datasheet: pdf

DATA SHEET
GaAs INTEGRATED CIRCUIT
μPG2179TB
ED
L, S-BAND MEDIUM POWER SPDT SWITCH
DESCRIPTION
The μPG2179TB is a GaAs MMIC L, S-band SPDT (Single Pole Double Throw) switch for mobile phone and other
3.0 GHz, with low insertion loss and high isolation.
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L, S-band applications. This device operates with dual control voltages of 2.5 to 5.3 V. This device can operate from 0.05 to
This device is housed in a 6-pin super minimold package, and is suitable for high-density surface mounting.
FEATURES
• Switch control voltage
: Vcont (H) = 2.5 to 5.3 V (3.0 V TYP.)
: Vcont (L) = −0.2 to +0.2 V (0 V TYP.)
• Low insertion loss
: Lins1 = 0.25 dB TYP. @ f = 0.05 to 1.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins2 = 0.30 dB TYP. @ f = 1.0 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High isolation
• Power handling
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: Lins3 = 0.35 dB TYP. @ f = 2.0 to 2.5 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Lins4 = 0.40 dB TYP. @ f = 2.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL1 = 27 dB TYP. @ f = 0.05 to 2.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: ISL2 = 24 dB TYP. @ f = 2.0 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (0.1 dB) = +29.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
: Pin (1 dB) = +32.0 dBm TYP. @ f = 0.5 to 3.0 GHz, Vcont (H) = 3.0 V, Vcont (L) = 0 V
• High-density surface mounting : 6-pin super minimold package (2.0 × 1.25 × 0.9 mm)
APPLICATIONS
• L, S-band digital cellular or cordless telephone
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• PCS, W-LAN, WLL and BluetoothTM etc.
ORDERING INFORMATION
Part Number
μPG2179TB-E4-A
Package
6-pin super minimold
Marking
G4C
Supplying Form
• Embossed tape 8 mm wide
• Pin 4, 5, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2179TB-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Document No. PG10454EJ02V0DS (2nd edition)
Date Published March 2004 CP(K)
The mark
shows major revised points.
μPG2179TB
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
2
3
G4C
1
(Top View)
(Bottom View)
6 1
6 6
5 2
5 5
4 3
4 4
1
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
Vcont2
5
INPUT
6
Vcont1
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(Top View)
2
3
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TRUTH TABLE
Vcont1
Vcont2
INPUT−OUTPUT1
INPUT−OUTPUT2
Low
High
ON
OFF
High
Low
OFF
ON
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Parameter
Input Power
Ratings
Vcont
6.0
Unit
Note
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Switch Control Voltage
Symbol
V
Pin
+33
dBm
Operating Ambient Temperature
TA
−45 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note ⏐Vcont1 − Vcont2⏐ ≤ 6.0 V
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
MIN.
TYP.
MAX.
Unit
Vcont (H)
2.5
3.0
5.3
V
−0.2
0
0.2
V
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Switch Control Voltage (H)
Symbol
Switch Control Voltage (L)
2
Vcont (L)
Data Sheet PG10454EJ02V0DS
μPG2179TB
ELECTRICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified)
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
−
0.25
0.45
dB
−
0.30
0.50
dB
−
0.35
0.55
dB
−
0.40
0.60
dB
23
27
−
dB
20
24
−
dB
15
20
−
dB
15
20
−
dB
f = 2.0 GHz
+25.5
+29.0
−
dBm
f = 2.5 GHz
+25.5
+29.0
−
dBm
f = 0.5 to 3.0 GHz
−
+29.0
−
dBm
Insertion Loss 1
Lins1
f = 0.05 to 1.0 GHz
Insertion Loss 2
Lins2
f = 1.0 to 2.0 GHz
Insertion Loss 3
Lins3
f = 2.0 to 2.5 GHz
Insertion Loss 4
Lins4
f = 2.5 to 3.0 GHz
Isolation 1
ISL1
f = 0.05 to 2.0 GHz
Isolation 2
ISL2
f = 2.0 to 3.0 GHz
Input Return Loss
RLin
f = 0.05 to 3.0 GHz
Note1
Output Return Loss
RLout
f = 0.05 to 3.0 GHz
Note1
Input Power
Pin (0.1 dB)
Note2
Note1
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0.1 dB Loss Compression
Note1
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Parameter
Switch Control Current
Icont
No signal
−
4
20
μA
Switch Control Speed
tsw
50%CTL to 90/10%RF
−
50
500
ns
Note1. DC blocking capacitor = 1 000 pF at f = 0.05 to 0.5 GHz.
