Wire Wound Chip Inductors SWI0603CT Series INTRODUCTION The SWI series are wire wound chip inductors widely used in the communication applications such as cellular phones, cable modem, ADSL, repeaters, Bluetooth, and other electronic devices. The wire wound inductors advance in higher self resonate frequency, better Q factor, and much more stable performance. Precious tolerance of 2% is available. FEATURES Operating temperature -40 to +125°C for ceramic series. Excellent solderability and resistance to soldering heat. Suitable for reflow soldering. High reliability and easy surface mount assembly. Wide range of inductance values are available for flexible needs. PART NUMBER SWI 0603 C T 10N J 1 1 Product Type 2 Chip Dimension Size (inch) mm SWI 0603 1608 Length (L) (inch) mm 2 3 taping 4 Width (W) (inch) mm 5 □□ 6 Thickness (T) (inch) mm Terminal (S) (inch) mm (0.063 ± 0.008) (0.041 ± 0.008) (0.041 ± 0.008) (0.014 ± 0.004) 1.60 ± 0.20 1.05 ± 0.20 1.05 ± 0.20 0.35 ± 0.10 L1 (Ref.) mm W1 (Ref.) mm t1 (Ref.) mm 0.80 0.95 0.50 3 Material Type C : Ceramic 4 Inductance Value 1N6 = 1.6nH 5 Tolerance B = ±0.2nH S = ±0.3nH G = ±2% J = ±5% K = ±10% 6 Internal Code 10N = 10nH 1 R10 = 100nH Wire Wound Chip Inductors SWI0603CT Series 1 Scope This specification applies to fixed inductors of the following types used in electronic equipment : *Ceramic Type : For lower inductance with high Q factor at high frequency and stable circuit requirement. 2 Construction *Configuration & Dimension : Please refer to the attached figures and tables. *Terminals 3 : Consist of Ag alloy followed by Nickel, then Au platting for easier soldering. Operating Temperature Range Operating Temperature Range is the scope of ambient temperature at which the inductor can be operated continuously at rated current. *Temp. Range : Ceramic material : -40°C ~ +125°C 4 Ingredient of terminals electrode 3rd Layer Ceramic Type : 2nd Layer 1st Layer : Ag 1st Layer 2nd Layer : Nickel (Ni) Termination 3rd Layer : Gold (Au) 5 Characteristics Standard Atmospheric Conditions Unless otherwise specified, the standard range of atmospheric conditions for making measurements and tests are as follows: Ambient Temperature : 25°C ± 2°C Relative Humidity : 60% to 70% Air Pressure : 86Kpa to 106Kpa 2 Wire Wound Chip Inductors SWI0603CT Series Temperature Profile 1 Reflow Temperature Profile (Temperature of the mounted parts surface on the printed circuit board) Recommended Peak Temperature : 250℃ Max 250℃ up /within 10secs Max. Reflow temperature : 260°C Gradient of temperature rise : av 1-4℃/sec Preheat : 160-190℃/within 90-120secs 220℃ up /within 30-60secs Composition of solder Sn-3Ag-0.5Cu 2 Dip Temperature Solder bathtub temperature : 260℃ max within 5secs. Preheating temperature : 100～130℃ deposit solder temperature. Composition of solder Sn-3Ag-0.5Cu 3 Soldering iron tip temperature : 350°C max / within 3 seconds. 3 Wire Wound Chip Inductors SWI0603CT Series Q2 Part No. Inductance (nH) 1 Tolerance Min Typical @900MHz S.R.F.3 Min (MHz) RDC 4 Max (Ω) IDC 5 Max (mA) Marking SWI0603CT 1N6 □-□□ 1.6 @ 250MHz B, S 24 40 12500 0.030 700 - SWI0603CT 1N8 □-□□ 1.8 @ 250MHz B, S 16 35 12500 0.045 700 - SWI0603CT 2N0 □-□□ 2.0 @ 250MHz B, S 16 31 6900 0.080 700 - SWI0603CT 3N9 □-□□ 3.9 @ 250MHz B, S 22 51 6900 0.080 700 - SWI0603CT 4N3 □-□□ 4.3 @ 250MHz B, S 22 45 5900 0.080 700 - SWI0603CT 4N7 □-□□ 4.7 @ 250MHz B, S 20 47 5800 0.130 700 - SWI0603CT 5N1 □-□□ 5.1 @ 