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Product Data Sheet
ZC40 – Z-Power COB
Superior high Flux for High Current System
Z Power Chip on board – ZC series, ZC40
SDW05F1C, SDW85F1C
28 x 28 (㎟)
RoHS
Product Brief
Description
Features and Benefits
•
•
The ZC(Z-Power Chip on board) series are
High Flux and High Efficiency.
•
•
•
•
•
•
It is COB (Chip On Board) series designed
for easy to attach to lighting fixture directly
without reflow process.
•
Super high Flux output and high
Luminance
Designed for high current operation
Design flexibility
MacAdam 3-step
Lead Free product
RoHS compliant
ZC series' thermal management perform
exceeds other power LED solutions.
•
•
MacAdam 3 step, 4-step available including
Key Applications
ANSI.
•
•
•
•
•
•
•
•
Provide COB total solution available(Optic,
reflector, holder etc.)
•
The Z-Power LED is ideal light sources for
general illumination applications, custom
designed solutions, and high performance
Outdoor lighting
Down Light
Street Light
Security Light
Architectural lighting
Decorative / Pathway lighting
Automotive
Decorative / Pathway lighting
lights.
Table 1. Product Selection Table
CCT
Part Number
Color
Min.
Typ.
Max.
SDW05F1C
Cool White
4700K
5300K
6000K
SDW85F1C
Neutral White
3700K
4000K
4200K
SDW85F1C
Warm White
3000K
SDW85F1C
Warm White
2700K
Rev1.0, August 6, 2013
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Product Data Sheet
ZC40 – Z-Power COB
Table of Contents
Index
•
Product Brief
•
Table of Contents
•
Product Nomenclature (Labeling Information)
•
Performance Characteristics
-
Relative Spectral Distribution
-
Luminous Flux Characteristics
-
Forward Current Characteristics
-
Junction Temperature Characteristics
-
Ambient Temperature Characteristics
•
Color Bin Structure
•
Packaging Information
-
Mechanical Dimensions
-
Tray packaging structure
-
Packing (bag & box)
•
Handling of Silicone Resin for LEDs
•
Precaution For Use
•
Revision History
•
Company Information
Rev1.0, August 6, 2013
2
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Product Data Sheet
ZC40 – Z-Power COB
Product Nomenclature
Table 2. Part Numbering System : X1X2X3 X4X5 X6X7 X8
Part Number Code
Description
Part Number
X1
Company
S
X2
Package series
D
X3
Color Specification
W0
White
W8
CRI 80
X4
Value
X5
Series number
5
X6
Lens type
F
Flat
X7
PCB type
1
PCB
X8
Revision number
C
New COB type
Table 3. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13
Lot Number Code
Description
Y1Y2
Year
Y3Y4
Month
Y5Y6
Day
Y7Y8Y9Y10
Mass order
Y11Y12Y13
Tray No.
Rev1.0, August 6, 2013
Lot Number
3
Value
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Product Data Sheet
ZC40 – Z-Power COB
Performance Characteristics
Table 4. Product Selection Guide, TA = 25ºC, RH30%
CCT (K)
Part Number
[1]
Typical
Luminous Flux [2]
ФV [3] (lm)
Typical Forward
Voltage (Vf) [4]
CRI [5],
Ra
Viewing
Angle
(degrees)
2Θ ½
Typ.
1000mA
1280mA*
1000mA
1280mA*
Min.
Typ.
SDW05F1C
5000
5030
6030
37
38.5
70
120
SDW85F1C
4000
4650
4860
37
38.5
80
120
SDW85F1C
3000
4300
5160
37
38.5
80
120
SDW85F1C
2700
4100
4920
37
38.5
80
120
Notes :
1.
Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate : 0.01, CCT 5% tolerance.
2.
SSC maintains a tolerance of ±7% on flux and power measurements.
3.
ФV is the total luminous flux output as measured with an integrating sphere.
4.
Tolerance is ±2.5V on forward voltage measurements.
5.
Tolerance is ±2 on CRI measurements.
* Calculated performance values are for reference only.
Rev1.0, August 6, 2013
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Product Data Sheet
ZC40 – Z-Power COB
Performance Characteristics
Table 5. Characteristics, TA = 25ºC, RH30%
Value
Parameter
Symbol
Unit
Min.
Typ.
Max.
Forward Current
IF
-
1.0
1.28
A
Power Dissipation
Pd
-
37.2
48.8
W
Tj
-
-
125
ºC
Operating Temperature
Topr
-40
-
85
ºC
Storage Temperature
Tstg
-40
-
100
ºC
Thermal resistance (J to S)
RθJ-S
-
0.4
-
K/W
ESD Sensitivity(HBM) [2]
-
-
-
±8
kV
Junction Temperature
[1]
Notes :
1.
IF  1280mA
2.
