Serial NOR Flash Embedded
240GB 2.5in 7mm 6.0 Gb/s 500 MB/s 250 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
480GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
512Mb
1Gb
2Gb
x1/x2/x4
x1/x2/x4
x1/x2/x4
Yes
1.7–2.0V,
2.7–3.6V
Yes
1.7–2.0V,
2.7–3.6V
Yes
1.7–2.0V,
2.7–3.6V
Note: Available in tray, tube, or tape and reel.
133 MHz
133 MHz
133 MHz
SO16 Wide,
24-ball TPBGA
24-ball TPBGA
24-ball TPBGA
Multi I/O
Multi I/O
Multi I/O
–40˚C to +85˚C
–40˚C to +85˚C
–40˚C to +85˚C
960GB 2.5in 7mm 6.0 Gb/s 500 MB/s 400 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
120GB mSATA 3.75mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
240GB mSATA 3.75mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
480GB mSATA 3.75mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
120GB M.2 3.5mm 6.0 Gb/s 500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
240GB M.2 3.5mm 6.0 Gb/s 500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
480GB M.2 3.5mm 6.0 Gb/s 500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
2.5in 7mm 6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB 2.5in 7mm 6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
512GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
1024GB
2.5in 7mm 6.0 Gb/s 550MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
64GB
2.5in 5mm
6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB 2.5in 5mm
6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB 2.5in 5mm
6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
512GB 2.5in 5mm
6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
1024GB
2.5in 5mm
6.0 Gb/s 550MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
64GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
512GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
64GB M.2 3.5mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB M.2 3.5mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
512GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
SSDs
26
64GB
NOR
your innovation. our memory.
M550 Self-Encrypting Drive Client SATA SSD*
Note: *Available in self-encrypting drive (SED) and non-SED versions.
27
Capacity
Form Factor
Height
MT/s
Read
Performance
Write
Performance
Voltage
Interface
Operating Temp
28
Form
Factor
Height
Random
Read
Random
Write
Sequential
Read
Sequential
Write
Voltage
Interface
Operating
Temp
2.1K IOPS
500 MB/s 130 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
M500 Enterprise SATA SSD
128GB 2.5in 7mm 6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
120GB 2.5in 7mm 54K IOP/s
256GB
2.5in 7mm 6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
240GB 2.5in 7mm 60K IOP/s
3K IOPS
500 MB/s 250 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB 2.5in 5mm
6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
480GB 2.5in 7mm
63K IOP/s
3.7K IOPS
500 MB/s 400 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB
2.5in 5mm
6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
960GB 2.5in
7mm
64K IOP/s
3.8K IOPS
500 MB/s 400 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
mSATA 3.75mm 54K IOP/s
2.1K IOPS
500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB mSATA 3.75mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
120GB 256GB
mSATA 3.75mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
240GB mSATA 3.75mm 60K IOP/s
3K IOPS
500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB M.2 3.5mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
480GB mSATA 3.75mm 63K IOP/s
3.7K IOPS
500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB M.2 3.5mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
120GB M.2 3.5mm 54K IOP/s
2.1K IOPS
500 MB/s 130 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
Note: *Available in self-encrypting drive (SED) and non-SED versions.
240GB M.2 3.5mm 60K IOP/s
3K IOPS
500 MB/s 250 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
M550 Client SATA SSD
480GB M.2 3.5mm 63K IOP/s
3.7K IOPS
500 MB/s 400 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
64GB
2.5in 7mm 6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB 2.5in 7mm 6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB 2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
512GB 2.5in
7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
1024GB
2.5in 7mm 6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
64GB
2.5in 5mm
6.0 Gb/s 550 MB/s 190 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB 2.5in 5mm
6.0 Gb/s 550 MB/s 350 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB 2.5in 5mm
6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
512GB 2.5in
5mm
6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
1024GB
2.5in 5mm
6.0 Gb/s 550 MB/s 500 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
64GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
512GB mSATA 3.75mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
64GB M.2 3.5mm 6.0 Gb/s 550 MB/s 190 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB M.2 3.5mm 6.0 Gb/s 550 MB/s 350 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
512GB M.2 3.5mm 6.0 Gb/s 550 MB/s 500 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
M510 Client SATA SSD
128GB 2.5in 7mm 6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB
2.5in 7mm 6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB 2.5in 5mm
6.0 Gb/s 520 MB/s 150 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
256GB
2.5in
5mm
6.0 Gb/s 520 MB/s 300 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
128GB mSATA 3.75mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB
mSATA 3.75mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
128GB M.2 3.5mm 6.0 Gb/s 520 MB/s 150 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
256GB M.2 3.5mm 6.0 Gb/s 520 MB/s 300 MB/s 3.3V SATA 6.0 Gb/s
0˚C to +70˚C
Note: M500 enterprise specifications listed here show the results of running enterprise test suites on a Micron M500 drive. We present them due to the interest in the M500 from
enterprise customers. This is the same product as Micron’s M500 client drive and can be ordered using the same part numbers.
M500DC Enterprise SATA SSD
120GB
1.8in 5mm 63K IOP/s
23K IOPS
425 MB/s 200 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
240GB 1.8in 5mm 63K IOP/s
33K IOPS
425 MB/s 330 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
480GB 1.8in
5mm
63K IOP/s
35K IOPS
425 MB/s 375 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
800GB
1.8in
5mm
65K IOP/s
24K IOPS
425 MB/s 375 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
120GB
2.5in
7mm
63K IOP/s
23K IOPS
425 MB/s 200 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
240GB 2.5in 7mm 63K IOP/s
33K IOPS
425 MB/s 330 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
480GB 2.5in 7mm 63K IOP/s
35K IOPS
425 MB/s 375 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
800GB
2.5in 7mm 65K IOP/s
24K IOPS
425 MB/s 375 MB/s 5V SATA 6.0 Gb/s
0˚C to +70˚C
P320h Enterprise PCIe SSD
175GB 2.5in
15mm
up to
415K IOPS
up to
145K IOPS
up to
1.75 GB/s
up to
1.1 GB/s
12V
x4 PCIe Gen2
0˚C to +85˚C
350GB 2.5in
15mm
up to
415K IOPS
up to
145K IOPS
up to
1.75 GB/s
up to
1.1 GB/s
12V
x4 PCIe Gen2
0˚C to +85˚C
350GB HHHL
14.47mm
up to
785K IOPS
up to
205K IOPS
up to
3.2 GB/s
up to
1.9 GB/s
12V
x8 PCIe Gen2
0˚C to +85˚C
700GB HHHL
14.47mm
up to
785K IOPS
up to
205K IOPS
up to
3.2 GB/s
up to
1.9 GB/s
12V
x8 PCIe Gen2
0˚C to +85˚C
P420m Enterprise PCIe SSD
350GB 2.5in 15mm
up to
400K IOPS
up to
51K IOPS
up to
1.7 GB/s
up to
500 MB/s
12V
x4 PCIe Gen2
0˚C to +85˚C
700GB 2.5in 15mm
up to
400K IOPS
up to
51K IOPS
up to
1.7 GB/s
up to
500 MB/s
12V
x4 PCIe Gen2
0˚C to +85˚C
700GB HHHL
14.71mm
up to
750K IOPS
up to
95K IOPS
up to
3.3 GB/s
up to
630 MB/s
12V
x8 PCIe Gen2
0˚C to +85˚C
1.4TB HHHL
14.71mm
up to
750K IOPS
up to
95K IOPS
up to
3.3 GB/s
up to
630 MB/s
12V
x8 PCIe Gen2
0˚C to +85˚C
SSDs
your innovation. our memory.
M510 Self-Encrypting Drive Client SATA SSD*
Capacity
29
Multichip
Packages
Bus Width
LPDDR
Density
Secondary
Bus Width
Voltage
Clock Rate
Package
Temp Range
MT29C NAND Flash + LPDDR MCPs
512Mb
x16, x32
1.7–1.9V
200 MHz
130-ball, 8.0 x 9.0 x 1.0mm
–40˚C to +85˚C
2Gb
x8, x16
1Gb
x16, x32
1.7–1.9V
200 MHz
130-ball, 8.0 x 9.0 x 1.0mm,
137-ball, 10.5 x 13.0 x 1.1mm
–40˚C to +85˚C
Micron Technology
4Gb
x8, x16
2Gb
x32
1.7–1.9V
208 MHz
130-ball, 8.0 x 9.0 x 1.0mm,
137-ball, 10.5 x 13.0 x 1.1mm
–40˚C to +85˚C
Product Family
4Gb
x16
4Gb
x32
1.7–1.9V
208 MHz
168-ball, 12 x 12 x 1mm
–40˚C to +85˚C
8Gb
x16
4Gb
x32
1.7–1.9V
208 MHz
137-ball, 10.5 x 13.0 x 1.1mm,
137-ball, 12 x 12 x 1mm
–40˚C to +85˚C
Bus Width
LPDDR2
Density
Secondary
Bus Width
Die Revision Designator
Special Processing
40= DDR4 SDRAM
41= DDR3 SDRAM
42= Mobile LPDDR2
44= RLDRAM® 3 Memory
46= DDR SDRAM/
Mobile LPDDR
47= DDR2 SDRAM
48= SDRAM/
Mobile LPSDR
49= RLDRAM 1 & 2 Memory
52= Mobile LPDDR3
Process Technology
Voltage
Clock Rate
Package
Temp Range
A = 1.2V VDD CMOS
C = 5.0V VCC CMOS
G = 3.0V VDD CMOS
H = 1.8V VDD CMOS
HC = 1.8V VDD CMOS, 1.2V I/O
J = 1.5V VDD CMOS
MT29R NAND Flash + LPDDR2 MCPs
K = 1.35V VDD CMOS
L = 1.2V VDD CMOS
LC= 3.3V VDD CMOS
N = 1.0V VDD CMOS
R = 1.55V VDD CMOS
V = 2.5V VDD CMOS
1Gb
x16
512Mb
x16
1.7–1.9V
400 MHz
121-ball, 7.5 x 8.0 x 0.8mm
–25˚C to +85˚C,
–40˚C to +85˚C
2Gb
x8
1Gb
x32
1.7–1.9V
400 MHz
162-ball, 8.0 x 10.5 x 0.8mm
–25˚C to +85˚C
Device Number (depth, width)
2Gb
x8
1Gb
x32
1.7–1.9V
533 MHz
162-ball, 8.0 x 10.5 x 0.8mm
–40˚C to +85˚C
4Gb
x8
2Gb
x32
1.7–1.9V
533 MHz
162-ball, 11.5 x 13.0 x 0.9mm
–25˚C to +85˚C
Blank = Bits
K=Kilobits
4Gb
x8
2Gb
x32
1.7–1.9V
533 MHz
162-ball, 8.0 x 10.5 x 0.8mm
–40˚C to +85˚C
Note: Products meet RoHS standards.
