UT63M147 Bus Transceiver - Aeroflex Microelectronic Solutions

Standard Products
UT63M147 MIL-STD-1553A/B Bus
Transceiver
Data Sheet
September 2009
FEATURES
INTRODUCTION
‰ 5-volt only operation (+10%)
The monolithic UT63M147 Transceivers are complete
transmitter and receiver pairs for MIL-STD-1553A and 1553B
applications. Encoder and decoder interfaces are idle low.
‰ Fit and functionally compatible to industry standard
transceiver
The receiver section of the UT63M147 series accepts biphasemodulated Manchester II bipolar data from a MIL-STD-1553
data bus and produces TTL-level signal data at its RXOUT and
RXOUT outputs. An external RXEN input enables or disables
the receiver outputs.
‰ Idle low transmitter inputs and receiver outputs
‰ Dual-channel 50-mil center 24-lead Flatpack
‰ Dual-channel 100-mil center 36-pin DIP
‰ Full military operating temperature range, -55°C to +125°C,
screened to QML Q or QML V requirements
‰ Radiation hardened to 1.0E6 rads(Si)
‰ Supports MIL-STD-1553 (UT63M147)
RXEN
‰ Standard Microcircuit Drawing (SMD) 5962-93226 available
RXOUT
RXIN
RXIN
F ILTER
and
LIMITER
F ILTER
TO DECODER
RXOUT
THRESHOLD
REFERENCE
DRIVERS
TXOUT
TXIN
COMPARE
TXOUT
TXIN
TXIHB
Figure 1. Functional Block Diagram
1
The transmitter section accepts biphase TTL-level signal data
at its TXIN and TXIN and produces MIL-STD-1553 data
signals. The transmitter’s output voltage is typically
12 VPP, L-L. Activating the TXIHB input or setting both data
inputs to the same logic level disables the transmitter outputs.
The UT63M147 series offers complete transmitter and receiver
pairs packaged in a dual-channel 36-pin DIP or 24-lead flatpack
configurations designed for use in any MIL-STD-1553
application.
Legend for TYPE field:
TI
TO
DO
DI
DIO
()
[]
=
=
=
=
=
=
=
TTL input
TTL output
Differential output
Differential input
Differential input/output
Channel designator
24-lead flatpack
TRANSMITTER
NAME
PIN
NUMBER
TYPE
TXOUT 1
(A)
1 [1]
DO
[DIO]
TXOUT
(B)
10 [7]
DO
[DIO]
TXOUT 1
(A)
2 [2]
DO
[DIO]
TXOUT
(B)
11 [8]
DO
[DIO]
TXIHB
(A)
34 [22]
TI
TXIHB
(B)
25 [16]
TI
TXIN
(A)
35 [23]
TI
TXIN
(B)
26 [17]
TI
TXIN
(A)
36 [24]
TI
TXIN
(B)
27 [18]
TI
DESCRIPTION
Transmitter outputs: TXOUT and TXOUT are differential data
signals.
TXOUT is the half-cycle complement of TXOUT.
Transmitter inhibit: This is an active high input signal.
Transmitter input: TXIN and TXIN are complementary TTLlevel Manchester II encoder inputs.
TXIN is the complement of TXIN input.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
Appendix 2 - 2
RECEIVER
NAME
PIN
NUMBER
TYPE
DESCRIPTION
RXOUT
(A)
5 [4]
TO
Receiver outputs: RXOUT and RXOUT are complementary
Manchester II decoder outputs.
RXOUT
(B)
14 [10]
TO
RXOUT
(A)
8 [6]
TO
RXOUT
(B)
17 [12]
TO
RXEN
(A)
6 [5]
TI
RXEN
(B)
15 [11]
TI
RXIN 1
(A)
29 [1]
DI
[DIO]
RXIN
(B)
20 [7]
DI
[DIO]
RXIN 1
(A)
30 [2]
DI
[DIO]
RXIN
(B)
21 [8]
DI
[DIO]
RXOUT is the complement of RXOUT output.
