ROHM BD6385EFV

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STRUCTURE
Silicon monolithic integrated circuits
PRODUCT SERIES
Bipolar stepping motor driver
TYPE
BD6383EFV
FUNCTION
・PWM constant current controllable two H bridge driver
・Built-in translator circuit for CLK-IN control
・Full, Half, Quarter step
・Mixed Decay control
・Parallel IN control
○Absolute maximum ratings(Ta=25℃)
Item
Supply voltage
Symbol
VCC0,1,2
Limit
Unit
-0.2~+36.0
V
1
W
1.6※
Power dissipation
Pd
4.7※2
W
Input voltage for control pin
VIN
-0.2~+5.5
V
RNF maximum voltage
VRNF
0.5
V
※3
Maximum output current
IOUT
1.0
A/phase
Operating temperature range
Topr
-25~+75
℃
Storage temperature range
Tstg
-55~+150
℃
Junction temperature
Tjmax
150
℃
※1
70mm×70mm×1.6mm glass epoxy board. Derating in done at 12.8mW/℃ for operating above Ta=25℃.
※2
4-layer recommended board. Derating in done at 37.6mW/℃ for operating above Ta=25℃.
※3
Do not, however exceed Pd, ASO and Tjmax=150℃.
○Recommended operating conditions (Ta=-25~+75℃)
Item
Symbol
Min
Supply voltage
VCC0,1,2
10
Output current
IOUT
※4
Do not, however exceed Pd, ASO.
Typ
24
0.5
This product isn’t designed for protection against radioactive rays.
REV. A
Max
28
0.7※4
Unit
V
A/phase
2/4
○Electrical characteristics (Unless otherwise specified Ta=25℃, VCC0,1,2=24V)
Item
Symbol
Min
Limit
Typ
Max
Whole
Circuit current at standby
ICCST
1.0
3.0
Circuit current
ICC
4.5
10
Control input (SELECT, CW_CCW, CLK, PS, MODE0, MODE1, ENABLE)
H level input voltage
VINH
2.0
L level input voltage
VINL
0.8
H level input current
IINH
35
50
85
L level input current
IINL
-10
0
Output (OUT1A, OUT1B, OUT2A, OUT2B)
Output ON resistance
Output leak current
Current control
RNFXS input current
RNFX input current
VREFX input current
VREFX input voltage range
MTHX input current
MTHX input voltage range
Comparator threshold
Minimum on time
Unit
mA
mA
PS=L
PS=H, VREFX=2V
V
V
μA
μA
VIN=5V
VIN=0V
RON
-
1.50
1.95
Ω
ILEAK
-
-
10
μA
IRNFS
IRNF
IVREF
VREF
IMTH
VMTH
VCTH
tONMIN
-2.0
-40
-2.0
0
-2.0
0
0.36
0.3
-0.2
-20
-0.1
-0.1
0.40
0.7
2.0
3.5
0.44
1.2
μA
μA
μA
V
μA
V
V
μs
REV. A
Conditions
IOUT=0.5A,
Sum of upper and lower
RNFXS =0V
RNFX=0V
VREFX=0V
MTHX=0V
VREFX=2V
R=39kΩ,C=1000pF
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○Package outline
Product No.
BD6383EFV
Lot No.
HTSSOP-B40 (Unit:mm)
○Block diagram
Buffer
VREF1 14
○Pin No. / Pin name
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
Current Limit Comp.
DAC
9 VCC1
7 OUT1A
CR1 11
Logic
CR
Timer
Predriver
2 RNF1
OCP
MTH1 13
CLK 18
MODE0 24
Reg
MODE1 25
CW_CCW 16
ENABLE 26
SELECT 15
Translator
TSD
RESET
Buffer
VREF2 27
5 OUT1B
OVLO
3 RNF1S
21 VCC0
23 GND
UVLO
19 PS
Current Limit Comp.
DAC
32 VCC2
34 OUT2A
CR2 30
MTH2 28
CR
Timer
Logic
Predriver
36 OUT2B
39 RNF2
OCP
38 RNF2S
TEST 20
40 GND
Pin name
NC
RNF1
RNF1S
NC
OUT1B
NC
OUT1A
NC
VCC1
NC
CR1
NC
MTH1
VREF1
SELECT
CW_CCW
NC
CLK
PS
TEST
NC : Non Connection
REV. A
Pin No.
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
Pin name
VCC0
NC
GND
MODE0
MODE1
ENABLE
VREF2
MTH2
NC
CR2
NC
VCC2
NC
OUT2A
NC
OUT2B
NC
RNF2S
RNF2
GND
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○Operation Notes
(1) Absolute maximum ratings
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating
conditions, etc., can break down the devices, thus making impossible to identify breaking mode, such as a
short circuit or an open circuit. If any over rated values will expect to exceed the absolute maximum ratings,
consider adding circuit protection devices, such as fuses.
(2) Power supply lines
As return of current regenerated by back EMF of motor happens, take steps such as putting capacitor
between power supply and GND as an electric pathway for the regenerated current. Be sure that there is no
problem with each property such as emptied capacity at lower temperature regarding electrolytic capacitor
to decide capacity value. If the connected power supply does not have sufficient current absorption capacity,
regenerative current will cause the voltage on the power supply line to rise, which combined with the
product and its peripheral circuitry may exceed the absolute maximum ratings. It is recommended to
implement a physical safety measure such as the insertion of a voltage clamp diode between the power
supply and GND pins
(3) GND potential
The potential of GND pin must be minimum potential in all operating conditions.
(4) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual
operating conditions. This IC exposes its frame of the backside of package. Note that this part is assumed
to use after providing heat dissipation treatment to improve heat dissipation efficiency . Try to occupy as
wide as possible with heat dissipation pattern not only on the board surface but also the backside.
(5) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the
IC to malfunction.
(6) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum ratings or ASO.
(7) Thermal shutdown circuit
The IC has a built-in thermal shutdown circuit (TSD circuit). If the chip temperature becomes Tjmax=150℃,
and higher, coil output to the motor will be open. The TSD circuit is designed only to shut the IC off to
prevent runaway thermal operation. It is not designed to protect or indemnify peripheral equipment. Do not
use the TSD function to protect peripheral equipment.
(8) Ground Wiring Pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground
patterns, placing a single ground point at the ground potential of application so that the pattern wiring
resistance and voltage variations caused by large currents do not cause variations in the small signal
ground voltage. Be careful not to change the GND wiring pattern of any external components, either.
(9) TEST pin
Be sure to connect TEST pin to GND.
REV. A
Notice
Notes
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The content specified herein is for the purpose of introducing ROHM's products (hereinafter
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which can be obtained from ROHM upon request.
Examples of application circuits, circuit constants and any other information contained herein
illustrate the standard usage and operations of the Products. The peripheral conditions must
be taken into account when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document.
However, should you incur any damage arising from any inaccuracy or misprint of such
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The technical information specified herein is intended only to show the typical functions of and
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The Products specified in this document are intended to be used with general-use electronic
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R1120A