EP Reliability Information

Texas Instruments Enhanced Plastic (EP) products provide a means to facilitate, not
replace, OEM qualification of COTS devices through baseline control and enhanced
qualification pedigree. TI EP package qualification comprehends performance at
extended temperatures with package element concerns such as glass transition
temperature and thermal expansion coefficients taken into account. Electrical testing is
warranted to meet the data sheet over the specified temperature range.
EP devices are qualified in accordance with TI Quality System Standards. Reliability
monitors are performed on a regular basis and include EFR/IFR (life test), temperature
cycle, and Biased Humidity (or HAST). TI Quality System Standards are based upon
accepted JEDEC and EIA standards for the test methods used.
In specific cases, when noted on the TI Enhanced Plastic Data sheet, long term hightemperature storage and/or extended use at maximum recommended operating
temperatures may result in a reduction of overall device life. The following information
is provided as a guide for those specific cases. Please see the attached Enhanced Plastic
disclaimer for more information.
Enhanced Plastic Quality and Reliability Data Disclaimer
The quality and reliability information provided by Texas Instruments is specific to the TI
Enhanced Plastic product family of plastic encapsulated commercial-off-the-shelf (COTS)
semiconductor products and components. Due to possible differences in product assembly and
test baselines, this information is NOT APPLICABLE to TI standard, industrial, or automotive
catalog commercial products.
Plastic encapsulated TI semiconductor devices are not designed and are not warranted to be
suitable for use in some military applications and/or military environments. Use of plastic
encapsulated TI semiconductor devices in military applications and/or military environments, in
lieu of hermetically sealed ceramic devices, is understood to be fully at the risk of Buyer.
Quality and reliability data provided by Texas Instruments is intended to be an estimate of product
performance based upon history only. It does not imply that any performance levels reflected in
such data can be met if the product is operated outside the conditions expressly stated in the
latest published data sheet for a device.
Existing industry standards for plastic encapsulated microcircuit qualification and reliability
monitors are based upon historical data, experiments, and field experience with the use of these
devices in commercial and industrial applications. The applicability of these standards in
determining the suitability for use and safety performance in military and aerospace applications
has not been established. Due to the multiple variations in field operating conditions, a
component manufacturer can only base estimates of product life on models and the results of
package and die level qualification.
The buyer’s use of this data, and all consequences of such use, is solely the buyer’s
responsibility. Buyer assumes full responsibility to perform sufficient engineering and additional
qualification testing in order to properly evaluate the buyer’s application and determine whether a
candidate device is suitable for use in that application. The information provided by TI shall not be
considered sufficient grounds on which to base any such determination.
THIS INFORMATION IS PROVIDED "AS IS" WITHOUT ANY EXPRESS OR
IMPLIED WARRANTY OF ANY KIND INCLUDING WARRANTIES OF
MERCHANTABILITY, NONINFRINGEMENT OF INTELLECTUAL PROPERTY,
OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT SHALL TI OR
ITS SUPPLIERS BE LIABLE FOR ANY DAMAGES WHATSOEVER
(INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS OF PROFITS,
BUSINESS INTERRUPTION, LOSS OF INFORMATION) ARISING OUT OF
THE USE OF OR INABILITY TO USE THE INFORMATION, EVEN IF TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
THIS INFORMATION SHOULD NOT BE USED TO ASSIST IN THE PRACTICE
OF “UPRATING” OR “UPSCREENING” DEVICES FOR USE BEYOND THEIR
RATED LIMITS.
TI may provide technical, applications or design advice, quality characterization,
and reliability data or service providing these items shall not expand or otherwise
affect TI's warranties as set forth in the Texas Instruments Incorporated Standard
Terms and Conditions of Sale for Semiconductor Products and no obligation or
liability shall arise from TI's provision of such items.
Quality and Reliability Data copyright © 2002, Texas Instruments Incorporated, all rights reserved.
Wirebond Life Calcuator
1 of 1
http://www.milasic.mo.ti.com/~andy/cgi-bin/htsl/index.cgi
Wirebond Life Estimator
Elevated Temperature Kirkendall Voiding Fail Mode
only valid for die pads with Al surface - N/A if pads have other types of surface metal (BOAC, Cu etc.)