NOR
Density
NOR
Family
PSRAM
Density
LPDDR
Density
Bus Width
Voltage
Sync
Clock Rate
Package
Temp Range
MT38 NOR Flash-Based MCPs
32Mb
WR
16Mb
NA
x16
1.7–1.95V
66 MHz
64Mb
WR
16Mb
NA
x16
1.7–1.95V
66 MHz
64Mb
WR
32Mb
NA
x16
1.7–1.95V
128Mb
LR
32Mb
NA
x16
1.7–1.95V
128Mb
LR
64Mb
NA
x16
256Mb
LR
64Mb
NA
x16
256Mb
–40˚C to +85˚C
66 MHz
52-ball TFBGA, 6 x 4mm
(AD-MUX);
88-ball TFBGA, 8 x 10mm
80 MHz
88-ball TFBGA, 8 x 10mm
–40˚C to +85˚C
1.7–1.95V
80 MHz
56-ball TFBGA, 8 x 6mm
(AD-MUX)
–40˚C to +85˚C
1.7–1.95V
80 MHz
88-ball TFBGA, 8 x 10mm
–40˚C to +85˚C
133 MHz
56-ball TFBGA, 8 x 8mm
(AD-MUX)
–40˚C to +85˚C
–40˚C to +85˚C
–40˚C to +85˚C
M18
128Mb
NA
x16
1.7–1.95V
256Mb
LR
NA
512Mb
x16/ x16
1.7–1.95V
80 MHz
133-ball TFBGA, 8 x 8mm
–40˚C to +85˚C
256Mb
M18
NA
512Mb
x16/ x16
1.7–1.95V
133 MHz
133-ball TFBGA, 8 x 8mm
–40˚C to +85˚C
512Mb
M18
NA
512Mb
x16/ x16
1.7–1.95V
133 MHz
133-ball TFBGA, 8 x 8mm
–40˚C to +85˚C
512Mb
M18
128Mb
NA
x16
1.7–1.95V
133 MHz
56-ball TFBGA, 8 x 8mm
(AD-MUX)
–40˚C to +85˚C
Note: Products meet RoHS standards.
IT ES :A
M= Megabits
G=Gigabits
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
Operating Temperatures
Blank = Commercial Temperature
IT1 = Industrial Temperature
AT = Automotive Temperature
WT = Wireless Temperature
1The
number one (1) and the capital letter “I”
utilize the same laser mark—“I”
Special Options
(Multiple processing codes are separated by a
space and are listed in hierarchical order.)
A = Automotive M = Reduced Standby
L = Low Power
X = Product Longevity
G = Graphics
Program (PLP)
Access/Cycle Time
Device Versions
Alphanumeric character(s) specified by individual data sheet.
L2, S2, and S4 devices are made with dual die in package.
DRAM
Technology
Mobile devices
C1 = Single die, 2n prefetch
C2 = 2-die stack, 2n prefetch
D1 = Single die, 4n prefetch
D2 = 2-die stack, 4n prefetch
D4 = 4-die stack, 4n prefetch
LA=2-die stack, reduced-page-size addressing
LF =Single die, standard addressing
LG=Single die, reduced-page-size addressing
L2=2-die stack, standard addressing
L4=4-die stack, standard addressing
R4=4-die stack, reduced-page-size addressing
All DRAM
RLDRAM only
Blank = Common I/O
C = Separate I/O
Package Codes
Lead
Plating
Pb-Free/RoHS-
Compliant Plating
Package Description 2, 3
DDR4 SDRAM
–
–
–
HA
HX
TRF
Part Numbering
Guides
x8, x16
NAND
Density
your innovation. our memory.
MT 48 A 128M16 D1 KL - 25
1Gb
Note: Products meet RoHS standards.
30
DDR4, DDR3, DDR2, DDR, SDRAM, Mobile LPDDR2/LPDDR/LPSDR,
and RLDRAM® Memory
MCPs
NAND
Density
Part Numbering
Guides
FBGA (96-ball, 9 x 14)
FBGA (78-ball, 9 x 11.5)
FBGA (Twindie®, 78-ball, 9 x 11.5)
Package codes and descriptions continued on next page.
Speed Grade
Mark
Speed Grade
Mark
-0
-A
t
RAC Access
Time
Untested
Untested
MAX Clock
Frequency
PC Targets
CL-tRCD-tRP
933 MHz
933 MHz
1067 MHz
1067 MHz
1200 MHz
13-13-13
14-13-13
15-15-15
16-15-15
16-16-16
400 MHz
400 MHz
533 MHz
533 MHz
667 MHz
667 MHz
667 MHz
800 MHz
800 MHz
933 MHz
1067 MHz
6-6-6
5-5-5
8-8-8
7-7-7
10-10-10
9-9-9
8-8-8
11-11-11
10-10-10
13-13-13
14-14-14
DDR4 SDRAM
-107E
-107H
-093E
-093H
-083E
DDR3 SDRAM
-25
-25E
-187
-187E
-15
-15E
-15F
-125
-125E
-107
-093
Access/cycle time continued on next page.
31
DRAM Component Part Numbering (Continued)
GDDR5 Part Numbering
Package Codes
Lead
Plating
Pb-Free/
RoHSPlating
Access/Cycle Time
Package Description 2, 3
DDR3 SDRAM
Mobile LPDDR3
DA
HA
HX
JP
JT
RA
RE
RH
SHM
STA
SMA
SLD
THD
THE
THG
THV
THA
TNA
THW
TRF
F BGA (78-ball, 8 x 10.5)
FBGA (96-ball, 9 x 14)
FBGA (78-ball, 9 x 11.5)
FBGA (78-ball, 8 x 11.5)
FBGA (96-ball, 8 x 14)
FBGA (78-ball, 10.5 x 12)
FBGA (96-ball, 10.5 x 12)
FBGA (78-ball, 9 x 10.5)
FBGA (QuadDie, 78-ball, 10.5 x 12)
FBGA (QuadDie, 3DS, 78-ball, 10.5 x 12)
FBGA (QuadDie, 78-ball, 9.5 x 11.5)
FBGA (TwinDie, 136-ball, 10 x 14)
FBGA (TwinDie, 78-ball, 9 x 11.5 x 1.2)
FBGA (TwinDie, 78-ball, 10.5 x 12)
FBGA (TwinDie, 3DS, 78-ball, 10.5 x 12)
FBGA (TwinDie, 78-ball, 8 x 11.5)
FBGA (QuadDie, 78-ball, 10 x 11.5)
FBGA (TwinDie, 96-ball, 10x14, x8 + x8)
FBGA (QuadDie, 78-ball, 8 x 11.5)
FBGA (TwinDie, 78-ball, 9.5 x 11.5)
DDR2 SDRAM
FP
FG
JN
HW
F6
FN
HV
HW
PK
–
–
–
–
–
–
BP
BG
CF
HR
B6
BN
HQ
HR
RT
HG
EB
WTR
THM
THN
THN
–
–
WTR
THT
FBGA (60-ball, 8 x 12)
FBGA (84-ball, 8 x 14)
FBGA (60-ball, 8 x 10)
FBGA (84-ball, 8 x 12.5)
FBGA (60-ball, 10 x 10)
FBGA (84-ball, 10 x 12.5)
FBGA (60-ball, 8 x 11.5)
FBGA (84-ball, 8 x 12.5)
FBGA (84-ball, 9 x 12.5)
FBGA (60-ball, 84-ball, 11.5 x 14)
FBGA (60-ball, 9 x 11.5)
FBGA (TwinDie, 63-ball, 9 x 11.5)
FBGA (TwinDie, 63-ball, 12 x 14)
FBGA (TwinDie, 63-ball, 9 x 11.5)
FBGA (TwinDie, 63-ball, 8 x 10
[1Gb, 50nm only])
FBGA (TwinDie, 63-ball, 9 x 11.5)
FBGA (Quad die, 65-ball, 9 x 11.5)
your innovation. our memory.
DDR SDRAM
32
Package Description 2, 3
CV
FG
FN
CY
BG
BN
TG
P
FBGA (84-ball, 60-ball, 8 x 12.5)
FBGA (84-ball, 60-ball, 8 x 14)
FBGA (54-ball, 60-ball,
84-ball, 10 x 12.5)
TSOP (Type II)
SDRAM
FB
FG
BB
BG
F4
F5
TG
xTG
B4
B5
P
xP
FBGA (60-ball, 8 x 16)
VFBGA (54-ball); FBGA
(84-ball, 60-ball, 8 x 14)
VFBGA (54-ball, 8 x 8)
VFBGA (90-ball, 8 x 13)
TSOP (Type II)
Stacked TSOP,
x = internal stacking code
EL
EM
EN
ET
WFBGA (178-ball SDP, 11 x 11.5 x 0.8)
VFBGA (178-ball DDP, 11 x 11.5 x 0.9)
VFBGA (253-ball DDP, 11.5 x 11.5 x 0.9)
TFBGA (178-ball QDP, 11 x 11.5 x 1.2)
Mobile LPDDR2
AB
AC
EU
EV
GU
GV
KH
KJ
KL
KP
KQ
KU
KV
LC
LD
LE
LF
LG
LH
LK
LL
LM
MA
MC
MG
MH
MP
PoP (121-ball SDP, 6.5 x 8 x 0.8)
PoP (134-ball DDP ICE, 10 x 11.5 x .65)
PoP (253-ball DDP, 11 x 11 x 0.9)
PoP (253-ball DDP, 11 x 11 x 1.2)
PoP (134-ball SDP, 10 x 11 x 0.7)
PoP (134-ball DDP, 10 x 11 x .85)
PoP (216-ball DDP, 12 x 12 x 0.8)
PoP (216-ball QDP, 12 x 12 x 1)
PoP (168-ball SDP & DDP, 12 x 12 x 0.8)
PoP (168-ball QDP, 12 x 12 x 1)
PoP (168-ball JD32, 12 x 12 x 0.75)
PoP (216-ball 3DP, 12 x 12 x 0.9)
PoP (216-ball SDP, 12 x 12 x 0.65)
PoP (240-ball QDP, 14 x 14 x 1)
PoP (220-ball QDP, 14 x 14 x 1)
PoP (168-ball 3DP, 12 x 12 x 1, 0.35mm ball)
PoP (168-ball SDP , 12 x 12 x 0.75)
PoP (168-ball DDP, 12 x 12 x 0.8)
PoP (216-ball SDP, 12 x 12 x 0.65)
PoP (216-ball DDP, 12 x 12 x 0.8)
PoP (216-ball DDP, 12 x 12 x 0.8)
PoP (216-ball QDP, 12 x 12 x 1)
PoP (168-ball SDP, 12 x 12 x 0.7)
PoP (240-ball DDP, 14 x 14 x 0.8)
PoP (134-ball QPD, 11.5 x 11.5 x 1.2)
PoP (134-ball QPD, 11 x 11.5 x 1)
PoP (220-ball DDP, 14 x 14 x 0.8)
Mobile LPDDR
BF
B5
B7
CK
CM
CX
JV
KQ
MA
VFBGA (60-ball SDP, 8 x 9 x 1)
VFBGA (90-ball SDP, 8 x 13 x 1)
VFBGA (60-ball SDP, 10 x 10 x 1)
VFBGA (60-ball SDP, 10 x 11.5 x 1)
VFBGA (90-ball SDP, 10 x 13 x 1)
VFBGA (90-ball SDP, 9 x 13 x 1)
PoP (168-ball QDP, 12 x 12 x 1)
PoP (168-ball DDP, 12 x 12 x 0.75)
PoP (168-ball SDP, 12 x 12 x 0.7)
Mobile LPSDR
B4
B5
BF
VFBGA (54-ball SDP, 8 x 8)
VFBGA (90-ball SDP, 8 x 13 x 1)
VFBGA (60-ball SDP, 8 x 9 x 1)
RLDRAM 1 and 2
FM
HU
BM
HT
µBGA (144-ball, 11 x 18.5)
FBGA (144-ball, 11 x 18.5)
RLDRAM 3
PA
RB
PKM
RCT
2Due
FBGA (168-, 169-ball,
13.5 x 13.5 x 1.2) SDP
FBGA (168-, 169-ball,
13.5 x 13.5 x 1.45) DDP
to space limitations, FBGA- and µBGA-packaged components and flip chips in packages have an abbreviated part
mark that is different from the part number. See our Web site for more information on abbreviated component marks.
