SEOUL MBT801

Z-Power LED
X10490
Technical
Data
Sheet
Specification
MBT801
SSC
Drawn
Approval
Customer
Approval
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
MBT801
1. Features
2. Absolute Maximum Ratings
3. Electro Characteristics
4. Optical characteristics
5. Outline Dimension
6. Packing
7. Soldering
8. Precaution for use
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
MBT801
MBT801
Features
Description
This surface-mount LED
comes in PLCC standard
package dimension. It has a
substrate made up of a
molded plastic reflector
sitting on top of a bent lead
frame. The die is attached
within the reflector cavity
and the cavity is
encapsulated by epoxy or
silicone
The package design coupled
with careful selection of
component materials allow
these products to perform
with high reliability in a
larger temperature range 40℃ to 100℃. The high
reliability feature is crucial to
Automotive interior and
Indoor ESS.
사진
• Industry Standard
PLCC SMT package
• High brightness
using AlInGaP and
InGaN dice
technologies
• Available in multiple
colors
• High volume, high
reliability
Applications
• Interior automotive
• Electronic Signs and
Signals
• Office Automation,
Electrical Appliances,
Industrial Equipment
Rev. 09
December 2006
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
1. Features
• BLUE colored SMT package
• Material InGaN/SiC
• Suitable for all SMT assembly methods
Suitable for all soldering methods
• RoHS Compliant
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
2. Absolute maximum ratings
Parameter
Symbol
Value
Unit
Power Dissipation
Pd
120
mW
Forward Current
IF
30
mA
Peak Forward Current
IFM *2
90
mA
Reverse Voltage
VR
5
V
Topr
-40 ~ +100
oC
Tstg
-40 ~ +100
oC
Operating
Temperature
Storage Temperature
*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
*2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio.
3. Electric characteristics
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Forward Voltage
VF
IF
=20mA
2.7
3.2
4.0
V
Reverse Current
IR
VR=5V
-
-
10
µA
IV
IF
=20mA
70
335
600
mcd
Peak Wavelength
λP
IF
=20mA
-
465
-
nm
Dominant Wavelength
λd
IF
=20mA
464
470
476
nm
Spectral Bandwidth 50%
∆λ
IF
=20mA
-
23
-
nm
IF
=20mA
-
120
-
deg.
Luminance Intensity
Viewing Angle
*2
*1
2θ
½
*1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the
mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%
*2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Relative Luminous Intensity vs Forward Current
Forward Current vs. Forward Voltage
(Ta=25 OC )
10
1
2.6
2.8
3.0
3.2
3.4
3.6
3.8
(Ta=25 OC )
1.6
Relative Luminous Intensity Iv/Iv [Rel]
100
Forward Current IF [mA]
Z-Power LED
X10490
Technical
Data
Sheet
4. Optical characteristics
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
4.0
0
5
10
15
20
25
30
Forward Current IF [mA]
Forward Voltage VF (V)
Radiation Diagram
Forward Current Derating Curve
(Ta=25 C )
O
40
Forward Current IF [mA]
0
-30
30
20
-60
30
60
10
-90
0
-40
-20
0
20
40
60
80
100
90
120
Ambient Temperature TA [OC]
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Recommended Solder Pattern
1.9
2.8
0.15
1.8
0.8
2.2
1.6
0.8
Anode
1.8
3.2
2.4
1.6
Cathode
Cathode Mark
2.2
( Tolerance: ±0.2, Unit: mm )
6. packing
1.75±0.1
1 .5 5 ± 0 .0 5
4 .0 ±0 .1
2 .0 ±0 .0 5
0 .2 2 ±0 .0 5
3.83±0.1
5°
3.5±0.1
8±0.1
1 .0 ±0 .1
8°
3 .1 ±0 .1
2 .2 2 ±0 .1
11.4 ± 0.1
180 +0
-3
9.0 ± 0.3
LABLE
2.0 ± 0.2
13
30°
10
±0.2
60
Z-Power LED
X10490
Technical
Data
Sheet
5.outline dimension
22
(1) Quantity : 2000pcs/Reel
(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm
(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned
off from the carrier tape at the angle of 10º to the carrier tape
(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
● Reel Packing Structure
Reel
XXX
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
HUMIDITY INDICATOR
DESI PAK
Aluminum Vinyl Bag
XXX
RANK:
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
Outer Box Structure
Material : Paper(SW3B(B))
SIZE (mm)
TYPE
a
c
b
7inch 245 220 142
1 SIDE
c
XXX
RANK:
1
QUANTITY : XXXX
LOT NUMBER : XXXXXXXXXX
PART NUMBER :
TOP LED
RoHS
XXXXXX
SEOUL SEMICONDUCTOR CO., LTD.
b
a
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
7. soldering
(1) Lead Solder
Lead Solder
Lead Solder
2.5~5 o C / sec.
Pre-heat
120~150℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
240℃ Max.
Soldering time
Condition
10 sec. Max.
2.5~5 C / sec.
Pre-heating
120~150 oC
240 oC Max.
10 sec. Max.
60sec. Max.
Above 200 oC
120sec. Max.
(2) Lead-Free Solder
Lead-frame Solder
1~5 o C / sec.
Lead Free Solder
Pre-heat
150~200℃
Pre-heat time
120 sec.
Max.
Peak-Temperature
260℃ Max.
Soldering time
Condition
10 sec. Max.
1~5 o C / sec.
Pre-heating
150~200 o C
260 oC Max.
10 sec. Max.
60sec. Max.
Above 220 oC
120sec. Max.
(3) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)
Z-Power LED
X10490
Technical
Data
Sheet
8. precaution for use
(1) Storage
In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a
desicator) with a desiccant. Otherwise, to store them in the following
environment is recommended.
Temperature : 5ºC ~30ºC Humidity : maximum 70%RH
(2) Attention after open.
LED is correspond to SMD, when LED be soldered dip, interfacial separation may
affect the light transmission efficiency, causing the light intensity to drop. Attention
in followed; Keeping of a fraction
Temperature : 5 ~ 40ºC Humidity : less than 10%
(3) In the case of more than 1 week passed after opening or change color of
indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC.
(4) Any mechanical force or any excess vibration shall not be accepted to apply
during cooling process to normal temperature after soldering.
(5) Quick cooling shall be avoided.
(6) Components shall not be mounted on warped direction of PCB.
(7) Anti radioactive ray design is not considered for the products.
(8) This device should not be used in any type of fluid such as water, oil, organic
solvent etc. When washing is required, IPA should be used.
(9) When the LEDs are illuminating, operating current should be decided after
considering the ambient maximum temperature.
(10) The LEDs must be soldered within seven days after opening the moisture-proof
packing.
(11) Repack unused products with anti-moisture packing, fold to close any opening
and then store in a dry place.
(12) The appearance and specifications of the product may be modified for
improvement without notice.
Rev. 00
November 2007
www.ZLED.com
Document No. : SSC-QP-7-07-24 (Rev.00)