DIP2450-01D3 2 G / 5 G WLAN diplexer Datasheet - production data Features • Low insertion loss in pass band • High attenuation levels • High rejection of out-of-band frequencies • Small footprint: < 1.4 mm2 Benefits • Very low profile (<600 µm after reflow) Flip Chip package 4 bumps • High Q, low loss • High RF performance • Tight tolerance • Bill of materials and area reduction Figure 1. Pin configuration (bump view) 1 2 5G 2G ANT GND Applications • WLAN • Bluetooth A • Mobile phone application • Wireless networking B Description This diplexer targets the use of dual band 2.4 GHz and 5 GHz. The DIP2450-01D3 is a diplexer dedicated to the WLAN/BT application. It is designed using STMicroelectronics IPD (integrated passive device) technology on non conductive glass substrate to optimize RF performance. May 2014 This is information on a product in full production. DocID023193 Rev 2 1/10 www.st.com Characteristics 1 DIP2450-01D3 Characteristics Table 1. Absolute rating (limiting values) Value Symbol Parameter Unit Min. PAV VESD antenna and 2G ports TOP Typ. Average power Max. 27 ESD ratings: MIL STD883C (HBM:C = 100 pF, R = 1.5 kΩ, air discharge) Charged device model (CDM) Machine model (MM: C = 200 pF, R = 25 Ω, L = 500 nH) 400 500 100 Operating temperature range -40 dBm V +85 ºC Table 2. Electrical characteristics and RF performance (Tamb = 25 °C) Value Symbol Parameter Test condition Unit Min. Typ. Max. Pass band 2 G band pass 2400 2483.5 MHz 5 G band pass 4900 5850 MHz f Z Nominal impedance Return loss Ω 50 All ports -17 dB S21 2 G to antenna insertion loss 2400 to 2483.5 MHz 0.6 0.7 dB S31 5 G to antenna insertion loss 4900 to 5850 MHz 0.6 0.7 dB Attenuation S21 2 G to antenna attenuation 4900 to 5850 MHz 20 dB S31 5 G to antenna attenuation 2400 to 2483.5 MHz 18 dB Out of band attenuation S21 S31 2/10 2 G to antenna attenuation 5 G to antenna attenuation 5850 to 7000 MHz 15 7000 to 9500 MHz 9 9800 to 10500 MHz 16 9800 to 11650 MHz 11 DocID023193 Rev 2 dB dB DIP2450-01D3 1.1 Characteristics Measured performance Figure 2. 2 G and 5 G forward transmission (Tamb = 25 °C) 0 S21 and S31 (dB) Figure 3. 2 G, 5 G and antenna reflection coefficient (Tamb = 25 °C) S11, S22 and S33 (dB) 0 -5 -10 -10 -20 -15 -30 S21 (2 G ≥ ANT) S31 (5 G ≥ ANT) -40 S11 (ANT) S22 (2 G) S33 (5 G) -20 -25 -50 -30 F (GHz) -60 F (GHz) -35 0 2 4 6 10 8 12 0 Figure 4. 2 G insertion loss (Tamb = 25 °C) -0.40 -20 -0.50 -30 -0.55 -40 -0.60 -50 -0.65 -60 F (GHz) 2.42 2.44 2.46 2.48 10 8 12 F (GHz) -70 4.9 2.50 Figure 6. 2 G attenuation in high frequency band (Tamb = 25 °C) -0 6 S21(dB) -10 -0.45 2.40 4 Figure 5. 2 G attenuation in 5 G band (Tamb = 25 °C) S21(dB) -0.70 2 S21(dB) 5.1 5.3 5.5 5.7 5.9 Figure 7. 