3Dimensions in millimeters. Note: Some device offerings are available in a VFBGA rather than an FBGA package; this is
noted on the data sheet.
Speed
Grade
Mark
MAX Clock
Frequency
PC Targets
CL-tRCD-tRP
E D W 40 32 B A BG - 70 - F
Micron Technology
Environment Code
F = Lead free (RoHS compliant) and halogen free
DDR2 SDRAM
-5E
-37E
-3
-3E
-25
-25E
-187E
200 MHz
267 MHz
333 MHz
333 MHz
400 MHz
400 MHz
533 MHz
3-3-3
4-4-4
5-5-5
4-4-4
6-6-6
5-5-5
7-7-7
Type
Speed
D = Packaged device
7A= 7 Gb/s
70= 7 Gb/s
6A= 6 Gb/s
60= 6 Gb/s
50= 5 Gb/s
Product Family
W=GDDR5
DDR SDRAM
-75
-6T
-6
-5B
133 MHz
167 MHz
167 MHz
200 MHz
2.5-3-3
2.5-3-3
2.5-3-3
3-3-3
133 MHz
133 MHz
143 MHz
167 MHz
167 MHz
183 MHz
200 MHz
3-3-3
2-2-2
3-3-3
3-3-3
3-3-3
3-3-3
3-3-3
SDRAM
-75
-7E
-7
-6
-6A
-55
-5
Package Code
Density/Bank
BG = FBGA
20= 2Gb/16 bank
40= 4Gb/16 bank
Die Revision
Power Supply
Organization
B = 1.5V, VDD
32= x32
Mobile LPDDR3
-15
-125
667 MHz
800 MHz
10-10-10
12-12-12
Part Numbering
Guides
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Pb-Free/
RoHSPlating
Hybrid Memory Cube Part Numbering
Mobile LPDDR2
-18
-25
-3
-37
-5
533 MHz
400 MHz
333 MHz
266 MHz
200 MHz
Mobile LPDDR
-75
-6
-54
-5
-48
133 MHz
167 MHz
185 MHz
200 MHz
208 MHz
Mobile LPSDR
-8
-75
-6
125 MHz
133 MHz
167 MHz
RLDRAM 1 and 2
-5
-33
-25
-25E
-18
200 MHz
300 MHz
400 MHz4
400 MHz5
533 MHz
RLDRAM 3
-125
-125E
-107
-107E
-093
-093E
800 MHz6
800 MHz7
933 MHz 7
933 MHz8
1067 MHz7
1067 MHz8
with tRC 20ns.
with tRC 15ns.
6Available with tRC (MIN) 12ns.
7Available with tRC (MIN) 10ns.
8Available with tRC (MIN) 8ns.
4Available
MT 43 A 04G 04 01 00 NGF - S15
Micron Technology
ES :A
Die Revision Designator
Special Processing
Product Family
43= HMC
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
DRAM Voltage
A= 1.2V VDD CMOS
Operating Temperatures
DRAM Die Density per Layer
Blank = Standard Temperature
G = Gigabits
Number of DRAM Die in Package
Special Options
Blank = No Special Options
Link Description
Logic Design Designator
Sequential Number for Product Variations
Package Codes
Codes
Package Description (mm)
NFA
NFH
NGF
NGK
BBGA (896-ball, 4 DRAM high, 31 x 31 x 4)
BBGA (896-ball, 8 DRAM high, 31 x 31 x 4)
BFBGA (666-ball, 4 DRAM high, 16 x 19.5 x 3.9)
BFBGA (666-ball, 8 DRAM high, 16 x 19.5 x 3.9)
Electrical & Physical
Link Specification
SerDes
I/O Interface
-515
-U10
15 Gb/s
10 Gb/s
5Available
33
NOR MCP Part Numbering
MCP NAND/NOR + LPDDR1 Part Numbering
MT 29C 1G 12M A A C A KC - xx
MT 38W 203 3 A 9 0 2 ZQx* Z W XQ5 - ES
Micron Technology
Production Status
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
Product Family
38L= NOR L-Series + xNAND + xDRAM
38M= NOR M-Series + xNAND + xDRAM
38W= NOR W-Series + xNAND + xDRAM
Die Revision Code
Contact factory
Density
NOR
xNAND
xDRAM
0
1
2
3
4
5
6
7
8
9
A
B
C
D
–
32Mb = 4MB
64Mb = 8MB
128Mb = 16MB
256Mb = 32MB
512Mb = 64MB
768Mb = 96MB
1Gb = 128MB
1.25Gb = 160MB
1.5Gb = 192MB
1.75Gb = 224MB
2Gb = 256MB
3Gb = 384MB
4Gb = 512MB
N/A
–
16Mb = 2MB
32Mb = 4MB
64Mb = 8MB
128Mb = 16MB
256Mb = 32MB
384Mb = 48MB
512Mb = 64MB
768Mb = 96MB
1Gb = 128MB
1.5Gb = 192MB
2Gb = 256MB
3Gb = 384MB
4Gb = 512MB
Operating Temperature Range
Special Options
Contact factory
Package Code
NOR
xDRAM
1
2
3
4
1.8V
3.0V
1.8–3.0V
3.0V
1.8V
3.0V
1.8–3.0V
3.0V
your innovation. our memory.
Die Count
34
Mark
NOR
xDRAM
A
B
1
1
1
2
= a null character used as a placeholder
xDRAM Description
0 = N/A
1 = Async PSRAM
2 = Sync PSRAM, No MUX
3 = Sync PSRAM, A/D MUX
4 = Sync PSRAM, AA/D MUX
5 = x16 DDR, 1KB Page
6 = x16 DDR, 2KB Page
7 = x16 DDR, 4KB Page
8 = x32 DDR, 4KB Page
NAND Description
NOR Configuration
Mark
Boot
MUX
1
2
3
4
5
6
7
8
9
A
B
C
Uniform
Uniform
Uniform
Uniform
Bottom
Bottom
Bottom
Bottom
Top
Top
Top
Top
NO
AD
A/D, AA/D**
AA/D
NO
A/D
A/D, AA/D**
AA/D
NO
A/D
A/D, AA/D**
AA/D
**AA/D
ZA = 44-ball VBGA (7.5 x 5 x 1), F10x4+4, 0.5
19Z = 64-ball VBGA (7.7 x 9 x 1), F10x6+4, P.5, B.3
ZQ = 88-ball TFBGA (8 x 10 x 1.2), F8x10+8, 0.8
ZS = 56-ball VFBGA (8 x 6 x 1), 10x6-8+4, .5, B.3
3RZ = 133-ball VFBGA (8 x 8 x 1), 3R14x14+1, 0.5
*x
Voltage Range (Core I/O)
Mark
I = Industrial (–40˚C to +85˚C)
W = Wireless (–25˚C to +85˚C)
interface configurable through register.
0 = N/A
Micron Technology
Production Status
Blank = Production
ES = Engineering Sample
DC = Daisy Chain
QS = Qualification Sample
MS = Mechanical Sample
Product Family
27C= OneNAND + LPDRAM MCP/PoP
28C= NOR + LPDRAM MCP/PoP
29C= NAND + LPDRAM MCP/PoP
Operating Temperature Range
NAND Density
1G=1Gb
2G=2Gb
4G=4Gb
8G=8Gb
AG=16Gb
BG=32Gb
CG=64Gb
DG=128Gb
IT = Industrial Temp (–40˚C to +85˚C)
W = Wireless (–25˚C to +85˚C)
DM= 128Mb
EM=256Mb
FM=512Mb
Special Options
Blank = Standard
E = On-die ECC enabled
LPDRAM Density
56M=256Mb
12M=512Mb
40M=640Mb
52M=1,152Mb
24M=1Gb
48M=2Gb
72M=3Gb
96M=4Gb
92M=8Gb
LPDRAM Access Time
Operating Voltage Range
A=1.70–1.95V
B=1.65–1.9V
C=1.5–1.7V
-5 =200 MHz CL3
-54 =185 MHz CL3
-6 =166 MHz CL3
-75 = 135 MHz CL3
-8 = 125 MHz
-10 = 100 MHz
-48 = 208 MHz
Package Code
D=1.2–1.5V
F =1.0 –1.2V
G= 1.7–1.95V DRAM; 2.7–3.6V NOR VCC ;
1.65–3.6V VCCQ
NAND Flash Configuration
Type
Width
Density
Generation
Type
Width
Density
Generation
A
B
C
D
E
F
G
H
J
K
M
N
P
R
T
U
V
Y
Z
x8
x16
x8
x16
x8
16
x8
x16
x8
x16
x16
x8
x16
x8
x16
x8
x16
x8
x16
–
–
1Gb
1Gb
–
–
–
–
2Gb
2Gb
–
4Gb
4Gb
–
–
1Gb
1Gb
4Gb
4Gb
–
–
First
First
–
–
–
–
Second
Second
–
First
First
–
–
Second
Second
Second
Second
AA
AB
AC
AD
AE
AF
AG
AH
AI
AJ
AK
AL
AM
KH
x8
x16
x8
x16
x8
x16
x8
x16
x8
x16
x16
x16
x16
x16
2Gb
2Gb
1Gb
1Gb
8Gb
8Gb
4Gb
4Gb
1Gb
1Gb
–
8Gb
128Gb
–
Third
Third
Third
Third
First
First
Fourth
Fourth
Fourth
Fourth
–
First
First
–
Type
Package
Package Description
JA
JC
JG
JI
JR
JS
JV
KC
KD
KN
KQ
KS
MA
MC
MD
ME
MF
MJ
MK
ML
MS
NE
RN
TE
PL
SK
SP
MCP
MCP
PoP
PoP
MCP
MCP
PoP
MCP
MCP
PoP
PoP
MCP
PoP
PoP
MCP
PoP
PoP
PoP
MCP
MCP
PoP
MCP
MCP
MCP
MCP
MCP
MCP
137-ball TFBGA (10.5 x 13 x 1.2)
107-ball TFBGA (10.5 x 13 x 1.2)
168-ball VFBGA (12 x 12 x 0.9)
168-ball TFBGA (12 x 12 x 1.1)
137-ball LFBGA (10.5 x 13 x 1.4)
137-ball TFBGA (10.5 x 13 x 1.2)
168-ball VFBGA (12 x 12 x 1.0)
107-ball TFBGA (10.5 x 13 x 1.1)
137-ball TFBGA (10.5 x 13 x 1.1)
184-ball VFBGA (14 x 14 x 1.0)
168-ball WFBGA (12 x 12 x 0.75)
137-ball VFBGA (10.5 x 13 x 1.0)
168-ball WFBGA (12 x 12 x 0.7)
240-ball WFBGA (14 x 14 x 0.8)
130-ball VFBGA (8 x 9 x 1.0)
240-ball TFBGA (14 x 14 x 1.12)
168-ball VFBGA (12 x 12 x 0.85)
240-ball VFBGA (14 x 14 x 0.85)
153-ball VFBGA (10 x 12 x 0.9)
153-ball VFBGA (8 x 9 x 0.9)
191-ball WFBGA (12 x 12 x 0.8)
133-ball VFBGA (11 x 10 x 1.0)
160-ball FBGA (11.5 x 11.5 x 0.94)
153-ball VFBGA (10 x 12 x 1.0)
162-ball WFBGA (11.5 x 13 x 0.8)
162-ball VFBGA (11.5 x 13 x 0.9)
162-WFBGA (8 x 10.5 x 0.8)
LPDRAM Configuration
Part Numbering
Guides
Mark
IT ES
Chip Count
LPDRAM Configuration continued on next page.