Receiver enable/disable: This is an active high input signal.
Receiver input: RXIN and RXIN are biphase-modulated
Manchester II bipolar inputs from MIL-STD-1553 data bus.
RXIN is the half-cycle complement of RXIN input.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
POWER AND GROUND
NAME
PIN
NUMBER
TYPE
DESCRIPTION
VCC
(A)
33 [20]
PWR
VCC
(B)
24 [14]
PWR
+5 VDC power (±10%)
Recommended decoupling capacitors:
1μF (tantalum) and 0.1μF (ceramic)
GND
(A)
3, 7, 31
[3,19,21]
GND
GND
(B)
12, 16, 22
[9,13,15]
GND
Ground reference
Appendix 2 - 3
TXOUT
1
36
TXIN
TXOUT
2
35
TXIN
3
34
TXIHB
4
33
VCC
32
NC
GND
NC
RXOUT
5
CHANNEL A
RXEN
6
31
GND
GND
7
30
RXIN
RXOUT
8
29
RXIN
NC
9
28
NC
TXOUT
10
27
TXIN
TXOUT
11
26
TXIN
GND
12
25
TXIHB
NC
VCC
RXOUT
13 CHANNEL B 24
23
14
RXEN
15
22
GND
GND
16
21
RXIN
RXOUT
17
20
RXIN
NC
18
19
NC
NC
Figure 2a. Functional Pin Diagram -- Dual Channel (36)
CHA
1
24
CHA
2
23
3
22
TXIHB
21
GND
GND
RXOUT
RXEN
RXOUT
CHB
CHB
GND
RXOUT
RXEN
RXOUT
4
CHANNEL A
TXIN
TXIN
5
20
VCC
6
19
GND
7
18
8
17
9
16
CHANNEL B
10
15
11
14
12
13
TXIN
TXIN
TXIHB
GND
VCC
GND
Figure 2b. Functional Pin Diagram -- Dual Channel (24) 1
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
Appendix 2 - 4
TRANSMITTER
TXIN
The transmitter section accepts Manchester II biphase TTL data
and converts this data into differential phase-modulated current
drive. Transmitter current drivers are coupled to a MIL-STD1553 data bus via a transformer driven from the TXOUT and
TXOUT terminals. Transmitter output terminals’ nontransmitting state is enabled by asserting TXIHB (logic “1”), or
by placing both TXIN and TXIN at the same logic level. Table
1, Transmit Operating Mode, lists the functions for the output
data in reference to the state of TXIHB. Figure 3 shows typical
transmitter waveforms.
BOTH HIGH
OR
BOTH LOW
TXIN
TXIHB
LINE-TO-LINE
DIFFERENTIAL
OUTPUT
TXOUT, TXOUT
90%
10%
RECEIVER
The receiver section accepts biphase differential data from a
MIL-STD-1553 data bus at its RXIN and RXIN inputs. The
receiver converts input data to biphase Manchester II TTL
format and is available for decoding at the RXOUT and RXOUT
terminals. The outputs RXOUT and RXOUT represent positive
and negative excursions (respectively) of the inputs RXIN and
RXIN. Figure 4 shows typical receiver output waveforms.
TXIN
TXIN
tTXDD
Table 1. Transmit Operating Mode
TXIN
TXIN
TXIHB
TXOUT
x1
x
1
Off2
0
0
x
Off3
0
1
0
On
1
0
0
On
1
1
x
Off3
Notes:
1. x = Don’t care.
2. Transmitter output terminals are in the non-transmitting mode during
Off-time.
3. Transmitter output terminals are in the non-transmitting mode during
Off-time, independent of TXIHB status.