At thermal Resistance, J to S means junction to COB’s metal pcb bottom.
3.
A zener diode is included to protect the product from ESD.
Rev1.0, August 6, 2013
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Product Data Sheet
ZC40 – Z-Power COB
Relative Spectral Distribution
Fig 1. Color Spectrum, Ta = 25℃, IF = 1000mA, RH30%
Cool white
Neutral white
Warm white
Relative Radiant Power [%]
1.0
0.8
0.6
0.4
0.2
0.0
300
400
500
600
700
800
Wavelength [nm]
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Product Data Sheet
ZC40 – Z-Power COB
Luminous Flux Characteristics
Fig 2. Radiant pattern, IF = 1000mA
1.1
1.0
Relative Intensity [%]
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
-90 -80 -70 -60 -50 -40 -30 -20 -10 0
10 20 30 40 50 60 70 80 90
Angular Displacement [degrees]
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Product Data Sheet
ZC40 – Z-Power COB
Forward Current Characteristics
Fig 3. Forward Voltage vs. Forward Current , Ta=25℃
1.4
Forward Current [A]
1.2
1.0
0.8
0.6
0.4
0.2
0.0
10
15
20
25
30
35
40
Forward Volatage [V]
Fig 4. Forward Current vs. Relative Luminous Flux, Ta=25℃
140
Relative luminous flux [%]
120
100
80
60
40
20
0
0
200
400
600
800
1000
1200
1400
Forward Current [mA]
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Product Data Sheet
ZC40 – Z-Power COB
Forward Current Characteristics
Fig 5. Forward Current vs. CIE X, Y Shift , Ta=25℃ (Warm white)
0.02
CIE(X)
CIE(Y)
Relative variation
0.01
0.00
-0.01
-0.02
0
100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
Forward Current [mA]
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Product Data Sheet
ZC40 – Z-Power COB
Junction Temperature Characteristics
Fig 6. Relative Light Output vs. Junction Temperature, IF=1000mA
120
Relative luminous flux [%]
100
80
60
40
20
0
40
60
80
100
120
o
Junction Temperature [ C]
Fig 7. Junction Temp. vs. CIE X, Y Shift, IF=1000mA (Warm white)
0.02
CIE(X)
CIE(Y)
Relative variation
0.01
0.00
-0.01
-0.02
25
50
75
100
125
150
o
Junction Temperature [ C]
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Product Data Sheet
ZC40 – Z-Power COB
Ambient Temperature Characteristics
Fig 8. Maximum Forward Current vs. Ambient Temperature, Tj(max.) = 125℃, IF=1.28A
1600
Maximum Current [mA]
1400
1200
1000
Rth(j-a)=0.6K/W
800
Rth(j-a)=1.0K/W
600
Rth(j-a)=1.4K/W
400
200
0
0
20
40
60
80
100
120
o
Ambient Temperature [ C]
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Product Data Sheet
ZC40 – Z-Power COB
Color Bin Structure
Table 6. Bin Code description
Luminous Flux (lm)
@ IF = 1000mA
Part Number
Bin Code
Min.
Max.
K1
3900
4500
K2
4500
5100
L1
5100
J2
SDW05F1C
SDW85F1C
Rev1.0, August 6, 2013
Color
Chromaticity
Coordinate
@ IF = 1000mA
Typical Forward
Voltage (Vf)
Bin Code
Min.
Max.
D
32.0
36.0
5800
E
36.0
40.0
3400
3900
D
32.0
36.0
K1
3900
4500
K2
4500
5100
E
36.0
40.0
Refer to page.13
Refer to page.14
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Product Data Sheet
ZC40 – Z-Power COB
Color Bin Structure
CIE Chromaticity Diagram (Cool white), Ta=25℃, IF=1000mA
0.38
ANSI
4700K
5000K
0.37
C1
5300K
C0
CIE Y
0.36
C3
5600K
0.35
B1
C2
6000K
0.34
B0
B3
B2
B5
C5
C4
B4
0.33
0.32
0.31
0.32
0.33
0.34
0.35
0.36
CIE X
B0
CIE x
0.3207
0.3212
0.3293
0.3292
B1
CIE y
0.3462
0.3389
0.3461
0.3539
CIE x
0.3292
0.3293
0.3373
0.3376
CIE y
0.3384
0.3306
0.3369
0.3451
CIE x
0.3222
0.3226
0.3295
0.3294
CIE y
0.3616
0.3534
0.3601
0.3687
CIE x
0.3463
0.3456
0.3539