Type
CE#, CS#
Chip Count
A
B
C
D
E
F
G
H
1, 1
1, 1
1, 2
1, 2
1, 2
1, 2
1, 2
1, 3
1 Flash, 1 LPDRAM
2 Flash, 1 LPDRAM
1 Flash, 2 LPDRAM
2 Flash, 2 LPDRAM
1 Flash, 3 LPDRAM
2 Flash, 3 LPDRAM
1 Flash, 4 LPDRAM
1 Flash, 3 LPDRAM
35
MCP NAND/NOR + LPDDR1 Part Numbering (Continued)
MCP e•MMC/NAND + LPDDR Part Numbering
MT 29RZ 4C 2D ZZ H G SK - 18 W x x .80E
Micron Technology
LPDRAM Configuration
Type
DDR
SDR
DDR
SDR
DDR
SDR
DDR
SDR
DDR
SDR
DDR
SDR
DDR
DDR
SDR
Type
your innovation. our memory.
AA
AB
AC
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AS
AT
AU
AV
AY
AZ
BA
BB
36
DDR
–
–
SDR
SDR
SDR
DDR
SDR
DDR
SDR
DDR
SDR
DDR
SDR
SDR
DDR
DDR
SDR
DDR
DDR
DDR
DDR
Density
Generation
x16
–
x32
–
x16
–
x32
–
x16
x16
x32
x32
x16
x32
x16
512Mb
–
512Mb
–
1Gb
–
1Gb
–
512Mb
512Mb
512Mb
512Mb
512Mb
512Mb
256Mb
First
–
First
–
First
–
First
–
Second
Second
Second
Second
Third
Third
First
Width
Density
Generation
x16
–
–
x16
x32
x16 + x16
x16
x16
x32
x32
x16
x16
x32
x32
x16 (2) + x16
x16 (2) + x32
x32
x32
x32 (x2)
x16
x32
–
256Mb
–
–
512Mb
512Mb
512Mb + 128Mb
1Gb
1Gb
1Gb
1Gb
2Gb
2Gb
2Gb
2Gb
1Gb + 128Mb
2Gb + 1Gb
256Mb
256Mb
4Gb + 1Gb
2Gb
2Gb
–
First
–
–
Third
Third
First
Second
First
Second
First
First
First
First
First
First
First
First
First
First/Second
Second
Second
–
Product Family
Production Status
29J= LPDDR + SLC e •MMC
29K= LPDDR + MLC e •MMC
29M= LPDDR2-S4 + SLC e •MMC
29P= LPDDR2-S4 + MLC e •MMC
29R= LPDDR2-S4 + SLC NAND
29T= LPDDR3-S4 + MLC e •MMC
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
Special Options
Blank = Standard
A = Customer variant
B = 2MB Boot area/2Mb RPMB
E = On-die ECC enabled
Z = A null character used as a placeholder.
NAND Density and Configuration
LPDRAM Density and Configuration
Type
Density
Type
Width
Z
T
U
V
W
X
Y
1
2
3
4
6
8
9
None
768Mb
640Mb
512Mb
256Mb
128Mb
64Mb
1Gb
2Gb
3Gb
4Gb
6Gb
8Gb
9Gb
Z
A
B
C
D
E
F
None
x4
x8
x16
x32
x64
x96
Operating Temperature Range
IT = Industrial Temp (–40˚C to +85˚C)
W = Wireless (–25˚C to +85˚C)
LPDRAM Speed Grade
-5 = 200 MHz CL3 (LPDDR 400)
-54 = 185 MHz CL3 (LPDDR 1)
-6 = 166 MHz CL3 (LPDDR 333)
-75 = 133 MHz CL3 (LPDDR 266)
-125 = 800 MHz CL12 (LPDDR 1600)
-18 = 533 MHz CL8 (LPDDR 1066)
-25 = 400 MHz CL6 (LPDDR 800)
-3 = 333 MHz CL5 (LPDDR 667)
-37 = 266 MHz CL4 (LPDDR 533)
Part Numbering
Guides
A
B
C
D
J
K
L
M
N
P
R
T
V
Y
Z
Width
Die Revision
Package Code
e •MMC Density and Controller
Type
Z
V
W
X
1
2
4
5
6
7
8
e •MMC Density
None
512MB
256MB
128MB
1GB
2GB
4GB
8GB
16GB
32GB
64GB
Type
Type
Z
K
L
M
N
P
Q
R
S
T
U
V
W
X
Y
Controller Version
None
e •MMC version 4.2
e •MMC version 4.2/4.3
e •MMC version 4.2/4.3
e •MMC version 4.4
e •MMC version 4.4
e •MMC version 4.4
e •MMC version 4.41
e •MMC version 4.41
e •MMC version 4.41
e •MMC version 4.41
e •MMC version 4.5
e •MMC version 4.5
e •MMC version 4.41
e •MMC version 5.0
Operating Voltage Range (Volts)
Operating Voltage Range continued on next page.
AH
AK
DI
DM
EQ
EW
HS
JD
KK
MF
MJ
MM
MW
MX
PL
RD
RL
SK
SP
TA
TF
TN
Package Description
221-ball (11.5 x 13 x 1.0)
153-ball (11.5 x 13 x 1.1)
169-ball (12 x 16 x 1.2)
153-ball (11.5 x 13 x 1.2)
162-ball (11.5 x 13 x 1.3)
162-ball (11.5 x 13 x 1.1)
199-ball (12 x 18 x 1.4)
199-ball (12 x 18 x 1.2)
168-ball (12 x 12 x 0.9)
168-ball (12 x 12 x 0.85)
240-ball (14 x 14 x 0.85)
162-ball (11 x 13.5 x 1.0)
162-ball (11.5 x 13 x 1.2)
152-ball (14 x 14 x 1.2)
162-ball (11.5 x 13 x 0.8)
162-ball (12 x 12 x 1.1)
221-ball (11.5 x 13 x 0.9)
162-ball (11.5 x 13 x 0.9)
162-ball (8 x 10.5 x 0.8)
162-ball (11 x 13.5 x 1.1)
162-ball (11.5 x 13 x 1.0)
121-ball (7.5 x 8 x 0.5)
Chip Count
Chip Count continued on next page.
37
MCP e•MMC/NAND + LPDDR Part Numbering (Continued)
e •MMC Memory Legacy Part Numbering
MT 29RZ 4C 2D ZZ H G SK - 18 W x x .80E
MT FC xx x x xx - xx xx x x x
Chip Count
Operating Voltage Range (Volts)
Type
e •MMC
LPDRAM
VCC
VDD
VDDQ
VCCM
VCCQM
–
1.8
1.8
1.8
1.8
1.8
–
1.8
–
–
1.8
1.8
1.8
1.8
1.8
1.35
1.2
1.8
1.8
1.8
1.2
1.2
–
1.8
1.8
1.8
1.8
1.2
1.2
1.2
1.8
1.8
1.8
1.2
1.2
–
1.2
1.2
1.2
1.8
1.8
1.8
1.8
3.3
1.8
3.3
–
1.8
3.3
1.8
1.8
1.8
1.8
1.8
1.8
1.8
1.8/3.3
1.8
1.8/3.3
–
1.8
1.8/3.3
–
–
–
Type
A
B
C
D
E
F
G
H
I
J
K
L
M
N
Chip Count
1 NAND Flash (CEO), 1 LPDRAM, 1 e •MMC
2 NAND Flash (CEO), 1 LPDRAM, 1 e •MMC
1 NAND Flash (CEO), 2 LPDRAM (CSO#/CS1#), 1 e •MMC
2 NAND Flash (CEO), 2 LPDRAM (CSO#/CS1#), 1 e •MMC
0 NAND Flash, 1 LPDRAM, 1 e •MMC
0 NAND Flash, 2 LPDRAM (CSO#/CS1#), 1 e •MMC
1 NAND Flash, 1 LPDRAM, 0 e •MMC
1 NAND Flash, 2 LPDRAM, 0 e •MMC
2 NAND Flash, 2 LPDRAM, 0 e •MMC
0 NAND Flash, 0 LPDRAM, 2 e •MMC
0 NAND Flash, 4 LPDRAM, 1 e •MMC
0 NAND Flash, 3 LPDRAM, 1 e •MMC
2 NAND Flash, 1 LPDRAM, 0 e •MMC
4 NAND Flash, 4 LPDRAM, 0 e •MMC
Blank = N/A
A = Design revision A
Flash + Controller = FC
Production Status
NAND Density
2G=4GB
4G=4GB
8G=8GB
Blank = Production
ES = Engineering sample
MS = Mechanical sample
16G=16GB
32G=32GB
64G=64GB
Wafer Process Applied
NAND Component
Type
0
J
L
M
Blank = No polyimide
Z = Polyimide
NAND Device
No silicon in package
25nm, 64Gb, x8, 3.3V
25nm, 32Gb, x8, 3.3V
25nm, 16Gb, x8, 3.3V
Controller ID
Type
Controller ID
0
C
D
G
T
U
V
W
No silicon in package
Version 4.51, embedded, 1st generation
Version 4.51, embedded, 2nd generation
Version 4.41, automotive, 2nd generation
Version 4.41, automotive, 2nd generation, custom
Version 4.41, automotive, 1st generation
Version 4.41, embedded, 1st generation
Version 4.51, automotive, 1st generation
Operating Temperature Range
WT = Standard: –25˚C to +85˚C
IT = Extended: –40˚C to +85˚C
AIT = Industrial: –40˚C to +85˚C + HR-certified test flow
AITI = Industrial: –40˚C to +85˚C + HR-certified test flow
Special Options
Blank = No special options
Type
Details
0M
1M
2M
3M
4M
5M
6M
L1
R1
1MB max boot area/100% max enhanced
2MB max boot area/100% max enhanced
4MB max boot area/100% max enhanced
8MB max boot area/100% max enhanced
16MB max boot area/100% max enhanced
32MB max boot area/100% max enhanced
64MB max boot area/100% max enhanced
Custom
Custom
Part Numbering
Guides
A
B
C
D
E
F
G
H
J
K
L
M
N
NAND
Design Revision
Micron Technology
your innovation. our memory.
Package Codes
38
Type
Package Description
AM
DE
DM
DN
DQ
EA
EC
ED
EF
NA
153-ball VFBGA (11.5 x 13 x 1.0)
153-ball LFBGA (11.5 x 13 x 1.4)
153-ball TFBGA (11.5 x 13 x 1.2)
169-ball LFBGA (14 x 18 x 1.4)
100-ball LBGA (14 x 18 x 1.4, 1.0 pitch)
153-ball WFBGA (11.5 x 13 x 0.8)
169-ball WFBGA (14 x 18 x 0.8)
169-ball VFBGA (14 x 18 x 1.0)
169-ball TFBGA (14 x 18 x 1.2)
100-ball TBGA (14 x 18 x 1.2)
All packages are PB free.