2 G return loss (Tamb = 25 °C) S22(dB) -10 -10 -15 -20 -30 -20 -40 -25 -50 F (GHz) -60 5 6 7 8 9 10 11 F (GHz) -30 12 2.40 DocID023193 Rev 2 2.42 2.44 2.46 2.48 2.50 3/10 10 Characteristics DIP2450-01D3 Figure 8. Antenna return loss in 2 G band (Tamb = 25 °C) Figure 9. Antenna return loss in 5 G band (Tamb = 25 °C) S11(dB) -10 -10 -15 -15 -20 -20 -25 -25 F (GHz) -30 2.40 2.42 2.44 2.46 2.48 4.9 2.50 S31(dB) -0.45 -20 -0.50 -30 -0.55 -40 -0.60 -50 -0.65 -60 F (GHz) 4.9 5.1 5.3 5.5 5.7 5.3 5.5 5.7 5.9 S31(dB) 5.9 S31(dB) F (GHz) -70 2.40 Figure 12. 5 G attenuation in high frequency band (Tamb = 25 °C) -0 5.1 Figure 11. 5 G attenuation in 2 G band (Tamb = 25 °C) -10 -0.70 F (GHz) -30 Figure 10. 5 G insertion loss (Tamb = 25 °C) -0.40 S11(dB) 2.42 2.44 2.46 2.48 2.50 Figure 13. 5 G return loss (Tamb = 25 °C) -10 S33(dB) -10 -15 -20 -30 -20 -40 -25 -50 F (GHz) -60 5 4/10 6 7 8 9 10 11 F (GHz) -30 12 4.9 DocID023193 Rev 2 5.1 5.3 5.5 5.7 5.9 DIP2450-01D3 Characteristics Figure 14. 2 G to 5 G isolation (Tamb = 25 °C) 0 S23 (dB) Figure 15. 2 G to 5 G isolation in 2 G band (Tamb = 25 °C) -15 S23(dB) -5 -20 -10 -15 -20 -25 -25 -30 -30 -35 -40 -25 -45 F (GHz) -50 F (GHz) -40 0 2 4 6 8 10 12 2.40 2.42 2.44 2.46 2.48 2.50 Figure 16. 2 G to 5 G isolation in 5 G band (Tamb = 25 °C) S23(dB) -15 -20 -25 -30 -25 F (GHz) -40 4.9 5.1 5.3 5.5 DocID023193 Rev 2 5.7 5.9 5/10 10 Application information 2 DIP2450-01D3 Application information Figure 17. Application schematic 5GHz Tx WLAN Diplexer 2GHz Tx 5GHz Rx 2GHz Rx BT Balun BT TX BT RX Figure 18. PCB recommendation 2G 5G ANT Pad diameter: 220 µm, distance from ground: 100 µm 6/10 DocID023193 Rev 2 DIP2450-01D3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 19. Package dimensions 725 µm 187.5 µm Ø255 µm ±40 µm 5G GND ANT 437.5 µm 625 µm 2G 630 µm ±60 µm 187.5 µm 187.5 µm 1.25 mm ±50 µm 3 Package information 1.1 mm ±50 µm Figure 20. Footprint Copper pad diameter: 220 µm recommended 260 µm maximum 200 µm Figure 21. Marking Dot, ST logo ECOPACK status xx = marking z = manufacturing location yww = datecode (y = year ww = week) Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended DocID023193 Rev 2 x x z y ww 7/10 10 Package information DIP2450-01D3 Figure 22. Flip Chip tape and reel specifications Ø 1.50 ± 0.10 4.0 ± 0.1 1.75 ± 0.1 2.0 ± 0.05 0.71 ± 0.05 All dimensions in mm 8/10 3.5 ±- 0.05 1.35± 0.05 8.0 +0.3 -0.10 0.20 ± 0.02 1.20 ± 0.05 4.0 ± 0.1 User direction of unreeling DocID023193 Rev 2 DIP2450-01D3 4 Ordering information Ordering information Table 3. Ordering information 5 Order code Marking Package Weight Base qty Delivery mode DIP2450-01D3 SA Flip Chip 1.88 mg 5000 Tape and reel (7”) Revision history . Table 4. Document revision history Date Revision Changes 27-June-2012 1 Initial release 07-May-2014 2 Updated Figure 19: Package dimensions. 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