Figure 3. Typical Transmitter
Wave
LINE-TO-LINE
DIFFERENTIAL
INPUT
RXOUT
RXOUT
RXOUT
RXOUT
tRXDD
Figure 4. Typical Receiver Waveforms
Appendix 2 - 5
DATA BUS INTERFACE 1
RECOMMENDED THERMAL PROTECTION
The designer can connect the UT63M147 to the data bus via a
short-stub (direct-coupling) connection or a long-stub
(transformer-coupling) connection. Use a short-stub connection
when the distance from the isolation transformer to the data bus
does not exceed a one-foot maximum. Use a long-stub
connection when the distance from the isolation transformer
exceeds the one-foot maximum and is less than twenty feet.
Figure 5 shows various examples of bus coupling
configurations. The UT63M147 series transceivers are designed
to function with MIL-STD-1553A and 1553B compatible
transformers.
All packages should mount to or contact a heat removal rail
located in the printed circuit board. To insure proper heat transfer
between the package and the heat removal rail, use a thermallyconductive material between the package and the heat removal
rail. Use a material such as Mereco XLN-589 or equivalent to
insure heat transfer between the package and heat removal rail.
Note:
1. The 24-lead flatpack internally connects TXOUT to RXIN and TXOUT to
RXIN for each channel.
1:2.5
SHORT-STUB
DIRECT COUPLING
1 FT. MAX.
55 OHMS
+5V DC OPERATION
55 OHMS
1:1.79
20 FT MAX
1:1.4
.75 ZO
TXOUT
RXIN
.75 ZO
TXOUT
RXIN
LONG-STUB
TRANSFORMER COUPLING
Figure 8. Transceiver Test Circuit MIL-STD-1553B
ZO
Note:
ZO defined per MIL-STD-1553B, Section 4.5.1.5.2.1.
Figure 5. Bus Coupling Configuration
Appendix 2 - 6
ZO
VCC
RECEIVER
55 OHMS
RXOUT
2.5:1
RXIN
2KOHMS
15 pF
* TP
35 OHMS
RXOUT
RXIN
Vin
2KOHMS
15 pF
55 OHMS
TP
RXEN
TRANSMITTER
55 OHMS
1:2.5
TXOUT
TXIN
RL =
TXIN
TXOUT
TXIHB
Notes:
1. TP = Test point.
2. RL removed for terminal
input impedance test.
3. TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
A
35 OHMS
55 OHMS
Figure 6. Direct Coupled Transceiver with Load
VCC
RECEIVER
2KOHMS
RXOUT
1.79:1
1.4:1
RXIN
2KOHMS
15 pF
* TP
Vin
RXOUT
RXIN
15 pF
TP
RXEN
TRANSMITTER
TXIN
TXOUT
1:1.79
1:1.4
A
TXIN
TXOUT
.75 ZO
35 OHMS
.75 ZO
TXIHB
Notes:
1. TP = Test point.
2. RL removed for terminal impedance test.
3. TXOUT and RXIN tied together.
TXOUT and RXIN tied together.
Figure 7. Transformer Coupled Transceiver with Load
Appendix 2 - 7
B
TXOUT
RL A
TERMINAL
TXOUT
Notes:
1. Transformer Coupled Stub:
Terminal is defined as transceiver plus isolation transformer. Point A is defined in figure 7.
2. Direct Coupled Stub:
Terminal is defined as transceiver plus isolation transformer and fault resistors. Point A is defined in figure 6.