39
e •MMC Memory Next-Generation Part Numbering
DDR4 Module Part Numbering
MT FC xx x x xx - xx xx x
MT 36 A SF 2G 72 P Z - 2G1 A 1
Operating Temperature Range
128G = 128GB
WT = Standard: –25˚C to +85˚C
IT = Extended: –40˚C to +85˚C
AIT = Industrial: –40˚C to +85˚C + HR-certified test flow
NAND Component
AA
AC
AG
AJ
AK
20nm, Rev A, 64Gb, x8, 3.3V
20nm, 32Gb, x8, 3.3V
20nm, 128Gb, x8, 3.3V
20nm, 128Gb, x8, 3.3V
20nm, Rev D, 64Gb, x8, 3.3V
Controller ID
Type
AA
AE
Special Options
Device
Controller ID
Version 4.51, embedded
Version 5.0
Blank = No special options
Type
Details
0M
1M
2M
3M
4M
5M
6M
L1
R1
1MB max boot area/100% max enhanced
2MB max boot area/100% max enhanced
4MB max boot area/100% max enhanced
8MB max boot area/100% max enhanced
16MB max boot area/100% max enhanced
32MB max boot area/100% max enhanced
64MB max boot area/100% max enhanced
Custom
Custom
Package Codes
Type
your innovation. our memory.
DE
DL
DM
DN
EF
EA
AM
NA
CN
EY
NS
40
Package Description
153-ball LFBGA (11.5 x 13 x 1.4)
169-ball TFBGA (12 x 18 x 1.2)
153-ball TFBGA (11.5 x 13 x 1.2)
169-ball LFBGA (14 x 18 x 1.4)
169-ball TFBGA (14 x 18 x 1.2)
153-ball WFBGA (11.5 x 13 x 0.8)
153-ball VFBGA (11.5 x 13 x 1.0)
100-ball TBGA (14 x 18 x 1.2)
153-ball VFBGA (11.5 x 13 x 1.0)
153-ball LFBGA (11.5 x 13 x 1.4)
153-ball VFBGA (11.5 x 13 x 1.2)
Die Revision
A=1.2V
Product Family
TF = FBGA without temp sensor
TS = DDP (dual die in package) without temp sensor
TQ = QDP (quad die in package) without temp sensor
SF = FBGA with temp sensor
SS = DDP with temp sensor
SQ = QDP with temp sensor
DF = VLP (very low profile) with temp sensor
DS = VLP DDP with temp sensor
DQ= VLP QDP with temp sensor
SZF = FBGA with temp sensor and heat spreader
SZS = DDP with temp sensor and heat spreader
SZQ= QDP with temp sensor and heat spreader
DZF = VLP with temp sensor and heat spreader
DZS = VLP DDP with temp sensor and heat spreader
DZQ= VLP QDP with temp sensor and heat spreader
Module Speed
-1G9
-1S9
-2G1
-2S1
-2G4
-107E
-107H
-093E
-093H
-083E
DDR4-1866
DDR4-1866
DDR4-2133
DDR4-2133
DDR4-2400
Module Version
A = 284-pin Unbuffered DIMM
H = 256-pin SODIMM
L = 284-pin LRDIMM
LS= 284-pin 3DS LRDIMM
P = 284-pin RDIMM
PS= 284-pin 3DS RDIMM
1866
1866
2133
2133
2400
PC4-1866
PC4-1866
PC4-2133
PC4-2133
PC4-2400
13-13-13
14-13-13
15-15-15
16-15-15
16-16-16
SPD = serial presence-detect pin (module only)
CL = CAS latency; tRCD = active-to-command time; tRP = precharge time
Device Number (depth, width)
Blank = Megabits
G= Gigabits
933
933
1067
1067
1200
Part Numbering
Guides
Type
Process Technology
Module Configuration SPD
(CL-tRCD-tRP)
16G=16GB
32G=32GB
64G=64GB
Module Bandwidth
4G=4GB
8G=8GB
Printed Circuit Board
Revision Designator
Number of Memory Components
Data Rate (MT/s)
NAND Density
MB Vendor/Revision (LRDIMM only)
Clock Frequency (MHz)
Flash + Controller = FC
Micron Technology
JEDEC Component
Speed Grade
Blank = Production
ES = Engineering sample
MS = Mechanical sample
Component Speed Grade/
Part Mark
Production Status
Module Speed Grade
Micron Technology
Package Codes
Pb-Free
Devices
Z
DZ
DZM
IZ
ZM
Package
Descriptions
Commercial temp; halogen-free; single-, dual-, quad-, or octal-rank
DIMM
Commercial temp; halogen-free; select single-, dual-, quad-, or
octal-rank DIMM
Commercial temp; reduced standby; halogen-free; select single-,
dual-, quad-, or octal-rank DIMM
Industrial temp, halogen-free; single-, dual-, or quad-rank DIMM
Commercial temp; reduced standby; halogen-free; select single-,
dual-, quad-, or octal-rank DIMM
All packages are PB free.
41
DDR3 Module Part Numbering
DDR2 Module Part Numbering
MT 36 K SF 2G 72 P Z - 1G6 E 1
Data Rate (MT/s)
Module Bandwidth
Module Configuration SPD
(CL-tRCD-tRP)
800
800
1066
1066
1066
1333
1333
1333
1333
1600
1600
1600
1866
1866
1866
2133
2133
2133
PC3-6400
PC3-6400
PC3-8500
PC3-8500
PC3-8500
PC3-10600
PC3-10600
PC3-10600
PC3-10600
PC3-12800
PC3-12800
PC3-12800
PC3-14900
PC3-14900
PC3-14900
PC3-17000
PC3-17000
PC3-17000
6-6-6
5-5-5
8-8-8
7-7-7
6-6-6
10-10-10
9-9-9
8-8-8
11-11-11
11-11-11
10-10-10
9-9-9
13-13-13
12-12-12
11-11-11
14-14-14
13-13-13
12-12-12
9-G1A
= -1333 SPD with -125 tested DRAM
SPD = serial presence-detect pin (module only)
CL = CAS latency; tRCD = active-to-command time; tRP = precharge time
Package Codes
your innovation. our memory.
Module Version
42
Blank = 240-pin Registered DIMM
A = 240-pin Unbuffered DIMM
AK= 244-pin Unbuffered Mini-DIMM
H = 204-pin SODIMM
L = 240-pin LRDIMM
LS= 240-pin 3DS LRDIMM
P = 240-pin Parity RDIMM
PK= 244-pin Parity Mini-DIMM
Pb-Free
Devices
Y
Z
IZ
DY
DZ
Package
Descriptions
Commercial temp; single- or dual-rank DIMM
Halogen-free; commercial temp; single- or dual-rank DIMM
Industrial temp, halogen-free; commercial temp;
single- or dual-rank DIMM
Commercial temp; select dual- or quad-rank DIMM
Halogen-free; commercial temp; select dual- or quad-rank DIMM
Device Number (depth, width)
Blank = Megabits
G= Gigabits
Module Version
Blank = 240-pin Registered DIMM
A= 240-pin Unbuffered DIMM
F= 240-pin FBDIMM
H= 200-pin SODIMM
P= Parity
PK= 244-pin Parity Mini-RDIMM
RH = 200-pin SORDIMM
Die Revision
Module Speed
-40E
-53E
-667
-80E
-800
-1GA
-5E
-37E
-3
-25E
-25
-187E
DDR2-400 200
DDR2-533 267
DDR2-667 333
DDR2-800 400
DDR2-800 400
DDR2-1066
533
Module Configuration SPD
(CL-tRCD-tRP)
Clock Frequency (MHz)
400
400
533
533
533
667
667
667
667
800
800
800
933
933
933
1067
1067
1067
TF =FBGA
TS = DDP (dual die in package)
TZS = DDP with heat spreader
VF = VLP (very low profile)
VS = VLP DDP
VZS = VLP DDP with heat spreader
Module Bandwidth
JEDEC Component
Speed Grade
DDR3-800
DDR3-800
DDR3-1066
DDR3-1066
DDR3-1066
DDR3-1333
DDR3-1333
DDR3-1333
DDR3-1333
DDR3-1600
DDR3-1600
DDR3-1600
DDR3-1866
DDR3-1866
DDR3-1866
DDR3-2133
DDR3-2133
DDR3-2133
Product Family
Data Rate (MT/s)
Component Speed Grade/
Part Mark
-25
-25E
-187
-187E
-187F
-15
-15E
-15F
-125
-125
-125E
-125F
-107
-107E
-107F
-093
-093E
-093F
Printed Circuit Board
Revision Designator
JEDEC Component
Speed Grade
Module Speed Grade
-80B
-80C
-1G0
-1G1
-1G2
-1G3
-1G4
-1G5
-1GA9
-1G6
-1G7
-1G8
-1G9
-1GB
-1GC
-2G1
-2G2
-2G3
E= Intel (FBDIMM)
D= IDT (FBDIMM)
N= NEC (FBDIMM)
400
533
667
800
800
1066
PC2-3200
PC2-4200
PC2-5300
PC2-6400
PC2-6400
PC2-8500
3-3-3
4-4-4
5-5-5
5-5-5
6-6-6
7-7-7
Part Numbering
Guides
TF=FBGA
TS = DDP (dual die in package)
SF = FBGA with temp sensor
SS = DDP with temp sensor
SQ = QDP with temp sensor
BF = VLP (very low profile) (17.9mm) with temp sensor
BS = VLP (17.9mm) DDP with temp sensor
DF = VLP (18.75mm) with temp sensor
DS = VLP (18.75mm) DDP with temp sensor
GF = 1.5U height with temp sensor
HF = 2U height with temp sensor
LF = 4U height with temp sensor
SZF = FBGA with temp sensor and heat spreader
SZS = DDP with temp sensor and heat spreader
SZQ = QDP with temp sensor and heat spreader
BZF = VLP (17.9mm) with temp sensor and heat spreader
BZS = VLP (17.9mm) DDP with temp sensor and heat spreader
DYS = VLP (18.75mm) with temp sensor and alternate heat spreader
DZF = VLP (18.75mm) with temp sensor and heat spreader
DZS = VLP (18.75mm) DDP with temp sensor and heat spreader
DZQ= VLP (18.75mm) QDP with temp sensor and heat spreader
Blank = Megabits
G= Gigabits
H=1.8V
G= 1.5V
R=1.55V
Module Speed
Product Family
Process Technology
Die Revision
J =1.5V
K=1.35V
M= 1.35V Reduced Standby
AMB Vendor
Number of Memory Components
Component Speed Grade/
Part Mark
Process Technology
AMB Vendor Rev (FBDIMM only)
Clock Frequency (MHz)
Printed Circuit Board
Revision Designator
Number of Memory Components
Device Number (depth, width)
Micron Technology
MB Vendor/Revision (LRDIMM only)
Module Speed Grade
Micron Technology
MT 36 H TF 1G 72 P Z - 80E C 1
SPD = serial presence-detect pin (module only)
CL = CAS latency; tRCD = active-to-command time; tRP = precharge time
Package Codes
Pb-Free
Devices
Package
Descriptions
Y
Z
Commercial temp; single- or dual-rank DIMM
Halogen-free; commercial temp; single- or
dual-rank DIMM
Commercial temp; select dual-rank DIMM
Halogen-free; commercial temp; select dualor quad-rank DIMM
Industrial temp; select dual-rank DIMM
Industrial temp; select dual-rank DIMM
Halogen-free; industrial temp; select singleand dual-rank DIMM
Halogen-free; industrial temp; select dualand quad-rank DIMM
DY
DZ
IY
TY
IZ
TZ
43
DDR and SDRAM Module Part Numbering
MT 36 V DDF 256 72
PSRAM CellularRAM® Memory Part Numbering
Y - 40B J 2
MT 45 W 1M W 16 P A FA - 70 1
Micron Technology
Printed Circuit Board
Revision Designator
Number of Memory Components
Die Revision Designator
Process Technology
Module Speed
Blank = 168-pin/184-pin/240-pin Registered DIMM
A= 168-pin/184-pin/240-pin Unbuffered DIMM
H= 144-pin/200-pin SODIMM
PH= 144-pin/200-pin Unbuffered SODIMM with PLLs
U= 100-pin Unbuffered DIMM
All SDRAM and DDR SDRAM DIMMs have serial-presence detect.