250MHz K, J 20 47 5700 0.140 700 - SWI0603CT 5N6 □-□□ 5.6 @ 250MHz K, J 16 40 5500 0.150 700 - SWI0603CT 6N8 □-□□ 6.8 @ 250MHz K, J, B 30 63 5800 0.110 700 - SWI0603CT 7N5 □-□□ 7.5 @ 250MHz K, J, B 28 64 4800 0.106 700 - SWI0603CT 8N2 □-□□ 8.2 @ 250MHz K, J, B 30 72 4600 0.100 700 - SWI0603CT 8N7 □-□□ 8.7 @ 250MHz K, J 28 66 4600 0.109 700 - SWI0603CT 9N1 □-□□ 9.1 @ 250MHz K, J 28 60 4000 0.135 700 - SWI0603CT 9N5 □-□□ 9.5 @ 250MHz K, J 28 62 4500 0.135 700 - SWI0603CT 10N □-□□ 10 @ 250MHz K, J, G 30 66 3800 0.130 700 - SWI0603CT 11N □-□□ 11 @ 250MHz K, J 33 68 4000 0.090 700 - SWI0603CT 12N □-□□ 12 @ 250MHz K, J, G 35 72 4000 0.130 700 - SWI0603CT 13N □-□□ 13 @ 250MHz K, J 38 75 4000 0.106 700 - SWI0603CT 15N □-□□ 15 @ 250MHz K, J, G 35 68 4000 0.170 700 - SWI0603CT 16N □-□□ 16 @ 250MHz K, J 34 66 3300 0.170 700 - SWI0603CT 18N □-□□ 18 @ 250MHz K, J, G 38 77 3100 0.170 700 - SWI0603CT 20N □-□□ 20 @ 250MHz K, J 38 72 3000 0.220 700 - SWI0603CT 22N □-□□ 22 @ 250MHz K, J, G 38 70 3000 0.220 700 - SWI0603CT 24N □-□□ 24 @ 250MHz K, J 37 75 2650 0.135 700 - SWI0603CT 27N □-□□ 27 @ 250MHz K, J, G 40 75 2800 0.220 600 - SWI0603CT 30N □-□□ 30 @ 250MHz K, J 45 57 2300 0.220 600 - SWI0603CT 33N □-□□ 33 @ 250MHz K, J, G 43 78 2300 0.220 600 - SWI0603CT 36N □-□□ 36 @ 250MHz K, J 43 70 2200 0.250 600 - SWI0603CT 39N □-□□ 39 @ 250MHz K, J, G 43 66 2200 0.250 600 - SWI0603CT 43N □-□□ 43 @ 250MHz K, J 38 62 2000 0.280 600 - SWI0603CT 47N □-□□ 47 @ 200MHz K, J, G 40 65 2000 0.280 600 - SWI0603CT 51N □-□□ 51 @ 200MHz K, J 40 66 1900 0.310 600 - SWI0603CT 56N □-□□ 56 @ 200MHz K, J, G 40 66 1900 0.310 600 - SWI0603CT 62N □-□□ 62 @ 200MHz K, J 40 60 1700 0.340 600 - SWI0603CT 68N □-□□ 68 @ 200MHz K, J, G 40 57 1700 0.340 600 - 4 Wire Wound Chip Inductors SWI0603CT Series Q2 Part No. Inductance (nH) 1 Tolerance Min Typical @900MHz S.R.F.3 Min (MHz) RDC 4 Max (Ω) IDC 5 Max (mA) Marking SWI0603CT 72N □-□□ 72 @ 150MHz K, J, G 35 60 1700 0.490 400 - SWI0603CT 82N □-□□ 82 @ 150MHz K, J, G 35 58 1700 0.540 400 - SWI0603CT 90N □-□□ 90 @ 150MHz K, J 35 52 1700 0.540 400 - SWI0603CT R10 □-□□ 100 @ 150MHz K, J, G 35 51 1400 0.630 400 - SWI0603CT R11 □-□□ 110 @ 150MHz K, J, G 35 22 1400 0.630 400 - SWI0603CT R12 □-□□ 120 @ 150MHz K, J, G 35 45 1300 0.650 300 - SWI0603CT R13 □-□□ 130 @ 150MHz K, J 35 40 1000 0.920 280 - SWI0603CT R15 □-□□ 150 @ 150MHz K, J, G 35 33 1000 0.920 280 - SWI0603CT R16 □-□□ 160 @ 100MHz K, J, G 30 27 1000 1.000 250 - SWI0603CT R18 □-□□ 180 @ 100MHz K, J, G 30 26 1000 1.250 240 - SWI0603CT R20 □-□□ 200 @ 100MHz K, J 30 23 1000 1.250 240 - SWI0603CT R21 □-□□ 210 @ 100MHz K, J 27 23 1000 1.700 200 - SWI0603CT R22 □-□□ 220 @ 100MHz K, J, G 30 23 1000 1.700 200 - SWI0603CT R24 □-□□ 240 @ 100MHz K, J 30 15 1000 1.700 200 - SWI0603CT R27 □-□□ 270 @ 100MHz K, J, G 30 10 1000 1.800 170 - SWI0603CT R33 □-□□ 330 @ 100MHz K, J 25 - 450 2.000 150 - SWI0603CT R39 □-□□ 390 @ 100MHz K, J 20 - 350 2.000 170 - 1. Inductance is measured in HP-4287A RF LCR meter with HP-16193 fixture. 2. Q is measured in HP-4287A RF LCR meter with HP-16193 fixture. 3. SRF is measured in ENA E5071B network analyzer or equivalent. 4. RDC is measured in HP-4338B milliohmeter or equivalent. 