Figure 8. Transceiver Test Circuit MIL-STD-1553
ABSOLUTE MAXIMUM RATINGS 1
PARAMETER
LIMITS
UNIT
-0.3 to +7.0
V
10
VPP, L-L
-0.3 to +5.5
V
Power dissipation 100% duty cycle (per channel)
3.6
W
Thermal impedance junction to case2
6.0
°C/W
+175
°C
-65 to +150
°C
VCC
Input voltage range (receiver)
Logic input voltage range
Maximum junction temperature
Storage temperature
Receiver common mode input voltage range
-5.0 to +5.0
V
Notes:
1. Stress outside the listed absolute maximum rating may cause permanent damage to the devices. This is a stress rating only, and functional operation of the device
at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Mounting per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
LIMITS
UNIT
+4.50 to +5.50
V
0 to +5.0
V
Receiver differential voltage
8.0
VP-P
Receiver common mode voltage range
+4.0
V
Driver peak output current
600
mA
0.3 to 1
MHz
-55 to +125
°C
Supply voltage range
Logic input voltage range
Serial data rate
Case operating temperature range (TC)
Appendix 2 - 8
DC ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
CONDITION
0.8
V
RXEN, TXIHB, TXIN, TXIN
RXEN, TXIHB, TXIN, TXIN
VIL
Input low voltage
VIH
Input high voltage
2.0
V
IIL
Input low current
-0.1
mA
VIL = 0.4V; RXEN, TXIHB, TXIN,
TXIN
IIH
Input high current
-40
40
μA
VIH = 2.7V; RXEN, TXIHB, TXIN,
TXIN
VOL
Output low voltage
.55
V
IOL = 4mA; RXOUT, RXOUT
VOH
Output high voltage
V
IOH = 0.4mA; RXOUT, RXOUT
ICC
VCC supply current
mA
mA
mA
mA
mA
0% duty cycle (non-transmitting)
25% duty cycle (ƒ = 1MHz)
50% duty cycle (ƒ = 1MHz)
87.5% duty cycle (ƒ = 1MHz)
100% duty cycle (ƒ = 1MHz)2
2.4
22
200
380
650
740
Note:
1. All tests guaranteed per test figure 6.
2. Guaranteed but not tested.
Appendix 2 - 9
RECEIVER ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
SYMBOL
MAXIMUM
UNIT
Input capacitance
15
pF
RXEN; input ƒ = 1MHz @ 0V
COUT2
Output capacitance
20
pF
RXOUT, RXOUT; ƒ = 1MHz @ 0V
VIC 5
Common mode input
voltage
5
V
Direct-coupled stub; input 1.2 VPP,
200ns rise/fall time ±25ns,
ƒ = 1MHz
VTH
Input threshold
voltage4 (no response)
0.20
VPP,L-L
Transformer-coupled stub; input at
ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 → 1 transition)
Input threshold voltage
(no response)
0.28
VPP,L-L
CIN 2
PARAMETER
Input threshold
voltage4 (response)
MINIMUM
-5
0.86
14.0
VPP,L-L
VPP,L-L
Input threshold voltage
(response)
CMRR5
Common mode
rejection ratio
1.20
20.02
Pass/Fail 3
CONDITION
Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output
0 → 1 transition)
Transformer-coupled stub; input at
ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 → 1 transition)
Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output
0 → 1 transition)
N/A
Notes:
1. All tests guaranteed per test figure 6.
2. Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance.
3. Pass/fail criteria per the test method described in MIL-HDBK-1553 Appendix A, RT Validation Test Plan, Section 5.1.2.2, Common Mode Rejection.