SDRAM Modules
Module
Speed
-133
-13E
Allowable
Component Speed
-6A, -75, -7E
-7E
your innovation. our memory.
DDR SDRAM Modules
44
Module
Speed
-335
-40B
Data Rate (MT/s)
Module Bandwidth
Module Configuration SPD
(CL-tRCD-tRP)
-6T
-6
-5B
DDR333 TSOP
DDR333 FBGA
DDR40012
167
167
200
333
333
400
PC2700
PC2700
PC3200
2.5-3-3
2.5-3-311
3-3-3
SPD = serial presence-detect pin (module only)
CL = CAS latency; tRCD = active-to-command time; tRP = precharge time
11Data valid window is 150ps greater than -6T.
12DDR400 nominal voltage is 2.6V.
Module Version 10
10
Clock Frequency (MHz)
Blank = Megabits
G= Gigabits
JEDEC Component
Speed Grade
Device Number (depth, width)
-335
-335
-40B
CL-tRCD-tRP
3-3-3
2-2-2
Package Codes
Lead-Plated
Devices
G
DG
I
T
Pb-Free
Devices
Y
DY
IY
TY
Package
Descriptions
Commercial temp; single- or dual-rank DIMM
Commercial temp; select dual-rank DIMM
Industrial-temp DIMM
Industrial temp; select dual-rank DIMM
Micron Technology
Production Status
Blank = Production
ES = Engineering Sample
MS = Mechanical Sample
Product Family
45= PSRAM CellularRAM® Memory
Operating Core Voltage
Operating Temperature Range
W= 1.70–1.95V
V=2.70–3.60V
WT = –30˚C to +85˚C
IT = –40˚C to +85˚C
AT = –40˚C to +105˚C
Address Locations
Options
M= Megabits
K=Kilobits
Blank = Standard device
L = Low power
I/O Voltage
Frequency
W=1.75–3.60V
V =2.70–3.60V
Bus Configuration
16=x16
Access/Cycle Time
Read/Write Mode Operation
P= Async/Page
B= Async/Page/Burst
DB = AA/D MUX
MB= MUX Burst
MP= Asynchronous MUX
Die Rev Code
Blank = P25A, P26Z, and P24Z Design
A=P24A Design
C=P25Z Design
D=P23Z Design
E=P22Z Design
Blank = No burst mode
8 = 80 MHz
1 = 104 MHz
13 = 133 MHz
55= 55ns
70= 70ns
85= 85ns
Part Numbering
Guides
DDF= FBGA (DDR SDRAM)
DDT= TSOP (DDR SDRAM)
DVF= FBGA VLP (DDR SDRAM)
SDF = FBGA (SDRAM)
SDT = TSOP (SDRAM)
Component Speed Grade/
Part Mark
Product Family
Module Speed Grade
L = 3.3V (SDRAM)
V = 2.5V (DDR SDRAM)
WT ES
Package Code
FA = 48-ball VFBGA (6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm)
FB = 54-ball VFBGA (6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm)
BA = 48-ball VFBGA (Pb-free 13; 6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm)
BB = 54-ball VFBGA (Pb-free 13; 6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm)
GX= 54-ball VFBGA (Green; 6 x 9 grid, 0.75mm pitch, 8 x 10 x 1mm)
GA= 48-ball VFBGA (Green; 6 x 8 grid, 0.75mm pitch, 6 x 8 x 1mm)
GB= 54-ball VFBGA (Green; 6 x 9 grid, 0.75mm pitch, 6 x 8 x 1mm)
13Lead
is not intentionally added by Micron during the manufacturing process, but
it can be present in trace amounts in the raw materials used to manufacture the
finished products.
Allowable
Component Speed
-6, -6T, -5B
-5B
45
NAND Flash Part Numbering
NAND Small Page Flash Memory Part Numbering
NAND 512 R 3 A 2 A ZA 6 E
MT 29F 2G 08 A A A A A WP - xx xx x ES: A
Micron Technology
Design Revision
A = 1st Design Revision
Product Family
Production Status
29F = NAND Flash
29E = Enterprise NAND Flash
Blank = Production
ES = Engineering Sample
QS = Qualification Sample
MS = Mechanical Sample
Density
Features
E = Internal ECC enabled X = Product Longevity Program
(PLP)
M = Media
Z = Polyimide (if applicable)
R = MLC+ features
S = Security features
Device Width
Operating Temperature Range
01 = 1 bit
08 = 8 bits
16= 16 bits
Blank = Commercial (0˚C to +70˚C)
IT = Extended (–40˚C to +85˚C) (AKA ET)
WT = Wireless Temp (–25˚C to +85˚C)
AAT = Automotive Grade (–40˚C to +105˚C)
AIT = Automotive Grade (–40˚C to +85˚C)
Level
Mark
Level
A
C
E
SLC
MLC
TLC
your innovation. our memory.
E = ECOPACK package, standard tray packaging
F = ECOPACK package, tape and reel packaging
Operating Temperature Range
Operating Voltage Range
6 = – 40˚C to +85˚C
X = – 40˚C to +85˚C; Product Longevity Program (PLP)
R =1.8V
W=3.0V
Configuration
Package Code
3= x8
4= x16
N= 48-pin TSOP
ZA/ZD = 55-, 63-ball VFBGA
E0= Bare die
DI= Known good die
NAND Product Family Identifier
A = 512B Page NAND SLC
Product Version
Device Options
A, B, C, D
0 = No options (CE care; sequential raw read enabled)
2 = CE don’t care
A = CE don’t care; automotive
Speed Grade
Blank = Async only
6 = 333 MT/s
12 = 166 MT/s
10 = 200 MT/s
Package Code14
Classification
46
128 = 128Mb
256 = 256Mb
512 = 512Mb
Mark
Die
nCE
RnB
I/O Channels
B
D
E
F
J
K
L
M
Q
T
U
V
1
2
2
2
4
4
4
4
8
16
8
16
1
1
2
2
2
2
4
4
4
8
4
8
1
1
2
2
2
2
4
4
4
4
4
4
1
1
2
1
1
2
4
2
4
2
2
4
Operating Voltage Range
A= 3.3V (2.70–3.60V)
B= 1.8V (1.70–1.95V)
C = 3.3V (2.70–3.60V), VCCQ 1.8V (1.70–1.95V)
D= 1.8V (1.65–3.6V) SIM
E = 3.3V (2.70–3.6V), VCCQ 3.3V or 1.8V (1.70–1.95V)
WP = 48-pin TSOP I (CPL version)
J1 = 132-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm
J2 = 132-ball TBGA (QDP), 12 x 18 x 1.2mm
J3 = 132-ball LBGA (8DP), 12 x 18 x 1.4mm
J4 = 132-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm
J5 = 132-ball TBGA (QDP), 12 x 18 x 1.2mm
J6 = 132-ball LBGA (8DP), 12 x 18 x 1.4mm
J7 = 152-ball LBGA (16DP), 14 x 18 x 1.5mm
J9 = 132-ball LBGA (16DP), 12 x 18 x 1.5mm
G1 = 272-ball VFBGA (SDP, DDP, 3DP, QDP), 14 x 18 x 1.0mm
G2 = 272-ball TFBGA (8DP), 14 x 18 x 1.3mm
G6 = 272-ball LFBGA (16DP), 14 x 18 x 1.5mm
H1 = 100-ball VBGA (SDP, DDP), 12 x 18 x 1.0mm
H2 = 100-ball TBGA (QDP), 12 x 18 x 1.2mm
H3 = 100-ball LBGA (8DP), 12 x 18 x 1.4mm
H4 = 63-ball VFBGA (SDP, DDP), 9 x 11 x 1.0mm
H6 = 152-ball VBGA (SDP, DDP), 14 x 18 x 1.0mm
H7 = 152-ball TBGA (QDP), 14 x 18 x 1.2mm
H8 = 152-ball LBGA (8DP), 14 x 18 x 1.4mm
HC = 63-ball VFBGA (SDP, DDP), 10.5 x 13 x 1.0mm
14Products
are Pb-free and RoHS-compliant. Lead is not intentionally added
by Micron during the manufacturing process, but it can be present in trace
amounts in the raw materials used to manufacture the finished products.
Interface
A = Async only
B = Sync/Async
D = SPI
Die Revision
A= 1st set of device features
B= 2nd set of device features (rev only if different from 1st set)
C= 3rd set of device features (rev only if different)
D= 4th set of device features (rev only if different)
Etc. ...
