SPED2 4.5mm-travel Push-push Type Smooth and linear operation feeling Detector ■ Typical Specifications Items Specifications Slide Rating（Resistive load） 1A 14.5V DC Contact resistance （Initial / After operating life） 100mΩ max. / 100mΩ max. Operating force 4.17±0.74N Push Operating life（With load） 30,000 cycles（1A 14.5V DC） 2-pole, 1-position 1-pole, 2-position Circuit configuration Rotary Product Line Power Changeover timing Total travel （mm） Non shorting 4.5 Mounting method Poles PC board 2 1 Connector 1 2 Positions Operation Alternate Terminal type Minimum order unit（pcs.） Product No. Drawing No. 1,120 SPED220200 1 2,000 SPED210203 2 Japan Export For PC board 280 − 400 Dual-in-line Package Type Packing Specifications Tray Number of packages（pcs.） Product No. 1 case / Japan 1 case / export packing Export package measurements （mm） 280 1,120 555×375×223 SPED220200 Horizontal Type Bulk Number of packages（pcs.） Product No. Vertical Type 1 case / Japan 1 case / export packing Export package measurements （mm） 400 2,000 400×270×290 SPED210203 Dimensions Unit:mm No. PC board mounting dimensions （Viewed from the mounting face side） Style 16.8 14 1.05 15 2-2.1 Turnover position A Travel ø9.7 ø4.8 15.58 2 11.65 ho le 43.55 2.85 9.5 8.3 ø3 05 3.5 4.5 0.8 18.3 26.7 1 ø10 ø3 . 11.65 2.2 ø11.15 2.65 4-1 2.65 Terminal No. 2 Terminal No. C1 8 ø1 . 2 ho le 8 (T=1.6) Terminal No. C2 Terminal No. 1 134 Refer to P.138 for soldering conditions. SPED2／4.5mm-travel Push-push Type Unit:mm No. Detector Dimensions Style Slide 16.8 14 6.1 Push Turnover position ø11.15 2 Travel 3.5 4.5 6.75 8.8 ø10 1.2 9.5 ø10 ø4.8 Terminal No.1 Rotary 17.2 ø9.7 Terminal No. 2 8 Terminal No. C1 C2 Power C2 1 2 Vertical Type Note Factory setting for contact points can be either 1 or 2. Horizontal Type C1 Dual-in-line Package Type Circuit Diagram 135 SPEF SPED2 SPED3 SPED4 SPED5 Detector Vertical Series Photo 9.4 D 9 16.8 H 6.9 18.3 16.97 13.1 18 Travel（mm） 1.5 — — — — Total travel（mm） 2.7 4.5 3.8 Number of poles 1 1 2 1 Dimensions （mm） 18 ● ● −40℃ to ＋95℃ ● ● ● ● Rating（max.） （Resistive load） 1A 14.5V DC Rating（min.） （Resistive load） Durability — — 2A 14.5V DC — — — — — — — — Operating life with load （at max. rated load） 30,000 cycles 100mΩ max. Initial contact resistance 100mΩ max. 3MΩ min. 100V DC Voltage proof Terminal strength Mechanical Operating performance Actuator direction strength Pulling direction 3MΩ min. 500V DC 100V AC for 1minute — — — 90N 30N — Cold Environmental performance Dry heat — — Wire strength 30N 98N 90N 98N — — — −40℃ 96h 85℃ 96h Damp heat Page Vertical Type Insulation resistance Horizontal Type Electrical performance Operating life without load 50μA 3V DC Dual-in-line Package Type Life cycle Power −40℃ to ＋85℃ 18.2 Rotary Automotive use 13.5 Push Operating temperature range 14 Slide W 85℃ 96h (Connector type) 105℃ 192h (Dip type) 105℃ 192h 40℃, 90 to 95%RH 96h 132 134 136 Push Switches Soldering Conditions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 138 Push Switches Cautions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 139 Note ● Indicates applicability to all products in the series. 115 Push Switches Soldering Conditions Detector Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile Push Temperature (˚C ) Slide 300 A max. B 200 D E 100 Rotary Room temperature Time (s) Pre-heating F max. C Power Dual-in-line Package Type Series（Reflow type） A（℃） 3s max. B（℃） C（s） D（℃） E（℃） F（s） 260 230 40 180 150 120 SPEG SPEJ SPEF SPEH Horizontal Type Notes 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Vertical Type Reference for Hand Soldering Series Soldering temperature Soldering time SPPJ3, SPPJ2, SPUN, SPPH4, SPPH1 350±10℃ 3+1/0s SPED2, SPED4 350±10℃ 3±0.5s SPEJ 350±10℃ 4s max. SPEG, SPEF 350±5℃ 3s max. SPEH, SPPH2 350℃ max. 3s max. SPUJ 300±10℃ 3+1/0s Reference for Dip Soldering (For PC board terminal types) Series 138 For PC board 端子タイプに適用 Items Dip soldering Preheating temperature Preheating time Soldering temperature Duration of immersion SPPJ3 100℃ max. 60s max. 260±5℃ 5±1s SPUN 100℃ max. 60s max. 260±5℃ 10±1s SPUJ, SPPH2, SPPH4 — 260±5℃ 5±1s SPPJ2, SPPH1, SPED2, SPED4, SPEF — 260±5℃ 10±1s