ROHM RCX330N25

Data Sheet
10V Drive Nch MOSFET
RCX330N25
 Structure
Silicon N-channel MOSFET
 Dimensions (Unit : mm)
TO-220FM
φ3.2
10.0
4.5
8.0
1.2
1.3
14.0
2.5
15.0
Features
1) Low on-resistance.
2) Fast switching speed.
3) Gate-source voltage
VGSS garanteed to be ±30V .
12.0
2.8
0.8
2.54
2.54
2.6
0.75
(1) (2) (3)
4) High package power.
 Inner circuit
Application
Switching
∗1
Packaging specifications
Package
Code
Basic ordering unit (pieces)
RCX330N25
Type
Bulk
500

(1) Gate
(2) Drain
(3) Source
Absolute maximum ratings (Ta  25°C)
Symbol
Parameter
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body Diode)
VDSS
VGSS
Limits
Unit
250
30
V
V
Continuous
ID
*3
33
A
Pulsed
IDP
*1
Continuous
Pulsed
IS
ISP
*3
132
33
A
A
*1
132
A
IAS
EAS
*2
A
mJ
W
Avalanche Current
Avalanche Energy
Power dissipation (Tc=25°C)
PD
16.5
74.8
40
Channel temperature
Range of storage temperature
Tch
Tstg
150
55 to 150
C
C
Symbol
Rth (ch-c)
Limits
3.13
Unit
C / W
*2
(1)
(2)
(3)
1 BODY DIODE
*1 Pw10s, Duty cycle1%
*2 L≒500H, VDD=50V, Rg=25, starting Tch=25°C
*3 Limited only by maximum temperature allowed.
 Thermal resistance
Parameter
Channel to Case
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1/6
2011.09 - Rev.A
Data Sheet
RCX330N25
 Electrical characteristics (Ta = 25C)
Parameter
Gate-source leakage
Symbol
IGSS
Drain-source breakdown voltage V(BR)DSS
Min.
Typ.
Max.
Unit
-
-
100
nA
VGS=±30V, VDS=0V
250
-
-
V
ID=1mA, VGS=0V
Conditions
IDSS
-
-
10
A
VDS=250V, VGS=0V
VGS (th)
3
-
5
V
VDS=10V, ID=1mA
RDS (on)*
-
77
105
l Yfs l*
10
-
-
S
ID=16.5A, VDS=10V
Input capacitance
Ciss
-
4500
-
pF
VDS=25V
Output capacitance
Coss
-
220
-
pF
VGS=0V
Reverse transfer capacitance
Crss
-
130
-
pF
f=1MHz
Turn-on delay time
td(on) *
-
50
-
ns
ID=16.5A, VDD 125V
tr *
-
200
-
ns
VGS=10V
td(off) *
-
120
-
ns
RL=7.6
Zero gate voltage drain current
Gate threshold voltage
Static drain-source on-state
resistance
Forward transfer admittance
Rise time
Turn-off delay time
Fall time
m ID=16.5A, VGS=10V
tf *
-
140
-
ns
RG=10
Total gate charge
Qg *
-
80
-
nC
ID=33A,
Gate-source charge
Gate-drain charge
Qgs *
Qgd *
-
25
27
-
nC
nC
VDD 125V
VGS=10V
*Pulsed
Body diode characteristics (Source-Drain) (Ta = 25C)
Parameter
Forward Voltage
Symbol
VSD *
Min.
Typ.
Max.