Part Numbering
Guides
64G= 64Gb
128G= 128Gb
256G= 256Gb
512G= 512Gb
1Tb = 1024Gb (1Tb)
2Tb = 2048Gb (2Tb)
1G = 1Gb
2G = 2Gb
4G = 4Gb
8G = 8Gb
16G= 16Gb
32G= 32Gb
Packaging
Density
N25Q Serial NOR Flash Memory Part Numbering
N25Q 128 A 1 3 E 12 4 0 G
SPI NOR Family Identifier
N25Q = Multi I/O SPI NOR Flash
Density
008= 8Mb
016= 16Mb
032= 32Mb
064= 64Mb
128= 128Mb
256= 256Mb
512= 512Mb
00A= 1Gb
Litho
A = 65nm
Feature Set
1 = Byte addressability, hold pin, Micron XiP
2 = Byte addressability, hold pin, basic XiP
3 = Byte addressability, reset pin, Micron XiP
4 = Byte addressability, reset pin, basic XiP
Operating Voltage Range
1= 1.7–2.0V VCC
3= 2.7–3.6V VCC
Array Configuration
T=Top
B=Bottom
E=Uniform
G= Easy transparent stack
Packaging
E = Tray
F = Tape and reel
G = Tube
Security
0, 1, 2, 3, 4, 5, 6
Contact Micron Sales for more information
Operating Temperature Range
4 = Industrial-tested with standard test flow (–40˚C to +85˚C)
A= Automotive: –40˚C to +125˚C + HR-certified test flow
H= Automotive: –40˚C to +85˚C + HR-certified test flow
Package Code
F3= DFN/3 x 2 (MLP)
F4= DFN/3 x 4 (MLP)
F6= DFN/6 x 5 (MLP)
F7= DFN/6 x 5 (MLP), sawn
F8= DFN/8 x 6 (MLP)
SC= SOP2-8/150 mil (SO8N)
SE= SOP2-8/208 mil (SO8W)
SF= SOP2-16/300 mil (SO16W)
12= T-PBGA-24b05/6 x 8 (TBGA 24)
51= XF-SCSP (CSP)
47
M25/M45 Serial NOR Flash Memory Part Numbering
M29W Parallel NOR Flash Memory Part Numbering
M25P 10 x V MN 6 T P x
SPI NOR Family Identifier
M25P = Data storage family
512K/1Mb – Uniform block erase 32KB
2Mb to 64Mb – Uniform block erase 64KB
128Mb – Uniform block erase 256KB
M25PE = Page erase family
Uniform block erase 256 byte + 4KB + 64KB
M45PE = Page erase family
Uniform block erase 256 byte + 64KB
M25PX= Dual I/O family
Uniform block erase 4KB + 64KB
M29 W 320 E T 70 N 6 E
Test Flow
Blank = Standard parts
A = Automotive: –40˚C to +85˚C + HR-certified test flow
(designated only for operating temp range 6)
RoHS
P = RoHS-compliant
G = RoHS-compliant
Packaging
Density
05=512Kb
10=1Mb
20=2Mb
40=4Mb
80=8Mb
16=16Mb
32=32Mb
64=64Mb
128 = 128Mb
Security
Blank = No security
S = UID preprogrammed
SO = UID + Permanent block lock
ST = UID + Permanent block lock + reverse power-up block lock status
Operating Voltage Range
V= 2.7–3.6V VCC
2.3–3.6V VCC (M25P available in 512Kb–4Mb;
M25PX available in 8Mb–16Mb)
Operating Temperature Range
6 = –40˚C to +85˚C
3 = Automotive: –40˚C to +125˚C + HR-certified test flow
Package Code
BA= PDIP8, 300 mils
MB= DFN, 3 x 2 (MLP)
MC= DFN, 3 x 4 (MLP)
ME= DFN, 8 x 6 (MLP)
MF= SOP2-16, 300 mils (SO16W)
MN= SOP2-8, 150 mils (SO8N)
MP= DFN, 6 x 5, (MLP)
MS= DFN, 6 x 5, sawn (MLP)
MW= SOP2-8, 208 mils (SO8W)
ZM= T-PBGA-24b05, 6 x 8 (TBGA 24)
E = ECOPACK package, standard tray packaging
F = ECOPACK package, tape and reel packaging
M29 = Standard Parallel NOR
Operating Voltage Range
Operating Temperature Range
W = 2.7–3.6V VCC
Density
400 = 4Mb
800 = 8Mb
160 = 16Mb
320 = 32Mb
640 = 64Mb
128 = 128Mb
256 = 256Mb
3 = –40˚C to +125˚C (automotive) 6 = –40˚C to +85˚C
Package Code
/NB = 56-pin TSOP, 14 x 20mm
N
N/NA = 48-pin TSOP, 12 x 20mm
ZA = 48-ball TBGA, 6 x 8mm, 0.8mm pitch (4Mb–64Mb)
64-ball TBGA, 10 x 13mm, 1mm pitch (128Mb/256Mb)
ZS = 64-ball FBGA, 11 x 13mm, 1mm pitch
ZF = 64-ball TBGA, 10 x 13mm, 1mm pitch
ZE = 48-ball TFBGA, 6 x 8mm, 0.8mm pitch
Silicon Version or Architecture Option
D, E, F, G
Functionality/Security
Speed
H = Uniform block (highest block protected)
L = Uniform block (lowest block protected)
B = Bottom boot (bottom blocks protected)
T = Top boot (top blocks protected)
45 = 45ns
5A = 55ns (automotive, temp range 6)
55 = 55ns
6A = 60ns (automotive, temp range 6)
60 = 60ns
7A = 70ns (automotive, temp range 6)
70 = 70ns
Part Numbering
Guides
Blank = SO Tube (MLP and BGA tray)
T = Tape and reel
Packaging
NOR Family Identifier
M29AW Automotive Uniform Block MLC Flash Memory
Part Numbering
your innovation. our memory.
JS 28F 512 M29AW H x
48
Package Code
JS= 56-pin TSOP, 14 x 20mm, RoHS
PC= 64-ball FBGA, 11x13mm, RoHS
Product Line Designator
28F = NOR parallel interface
Density
512 =512Mb
00A=1Gb
Device Features
(Optional) Assigned to cover packing media
and/or features or other specific configurations.
Packaging
B = Tape and reel
Functionality/Security
H = Uniform block (highest block protected by VPP/WP#)
L = Uniform block (lowest block protected by VPP/WP#)
Parallel NOR Family Identifier
M29AW = Automotive: Parallel Flash memory, uniform block, 3V core
49
M29DW Parallel NOR Flash Memory Part Numbering
M29F Automotive Single-Bank 5V Flash Memory Part Numbering
M29 DW 323 D T 70 N 6 E
M29F 160 F T 55 M 6
Packaging
NOR Family Identifier
E = ECOPACK package, standard tray packaging
F = ECOPACK package, tape and reel packaging
M29 = Standard Parallel NOR
Operating Voltage Range
DW = 2.7–3.6V VCC, multibank
Operating Temperature Range
Density
3 = –40˚C to +125˚C (automotive) 6 = –40˚C to +85˚C
323 = 32Mb, x8/x16
127 = 128Mb, x8/x16
128 = 128Mb, x16
256 = 256Mb, x16
Package Code
Silicon Version or Architecture Option
D, E, F, G
Functionality/Security
Speed
H = Uniform block (highest block protected)
L = Uniform block (lowest block protected)
B = Bottom boot (bottom blocks protected)
T = Top boot (top blocks protected)
5A = 55ns (automotive, temp range 6)
60 = 60ns
7A = 70ns (automotive, temp range 6)
70 = 70ns
Blank = Standard tray packaging
E = Standard tray packaging, RoHS
F = Tape and reel packaging, RoHS, 24mm
T = Tape and reel packaging, 24mm
M29F =Parallel NOR, single bank, top/bottom boot block,
5V supply voltage
Density
200 = 16Mb
400 = 32Mb
800 = 64Mb
160 = 128Mb
Litho
F = 110nm
Functionality/Security
B = Bottom boot (bottom blocks protected)
T = Top boot (top blocks protected)
Operating Temperature Range
3 = Automotive: –40˚C to +125˚C 6 = Automotive: –40˚C to +85˚C
Package Code
= SO44, 0.525in cu
M
N = 48-pin TSOP-1, 12 x 20mm, AL 4
ZA = 48-ball TBGA, 6 x 8mm, 0.8mm pitch
(only 8Mb, bottom boot)
Speed
55 = 55ns (temp range 3: –40˚C to +125˚C)
5A = 55ns (temp range 6: –40˚C to +85˚C)
Part Numbering
Guides
F = 56-pin TSOP
N
N = 48-pin TSOP
ZA = 64-ball TBGA
ZE = 48-ball TFBGA
Packaging
NOR Family Identifier
M29EW Parallel NOR Flash Memory Part Numbering
PC 28F 256 M29EW x H x
Package Code
Device Features
your innovation. our memory.
JR= 48-pin TSOP, RoHS, HF
JS= 56-pin TSOP, RoHS, HF
PC= Fortified 64-ball BGA, RoHS, HF
PZ= 48-pin BGA (RoHS, HF)
RC= Fortified 64-ball BGA
50
Product Line Designator
28F = NOR parallel interface
Density
032 =32Mb, x8/x16
064 =64Mb, x8/x16
128 =128Mb, x8/x16
256 =256Mb, x8/x16
(Optional) Assigned to cover packing media
and/or features or other specific configurations.
Functionality/Security
H = Uniform block (highest block protected)
L = Uniform block (lowest block protected)
B = Bottom boot (bottom two blocks protected)
T = Top boot (top two blocks protected)
Lithography
512 =512Mb, x8/x16
00A=1Gb, x8/x16
00B=2Gb (1Gb/1Gb), x8/x16
Blank = 65nm
Parallel NOR Family Identifier
M29EW = Parallel Flash memory, 3V core, 1.8–3.6V I/O
51
P30/P33 Parallel NOR Flash Memory Part Numbering
G18 Parallel NOR Flash Memory Part Numbering
PC 28F 128 P 33 T F 60 x
Device Features
Package Code
(Optional) Assigned to cover packing media
and/or features or other specific configurations.
JS = 56-pin TSOP, RoHS
PC= 64-ball Easy BGA, RoHS
RC= 64-ball Easy BGA
Micron Technology
Production Status
Blank = Production
ES = Engineering samples
Product Family
28G = G series Parallel NOR
Speed
Product Line Designator
Density
512 =512Mb, x16
00A=1Gb, x16
00B=2Gb (1Gb/1Gb), x16
Lithography
NOR Family Identifier
F = 65nm
P = P30/P33 Parallel NOR
Operating Temperature Range
Voltage
IT = –40˚C to +85˚C (Grade 3 AEC-Q100)
AT = –40˚C to +105˚C (Grade 2 AEC-Q100)
U = 1.7–2.0V
Density
Special Options
256= 256Mb
512= 512Mb
01G= 1Gb
A = Automotive quality
S = Standard
X = Product Longevity Program (PLP)
Stack
Security Features
A = Single die
0 = Standard features
Die Rev Code
Functionality
Operating Voltage Range
B = Bottom boot
T = Top boot
30 = 1.7–2.0V, 2.3–3.6V
33 = 2.7–3.6V
A = Rev. A
B = Rev. B
C = Rev. C
GC = 64-ball TBGA, 10 x 8 x 1.2mm
Interface
Block Structure
Package Codes
Part Numbering
Guides
60 = 60ns
65 = 65ns
70 = 70ns
75 = 75ns
85 = 85ns
95 = 95ns
Blank = Various speeds
28F = NOR parallel interface
640 =64Mb, x16
128 =128Mb, x16
256 =256Mb, x16
MT 28G U A A A 2 E GC - 0 S IT ES
E = Uniform
1 = x16
2 = x16 A/D MUX
P30/P33 Stacked
PC 48F 3000 P0 Z T Q E x
Package Code
your innovation. our memory.
P C= 64-ball Easy BGA, RoHS
PF = 88-ball Quad+ BGA, RoHS
RC= 64-ball Easy BGA
RD= 88-ball Quad+ BGA
52
Product Line Designator
48F = NOR parallel interface for stacked configurations
Density
3000= 128Mb, x16
4000= 256Mb, x16
4400= 512Mb (256Mb/256Mb), x16
NOR Family Identifier
P0 = P30/P33 Parallel NOR
Operating Voltage Range
Z = Individual chip enable(s), 1.7–2.0V VCC, 1.7–3.6V VCCQ
V = Virtual chip enable(s), 1.7–2.0V VCC, 1.7–3.6V VCCQ
X = Individual chip enable(s), 2.3–3.6V VCC, 2.3–3.6V VCCQ
T = Virtual chip enable(s), 2.3–3.6V VCC, 2.3–3.6V VCCQ
J3 Parallel NOR Flash Memory Part Numbering
Device Features
PC 28F 320 J 3 F 75
(Optional) Assigned to cover packing media
and/or features or other specific configurations.
