1N5806U Aerospace 2.5 A fast recovery rectifier Datasheet - production data Description A This power ultrafast recovery rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. It is housed in a surface mount hermetically sealed LCC2A package whose footprint is 100% compatible with industry standard solutions in D5A. K K The 1N5806U is suitable for switching mode power supplies and high frequency DC to DC converters such as low voltage high frequency inverter, free wheeling or polarity protection. A Leadless chip carrier 2 (LCC2A) Features Aerospace applications Surface mount hermetic package High thermal conductivity materials Very small conduction losses Negligible switching losses Extremely fast switching Low forward voltage drop Package mass: 0.12 g Target radiation qualification – 150 krad (Si) low dose rate – 3 Mrad (Si) high dose rate ESCC qualified Order code ESCC detailed specification Table 1. Device summary(1) Quality level Lead finish 1N5806UA1 Engineering model Gold 1N5806U01A 5101/014/13 ESCC flight Gold 1N5806U02A 5101/014/14 ESCC flight Solder dip EPPL IF(AV) VRRM Tj(max) VF(max) yes 2.5 150 175 1 1. Contact ST sales office for information about the specific conditions for products in die form. November 2013 This is information on a product in full production. DocID15986 Rev 3 1/9 www.st.com Characteristics 1 1N5806U Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Average forward rectified current IFSM Forward surge current Tstg Storage temperature range Tj Tsol Value Unit 150 V 6 A Tc ≥ 142 °Cδ = 0.5 2.5 A tp = 8.3 ms sinusoidal 35 tp = 10 ms sinusoidal 33 A -65 to + 175 °C Maximum operating junction temperature 175 °C Maximum soldering temperature (1) 245 °C Value Unit 13 C/W 1. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed. Table 3. Thermal resistance Symbol Rth (j-c) (1) Parameter Junction to case 1. Package mounted on infinite heatsink Table 4. Static electrical characteristics Symbol Parameter Tests conditions Tj = 25 °C IR (1) Reverse current Tj = 125 °C Tj = 25 °C Tj = -65 °C VR = 150 V Forward voltage Tj = 125 C VR = 160 V IF = 1 A Tj = -65 C Tj = 25 C Typ. Max. - - 0.5 - - 20 - - 10 - - 10 - - 880 - - 800 - - 1075 - - 1000 IF = 2.5 A mV 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 680 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.70 x IF(AV) + 0.10 x IF2(RMS ) 2/9 Unit µA Tj = 25 C VF (2) Min. DocID15986 Rev 3 1N5806U Characteristics Table 5. Dynamic characteristics Symbol Test conditions Parameter Min. Typ. Max. Unit IF = IR = 0.5 A, Irr = 0.05 A, dI/dt = -65 A/µs (min.) - - 25 IF = 1 A, VR = 30 V, dI/dt = -50 A/µs, - - 30 Forward recovery voltage IFM = 250 mA - - 2.2 V tFR Forward recovery time IFM = 250 mA, VRF = 1.1 x VF - - 15 ns Cj Diode capacitance VR = 10 V, F = 1 MHz - - 25 pF tRR Reverse recovery time VFP ns Figure 1. Forward voltage drop versus forward Figure 2. Forward voltage drop versus forward current (typical values) current (maximum values) IFM(A) IFM(A) 10 10 8 8 6 6 4 TTjj= =125 125°C 2 TTjj= =25 25°C °C 4 Tj = - 65 °C Tj = 125 °C Tj = -65 °C T j = 25°C °C 2 VFM(V) VFM(V) 0 0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Figure 4. Relative variation of thermal impedance, junction to case, versus pulse duration IR(µA) Zth(j-c)/Rth(j-c) 1.E+01 1.0 0.9 1.E+00 Tj=125 °C 0.8 0.7 LCC2A 0.6 1.E-01 Tj=75 °C 0.5 0.4 1.E-02 Single pulse 0.3 Tj=25 °C 0.2 1.E-03 0 20 40 60 80 100 120 140 tP(s) 0.1 VR(V) 1.E-04 160 0.0 1.E-06 DocID15986 Rev 3 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 3/9 9 Characteristics 1N5806U Figure 5. Reverse recovery time versus dIF/dt Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) tRR(ns) 100 40 F=1 MHz VOSC=30 mVRMS Tj=25 °C IF=IF(AV) VR=120 V 36 32 28 Tj=125 °C 24 20 10 16 Tj=25 °C 12 8 dIF/dt(A/µs) 4 VR(V) 0 1 0 4/9 50 100 150 200 250 300 350 400 450 500 1 DocID15986 Rev 3 10 100 1000 1N5806U 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 7. Leadless chip carrier 2 (LCC2A) package dimension definitions A D B 2 C Note 1 1 F Pin 2 Cathode Note 1 Pin 1 Anode Note 1 E 1 H E 2 r1 G r2 I 1. The anode is identified by metalization in two top internal angles and the index mark. DocID15986 Rev 3 5/9 9 Package information 1N5806U Table 6. Leadless chip carrier 2 (LCC2A) package dimension values Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A(1) 1.86 2.03 2.20 0.073 0.080 0.087 B 4.54 4.67 4.87 0.179 0.184 0.192 C 2.33 2.46 2.59 0.92 0.97 0.102 D 1.53 1.70 1.87 0.060 0.067 0.074 E 0.48 - 0.71 0.019 - 0.028 F - 1.3 - - 0.051 - G - 2.16 - - 0.085 - H - 0.86 - - 00.34 - I - 0.15 - - 0.006 - r1 - 0.15 - - 0.006 - r2 - 0.20 - - 0.008 - 1. Measurement prior to solder coating the mounting pads on bottom of package 6/9 DocID15986 Rev 3 1N5806U 3 Ordering information Ordering information Table 7. Ordering information(1) Order code ESCC detailed Package Lead finish Marking(2) EPPL specification 1N5806UA1 - 1N5806U01A 5101/014/13 1N5806U02A 5101/014/14 Gold 5806 - Gold 510101413 Y Solder dip 510101414 - LCC2A Mass Packing 0.12 g Waffle pack 1. Contact ST sales office for information about the specific conditions for products in die form. 2. Specific marking only. The full marking includes in addition: For the engineering models: ST logo, date code, country of origin (FR). For ESCC flight parts: ST logo, date code, country of origin (FR), ESA logo, serial number of the part within the assembly lot. 4 Other information 4.1 Date code Date code is structured as describe below: EM xyywwz ESCC flight yywwz Where: 4.2 – x (EM only): 3, assembly location Rennes (France) – yy: last two digits year – ww: week digits – z: lot index in the week Documentation In Table 8 is a summary of the documentation provided with each type of products. Table 8. Documentation provided with each type of products Quality level Documentation Engineering model ESCC flight Certificate of conformance DocID15986 Rev 3 7/9 9 Revision history 5 1N5806U Revision history Table 9. Document revision history 8/9 Date Revision Changes 27-Jul-2009 1 First issue. 25-Mar-2010 2 Updated ESCC status in Features and added footnote to Table 3. 8-Nov-2013 3 Updated Table 1, Table 2, Table 5 and Table 7 and inserted Other information. 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