4. Guaranteed by design.
5. Guaranteed to the limits specified if not tested.
Appendix 2 - 10
TRANSMITTER ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
CONDITION
VO
Output voltage swing per
MIL-STD-1553B 4
(see figure 9)
18
27
VPP,L-L
Transformer-coupled stub, Figure 8,
Point A; input ƒ = 1MHz,
RL = 70 ohms
per MIL-STD-1553B
(see figure 9)
6.0
9.0
VPP,L-L
Direct-coupled stub, Figure 8, Point
A; input ƒ = 1MHz,
RL = 35 ohms
per MIL-STD-1553A 4
(see figure 9)
6.0
20
VPP,L-L
14
mV-RMS L-L
5
mV-RMS L-L
VNS2
Output noise voltage
differential (see figure 9)
Figure 7, Point A; input
ƒ = 1MHz, RL = 35 ohms
Transformer-coupled stub, Figure 8,
Point A; input ƒ = DC to 10MHz, RL
= 70 ohms
Direct-coupled stub, Figure 8, Point
A; input ƒ = DC to 10MHz,
RL = 35 ohms
VOS3
VDIS
Output symmetry
Output voltage
distortion (overshoot or
ring) (see figure 9)
CIN 2
Input capacitance
TIZ4
Terminal input
impedance
-250
+250
mVPP,L-L
Transformer-coupled stub, Figure 8,
Point A; RL = 140 ohms,
measurement taken 2.5μs after end
of transmission
-90
+90
mVPP,L-L
-900
+900
mVpeak,L-L
Transformer-coupled stub, Figure 8,
Point A; RL = 70 ohms
-300
+300
mVpeak,L-L
Direct-coupled stub, Figure 8, Point
A; RL = 35 ohms
15
pF
RXEN, TXIHB, TXIN, TXIN; input
ƒ = 1MHz @ 0V
1
Kohm
Transformer-coupled stub, Figure 7,
Point A; input ƒ = 75KHz to 1MHZ
(power on or power off; nontransmitting, RL removed from
circuit).
2
Kohm
Direct-coupled stub, Figure 6, Point
A; input ƒ = 75KHz to 1MHZ (power
on or power off; non-transmitting,
RL removed from circuit).
Direct-coupled stub, Figure 8, Point
A; RL = 35 ohms, measurement
taken 2.5μs after end of transmission
Notes:
1. All tests guaranteed per test figure 6.
2. Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect
3. Test in accordance with the method described in MIL-STD-1553B output symmetry, section 4.5.2.1.1.4.
4. Guaranteed to the limits specified if not tested.
Appendix 2 - 11
AC ELECTRICAL CHARACTERISTICS 1
VCC = 5.0V ±10%
-55°C < TC < +125°C
SYMBOL
PARAMETER
MINIMUM
MAXIMUM
UNIT
CONDITION
tR, tF
Transmitter output rise/
fall time (see figure 10)
100
300
ns
Input ƒ = 1MHz 50% duty cycle:
direct-coupled RL = 35 ohms output
at 10% through 90% points TXOUT,
TXOUT. Figure 10.
tRXDD
RXOUT delay
-200
200
ns
RXOUT to RXOUT, Figure 4.
tTXDD 3
TXIN skew
-25
25
ns
TXIN to TXIN, Figure 3.
tRZCD
Zero crossing distortion
(see figure 11)
-150
150
ns
Direct-coupled stub; input ƒ = 1MHz,
3 VPP (skew INPUT ±150ns), rise/fall
time 200ns.
tTZCS
Zero crossing stability
(see figure 11)
-25
25
ns
Input TXIN and TXIN should create
Transmitter output zero crossings at
500ns, 1000ns, 1500ns, and 2000ns.
These zero crossings should not
deviate more than ±25ns.
tDXOFF3,4
Transmitter off; delay
from inhibit active
100
ns
TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic zero to
one, see figure 12.
tDXON 3,5
Transmitter on; delay
from inhibit inactive
150
ns
TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic one to
zero, see figure 13.
tRCVOFF 3
Receiver off
50
ns
Receiver turn off time, see figure 13.
tRCVON 3
Receiver on
50
ns
Receiver turn on time, see figure 13.
tRCVPD 3
Receiver propagation
450
ns
Receiver propagation delay, see
figure 13.
tXMITPD 3
Transmitter
propagation
200
ns
Transmitter propagation delay, see
figure 12.