Speed
60 = 60ns
65 = 65ns
70 = 70ns
75 = 75ns
85 = 85ns
95 = 95ns
Blank = Various speeds
Ballout Designator
Q = Quad+
0 = Discrete
Functionality
B = Bottom boot, top/bottom boot
T = Top boot
Package Code
JS = 56-pin TSOP, RoHS
PC= 64-ball Easy BGA, RoHS
RC= 64-ball Easy BGA
TE = 56-pin TSOP
Product Line Designator
28F = NOR parallel interface
Density
320 =32Mb, x8/x16
640 =64Mb, x8/x16
128 =128Mb, x8/x16
256 =256Mb, x8/x16
Speed
75 = 75ns
95 = 95ns
105 = 105ns
Lithography
F = 65nm with HR-certified test flow
D = 130nm
Operating Voltage Range
3 = 3V VCC, 3V VPEN
NOR Family Identifier
J = J3 Parallel NOR
53
M28W Parallel NOR Flash Memory Part Numbering
M58WR Parallel NOR Flash Memory Part Numbering
M28 W 160C T 70 N 6 T
M58 W R 016 K T 7A ZB 6 E
NOR Family Identifier
Packaging
M28 = Parallel NOR
Blank = Standard tray packaging
E = ECOPACK package, standard tray packaging
F = ECOPACK package, tape and reel packaging
U = ECOPACK package, tray packaging
Operating Voltage Range
W = 2.7–3.6V VDD, 1.65–3.6V VDDQ
Operating Temperature Range
Density/Functionality
160C = 16Mb, x16, boot block
320FC = 32Mb, x16, boot block
640HC = 64Mb, x16, boot block
6 = –40˚C to +85˚C
Package Code
Functionality
Speed
B = Bottom boot
T = Top boot
70 = 70ns
M58 = Parallel NOR
Packaging
E = Standard tray packaging
F = Tape and reel packaging
Flash Identifier
W = Multiple bank, burst mode
Operating Voltage Range
R = 1.7–2.0V VDD
Density/Functionality
016 = 16Mb, x16
032 = 32Mb, x16
064 = 64Mb, x16
Technology
K = 65nm process
Operating Temperature Range
6 = –40˚C to +85˚C
Package Code
ZB = 56-ball VFBGA
Automotive Temp Range
7A = Automotive-grade certified –40˚C to +85˚C
Functionality
B = Bottom boot
T = Top boot
Part Numbering
Guides
N = 48-pin TSOP
ZB = 46-ball TFBGA
NOR Family Identifier
M58BW Parallel NOR Flash Memory Part Numbering
M58 B W 32F T 4 T 3 T
NOR Family Identifier
M58 = Parallel NOR
Flash Identifier
your innovation. our memory.
B = Burst mode
54
Packaging
F = ECOPACK package, tape and reel packaging
T = Standard tray packaging
Operating Temperature Range
3 = –40˚C to +125˚C (automotive)
Operating Voltage Range
W = 2.7–3.6V VDD range for 45ns speed class
2.5–3.3V VDD range for 55ns speed class
2.4V–VDD VDDQ range for 45ns and 55ns speed classes
Density/Functionality
16F = 16Mb, x32, boot block, burst, 0.11µm process
32F = 32Mb, x32, boot block, burst, 0.11µm process
Package Code
T= 80-pin PQFP
ZA = 80-ball LBGA
Speed
4 = 45ns
5 = 55ns
Functionality
B = Bottom boot
T = Top boot
55
3xx and 4xx SSD Part Numbering
4xx and 5xx SSD Part Numbering
MT FD D AC 128 M x x - 1 G 1 2 xx xx ES
MT FD D AK 120 M AV - 1 AE 1 2 AB YY ES
Micron Technology
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
Flash Drive (SSD)
Drive Interface
Operating Temperature Range
A = SATA 1.5 Gb/s
B = SATA 3.0 Gb/s
D = SATA 6.0 Gb/s
G= PCIe Gen2
Blank = Commercial (0˚C to +70˚C)
Hardware Feature Set
Drive Form Factor
AA = 1.8in, 5mm, Micro SATA connector
AC = 2.5in, 9.5mm
AG = Full-height, full-length x8
AH = Full-height, half-length x8
AK = 2.5in, 7mm
AR = Half-height, half-length x8
AT=mSATA
Security Feature Set
Blank = Blank
1 = Contact factory
2 = SED (self-encrypting drive)
4 = Oprom 1 (Bootable) – P320h only
5 = UEFI – P320h only
Drive Density
001= 1GB
002= 2GB
004= 4GB
008= 8GB
014= 14GB
016= 16GB
025= 25GB
030= 30GB
032= 32GB
050= 50GB
060= 60GB
NAND Type
your innovation. our memory.
S=SLC
M=MLC
56
064= 64GB
120= 120GB
128= 128GB
175= 175GB
200= 200GB
256 = 256GB
350= 350GB
400= 400GB
512= 512GB
700= 700GB
BOM Revision
Production:
1 = 1st generation
2 = 2nd generation
3 = 3rd generation
Etc. ...
ES:
A = 1st generation
B = 2nd generation
C = 3rd generation
Etc. ...
NAND Component
A = 4Gb, SLC, x8, 3.3V, 72nm
B = 8Gb, SLC, x8, 3.3V, 50nm
C = 16Gb, MLC, x8, 3.3V, 50nm
D = 4Gb, SLC, x8, 3.3V, 50nm
E = 16Gb, MLC, x8, 3.3V, 34nm
F = 32Gb, MLC, x8, 3.3V, 34nm
G = 32Gb, MLC, x8, 3.3V, 34nm
H = 8Gb, SLC, x8, 3.3V, 50nm
J = 32Gb, MLC, x8, 3.3V, 25nm
K = 64Gb, MLC, x8, 3.3V, 25nm
L = 4Gb, SLC, x8, 3.3V, 34nm
M = 8Gb, SLC, x8, 3.3V, 34nm
N = 16Gb, SLC, x8, 3.3V, 34nm
Sector Size
1 = 512 byte
AE= C200/P200
AF= eUSB
AG= C300
AH= P320
AJ= e230
AL= P300
AM= C400
AN= P400m
AR= P400e
Product Family
Production Status
Blank = Production
ES = Engineering sample
MS = Mechanical sample
Flash Drive (SSD)
Drive Interface
Customer Designator
B = SATA 3.0 Gb/s
D = SATA 6.0 Gb/s
E = SAS 6.0 Gb/s
F = PCIe Gen1
G= PCIe Gen2
YY = Standard
Additional Features
AB = Standard
AF = Contact factory
Drive Form Factor
AA = 1.8in, 5mm, micro SATA connector
AC = 2.5in, 9.5mm
AG = Full-height, full-length x8
AH = Full-height, half-length x8
AK = 2.5in, 7mm
AR = Half-height, half-length x8
AT=mSATA
AV = M.2, 80mm x 22mm x 3.5mm
AW= 2.5in, 5mm
Drive Density
0 50 = 50GB
060 = 60GB
064 = 64GB
100 = 100GB
120 = 120GB
128 = 128GB
175 = 175GB
200 = 200GB
240 = 240GB
256 = 256GB
350 = 350GB
400 = 400GB
480 = 480GB
500 = 500GB
512 = 512GB
700 = 700GB
800 = 800GB
960 = 960GB
1T0 = 1024GB
1T4 = 1.4TB
Extended Firmware Features
Z = Blank
1 = Contact factory
2 = SED (self-encrypting drive)
3 = Oprom 1 (Bootable) – P420h only
4 = UEFI – P420h only
Sector Size
1 = 512 byte
AA = 32Gb, SLC, x8, 3.3V, 25nm
AB = 64Gb, MLC, x8, 3.3V, 25nm
AC = 64Gb, MLC, x8, 3.3V, 20nm
AD = 64Gb, MLC, x8, 3.3V, 20nm
AE = 128Gb, MLC, x8, 3.3V, 20nm
AF = 32Gb, MLC, x8, 3.3V, 34nm
AG = 32Gb, MLC, x8, 3.3V, 25nm
AH = 64Gb, MLC, x8, 3.3V, 20nm
AJ = 64Gb, SLC, x8, 3.3V, 20nm
NAND Component
NAND Type
S=SLC
M=MLC
Operating Temperature Range
Commercial (0˚C to +70˚C) for all SSDs
Part Numbering
Guides
Blank = Blank
AA = Contact factory
AB = Contact factory
AC = Contact factory
Micron Technology
BOM Revision
Production:
1 = 1st generation
2 = 2nd generation
3 = 3rd generation
Etc. ...
ES:
A = 1st generation
(P420m only)
B = 2nd generation
C = 3rd generation
Etc. ...
Product Family
AV = M500
AY = M550
AX = P420m
AZ = M510
57
Product Lifecycle
Solutions
Web Tools
Memory Choices for Mass Market
Distribution Customers
Micron’s Product Lifecycle Solutions bring the stability of our memory support into alignment with the
lifecycle of your design. Depending on your specific requirements, choose between our standard lifecycle
support and the extended support of our Product Longevity Program (PLP).
Standard Lifecycle Products
For customers with application lifecycles
of up to 7+ years
• Select
DRAM, NAND,
and NOR products
• Stability and longevity for
mission-critical applications with extensive
design-in or requalification requirements
• Minimum 10-year form, fit, function
compatibility from the date of introduction
• Extended 2-year conversion timeline in case
of part number change or discontinuance
Customizable Workspace
The Micron Workspace is where you can save and organize part pages, data sheets, and links for easy
access in the future.
•
Save parts, documents, and pages for fast and easy access
Organize documents and parts in folders
• Share parts, pages, or project folders with colleagues
• View secure documents that you already have access to view via My Documents
• Receive messages from Micron contacts in My Messages
•
Micron Blog
micronblogs.com
Join the conversation at Micron’s blog, where we highlight our recent technology developments—from
advanced storage solutions to the cutting edge of server, computing, and mobile memory.
Extensive Support Resources
micron.com/support
•
Technical notes
FBGA decoder
• Part numbering guides
• General FAQs
• Purchasing information
•
Micron System Power Calculator
micron.com/powercalc
Web Tools
58
For customers with
application lifecycles
of up to 7–10+ years
Visit micron.com to find all of our detailed product specification data, including part status, recommended
parts (where applicable), disty stock and sample information, data sheets, and modeling tools. You also
can find information about our plans for long-term product support, design webinars, and product FAQs.
Product Lifecycle
Solutions
LPDRAM, NOR, SLC/ MLC NAND,
•
e MMC, MCPs, SSDs, and other products
• One-stop supplier for a broad range of
applications
• Leading-edge technology, optimum
performance/feature combinations,
multiple densities, cost-effective products
• Optimum performance/feature combinations,
multiple densities, cost-effective products
• Strong record of long-term support for legacy
products
• Up to 5-year roadmap visibility for standard
products
• Standard JEDEC conversion and
discontinuance time lines apply
your innovation. our memory.
• DRAM,
Product Longevity
Program (PLP)
One-Stop Product Catalogs
Sales Representative Lookup
micron.com/how-to-buy
Locate a sales representative in your area who can help you buy products, create a corporate account,
and gain expertise.
©2011 Micron Technology, Inc. All rights reserved. Micron, the Micron logo, and ClearNAND are trademarks of Micron Technology, Inc. RLDRAM is a trademark of Qimonda
AG in various countries, and is used by Micron Technology, Inc. under license from Qimonda. CellularRAM is a registered trademark of Micron Technology, Inc., inside the U.S.
and a trademark of Qimonda AG outside the U.S. All other trademarks are the property of their respective owners. Lead is not intentionally added by Micron during the
manufacturing process, but it can be present in trace amounts in the raw materials used to manufacture the finished products. Products are warranted only to meet Micron’s
production data sheet specifications. Products and specifications are subject to change without notice. Rev. 10/14 EN.L
59
Product Lifecycle
For data sheets, technical notes,
and other product and sales
information, visit Micron’s
web site or phone us today.
micron.com
(208) 368-3900
(011) +1 (208) 368-3900