0.3552
CIE y
0.3514
0.3428
0.3487
0.3578
CIE x
0.3366
0.3364
0.3433
0.3440
B5
CIE x
0.3293
0.3294
0.3366
0.3369
CIE y
0.3243
0.3178
0.3234
0.3306
CIE x
0.3294
0.3295
0.3364
0.3366
CIE y
0.3687
0.3601
0.3669
0.3760
CIE x
0.3373
0.3369
0.3448
0.3456
CIE y
0.3369
0.3288
0.3345
0.3428
CIE x
0.3440
0.3433
0.3500
0.3514
CIE x
0.3293
0.3293
0.3369
0.3373
CIE y
0.3306
0.3234
0.3288
0.3369
CIE x
0.3200
0.3207
0.3292
0.3290
CIE y
0.3534
0.3451
0.3514
0.3601
CIE x
0.3456
0.3448
0.3526
0.3539
CIE y
0.3428
0.3345
0.3400
0.3487
CIE x
0.3381
0.3376
0.3463
0.3470
CIE x
0.3217
0.3222
0.3294
0.3293
CIE y
0.3572
0.3462
0.3539
0.3656
CIE x
0.3290
0.3292
0.3376
0.3381
CIE y
0.3601
0.3514
0.3578
0.3669
CIE x
0.3369
0.3366
0.3440
0.3448
CIE y
0.3740
0.3616
0.3687
0.3810
CIE x
0.3470
0.3463
0.3552
0.3572
CIE y
0.3316
0.3243
0.3306
0.3384
B9
C3
C7
13
B4
CIE y
0.3461
0.3384
0.3451
0.3534
B8
C2
C6
Rev1.0, August 6, 2013
B3
CIE y
0.3389
0.3316
0.3384
0.3461
B7
C1
C5
CIE x
0.3448
0.3440
0.3514
0.3526
CIE x
0.3212
0.3217
0.3293
0.3293
B6
C0
CIE x
0.3376
0.3373
0.3456
0.3463
B2
CIE y
0.3539
0.3461
0.3534
0.3616
CIE y
0.3656
0.3539
0.3616
0.3740
C4
C8
CIE y
0.3451
0.3369
0.3428
0.3514
C9
CIE y
0.3810
0.3687
0.3760
0.3891
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Product Data Sheet
ZC40 – Z-Power COB
Color Bin Structure
CIE Chromaticity Diagram (Warm white), Ta=25℃, IF=1000mA
3-step (E10, G10, H10)
4-step (E11, G11, H11)
ANSI
0.44
2600K
2700K
2900K
3000K
0.42
3200K
H22
H11
G21
H10
G11
3700K
CIE Y
H21
G22
G10
0.40
4000K
H23
E22
4200K
E21
0.38
H24
G24
G23
E11
E10
E24
E23
0.36
0.34
0.36
0.38
0.40
0.42
0.44
0.46
0.48
CIE X
E10
CIE x
0.3764
0.3793
0.3840
0.3854
CIE y
0.3713
0.3828
0.3887
0.3768
3-STEP
G10
CIE x
CIE y
0.4267 0.3946
0.4328 0.4079
0.4422 0.4113
0.4355 0.3977
H10
CIE x
0.4502
0.4576
0.4667
0.4588
E11
CIE y
0.4020
0.4158
0.4180
0.4041
CIE x
0.3744
0.3782
0.3912
0.3863
CIE y
0.3685
0.3837
0.3917
0.3758
4-STEP
G11
CIE x
CIE y
0.4242 0.3919
0.4322 0.4096
0.4449 0.4141
0.4359
0.396
H11
CIE x
CIE y
0.4475 0.3994
0.4573 0.4178
0.4695 0.4207
0.4589 0.4021
ANSI
E21
CIE x
0.3703
0.3736
0.3871
0.3849
0.3784
0.3765
E22
CIE y
0.3726
0.3874
0.3959
0.3881
0.3841
0.3765
CIE x
0.3890
0.3914
0.3849
0.3871
0.4006
0.3952
CIE y
0.3990
0.4165
0.4212
0.4122
0.4100
0.4011
CIE x
0.4406
0.4451
0.4387
0.4430
0.4562
0.4468
CIE y
0.4077
0.4260
0.4289
0.4197
0.4182
0.4090
CIE x
0.4644
0.4697
0.4636
0.4687
0.4810
0.4703
G21
CIE x
0.4223
0.4299
0.4430
0.4387
0.4324
0.4284
CIE x
0.3670
0.3703
0.3765
0.3746
0.3806
0.3784
CIE y
0.4055
0.4145
0.4122
0.4212
0.4260
0.4077
CIE x
0.4147
0.4223
0.4284
0.4243
0.4302
0.4259
CIE y
0.4118
0.4211
0.4197
0.4289
0.4319
0.4132
CIE x
0.4373
0.4468
0.4526
0.4477
0.4534
0.4483
G22
H21
CIE x
0.4468
0.4562
0.4687
0.4636
0.4575
0.4526
E23
CIE y
0.3842
0.3922
0.3881
0.3959
0.4044
0.3880
CIE x
0.3784
0.3806
0.3865
0.3890
0.3952
0.3898
CIE y
0.3814
0.3990
0.4011
0.3922
0.3943
0.3853
CIE x
0.4259
0.4302
0.4361
0.4406
0.4468
0.4373
CIE y
0.3893
0.4077
0.4090
0.3998
0.4012
0.3919
CIE x
0.4483
0.4534
0.4591
0.4644
0.4703
0.4593
G23
H22
Rev1.0, August 6, 2013
E24
CIE y
0.3578
0.3726
0.3765
0.3689
0.3725
0.3647
G24
H23
14
CIE y
0.3647
0.3725
0.3762
0.3842
0.3880
0.3716
CIE y
0.3853
0.3943
0.3964
0.4055
0.4077
0.3893
H24
CIE y
0.3919
0.4012
0.4025
0.4118
0.4132
0.3944
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Product Data Sheet
ZC40 – Z-Power COB
Mechanical Dimensions
Circuit
Notes :
1.