range.
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2. Pin (0.1 dB) is the measured input power level when the insertion loss increases 0.1 dB more than that of linear
STANDARD CHARACTERISTICS FOR REFERENCE
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified)
Parameter
Symbol
1 dB Loss Compression
Pin (1 dB)
Input Power
Note
3rd Order Intermodulation Intercept
MIN.
TYP.
MAX.
Unit
f = 0.5 to 3.0 GHz
−
+32.0
−
dBm
f = 0.5 to 3.0 GHz, 2 tone,
−
+60.0
−
dBm
5 MHz spicing
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Point
IIP3
Test Conditions
Note Pin (1 dB) is the measured input power level when the insertion loss increases 1 dB more than that of linear
range.
Caution When using this IC, a DC coupling capacitor must be externally attached to the I/O pins.
A DC coupling capacitor with a capacitance of 100 pF or lower is recommended when using a
frequency of 0.5 GHz or higher, and one with a capacitance of 1,000 pF is recommended when
using a frequency of less than 0.5 GHz. The ideal value changes depending on the frequency and
bandwidth used, so select a capacitor with a suitable capacitance according to the usage
conditions.
Data Sheet PG10454EJ02V0DS
3
μPG2179TB
EVALUATION CIRCUIT
OUTPUT2
OUTPUT1
2
1
4
5
6
IN
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1 000 pF
3
CO
Vcont2
Remark CO : 0.05 to 0.5 GHz 1 000 pF
1 000 pF
INPUT Vcont1
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0.5 to 3.0 GHz 100 pF
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CO
CO
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The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
4
Data Sheet PG10454EJ02V0DS
μPG2179TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Vcont2
ED
6pin SMM SPDT SW
Vc2
OUTPUT2
2
IN
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C2
C
C
4
OUT 2
INPUT
C1
IN
G4C
C1
C3
C1
C
C
C2
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5
1
OUT 1
OUTPUT1
Vc1
Vcont1
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USING THE NEC EVALUATION BOARD
Symbol
C1, C2, C3
C4, C5
Values
100 pF
1 000 pF
Data Sheet PG10454EJ02V0DS
5
μPG2179TB
TYPICAL CHARACTERISTICS
(TA = +25°C, Vcont (H) = 3.0 V, Vcont (L) = 0 V, DC blocking capacitors = 100 pF, unless otherwise specified)
0.4
0.4
0.3
0.3
0.2
0.1
0
–0.1
–0.2
–0.4
50
10
0
–10
–20
–30
–40
50
30
20
10
0
–10
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
INPUT–OUTPUT1
INPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
INPUT RETURN LOSS vs. FREQUENCY
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Frequency f (GHz)
50
40
40
Input Return Loss RLin (dB)
50
30
20
10
0
–10
–20
–30
30
20
10
0
–10
–20
–30
–40
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
Frequency f (GHz)
Remark The graphs indicate nominal characteristics.