1. Select Mold Compound
GE1030MDP
2. Junction Temp
136
Std
Standard Plot
Std
Calculate
OR
2. Ambient, Tja and Power
Tj(C)
Ta(C)
Power(W)
Tja(C/W)
Min Temp
Max Temp Alternate Title
Estimated Wirebond Life is 57123 hours(6.5 Years)
Reference Assessing Encapsulant Impact on Ball Bond Life
Any questions or comments regarding this area should go to :
Andy Pauley 903-868-6379
2/21/2006 2:30 PM
OPERATING LIFE DERATING TABLE - LM2901QPWREP
1/TF versus 1/Tj in ºK
0.0001
150C (21.6K HRS, 2.5 YRS)
145C (38.4K HRS, 4.4 YRS)
1/tf in Hours
140C (69.0K HRS, 7.9 YRS)
0.00001
135C (126.0K HRS, 14.4 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
Wirebond Life Calcuator
1 of 1
http://www.milasic.mo.ti.com/~andy/cgi-bin/htsl/index.cgi
Wirebond Life Estimator
Elevated Temperature Kirkendall Voiding Fail Mode
only valid for die pads with Al surface - N/A if pads have other types of surface metal (BOAC, Cu etc.)
1. Select Mold Compound
GE1030MDP
2. Junction Temp
142
Std
Official Plot
Std
Calculate
OR
2. Ambient, Tja and Power
Tj(C)
Ta(C)
Power(W)
Tja(C/W)
Min Temp
Max Temp Alternate Title
Estimated Wirebond Life is 29181 hours(3.3 Years)
Reference Assessing Encapsulant Impact on Ball Bond Life
Any questions or comments regarding this area should go to :
Andy Pauley 903-868-6379
2/24/2006 2:44 PM
OPERATING LIFE DERATING TABLE - SM320VC33PGEA120EP
1/TF versus 1/Tj in ºK
0.0001
1/tf in Hours
110C (55.6K HRS, 6.3 YRS)
105C (76.9K HRS, 8.8 YRS)
R2 = 0.9881
0.00001
100C (142.8K HRS, 16.3 YRS)
95C (217.2K HRS, 24.8 YRS)
Notes:
0.000001
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature (does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
1/Tj in Deg K
OPERATING LIFE DERATING TABLE - SN65LBC176QDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74AC04MDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74AC14MDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74AC244MDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74AC373MDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74ACT244MDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74ACT373MDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74ACT74MDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC04AQDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC138AQDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC373AQDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC374AQDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC540AQDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC541AQDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC573AQDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVC574AQDWREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVTH244AQDBREP
1/TF versus 1/Tj in ºK
0.0001
145C (24.4K HRS, 2.8 YRS)
1/tf in Hours
140C (43.5K HRS, 5 YRS)
135C (79.01K HRS, 9 YRS)
0.00001
130C (145.6K HRS, 16.6 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SN74LVTH244AQPWREP
1/TF versus 1/Tj in ºK
0.0001
150C (21.6K HRS, 2.5 YRS)
145C (38.4K HRS, 4.4 YRS)
1/tf in Hours
140C (69.0K HRS, 7.9 YRS)
0.00001
135C (126.0K HRS, 14.4 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - TLC2274xDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - UC1843AMDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - UCC2808AQDREP
1/TF versus 1/Tj in ºK
0.0001
140C (29.1K HRS, 3.3 YRS)
1/tf in Hours
135C (51.0K HRS, 5.8 YRS)
130C (90.1K HRS, 10.3 YRS)
0.00001
125C (161.8K HRS, 18.5 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SM320F2812GHHMEP
1/TF versus 1/Tj in ºK
1.00E-04
130C (10.0kHRS, 1.2 YRS)
1/tf in Hours
120C (25.0kHRS, 2.9 YRS)
110C (64.0kHRS, 7.3 YRS)
1.00E-05
100C (170KHRS, 20.0 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Design Operating Life Goal is 10 years @ 105C Junction Temperature
(does not included package interconnect life)..
3. Attached Enhanced Plastic Product Disclaimer Applies.
1.00E-06
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - SM320F2812PGFMEP
1/TF versus 1/Tj in ºK
1.00E-04
125C (17.5kHRS, 2 YRS)
1/tf in Hours
115C (38.98kHRS, 4.45 YRS)
105C (90.3kHRS, 10.3 YRS)
1.00E-05
95C (219KHRS, 25.0 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Maximum Recommended Operating Conditions.