-
-
1.5
Unit
V
Conditions
Is=33A, VGS=0V
*Pulsed
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2/6
2011.09 - Rev.A
Data Sheet
RCX330N25
Electrical characteristic curves (Ta=25C)
Fig.2 Typical Output Characteristics (Ⅱ)
Fig.1 Typical Output Characteristics (Ⅰ)
35
35
Ta=25°C
Pulsed
30
Ta=25°C
Pulsed
VGS=10.0V
30
VGS=10.0V
VGS=8.0V
VGS=8.0V
20
VGS=7.0V
15
25
Drain Current : ID [A]
Drain Current : ID [A]
25
20
VGS=7.0V
15
10
10
VGS=6.5V
VGS=6.5V
5
VGS=6.0V
VGS=6.0V
VGS=5.5V
3
4
0
0
0
1
2
0
5
10
20
Drain-Source Voltage : VDS [V]
40
50
Fig.4 Gate Threshold Voltage vs. Channel Temperature
100
6
VDS=10V
pulsed
VDS=10V
ID=1mA
pulsed
Gate Threshold Voltage : VGS(th) [V]
10
Drain Currnt : ID [A]
30
Drain-Source Voltage : VDS [V]
Fig.3 Typical Transfer Characteristics
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
1
0.1
0.01
5
4
3
0.001
2
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5
-50
0
50
100
150
Channel Temperature : Tch [℃]
Gate-Source Voltage : VGS [V]
Fig.6 Static Drain-Source On-State Resistance vs. Channel Temperature
Fig.5 Static Drain-Source On-State Resistance vs. Drain Current
200
1000
VGS=10V
pulsed
VGS=10V
pulsed
180
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
Static Drain-Source On-State Resistance
RDS(on) [mW]
Static Drain-Source On-State Resistance
RDS(on) [mW]
VGS=5.5V
5
100
160
140
ID=33A
120
100
ID=16.5A
80
60
40
20
10
0.01
0
0.1
1
10
-50
100
Drain Current : ID [A]
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-25
0
25
50
75
100
125
150
Channel Temperature : Tch [℃]
3/6
2011.09 - Rev.A
Data Sheet
RCX330N25
Fig.8 Source Current vs. Source-Drain Voltage
Fig.7 Forward Transfer Admittance vs. Drain Current
100
100
VGS=0V
pulsed
10
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
10
Source Current : Is [A]
Forward Transfer Admittance
|Yfs | [S]
VDS=10V
pulsed
1
Ta=125°C
Ta=75°C
Ta=25°C
Ta=-25°C
0.1
0.01
0.01
1
0.1
0.01
0.1
1
10
100
0.0
0.5
Drain Current : ID [A]
1.0
1.5
Fig.9 Static Drain-Source On-State Resistance vs. Gate-Source Voltage
Fig.10 Switching Characteristics
0.5
10000
VDD≒125V
VGS=10V
RG=10Ω
Ta=25°C
Pulsed
0.4
tf
1000
ID=16.5A
0.3
Switching Time : t [ns]
Static Drain-Source On-State Resistance
RDS(on) [Ω]
Ta=25°C
Pulsed
ID=33.0A
0.2
td(off)
td(on)
100
tr
10
0.1
1
0
0
2
4
6
8
10
12
14
16
18
0.01
20
0.1
1
10
100
Gate-Source Voltage : VGS [V]
Drain Current : ID [A]
Fig.11 Dynamic Input Characteristics
Fig.12 Typical Capacitance vs. Drain-Source Voltage
10000
14
Ta=25°C
VDD=125V
ID=33A
Pulsed
12
Ciss
10
Capacitance : C [pF]
Gate-Source Voltage : VGS [V]
2.0
Source-Drain Voltage : VSD [V]
8
6
1000
Coss
100
4
Crss
Ta=25°C
f=1MHz
VGS=0V
2
10
0
0
10
20
30
40
50
60
70
80
0.01
90
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© 2011 ROHM Co., Ltd. All rights reserved.
0.1
1
10
100
1000
Drain-Source Voltage : VDS [V]
Total Gate Charge : Qg [nC]
4/6
2011.09 - Rev.A
Data Sheet
RCX330N25
Fig.14 Normalized Transient Thermal Resistance v.s. Pulse Width
Fig.13 Maximum Safe Operating Area
1000
10
Drain Current : ID [ A ]
100
Normalized Transient Thermal Resistance : r(t)
Ta=25°C
Single Pulse
Operation in this area
is limited by RDS(on)
(VGS = 10V)
10
PW = 100μs
1
PW = 1ms
0.1
PW = 10ms
0.01
0.01
0.1
1
10
100
1
0.1
0.01
0.001
Rth(ch-a)=44.9°C/W
Rth(ch-a)(t)=r(t)×Rth(ch-a)
0.0001
0.0001
1000
0.001
0.01
0.1
1
10
100
1000
Pulse width : Pw (s)
Drain-Source Voltage : VDS [ V ]
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Ta=25°C
Single Pulse
5/6
2011.09 - Rev.A
Data Sheet
RCX330N25
 Measurement circuits
Pulse width
VGS
ID
VDS
90%
50%
10%
VGS
VDS
RL
50%
10%
D.U.T.
VDD
RG
10%
90%
td(on)
90%
td(off)
tr
ton
tf
toff
Fig.1-2 Switching Waveforms
Fig.1-1 Switching Time Measurement Circuit
VG
VGS
ID
VDS
RL
Qg
VGS
D.U.T.
IG(Const.)
Qgs
Qgd
VDD
Charge
Fig.2-2 Gate Charge Waveform
Fig.2-1 Gate Charge Measurement Circuit
VGS
IAS
VDS
V(BR)DSS
D.U.T.
RG
L
VDD
IAS
VDD
EAS =
Fig.3-1 Avalanche Measurement Circuit
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© 2011 ROHM Co., Ltd. All rights reserved.
1
2
L IAS
2
V(BR)DSS
V(BR)DSS - VDD
Fig.3-2 Avalanche Waveform
6/6
2011.09 - Rev.A
Notice
Notes
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R1120A