Notes:
1. All tests guaranteed per test figure 6.
2. Guaranteed by device characterization.
3. Supplied as a design limit but not guaranteed or tested.
4. Delay time from transmit inhibit (1.5V) rising to transmit off (280mV).
5. Delay time from not transmit inhibit (1.5V) falling to transmit on (1.2V).
Table 2. Transformer Requirements
± 5VDC
COUPLING TECHNIQUE
DIRECT-COUPLED:
Isolation Transformer Ratio
2.5:1
TRANSFORMER-COUPLED:
Isolation Transformer Ratio
1.79:1
Coupling Transformer Ratio
1:1.4
Appendix 2 - 12
VDIS (Overshoot)
VDIS (Ring)
0 Volts
0 Volts
VO
VNS
Figure 9. Transmitter Output Characteristics (VDIS, VNS, VO)
tR
90%
90%
VO
tTZCS
10%
10%
tF
Figure 10. Transmitter Output Zero Crossing Stability, Rise Time, Fall Time (tTZCS, tR, tF)
VIN
tRZCD
Figure 11. Receiver Input Zero Crossing Distortion (tRZCD)
Appendix 2 - 13
10%
TX OUTPUT
zero crossing
10%
tDXON
tDXOFF
tXMITPD
INHIBIT
50%
50%
TX IN
and
50%
TX IN
Figure 12. Transmitter Timing
RX INPUT
zero crossing
RXEN
tRCVPD
50%
50%
RXEN
tRCVON
tRCVOFF
50%
50%
Figure 13. Receiving Timing
Appendix 2 - 14
50%
RX OUT
and
RX OUT
0.001 MIN.
.023 MAX.
.014 MIN.
LEAD 1
INDICATOR
1.89 MAX.
0.100
0.005 MIN.
0.155
MAX.
.610 MAX.
.570 MIN.
0.150
MIN.
Notes:
1. Package material: opaque ceramic.
2. All package finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material should
be used.
.015 MAX.
.008 MIN.
.620 MAX.
.590 MIN.
(AT SEATING PLANE)
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity
LEAD 1 INDICATOR
0.016 ±.002
.810 MAX.
.050
.600 MAX.
.400 MIN.
.010 + .002 - .001
0.130 MAX.
0.070 ±0.010
(AT CERAMIC BODY)
Notes:
1. Package material: opaque ceramic.
2. All package plating finishes are per MIL-PRF-38535.
3. It is recommended that package ceramic be mounted to a heat removal rail located in the
printed circuit board. A thermally conductive material should be used.
Figure 15. 24-Lead Flatpack, Dual Cavity
(50-mil lead spacing)
Appendix 2 - 16
ORDERING INFORMATION
UT63M14x Monolithic Transceiver, 5V Operation: SMD
5962
*
93226 *
*
*
*
Lead Finish:
(A) = Solder
(C) = Gold
(X) = Optional
Case Outline:
(X) = 36 pin DIP
(Z) = 24 pin FP
Class Designator:
(Q) = Class Q
(V) = Class V
Device Type
(03) = Idle low
Drawing Number: 93226
Total Dose:
(H) = 1E6 rads(Si)
(G) = 5E5 ads(Si)
(F) = 3E5 rads(Si)
(R) = 1E5rads(Si)
(-) = None
Federal Stock Class Designator: No options
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Total dose must be specified for all QML Q and QML V devices.
4. Neutron irradiation limits will be added when available.
17
UT63M14x Monolithic Transceiver, 5V Operation
UT63M-
*
*
*
*
Total Dose:
()
= None
Lead Finish:
(A) = Solder
(C) = Gold
(X) = Optional
Screening:
(C) = Military Temperature
(P) = Prototype
Package Type:
(B) = 36-pin DIP
(C) = 24-pin FP
Device Type Modifier:
147 =
Idle Low Transceiver
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Military Temperature range devices are burned-in and tested at -55°C, room temperature, and 125°C. Radiation characteristics are neither tested nor
guaranteed and may not be specified.
4. Devices have prototype assembly and are tested at 25°C only. Radiation characteristics are neither tested nor guaranteed and may not be specified.
Lead finish is GOLD only.
18
Aeroflex Colorado Springs - Datasheet Definition
Advanced Datasheet - Product In Development
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