BIPOLAR ANALOG INTEGRATED CIRCUIT UPC3224TB 5 V, SILICON MMIC WIDEBAND AMPLIFIER DESCRIPTION The PC3224TB is a silicon monolithic IC designed as IF amplifier for DBS tuners. This IC is manufactured using our 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. FEATURES • Wideband response : fu = 3.2 GHz TYP. @ 3 dB bandwidth • Low current : ICC = 9.0 mA TYP. • Power gain : GP = 21.5 dB TYP. @ f = 1.0 GHz : GP = 21.5 dB TYP. @ f = 2.2 GHz • Supply voltage : VCC = 4.5 to 5.5 V • Port impedance : input/output 50 APPLICATION • IF amplifiers in DBS converters etc. ORDERING INFORMATION (Solder Contains Lead) Part Number PC3224TB-E3 Package Marking 6-pin super minimold C3K Supplying Form Embossed tape 8 mm wide 1, 2, 3 pins face the perforation side of tape Qty 3 kpcs/reel ORDERING INFORMATION (Pb-Free) Part Number PC3224TB-E3-A Package Marking 6-pin super minimold C3K Supplying Form Embossed tape 8 mm wide 1, 2, 3 pins face the perforation side of tape Qty 3 kpcs/reel Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PC3224TB-A Caution: Observe precautions when handling because these devices are sensitive to electrostatic discharge Document No. PU10490EJ01V0DS (1st edition) Date Published May 2004 CP(K) UPC3224TB PIN CONNECTIONS Pin No. Pin Name 1 INPUT 2 GND 3 GND 4 OUTPUT 5 GND 6 VCC PRODUCT LINE-UP OF 5 V-BIAS SILICON MMIC MEDIUM WIDEBAND AMPLIFIER (T A = +25C, f = 1 GHz, VCC = Vout = 5.0 V, ZS = ZL = 50 ) Part No. PC2711TB PC2712TB PC3215TB PC3224TB Note fu PO (sat) GP NF ICC (GHz) (dBm) (dB) (dB) (mA) 2.9 +1.0 13 5.0 12 2.6 +3.0 20 4.5 12 C1H 2.9 +3.5 20.5 2.3 14 C3H 3.2 +4.0 21.5 4.3 9.0 C3K Package 6-pin super minimold Note PC3215TB is f = 1.5 GHz Remark Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail. 2 Data Sheet PU10490EJ01V0DS Marking C1G UPC3224TB PIN EXPLANATIONS PIN No. 1 Pin Name INPUT Applied Voltage (V) – Pin Voltage (V) Function and Applications Note 0.91 Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multi-feedback circuits is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. 4 OUTPUT – 4.42 Signal output pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. 6 VCC 4.5 to 5.5 – Power suplly pin. This pin should be externally equipped with bypass capacitor to minimize its impedance. 2 GND 0 – Ground pin. 3 This pin should be connected to system ground with minimum inductance. 5 Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference. Note Pin Voltage is measured at VCC = 5.0 V Data Sheet PU10490EJ01V0DS 3 UPC3224TB ABSOLUTE MAXIMUM RATINGS Parameter Symbol Conditions Ratings Unit Supply Voltage VCC TA = +25C 6.0 V Total Circuit Current ICC TA = +25C 25 mA Power Dissipation PD TA = +85C 270 mW Operating Ambient Temperature TA 40 to +85 C Storage Temperature Tstg 55 to +150 C Input Power Pin +10 dBm Note TA = +25C Note Mounted on double-sided copper-clad 50 50 1.6 mm epoxy glass PWB RECOMMENDED OPERATING RANGE Parameter Symbol Conditions MIN. TYP. MAX. Unit Supply Voltage VCC 4.5 5.0 5.5 V Operating Ambient Temperature TA 40 +25 +85 C MIN. TYP. MAX. Unit ELECTRICAL CHARACTERISTICS (T A = +25C, VCC = 5.0 V, ZS = ZL = 50 ) Parameter Symbol Test Conditions Circuit Current ICC No input signal 7.0 9.0 12.0 mA Power Gain GP f = 1.0 GHz, Pin = 30 dBm 19.0 21.5 24.0 dB f = 2.2 GHz, Pin = 30 dBm 18.5 21.5 24.5 f = 1.0 GHz, Pin = 5 dBm +1.5 +4.0 f = 2.2 GHz, Pin = 5 dBm 1.5 +1.5 f = 1.0 GHz 6.5 3.5 f = 2.2 GHz 8.5 5.5 f = 1.0 GHz 4.3 5.8 f = 2.2 GHz 4.3 5.8 3 dB down below flat gain at f = 0.1 GHz 2.8 3.2 GHz f = 1.0 GHz, Pin = 30 dBm 35.0 40.0 dB f = 2.2 GHz, Pin = 30 dBm 37.0 42.0 f = 1.0 GHz, Pin = 30 dBm 9.0 12.0 f = 2.2 GHz, Pin = 30 dBm 10.0 14.0 f = 1.0 GHz, Pin = 30 dBm 11.0 17.0 f = 2.2 GHz, Pin = 30 dBm 8.0 12.0 0.8 Saturated Output Power Gain 1 dB Compression Output PO (sat) PO (1 dB) Power Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss Gain Flatness 4 NF fu ISL RLin RLout GP f = 0.1 to 2.2 GHz Data Sheet PU10490EJ01V0DS dBm dBm dB dB dB dB UPC3224TB OTHER CHARACTERISTICS, FOR REFERENCE PURPOSES ONLY (T A = +25C, VCC = 5.0 V, ZS = ZL = 50 ) Parameter Output Intercept Point Symbol OIP3 Test Conditions Reference Value Unit f = 1.0 GHz +7.0 dBm f = 2.2 GHz +5.5 Data Sheet PU10490EJ01V0DS 5 UPC3224TB TEST CIRCUIT The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. COMPONENTS OF TEST CIRCUIT FOR MEASURING ELECTRICAL CHARACTERISTICS Type Value C1 , C2 Chip Capacitor 100 pF C3 Chip Capacitor 1 000 pF C4 Feed-through Capacitor 1 000 pF CAPACITORS FOR THE VCC, INPUT AND OUTPUT PINS Capacitors of 1000 pF are recommendable as the bypass capacitor for the V CC pin and the coupling capacitors for the input and output pins. The bypass capacitor connected to the VCC pin is used to minimize ground impedance of VCC pin. So, stable bias can be supplied against VCC fluctuation. The coupling capacitors, connected to the input and output pins, are used to cut the DC and minimize RF serial impedance. Their capacitances are therefore selected as lower impedance against a 50 load. The capacitors thus perform as high pass filters, suppressing low frequencies to DC. To obtain a flat gain from 100 MHz upwards, 1 000 pF capacitors are used in the test circuit. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 10 000 pF. Because the coupling capacitors are determined by equation, C = 1/(2 Rfc). 6 Data Sheet PU10490EJ01V0DS UPC3224TB ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD COMPONENT LIST Value C1 , C2 100 pF C3 , C4 1 000 pF Notes 1. 30 30 0.4 mm double sided copper clad polyimide board. 2. Back side: GND pattern 3. Solder plated on pattern 4. : Through holes Data Sheet PU10490EJ01V0DS 7 UPC3224TB TYPICAL CHARACTERISTICS (T A = +25C , unless otherwise specified) Remark The graphs indicate nominal characteristics. 8 Data Sheet PU10490EJ01V0DS UPC3224TB Remark The graphs indicate nominal characteristics. Data Sheet PU10490EJ01V0DS 9 UPC3224TB Remark The graphs indicate nominal characteristics. 10 Data Sheet PU10490EJ01V0DS UPC3224TB S-PARAMETERS (T A = +25C, VCC = 5.0 V) S11FREQUENCY S22FREQUENCY Data Sheet PU10490EJ01V0DS 11 UPC3224TB PACKAGE DIMENSIONS 6-PIN SUPER MINIMOLD (UNIT: mm) 12 Data Sheet PU10490EJ01V0DS UPC3224TB NOTES ON CORRECT USE (1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be each attached to input and output pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Wave Soldering Partial Heating Soldering Conditions Condition Symbol Peak temperature (package surface temperature) : 260C or below Time at peak temperature : 10 seconds or less Time at temperature of 220C or higher : 60 seconds or less Preheating time at 120 to 180C : 12030 seconds Maximum number of reflow processes : 3 times Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (molten solder temperature) : 260C or below Time at peak temperature : 10 seconds or less Preheating temperature (package surface temperature) : 120C or below Maximum number of flow processes : 1 time Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below Peak temperature (pin temperature) : 350C or below Soldering time (per side of device) : 3 seconds or less Maximum chlorine content of rosin flux (% mass) : 0.2%(Wt.) or below IR260 WS260 HS350 Caution Do not use different soldering methods together (except for partial heating). 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