2. Design Operating Life Goal is 10 years @ 105C Junction Temperature
(does not included package interconnect life)..
3. Attached Enhanced Plastic Product Disclaimer Applies.
1.00E-06
1/Tj in Deg K
R2 = 0.9881
OPERATING LIFE DERATING TABLE - TL441MNSREP
1/TF versus 1/Tj in ºK
0.001
150C (9.7K HRS, 1.1 YRS)
0.0001
1/tf in Hours
140C (27.8K HRS,3.2 YRS)
130C (86K HRS, 9.8 YRS)
0.00001
Notes:
120C (282K HRS, 32.1 YRS)
1. See Datasheet for Absolue Maximum and Minimum Recommended Operating Conditions
2. Silicon Operating Life Design Goal is 10 years @ 105C Junction Temperature
(does not include package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
1/Tj in Deg K
OPERATING LIFE DERATING TABLE TPS3803/3805XXXXDCK
1/TF versus 1/Tj in ºK
0.0001
150C (10.3K HRS, 1.2 YRS)
1/tf in Hours
140C (23.9K HRS,2.7 YRS)
130C (58K HRS, 6.6 YRS)
0.00001
120C (146.7K HRS, 16.8 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
Continuous 1/Tj in Deg K
OPERATING LIFE DERATING TABLE 74VMEH22501A
Based on Electromigration Fail Mode
1/TF versus 1/Tj in ºK
0.0001
150C (17K HRS, 1.96 YRS)
1/tf in Hours
125C (52.7K HRS, 6 YRS)
0.00001
85C (438K HRS, 49.97 YRS)
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000001
Continuous 1/Tj in Deg K
OPERATING LIFE DERATING TABLE TPS40055xPWPxEP
1/TF versus 1/Tj in ºK
0.0001
140C (6.9E4 HRS,7.9 YRS)
0.00001
120C (9.2E5 HRS, 1.1E2 YRS)
1/tf in Hours
0.000001
0.0000001
90C (7.7E7 HRS, 8.8E3 YRS)
0.00000001
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Attached Enhanced Plastic Product Disclaimer Applies.
0.000000001
Continuous 1/Tj in Deg K
SN74HVD230MDREP Operating Life Derating Chart
100000
10000
Years estimated life
Wirebond Voiding
Fail Mode
1000
100
10
1
80
90
100
110
120
Continuous Tj (°C)
130
140
150
160
SN74LVTH162373MDLREP Operating Life Derating Chart
1.00E+05
1.00E+04
Years estimated life
Wirebond Voiding
Fail Mode
1.00E+03
1.00E+02
1.00E+01
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1.00E+00
80
90
100
110
120
Continuous Tj (°C)
130
140
150
160
LM211MD*EP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
100
110
120
130
Continuous Tj (°C)
140
150
160
UC2825AMDW*EP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
105
110
115
120
125
Continuous Tj (°C)
130
135
140
145
CLVTH16543MDL*EP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
100
110
120
130
Continuous Tj (°C)
140
150
160
SN74LVTH245AMDB*EP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
100
110
120
130
Continuous Tj (°C)
140
150
160
SN74LVTH162245AMDLREP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
100
110
120
130
Continuous Tj (°C)
140
150
160
SN74LVTH16245AMDB*EP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
100
110
120
130
Continuous Tj (°C)
140
150
160
SN74LVTH273NSREP Operating Life Derating Chart
1000
Years estimated life
Wirebond Voiding
Fail Mode
100
Electromigration Fail Mode
10
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1
100
110
120
130
Continuous Tj (°C)
140
150
160
TLC5940*EP Operating Life Derating Chart
1.00E+04
Years estimated life
1.00E+03
Wirebond Voiding
Fail Mode
1.00E+02
1.00E+01
Notes:
1. See Datasheet for Absolute Maximum and Minimum Recommended Operating Conditions.
2. Silicon Operating ife Design Goal is 10 years @105C Junction Temperature (does not include
package interconnect life).
3. Enhanced Plastic Product Disclaimer Applies.
1.00E+00
100
110
120
130
Continuous Tj (°C)
140
150
160