6
INPUT–OUTPUT2
ISOLATION vs. FREQUENCY
40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RLin (dB)
–0.3
–0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL (dB)
20
–0.2
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Isolation ISL (dB)
30
0
–0.1
Frequency f (GHz)
INPUT–OUTPUT1
ISOLATION vs. FREQUENCY
40
0.1
–0.4
–0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
0.2
IN
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–0.3
INPUT–OUTPUT2
INSERTION LOSS vs. FREQUENCY
ED
0.5
Insertion Loss Lins (dB)
Insertion Loss Lins (dB)
0.5
INPUT–OUTPUT1
INSERTION LOSS vs. FREQUENCY
Data Sheet PG10454EJ02V0DS
μPG2179TB
INPUT–OUTPUT1
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT–OUTPUT2
OUTPUT RETURN LOSS vs. FREQUENCY
40
40
20
10
0
–10
–20
–30
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Frequency f (GHz)
f = 1.0 GHz
25
17
15
13
15 17
–20
–30
–40
–50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
33
Output Power Pout (dBm)
27
19
–10
OUTPUT POWER vs. INPUT POWER
31
29
21
0
Frequency f (GHz)
OUTPUT POWER vs. INPUT POWER
23
10
f = 2.5 GHz
29
27
25
23
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Output Power Pout (dBm)
31
20
IN
U
–40
30
ED
30
33
50
Output Return Loss RLout (dB)
Output Return Loss RLout (dB)
50
21
19
17
15
19 21
23 25
27 29
31
33 35
13
15 17
Input Power Pin (dBm)
19
21 23
25
27 29 31
33
35
Input Power Pin (dBm)
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Remark The graphs indicate nominal characteristics.
Data Sheet PG10454EJ02V0DS
7
μPG2179TB
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
2.1±0.1
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0.2+0.1
–0.05
0.65
0.65
1.3
2.0±0.2
1.25±0.1
8
Data Sheet PG10454EJ02V0DS
0.15+0.1
–0.05
IN
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0 to 0.1
0.7
0.9±0.1
0.1 MIN.
μPG2179TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Peak temperature (package surface temperature)
: 10 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
Preheating time at 120 to 150°C
: 30 to 60 seconds
Time at temperature of 200°C or higher
Peak temperature (molten solder temperature)
Time at peak temperature
: 25 to 40 seconds
VP215
: 3 times
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Maximum chlorine content of rosin flux (% mass)
IR260
: 60 seconds or less
Peak temperature (package surface temperature)
Maximum number of reflow processes
Wave Soldering
: 260°C or below
Time at peak temperature
Time at temperature of 220°C or higher
VPS
Condition Symbol
ED
Infrared Reflow
Soldering Conditions
For soldering
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
WS260
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
: 1 time
Peak temperature (pin temperature)
: 350°C or below
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Maximum chlorine content of rosin flux (% mass)
Soldering time (per side of device)
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Partial Heating
: 0.2%(Wt.) or below
: 3 seconds or less
HS350
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Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10454EJ02V0DS
9
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
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μPG2179TB
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• The information in this document is current as of March, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
• NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
• While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
• NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4 - 0110
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Data Sheet PG10454EJ02V0DS
μPG2179TB
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
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1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
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• Do not lick the product or in any way allow it to enter the mouth.
For further information, please contact
NEC Compound Semiconductor Devices, Ltd.
http://www.ncsd.necel.com/
E-mail: salesinfo@ml.ncsd.necel.com (sales and general)
techinfo@ml.ncsd.necel.com (technical)
5th Sales Group, Sales Division TEL: +81-44-435-1588 FAX: +81-44-435-1579
NEC Compound Semiconductor Devices Hong Kong Limited
E-mail: ncsd-hk@elhk.nec.com.hk (sales, technical and general)
FAX: +852-3107-7309
TEL: +852-3107-7303
Hong Kong Head Office
TEL: +886-2-8712-0478 FAX: +886-2-2545-3859
Taipei Branch Office
FAX: +82-2-558-5209
TEL: +82-2-558-2120
Korea Branch Office
NEC Electronics (Europe) GmbH
http://www.ee.nec.de/
TEL: +49-211-6503-0 FAX: +49-211-6503-1327
California Eastern Laboratories, Inc.
http://www.cel.com/
TEL: +1-408-988-3500 FAX: +1-408-988-0279
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