5. For 15 °C Rise. Remarks : Unit weight = 0.0049g (for ref.) 5 Wire Wound Chip Inductors SWI0603CT Series L vs Freq Plot 200 R12 180 160 140 120 L (nH) 100 68N 80 60 40 33N 20 22N 0 12N 3N9 1 10 100 1000 10000 Freq (MHz) Q vs Freq Plot 100 90 33N 80 22N 70 12N 60 Q 3N9 50 40 68N 30 R12 20 10 0 1 10 100 Freq (MHz) 6 1000 10000 Wire Wound Chip Inductors SWI0603CT Series ITEM Inductance and Tolerance Quality Factor Electrical Characteristics Mechanical Characteristics Insulation Resistance Dielectric Withstanding Voltage Temperature Coefficient of Inductance (TCL) Component Adhesion (Push Test) Drop Test Thermal Shock Test Solderability Resistance to Soldering Heat Vibration (Random) Cold Temperature Storage Endurance Characteristics High Temperature Storage Moisture Resistance High Temperature with Loaded CONDITION Measuring Frequency : As shown in Product Table Measuring Temperature : +25°C Measured at 100V DC between inductor terminals and center of case. Measured at 500V AC between inductor terminals and center of case for a maximum of 1 minute. Over -40°C to +85°C at frequency specified in Product Table. The component shall be reflow soldered onto a P.C. Board ( 240°C ± 5°C for 20 seconds ). Then a dynometer force gauge shall be applied to any side of the component. The inductor shall be dropped two times on the concrete floor or the vinyl tile from 1M naturally. Each cycle shall consist of 30 minutes at -40°C followed by 30 minutes at +85°C with a 5 minutes transition time between temperature extremes. Test duration is 10 cycles. Dip pads in flux and dip in solder pot containing lead free solder at 240°C ± 5°C for 5 seconds. Dip the components into flux and dip into solder pot containing lead free solder at 260°C ± 5°C for 5 ± 2 seconds. Inductors shall be randomly vibrated at amplitude of 1.5mm and frequency of 10-55Hz : 0.04G/Hz for a minimum of 15 minutes per axis for each of the three axes. Inductors shall be stored at temperature of -40°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored at temperature of 85°C ± 2°C for 1000hrs (+48 -0 hrs.) Then inductors shall be subjected to standard atmospheric conditions for 1 hour. After that, measurement shall be made. Inductors shall be stored in the chamber at 45°C at 90-95 R.H. for 1000 hours. Then inductors are to be tested after 2 hours at room temperature. Inductors shall be stored in the chamber at +85°C for 1000 hours with rated current applied. Inductors shall be tested at the beginning of test at 500 hours and 1000 hours. Then inductors are to be tested after 1 hour at room temperature. 7 SPECIFICATION Within Specified Tolerance 1000 mega ohms minimum No damage occurs when the test voltage is applied. +25 to 500 ppm/°C 6 TCL = L1 - L2 x 10 (ppm /°C) L1(T1-T2) 0402 series - 350g 0603 series - 1.0Kg Other series - 0805 ~ 1210 Minimum 1Kg for Ag termination and 2Kg for Mo/Mn termination. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage A minimum of 80% of the metalized area must be covered with solder. Change In Inductance: No more than 5% Change In Q: No more than 10% Change In Appearance: Without distinct damage Inductors shall not have a shorted or open winding. Wire Wound Chip Inductors SWI0603CT Series Type Pcs/Reel SWI0603 3,000 Φ 1.50 Chip Cavity Type SWI0603 T 2.0 1.75 Insert Pitch Tape Thickness 3.50 A B F K T W 1.35 1.90 4.00 1.15 0.28 8.00 W B A F Blank Portions Chip Cavity K 4.0 Leader Top Tape Strength The top tape requires a peel-off force of 0.2 to 0.7N in the direction of the arrow as illustrated below. Top Tape 0~15° 80mm min. Direction of tape feed 160mm min. Base Tape Recommended Pattern Dimensions (unit : m/m) Type A B C A SWI0603 1.90 0.65 1.00 B C 8