2.
3.
All dimensions are in millimeters.
Scale : none
Undefined tolerance is ±0.2mm
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Product Data Sheet
ZC40 – Z-Power COB
Tray Packing Structure
Notes :
1.
2.
3.
Quantity : 12pcs/Tray
All dimensions are in millimeters (tolerance : ±0.3)
Scale none
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Product Data Sheet
ZC40 – Z-Power COB
Packaging (Bag and box)
1. Moisture-proof bag
*1,2
X9 X10 X11X12X13
12
X1 X2 X3 X4 X5 X6 X7X8
- Desiccant
- Humidity Indicator
2. Outer Box Structure
1
SIDE
X9 X10 X11X12X13
1
X1 X2 X3 X4 X5 X6 X7X8
Notes :
1.
Heat Sealed after packing (Use Zipper Bag)
2.
Quantity : 1 Tray(12pcs) /Bag
: Max 2 Bag /Box(ⓒ80), Max 4 Bag /Box(ⓒ142)
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Product Data Sheet
ZC40 – Z-Power COB
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.
(3) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of wire.
(4) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be
assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not
recommended. Ultrasonic cleaning may cause damage to the LED.
(5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(6) Avoid leaving fingerprints on silicone resin parts.
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Product Data Sheet
ZC40 – Z-Power COB
Precaution for Use
(1) Storage
To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a
desiccant.
The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%.
(2) Use Precaution after Opening the Packaging. Pay attention to the following:
a. Recommend conditions after opening the package
- Sealing
- Temperature : 5 ~ 40℃ Humidity : less than RH30%
b. If the package has been opened more than 4 week or the color of the desiccant changes.
(3) For manual soldering
SSC recommends the soldering condition (ZC series product is not adaptable to reflow process)
a. Use lead-free soldering
b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C.
c. Before proceeding the next step, product temperature must be stabilized at room temperature.
(4) Components should not be mounted on warped (non coplanar) portion of PCB.
(5) Radioactive exposure is not considered for the products listed here in.
(6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically
disposed of.
(7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc.
When washing is required, IPA (Isopropyl Alcohol) should be used.
(8) When the LEDs are in operation the maximum current should be decided after measuring the
package temperature.
(9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more
after being shipped from SSC, a sealed container with vacuum atmosphere should be used for
storage.
(10) The appearance and specifications of the product may be modified for improvement without
notice.
(11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration.
(12) Attaching LEDs, do not use adhesive that outgas organic vapor.
(13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the
reverse voltage is applied to LED, migration can be generated resulting in LED damage.
(14) Please do not touch any of the circuit board, components or terminals with bare hands or metal
while circuit is electrically active.
(15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures
can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic
energy. The result can be a significant loss of light output from the fixture. Knowledge of the
properties of the materials selected to be used in the construction of fixtures can help prevent
these issues.
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Product Data Sheet
ZC40 – Z-Power COB
Revision History
Revision
Date
Page
1.0
2013-07-12
All
Remarks
Initial release of preliminary data sheet applied
Published by
Seoul Semiconductor © 2013 All Rights Reserved.
Company Information
Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light
emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back
lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000
patents globally, while offering a wide range of LED technology and production capacity in areas such
as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced AC LED, and "Acrich
MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad
product portfolio includes a wide array of package and device choices such as Acrich, high-brightness
LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors.
The company is vertically integrated from epitaxial growth and chip manufacture in it’s fully owned
subsidiary, Seoul Optodevice, through packaged LEDs and LED modules in three Seoul
Semiconductor manufacturing facilities. Seoul Optodevice also manufactures a wide range of unique
deep-UV wavelength devices.
Legal Disclaimer
Information in this document is provided in connection with Seoul Semiconductor products. With
respect to any examples or hints given herein, any typical values stated herein and/or any information
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Rev1.0, August 6, 2013
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